AN9800: Total Power Conversion Solutions for Computer Motherboards Using HIP6017, HIP6019 Controller Ics

Total Power Conversion Solutions for Computer
Motherboards Using HIP6017, HIP6019 Controller ICs
®
Application Note
April 1998
AN9800.1
Author: Bogdan M. Duduman
Introduction
The evaluation board features a 5-bit DAC-controlled
synchronous buck converter targeted at the microprocessor
core voltage, an adjustable standard buck converter
(HIP6019EVAL1 only) supplying the I/O circuitry, an adjustable
linear controller aimed at the GTL bus, and an adjustable linear
regulator with built-in pass element to provide power to the
clock generator. The HIP6017 is ideally suited for PC
applications employing an ATX power supply, while the
HIP6019 addresses the same need in PCs using a PS2 power
supply or in situations where the 3.3V output of the ATX supply
does not provide adequate regulation or transient response.
Table 1 summarizes the target design parameters of the four
on-board regulator blocks (three in case of HIP6017EVAL1).
The four core regulator reference designs presented in
Table 2 share much common circuitry and the same printed
circuit board. They highlight the operation of the
HIP6017/HIP6019 controllers in an embedded motherboard
application environment and the difference amongst paired
designs resides in the step load capability for given output
regulation limits (see Table 1 for such regulation limit
examples). While design examples 1 and 2 conform to the
stringent requirements of Intel’s converter design guidelines,
design examples 1A and 2A account for the practical
experience of PC system designers. In contrast to the
conservative worst-case specifications published by Intel,
practical experience of PC system designers reveals
1
microprocessor core currents 30% lower than the theoretical
absolute maximum levels. This experience reflects in the
design of the core regulator, as shown in examples 1A and
2A. The design engineer is encouraged to modify the board
according to his own experience or specifications, and the
evaluation platform is laid out to accommodate this. The
core regulator of HIP6017/HIP6019EVAL1 ships populated
as design example 1A.
+5V
+12V
THIS BLOCK INCLUDED
IN HIP6019 ONLY
Keeping pace with today’s high-performance desktop PC
architectures, the HIP6017 and HIP6019 controller/regulator
ICs respond to the need for increased integration and reduced
system-level costs. The Intersil HIP6017 and HIP6019 are
complex controllers that integrate one and two, respectively,
switching regulators, a linear controller, and a linear regulator in
a single 28-lead SOIC package. The switching converters
employ voltage-mode control architecture and high circuit
performance is insured by the use of high Gain - Bandwidth
Product (GBWP) error amplifiers, high-accuracy references, a
programmable free-running oscillator, and adaptable shootthrough protection. The ICs offer a full range of protection
features including over-current, over-voltage, as well as fault
condition signaling and shutdown. All these combined features
make the HIP6017 and HIP6019 ideal as total microprocessor
point-of-use power supply solution providers [1, 2]. Figure 1
presents a simple block diagram of the HIP6017/HIP6019
application circuit.
ADJUSTABLE
SYNCHRONOUS BUCK
CONTROLLER
+
DAC
+
ADJUSTABLE
STANDARD BUCK
CONTROLLER
ADJUSTABLE
LINEAR
CONTROLLER
VID0
VID1
VID2
VID3
VID4
+
ADJUSTABLE
LINEAR
REGULATOR
+
FIGURE 1. HIP6017/HIP6019 EVAL1 BLOCK DIAGRAM
Quick Start Evaluation
The inputs of both evaluation platforms will accept either
standard power supplies or an ATX-style power supply. The
outputs can be exercised using either resistive loads,
electronic loads, or the Intel Slot 1 EMT tool. Shielded scope
probe test points on the dynamic outputs (core, I/O, and GTL
bus) allow for accurate inspection of the output power
quality. Before proceeding, please consult Table 1 for the
evaluation board’s design envelope characteristics.
AUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
Application Note 9800
TABLE 1. HIP6017/HIP6019EVAL1 DESIGN PARAMETERS
NOMINAL
VOLTAGE
(V)
STATIC
TOLERANCE
(±,%)
DYNAMIC
TOLERANCE
(±,%)
NOMINAL
CURRENT
(A)
MAXIMUM
CURRENT
(A)
MAXIMUM
CURRENT
STEP (A)
MAXIMUM
SLEW RATE
(A/μs)
VCC_CORE
2.8
2.14
4.28
10
14.2
9.5
30
VCC_L2
3.3
5.0
5.0
5
8
7
1
VCC_VTT
1.5
9.0
9.0
1
4
3
8
VCC_CLK
2.5
4
4
0.1
0.2
N/A
N/A
OUTPUT
TABLE 2. HIP6017/HIP6019EVAL1 CORE REGULATOR DESIGN EXAMPLES
REF. DES.
