CD2010

MATERIAL DECLARATION SHEET
Material Number
Product Line
CD2010 Series
Schottky Rectifier Diodes
Compliance Date
RoHS Compliant
No.
1
Construction
Element(subpart)
FRP
January 1, 2005
Yes
MSL
Homogeneous
Material
1
Material
weight
[mg]
Others
12
2
Epoxy
Plastic
5.36
3
Solder Cream
Metal
0.94
4
Dice
Others
1.30
5
Terminal Plating
Metal
0.4
Total weight
20
This Document was updated on:
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Homogeneous
Material\
Substances
Continuous
filament glass
fibers
Copper
Non-Hazardous
cured resin
Silicon Dioxide
Bisphenol type
epoxy
Lead *2
Tin
Silver
Silicon
Silver
Nickel
Titanium
Arsenic
Phosphorus
Tin
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
65997-17-3
43
25.8
7440-50-8
14
8.4
Proprietary
43
25.8
7631-86-9
55
14.74
9003-36-5
45
12.06
7439-92-1
7440-31-5
7440-22-4
7440-21-3
7440-22-4
7440-02-0
7440-32-6
7440-38-2
7723-14-0
88
10
2
90.46
8.5
0.67
0.27
0.09
0.01
4.136
0.47
0.094
5.8799
0.5525
0.04355
0.01755
0.00585
0.00065
7440-31-5
100
2
CASRN
Subpart
mass of total
wt. (%)
60.00
26.80
4.70
6.50
2.00
2015/05/05
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MATERIAL DECLARATION SHEET
Important remarks:
1.
It is the responsibility of the user to verify they are accessing the latest version.
2. *:Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more
lead);
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