MATERIAL DECLARATION SHEET Material Number P6SMB480A~550A, P6SMB130CA~550CA Product Line Semiconductors Compliance Date RoHS Compliant 2015/04/08 Yes MSL Material Construction Homogeneous weight Element(subpart) Material [mg] No. 1 Dice Silicon 4.479 2 High-melting point Solder paste solder paste 3.02 3 Lead frame / Leads / Disc Copper alloy 33.50 4 Molding Compound Epoxy material 51.00 5 Plating Matte-Tin 1.011 Total Weight 93.01 This Document was updated on: 1 Homogeneous CASRN if Material\ applicable Substances Silicon 7440-21-3 Phosphorous 7723-14-0 Boron 7440-42-8 Nickel 7440-02-0 Lead Glass 7439-92-1 Silicon dioxide 7631-86-9 Aluminum oxide 1344-28-1 Tin 7440-31-5 Lead 7439-92-1 Silver 7440-22-4 Copper 7440-50-8 Iron 7439-89-6 Phosphorus 7723-14-0 Silica 14808-60-7 Epoxy resin 25928-94-3 Phenolic resin-A,-B 9003-35-4 Aluminum hydroxide 21645-51-2 Carbon black 1333-86-4 Tin 7440-31-5 Material Mass Materials Subpart mass % of total unit Mass % of total wt. (%) wt. 60.1800% 2.898% 0.0100% 0.0005% 0.0100% 0.0005% 4.815% 14.8000% 0.713% 12.5000% 0.602% 10.0000% 0.482% 2.5000% 0.1204% 5.000% 0.162% 3.247% 92.500% 3.003% 2.500% 0.081% 99.800% 35.946% 36.018% 0.150% 0.054% 0.050% 0.018% 76.000% 41.673% 9.000% 4.935% 54.833% 8.000% 4.387% 6.000% 3.290% 1.000% 0.548% 100.000% 1.087% 1.087% 2015/04/08 (EU) RoHS Directive 2011/65/EU ANNEX - Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) , and 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1