EXAMPLE 1
VOUT = 2.8V
IOUT = 14.2A
IOUT_STEP = 13.5A
EXAMPLE 1A
VOUT = 2.8V
IOUT = 14.2A
IOUT_STEP = 9.5A
EXAMPLE 2
VOUT = 2.0V
IOUT = 16.0A
IOUT_STEP = 15.6A
EXAMPLE 2A
VOUT = 2.0V
IOUT = 16.0A
IOUT_STEP = 11.0A
MOSFETs
Q1
Q2
HUF76139
HUF76139
HUF76139
HUF76139
HUF76143
HUF76143
HUF76143
HUF76143
OCSET
RESISTOR
R2
1.3kΩ
1.3kΩ
1.1kΩ
1.1kΩ
OUTPUT
INDUCTOR
L3
2.9μH (9T of 16AWG
on T60-52 core)
2.9μH (9T of 16AWG
on T60-52 core)
2.2μH (7T of 16AWG
on T68-52A core)
2.2μH (7T of 16AWG
on T68-52A core)
INPUT
CAPACITORS
C1-13
4
(EEUFA1A10)
4
(EEUFA1A10)
9
(EEUFA1A10)
8
(EEUFA1A10)
OUTPUT
CAPACITORS
C24-36
9
(EEUFA1A10)
7
(EEUFA1A10)
11
(EEUFA1A10)
8
(EEUFA1A10)
OFFSET
RESISTOR
R9
732kΩ
732kΩ
432kΩ
432kΩ
COMPONENT
DESCRIPTION
On either board, if using an Intel Slot 1 EMT Tool, the core
regulator VID jumpers located on the evaluation board are in
parallel with the ones located on the tool itself, so remember
to de-populate one set of jumpers completely and use the
other set to dial-in the desired output voltage.
HIP6017EVAL1
The easiest way to power this board is by using an ATX-type
computer power supply. Simply plug the appropriate supply
connector into the on-board receptacle (J2), connect the
outputs (VCC_CLK, VCC_CORE, and VCC_VTT) to the
desired loads, and power-up the board.
If using standard laboratory power supplies, make sure the
power-up sequence follows this order: 3.3V supply, followed
by the 5V and 12V supplies in no particular order. This
sequence is required by the IC’s sophisticated monitoring
and protection circuitry.
HIP6019EVAL1
Similarly, the easiest way to power this board is also by
using an ATX-type PC power supply. Plug the appropriate
output connector into the evaluation board’s input receptacle
(J2), connect the desired output loads, and power-up. If
using standard laboratory equipment, the input supplies (5V
and 12V) do not require any special sequencing.
2
HIP6017/HIP6019EVAL1 Reference
The evaluation board is designed to simultaneously meet all
the applicable criteria outlined in Table 1 (HIP6017EVAL1
does not provide the 3.3V I/O voltage). The following section
highlights some of the most important features of this
system’s power solution.
ATX Power Supply Control Interface
JP5 allows control of the power supply. By placing the jumper
in the 1-2 position, the PS-ON (output enable) input of the
ATX supply is connected to ground, thus unconditionally
enabling the outputs. Placing the jumper in the 2-3 position
connects the supply control pin to the drain of Q5 (see Figure
2). When ATX supply is turned on, the 5V stand-by output
turns Q5 on and enables the power supply outputs. If
FAULT/RT pin goes high, Q6 latches on, thus turning off Q5
and disabling the power supply outputs. Cycling power off and
then back on re-enables the power supply. The sole purpose
of this circuit is to exemplify a possible interface between the
control circuit’s FAULT output and an ATX power supply. In
case of an over-voltage event, this circuit disables the input
supply much faster than its internal short-circuit protection,
thus minimizing any risks of power supply failure.
