CD214B-R Serial SMB MDS

MATERIAL DECLARATION SHEET
Material Number
CD214B-R Serial
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
2005/03/02
Yes
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight
[mg]
1
Solder wafer
Metal
1.552
2
Dice
Metal
25.986
3
Molding
compound
Plastic
62.807
4
Lead Wire
Metal
29.555
5
Plating
Metal
Total weight
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0.1
Homogeneous
Material\
Substances
2
Lead *
Tin
Silver
Silicon
Nickel
Aluminum
Lead*3
Phosphorus
Boron
Trace metals
Silica
Epoxy Resin
Phenol Resin
Antimony trioxide
Copper
Misc., not to
declare
Tin
Misc., not to
declare
CASRN
if applicable
Materials
Mass %
7439-92-1
7440-31-5
7440-22-4
7440-21-3
7440-02-0
7429-90-5
7439-92-1
7723-14-0
7440-42-8
14808-60-7
29690-82-2
9003-35-4
1309-64-4
7440-50-8
92.5
5
2.5
73.54
1.99
0.56
14.80
0.249
0.874
7.987
70
20
8
2
>99.0
-
<1.0
7440-31-5
>99.0
-
<1.0
Material
Mass % of
total unit wt.
1.196
0.065
0.032
15.929
0.431
0.121
3.205
0.054
0.189
1.730
36.637
10.468
4.187
1.047
24.383
0.246
0.083
0.001
Subpart
mass of total
wt. (%)
1.29
21.66
52.34
24.63
0.08
120.0
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MATERIAL DECLARATION SHEET
This Document was updated on:
2015/11/03
Important remarks:
1.
It is the responsibility of the user to verify they are accessing the latest version.
2. *:Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more
lead);
3. *:Excepted for RoHS 7(c) I-Electrical and electronic components containing lead in a glass or ceramic other then dielectric ceramic in
capacitors,e.g.piezoelectronic devices, or in a glass or ceramic matrix compound;
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