CDDFN2-T50LC 051716

MATERIAL DECLARATION SHEET
Material Number
ESD Suppressing Device
CDDFN2-T5.0LC
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
2013/8/2
Yes
MSL
3
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [mg]
1
Wafer
Silicon
0.05
Homogeneous
Material\
Substances
Silicon
0.4182
Copper Alloy
(NiPdAu)
2
Lead frame
Ni plating
Pd plating
Au plating
3
4
Epoxy
wire
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Polymer
CASRN
if applicable
Materials
Mass %
7440-21-3
100.00%
Material
Mass % of
total unit wt.
4.501%
Copper
7440-50-8
95.31%
37.649%
0.013
0.0028
0.0007
0.0037
0.0003
0.0001
Nickel
Silicon
Magnesium
Nickel
Palladium
Gold
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-57-3
7440-57-5
2.97%
0.64%
0.15%
0.85%
0.06%
0.02%
1.170%
0.252%
0.063%
0.333%
0.027%
0.009%
0.0255
Aluminum oxide
1344-28-1
50.00%
2.296%
0.006
Epoxy resin
Proprietary
11.7%
0.537%
0.017
Epoxy resin
Proprietary
33.3%
1.529%
0.0025
Aromatic amine
Proprietary
5.00%
0.229%
0.0099
Gold
7440-57-5
99.99%
0.891%
0.0001
Misc, not to
declare
/
0.01%
0.009%
0.525
Silica Fused
60676-86-0
93.70%
47.265%
Noble metal
Subpart
mass of total
wt. (%)
4.501%
39.503%
4.591%
0.9%
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MATERIAL DECLARATION SHEET
Total weight
This Document was updated on:
0.017
Epoxy Resin
Proprietary
3.00%
1.530%
0.017
Phenol Resin
Proprietary
3.00%
1.530%
0.002
Carbon Black
1333-86-4
0.30%
0.180%
1.1108 mg
2015/01/13
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
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