Application Note 9800
Over-Current Protection
FAULT/RT
ATX
CONNECTOR
9
5VSB
R26
5.1K
J2
JP5
14
3, 5, 7, 13
15, 16, 17
PS-ON
3
2
GND
1
R27
5.1K
CR3
1N4148
Q5
Q6
1/2
RF1K49154
1/2
RF1K49154
FIGURE 2. ATX POWER SUPPLY CONTROL CIRCUIT
Lossless Output Voltage Droop with Load
The switching regulators on the HIP6017/HIP6019EVAL1
boards implement output voltage droop functions, where the
output voltage sags proportionately with the output current.
Although not necessary for proper circuit operation, this
method takes advantage of the static regulation limits to
improve the dynamic regulation by expanding the available
headroom for transient edge output excursion. In such
practical applications, compared to a non-droop
implementation, this translates to fewer output capacitors or
better regulation for the same type and number of
capacitors. Figure 3 details the output voltage characteristics
of a converter with 2.3% droop compared to a non-droop
implementation.
2.832V
WITHOUT DROOP
2.800V
2.768V
OUTPUT VOLTAGE
WITH DROOP
0.5A
OUTPUT CURRENT
14.2A
FIGURE 3. OUTPUT VOLTAGE DROOP AT 2.8V DAC SETTING
In contrast to droop implementation involving a resistive
element placed in the output current path, this method does
not involve the additional power loss introduced by the
resistor. By moving the voltage regulation point ahead of the
output inductor (at the PHASE node), droop becomes equal
to the average voltage drop across the output inductor’s DC
resistance as well as any distributed resistance. To insure
symmetric output voltage excursions about the set voltage in
response to load transients, the output voltage is offset
above the nominal level by half the calculated droop.
3
The switching regulators within HIP6017 and HIP6019
employ a lossless current sensing technique based on the
upper MOSFET’s rDS(ON). During the ON-time of the upper
MOSFET, its drain-to-source voltage is compared with a
user-adjustable voltage created by an internal current
source across ROCSET (i.e., R1, R2 in the schematic). When
the MOSFET’s drain-to-source voltage exceeds the preset
threshold, the regulator immediately shuts down all outputs
and initiates a soft-start cycle. If the condition persists, the
third shutdown latches the chip off. Cycling the bias voltage
OFF and ON resets the protection circuitry.
The linear regulator outputs employ a different method of
over-current detection. Given the relatively large rDS(ON) of
the pass devices, a short-circuit condition usually translates
into a dip in the output voltage. If the output voltage (as
sensed at the feedback pin) dips below approximately 75%
of the set point, this undervoltage is interpreted as an overcurrent event and the control IC reacts accordingly, shutting
down all outputs and cycling the soft-start.
The internal regulator is protected by an additional internal
output current mirror. Output current exceeding the preset
threshold (see data sheet) generates a similar response.
Any over-current event on any output is reported by the
toggle of the PGOOD output.
Over-Voltage Protection
Both switching regulator outputs are protected against overvoltage events. The VCC_L2 regulator (standard buck,
HIP6019EVAL1 only) has a threshold internally set at 4.3V.
The microprocessor core regulator (synchronous buck) has
a voltage-tracking over-voltage threshold set at 115%
(typically) of the DAC setting. In case of an over-voltage
event, the microprocessor core regulator attempts to
regulate the output voltage at the over-voltage threshold.
Both switching regulators report the overvoltage condition
through a high output on the FAULT/RT pin.
In addition to the normal over-voltage operation, the
microprocessor core regulator has another very useful
protection feature presented in Figures 4 and 5. In case of a
power-up sequence with a shorted upper MOSFET, and bias
voltage above 4V (typically), an independent functional block
acts upon the lower gate driver, regulating the core voltage
to around 1.3V until the controller bias voltage reaches
power-on threshold, at which point normal operation
resumes, core voltage is regulated to 115% of the DAC
setting (2.8V in this case), and fault condition is reported on
the FAULT/RT pin.
Application Note 9800
Printed Circuit Board
VDAC = 2.8V
+12VIN
1
4
FAULT/RT
+5VIN
3
VCC_CORE
2
The practical implementation of the circuit is done on a twoounce, four-layer printed circuit board. The two internal
layers are dedicated for ground and power planes. The
layout is compact and several additional footprints are
provided for increased evaluation flexibility. The
component side of the board contains an embedded
serpentine resistor (approx. 200mΩ) series with the drain of
Q4. This resistor is not necessary for the proper operation
of the circuit; its role is simply to share the power
dissipation which otherwise would be dissipated entirely by
Q4. Contact Intersil technical support at 1-888-INTERSIL for
board layout Gerber files.
