CDSOD323

MATERIAL DECLARATION SHEET
Package Type
SOD323
Product Line
Diode Array
Compliance Date
January 1st, 2006
RoHS Compliant
No.
1
Construction
Element (subpart)
Encapsulation
(EIAJ SC76)
Yes
Homogeneous
Material
Epoxy resin
MSL
1
Material
weight [g]
0.0027
Homogeneous
Material\
Substances
CASRN
if applicable
Materials
Mass %
Fused Silica (SiO2)
Epoxy resin
Epoxy CN
Phenol resin
60676-86-0
na
29690-82-2
na
87.70
5.00
2.00
5.00
Copper
7440-50-8
94.56
Carbon Black
2
3
Leadframe
Chip
Copper alloy
Silicon
0.0021
0.0004
Iron
Zinc
Die Attach
Silver epoxy
0.000080
5
Bond wires
Gold
6
Terminal Finish
Matte Tin
Total Weight
7439-89-6
7440-66-6
0.30
2.23
0.01
Phosphorous
7723-14-0
0.03
Silver (Plating)
7440-22-4
3.17
43.92
2.50
1.00
2.50
0.87
0.00
0.01
6.70
Nickel
7440-02-0
3.08
0.22
Silver
7440-57-5
7440-22-4
0.13
75.00
38.87
1.23
93.73
3.05
50.08
0.15
7440-21-3
7429-90-5
Subpart
mass of total
wt. (%)
36.75
Silicon
Aluminium
Gold
4
1333-86-4
Material
Mass % of
total unit wt.
0.22
7.15
0.01
1.12
1.50
Epoxy
9003-36-5
25.00
0.37
0.00004
Gold
7440-57-5
100.00
0.83
0.83
0.00008
Matte Tin
7440-31-5
100.00
1.41
1.57
0.005400
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
Rev Sept 2011 page 1 of 1
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