SMAJ5.0A~350A, SMAJ5.0CA~130CA

MATERIAL DECLARATION SHEET
Material Number
Product Line
Compliance Date
SMAJ5.0A ~ 350A, SMAJ5.0CA ~ 130CA
Semiconductors
2011/01/01
RoHS Compliant
YES
Construction
No.
Element(subpart)
MSL
Homogeneous
Material
1
Material
weight [mg]
1
Dice
Silicon
1.330
2
High-melting point
Solder paste
Solder paste
2.003
3
Lead frame
Copper
27.5
4
Molding
compound
Epoxy material
31.035
5
Plating
Matte-100% tin
Total weight
0.663
62.531
This Document was updated on:
Homogeneous
Material\
Substances
CASRN
if applicable
Silicon
Phosphorus
Boron
Nickel
7440-21-3
7723-14-0
7440-42-8
7440-02-0
Lead-containing glass 7439-92-1
Silicon dioxide
7631-86-9
Aluminum oxide
1344-28-1
Tin
7440-31-5
Lead
7439-92-1
Silver
7440-22-4
Copper (Cu)
7440-50-8
Iron
7439-89-6
Phosphorus
7723-14-0
Silica
14808-60-7
Epoxy resin
25928-94-3
Phenolic resin-A,B 9003-35-4
Aluminum hydroxide 21645-51-2
Carbon black
1333-86-4
Tin
7440-31-5
Materials
Mass %
60.18
0.01
0.01
14.8
12.5
10.0
2.5
5
92.5
2.5
99.8
0.15
0.05
76
9
8
6
1
100
Material Mass
Subpart
% of total unit mass of total
wt.
wt. (%)
1.2800
0.0002
0.0002
0.3148
0.2659
0.2127
0.0532
0.16
2.963
0.08
43.89
0.066
0.022
37.72
4.467
3.971
2.978
0.496
1.06
2.127
3.203
43.978
49.632
1.06
2015/02/09
(EU) RoHS Directive 2011/65/EU Application of lead which are exempted from the requirements:
7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound.
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