Power MOSFETs
CH1 10.0V
CH3 1.00V
CH2 1.00V
CH4 10.0V
M20.0ms
CH2
2.02V
FIGURE 4. START-UP SEQUENCE WITH SHORTED Q1
(ATX CONTROL CIRCUIT BY-PASSED)
Figure 4 exemplifies operation of the evaluation board
without the help of the control circuit shown in Figure 2, the
ATX supply being shut down by its internal over-current
protection circuitry. Proper operation of this protection
feature is contingent, however, on the 12V bias voltage
being sufficiently high to turn on the lower MOSFET and the
lower MOSFET being a logic-level type. The circuit has been
tested with several ATX supplies, and they all produced
acceptable bias voltage for the operation of the protection
circuitry and the on-board logic-level UltraFET™ MOSFETs.
VDAC = 2.8V
The power transistors utilized by HIP6017/HIP6019EVAL1
belong to Intersil’ newest line of 30V UltraFET MOSFETs.
Featuring reduced rDS(ON) and low trr and Qrr, these
transistors allow for elimination of the traditional lower
MOSFET anti-parallel schottky.
HIP6017/HIP6019EVAL1 Performance
Efficiency
Figure 6 displays the laboratory-measured efficiency of the
HIP6017EVAL1 reference design versus load current, for 5V
input and 100 linear feet per minute (LFM) of airflow. Due to the
fact that the linear regulators efficiency is not a figure of merit
for the application circuit, the efficiency results were obtained
based on loading of the switching regulator output only.
95
+12VIN
EXAMPLE 1A
(VCC_CORE = 2.8V)
1
4
CONVERTER EFFICIENCY (%)
PS_ON
+5VIN
3
VCC_CORE
93
91
89
87
2
CH1 10.0V
CH3 1.00V
M 20.0ms CH2
CH2 1.00V
CH4 5.00V
2.02V
FIGURE 5. START-UP SEQUENCE WITH SHORTED Q1
(ATX CONTROL CIRCUIT ACTIVE)
Figure 5 depicts the same start-up scenario, this time with
the ATX supply control interface enabled. As seen in the
oscilloscope capture, as soon as power-on reset (POR)
thresholds are detected, the HIP6019 detects the overvoltage condition and reports it on the FAULT/RT pin. In
turn, the control circuit shuts down the ATX supply by
generating a logic high at the PS-ON input.
4
85
0
3
6
9
12
SWITCHING CONVERTER OUTPUT CURRENT (A)
15
FIGURE 6. HIP6017EVAL1 MEASURED CONVERTER
EFFICIENCY
Similarly, Figure 7 displays the efficiency obtained in the
HIP6019EVAL1 circuit. Since this evaluation platform
contains two switching regulators, both switching regulator
outputs were simultaneously loaded and measured. The
efficiency curve in Figure 7 represents a composite result of
the overall circuit efficiency plotted against total converter
output power.
UltraFET™ is a trademark of Intersil Corporation.
Application Note 9800
95
CONVERTER EFFICIENCY (%)
EXAMPLE1
(VCC_CORE = 2.8V)
93
91
89
87
should be at least 1.25 to 1.5 times the maximum input
voltage. High frequency decoupling (highly recommended) is
implemented through the use of ceramic capacitors in
parallel with the bulk aluminum capacitor filtering. The
switching converter’s input RMS current is dependent on the
input and output voltages as well as the output current.
Figure 9 shows this approximate relationships for five
different levels of current. Based on the linearity of the
relationship, the graph results can be interpolated for
additional levels of output current. For output voltages
ranging from 2 to 3V, a good approximation of the input RMS
current is 1/2 the output current.
0
40
20
60
100
80
COMBINED SWITCHING CONVERTERS OUTPUT POWER (W)
FIGURE 7. HIP6019EVAL1 MEASURED CONVERTER
EFFICIENCY
Load Transient Response
Channel 4 of the oscilloscope captures presented in Figure 8
details the core voltage regulation of a HIP6019EVAL1 in
response to a 12A output step load transient (larger than the
9.5A design point) as provided by an Intel Slot 1 Test Tool.
All other outputs are subjected to the maximum transient
loading conditions and all channels are vertically offset by
the nominal output voltage settings as described in Table 1.
