CDNBS04-B MDS

MATERIAL DECLARATION SHEET
CDNBS04-B SERIES
Material Number
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
01 Jan 2006
Yes
MSL
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight
[mg]
1
Dice
Silica compound
3.25
2
Solder Paste
High-melting point
solder
11.25
3
Lead frame &clip
Copper Alloy
40.19
4
5
Epoxy material
Plating cover
Epoxy molding
compound
Sn plating cover
Total weight
Headquarters Riverside CA
69.06
1.25
1
Homogeneous
Material\
Substances
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Silicon
Lead*
Nickel
Lead*
Tin
Silver
Copper
Zinc
Iron
Phosphorus
Silica
7440-21-3
7439-92-1
7440-02-0
7439-92-1
7440-31-5
7440-22-4
7440-50-8
7440-66-6
7439-89-6
7723-14-0
14808-60-7
96.5%
2.5%
1.0%
92.5%
5.0%
2.5%
99.95%
0.004%
0.010%
0.034%
70%
2.50%
0.07%
0.03%
8.32%
0.45%
0.23%
32.14%
0.00%
0.00%
0.01%
38.67%
Epoxy resin
29690-82-2
15%
8.29%
9003-35-4
10.0%
5.53%
1309-64-4
2.5%
1.38%
40039-93-8
2.5%
1.38%
7440-31-5
99.5%
1.00%
Phenolformaldehyde
polymer
Antimony trioxide
Bisphenol A
diglycidyl ether
Tin
Subpart
mass of total
wt. (%)
2.60%
9.00%
32.15%
55.25%
1.00%
125
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 1 of 2
MATERIAL DECLARATION SHEET
This Document was updated on:
2015-4-27
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)
7(c)-I.Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g.
piezoelectronic devices, or in a glass or ceramic matrix compound.
Headquarters Riverside CA
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 2 of 2
Similar pages