CD214B-B_MDS

MATERIAL DECLARATION SHEET
CD214B-B SERIES
Material Number
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
2004/8/2
Yea
MSL
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight
[mg]
1
Dice
Silica compound
4.60
2
Solder Paste
High-melting point
solder
2.33
3
Lead frame &clip
Copper Alloy
40.48
4
Epoxy material
Green molding
compound
44.66
Sn plating cover
0.93
5
Plating cover
Total weight
This Document was updated on:
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1
Homogeneous
Material\
Substances
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Silicon
Nickel
Lead
Tin
Silver
Copper
Zinc
Iron
Phosphorus
Silica fused
7440-21-3
7440-02-0
7439-92-1
7440-31-5
7440-22-4
7440-50-8
7440-66-6
7439-89-6
7723-14-0
7631-86-9
98%
2%
92.5%
5.0%
2.5%
99.950%
0.004%
0.010%
0.034%
68.7%
4.85%
0.1%
2.317%
0.12%
0.063%
43.505%
0.002%
0.004%
0.015%
33.375%
Silica quartz
14808-60-7
25.0%
11.045%
Phenolic resin
Carbon black
9003-35-4
1333-86-4
6.0%
0.3%
3.362%
0.240%
Tin
7440-31-5
100%
1.00%
Subpart
mass of total
wt. (%)
4.95%
2.50%
43.53%
48.02%
1.00%
93.0
2015-4-27
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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MATERIAL DECLARATION SHEET
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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