DFN-2 Package

MATERIAL DECLARATION SHEET
Material Number
CDDFN2-T5.0C
Product Line
Diode Products
Compliance Date
16 Jun 2009
RoHS Compliant
Yes
No.
Construction
Element(subpart)
MSL
Homogeneous
Material
Material
weight [g]
1
FR-4 Board
Substrate/
Terminal
2
Wafer
Diode
0.000029
3
Al wire
Conductor
0.000001
4
Silver paste
Welding
0.000005
5
Molding
Compound
Outer
0.000511
Total weight
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0.000223
1
Homogeneous Material\
Substances
if applicable
Materials
Mass %
Copper
Nickel
Gold
Epoxy Resin
Silicon
Aluminum
Titanium
Gold
Arsenic
Aluminum
7440-50-8
7440-02-0
7440-57-5
-------------7440-21-3
7429-90-5
7440-32-6
7440-57-5
7440-38-2
7429-90-5
43.01%
3.677%
0.099%
53.22%
90.70%
1.90%
0.001%
6.40%
0.07%
>99%
Material
Mass % of
total unit
wt.
43.01%
3.677%
0.099%
53.22%
90.70%
1.90%
0.001%
6.40%
0.07%
>99%
Silicon
Additives
Silver
Epoxy resins
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Catalyst
7440-21-3
---------7440-22-4
---------60676-86-0
--------------------------1333-86-4
--------------
<1%
1~7%
76~85%
5~25%
70~90%
5~15%
5~15%
0.1~0.5%
<1%
<1%
1~7%
76~85%
5~25%
70~90%
5~15%
5~15%
0.1~0.5%
<1%
CASRN
Subpart
mass of
total wt. (%)
29.00
3.77
0.13
0.65
66.45
0.000769
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MATERIAL DECLARATION SHEET
This Document was updated on: 21 Aug 2009
Important remarks:
1.
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