MATERIAL DECLARATION SHEET Material Number ESD Suppressing Device CDDFN2-T5.0LC Product Line Semiconductor Products Compliance Date RoHS Compliant 2013/8/2 Yes MSL 3 No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Wafer Silicon 0.05 Homogeneous Material\ Substances Silicon 0.4182 Copper Alloy (NiPdAu) 2 Lead frame Ni plating Pd plating Au plating 3 4 Epoxy wire Headquarters Riverside CA Polymer CASRN if applicable Materials Mass % 7440-21-3 100.00% Material Mass % of total unit wt. 4.501% Copper 7440-50-8 95.31% 37.649% 0.013 0.0028 0.0007 0.0037 0.0003 0.0001 Nickel Silicon Magnesium Nickel Palladium Gold 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-57-3 7440-57-5 2.97% 0.64% 0.15% 0.85% 0.06% 0.02% 1.170% 0.252% 0.063% 0.333% 0.027% 0.009% 0.0255 Aluminum oxide 1344-28-1 50.00% 2.296% 0.006 Epoxy resin Proprietary 11.7% 0.537% 0.017 Epoxy resin Proprietary 33.3% 1.529% 0.0025 Aromatic amine Proprietary 5.00% 0.229% 0.0099 Gold 7440-57-5 99.99% 0.891% 0.0001 Misc, not to declare / 0.01% 0.009% 0.525 Silica Fused 60676-86-0 93.70% 47.265% Noble metal Subpart mass of total wt. (%) 4.501% 39.503% 4.591% 0.9% www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Total weight This Document was updated on: 0.017 Epoxy Resin Proprietary 3.00% 1.530% 0.017 Phenol Resin Proprietary 3.00% 1.530% 0.002 Carbon Black 1333-86-4 0.30% 0.180% 1.1108 mg 2015/01/13 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2