APPROXIMATE INPUT RMS CURRENT (A)
10
85
VIN = 5V
IOUT = 18A
IOUT = 16A
8
IOUT = 14A
IOUT = 12A
6
IOUT = 10A
4
2
0
0
1
2
3
OUTPUT VOLTAGE (V)
4
5
FIGURE 9. SWITCHING CONVERTER RMS INPUT CURRENT
1
4
VCC_L2
Using the above graph and the capacitor RMS current
rating, a minimum number of input capacitors can be easily
determined. If the time-averaged load is different than the
maximum load, the number of input capacitors may be
cautiously scaled down.
VCC_CORE
VCC_VTT
2
3
VCC_CLK
CH1 50.0mV BW CH2 50.0mV BW
CH3 50.0mV BW CH4 50.0mV BW
M 100μs CH2
FIGURE 8. HIP6019EVAL1 OUTPUT TRANSIENT RESPONSE
HIP6017/HIP6019EVAL1 Modifications
Input Capacitors Selection
In a DC/DC converter employing an input inductor, the input
RMS current is supplied entirely by the input capacitors. The
number of input capacitors is usually determined by their
maximum RMS current rating. The voltage rating at
maximum ambient temperature of the input capacitors
5
Output Voltages
The synchronous buck converter supplying the
microprocessor core voltage is controlled by the internal
DAC. Output voltage can be adjusted by selecting the
appropriate VID jumper combination. For more information
please refer to the HIP6019 data sheet which contains a
very comprehensive table detailing all the VID combinations
and the resultant output voltages. Noteworthy is the fact the
HIP6019 can be operated with or without pull-up resistors on
the VID lines. If droop implementation is desired, the no-load
output voltage can be determined from the following
equation:
R4 + R8
V VCC – CORE = V DAC • ⎛ 1 + ----------------------⎞ , where
⎝
R9 ⎠
(EQ. 1)
VDAC = DAC-set output voltage target.
In case of the standard buck regulator, as well as the linear
regulator and controller, output voltage adjustment is based
Application Note 9800
For the standard buck regulator:
R3 + R5
V VCC – L2 = V REF • ⎛ 1 + ----------------------⎞
⎝
R6 ⎠
(EQ. 2)
For the linear controller:
R11
V VCC – VTT = V REF • ⎛ 1 + -----------⎞
⎝
R12⎠
(EQ. 3)
for the linear regulator:
100
REGULATOR PHASE MARGIN (DEGREES)
on the chip’s internal bandgap voltage reference. Simple
resistor value changes allow for outputs as low as 2.7V or as
high as 4.2V. The steady-state DC output voltages can be
set using the following equations:
90
80
70
60
1000μF
562μF
316μF
178μF
100μF
56μF
32μF
18μF
10μF
50
40
30
20
10
0
R13
V VCC – CLK = V REF • ⎛ 1 + -----------⎞ , where
⎝
R14⎠
Note the fact that since the internal regulator draws its input
power from the FB2 pin, VVCC_CLK cannot exceed the
voltage set by the user for the VVCC_L2 output. Similarly,
VVCC_VTT cannot be set higher than its input source
(VVCC_L2 in HIP6019EVAL1, and +3.3V in HIP6017EVAL1.)
Output Capacitors Selection
Selection of the output capacitors should take into account
all the component parasitics. Table 2 offers some
recommendations for the core regulator based on the output
requirements.
Sizing the output capacitor for the internal linear regulator is
a somewhat different procedure, mainly due to the fact that
the stability of this regulator depends on the characteristics
of this output capacitor. The output capacitance and ESR
determine the loop stability, and Figure 10 helps quantify the
tradeoff between the type of capacitor used and the resulting
regulator loop phase margin. As with any other design, the
selection should be made in such a way as to provide a
minimum of 45 degrees of phase margin (selection should
be made above the dotted line). Additionally, the selected
output capacitor should be able to keep the output voltage
within desired regulation limits when subjected to typical
load transients.
6
0.4
0.6
0.8
1.0
OUTPUT CAPACITOR ESR (Ω)
(EQ. 4)
VREF = HIP6019 internal reference voltage (typically 1.265V).
0.2
FIGURE 10. VCC_CLK REGULATOR LOOP PHASE MARGIN
vs OUTPUT CAPACITOR CHARACTERISTICS
Conclusion
The HIP6019EVAL1 board lends itself to a wide variety of
high-power DC-DC microprocessor converter designs. The
built-in flexibility allows the designer to quickly modify for
applications with various requirements, the printed circuit
board being laid out to accommodate the necessary
components for operation at currents up to 19A.
