CD2320 MDS

MATERIAL DECLARATION SHEET
Material Number
CD2320 Serial
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
No.
1
Construction
Element(subpart)
FRP
2006/06/26
Yes
MSL
Homogeneous
Material
1
Material
weight
[mg]
Others
42.5
2
Epoxy
Plastic
20.3
3
Solder Cream
Metal
1.523
4
Dice
Others
4.277
5
Terminal Plating
Metal
1.4
Total weight
70.0
This Document was updated on:
Homogeneous
Material\
Substances
Continuous
filament glass
fibers
Copper foil
Non-Hazardous
cured resin
Silicon Dioxides
F-P-R resin
Lead *2
Tin
Silver
Silicon
Nickel
Lead*3
Gold
Tin
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit
wt.
65997-17-3
43
26.107
7440-50-8
14
8.5
Proprietary
43
26.107
7631-86-9
9003-36-5
7439-92-1
7440-31-5
7440-22-4
7440-21-3
7440-02-0
7439-92-1
7440-57-5
55
45
88
10
2
35.77
0.7
63.51
0.02
15.95
13.05
1.91488
0.2176
0.04352
2.186
0.043
3.88
0.001
7440-31-5
100
2
Subpart
mass of total
wt. (%)
60.71
29
2.18
6.11
2
2015/05/05
Important remarks:
1.
It is the responsibility of the user to verify they are accessing the latest version.
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MATERIAL DECLARATION SHEET
2. Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more
lead);
3. Excepted for RoHS 7(c) I-Electrical and electronic components containing lead in a glass or ceramic other then dielectric ceramic in
capacitors,e.g.piezoelectronic devices, or in a glass or ceramic matrix compound;
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