CD216A-B

MATERIAL DECLARATION SHEET
CD216A-B SERIES
Material Number
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
2004/8/2
Yea
MSL
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight
[mg]
1
Dice
Silica compound
2.2
2
Solder Paste
High-melting point
solder
0.81
3
Lead frame &clip
Copper Alloy
5.27
4
Epoxy material
Green molding
compound
7.78
5
Plating cover
Sn plating cover
0.14
Total weight
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1
Homogeneous
Material\
Substances
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
7440-21-3
7440-02-0
7439-92-1
7440-31-5
7440-22-4
7440-50-8
7439-89-6
7723-14-0
98%
2%
92.5%
5.0%
2.5%
99.950%
0.1%
0.034%
13.31%
0.27%
4.63%
0.25%
0.12%
32.48%
0.04%
0.01%
60676-86-0
83%
39.86%
Epoxy resin
29690-82-2
13.5%
6.48%
BTDA
Silica, quartz
Carbon black
2421-28-5
14808-60-7
1333-86-4
0.55%
2.4%
0.55%
0.26%
1.16%
0.26%
Tin
7440-31-5
100%
0.87%
Silicon
Nickel
Lead*
Tin
Silver
Copper
Iron
Phosphorus
Silica,
amorphous, fused
Subpart
mass of total
wt. (%)
13.58%
5.00%
32.53%
48.02%
0.87%
16.2
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MATERIAL DECLARATION SHEET
This Document was updated on:
2015-4-27
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)
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