References
For Intersil documents available on the internet, see web site
http://www.intersil.com.
[1] HIP6019 Data Sheet, Intersil Corporation, FN4490.
[2] HIP6017 Data Sheet, Intersil Corporation, FN4496.
Application Note 9800
HIP6017EVAL1 Schematic
+12VIN
F1
+5VIN
L1
1μH
15A
GND
F2
GND
SPARE
+
C17
SPARE
R1
GND
C16
1μF
C1-13
4x1000μF
VCC
C15
1μF
1000pF
R2
28
GND2
C18
9
TP1
23
PWRGOOD
OCSET1 1.3K
8
PGOOD
SPARE
JP6
TP5
R25
+3.3VIN
Q3
SPARE
NC
L2
VCC_L2
NC
Q1
HUF76139S3S
27 UGATE1
PHASE1
26
1
2
SPARE
+
C23
1000μF
R3
SPARE
CR2
SPARE
25
24
VIN2
R5
C37
SPARE
R20
0
0
C49
V33
C38
R21
Q4
HUF75307D3S
TP6
VCC_VTT
+
R7
FB3
1.87K
+
C24-36
7x1000μF
R4
4.99K
VSEN1
C40
R8
FB1
5
19
16
12
VID0
SPARE SPARE
C42
R10
R9
0.01μF
150K
732K
0.68μF
R23
SPARE
JP0
VID1
JP1
VID2
JP2
VID3
JP3
VID4
JP4
TP7
SS
14
13
R22
C50
C41
COMP1
C48
0.039μF
17
VID[0]
VID[1]
VID[2]
VID[3]
VID[4]
GND
R24
GND
TP9
SPARE
5V
5VSB
9
14
3, 5, 7, 13
15, 16, 17
VCC_VTT VCC_L2
B113
B117
B121
6
FAULT / RT
ATX
1, 2, 11
MOTHERBOARD
CONNECTOR
A1
A3
B5
B9
R14
10K
+5VIN
J2
18
3
FB2
10K
4, 6
19, 20
10
7
VCC_CORE
2.9μH
2.21K
4
R13
12V
PGND
11
R12
10K
VOUT2
L3
Q2
HUF76139S3S
10pF
R11
+12VIN
21
LGATE1
C39
GATE3
C47
270μF
HIP6017
10K
CR1
SPARE
SPARE SPARE
C43-46
4x1000μF
+
22
20
TP8
VCC_CLK
10
U1
SPARE
SPARE SPARE
R6
SPARE
NC
15
TP4
3.3V
JP7
R26
5.1K
VCC_L2
+5VIN
1N4148
PS-ON
JP5
GND
VCC_CORE
Q5
Q6
1/2
RF1K49154
GND
VCC5
1/2
RF1K49154
VCC5 PWRGOOD VID[0] VID[1] VID[2] VID[3] VID[4]
B13, B17, B25, B29, B33, B37 A2, A6, A10, A14, A18, A22, B109
B45, B49, B53, B57, B65, B69 A26,A30, A34, A38, A42, A46,
B73, B77, B85, B89, B93, B97 A50, A54, A58, A62, A66, A70,
B105
A74, A78, A82, A86, A90, A94
J1
A98, A102, A106, A110, A114, A118
7
R27
5.1K
CR3
A12
B120 A120 A119
B119 A121
SLOT 1 EDGE CONNECTOR
Application Note 9800
HIP6019EVAL1 Schematic
+12VIN
F1
+5VIN
L1
1μH
15A
F2
+
C17
GND
GND
1000pF
R1
OCSET2
1.3K
C18
1000pF
R2
28
9
VCC_L2
UGATE2
TP3
L2
PWRGOOD
OCSET1 1.3K
8
PGOOD
PHASE2
Q1
HUF76139S3S
27 UGATE1
PHASE1
26
1
2
TP4
10K
L3
5.2μH
+
C19-23
5x1000μF
R3
4.99K
VSEN2
FB2
3.32K
R21
C49
0.68μF
R20
C38
+
R7
C39
5.11K
220K
0.1μF
R11
FB3
1.87K
10K
R14
10K
3, 5, 7, 13
15, 16, 17
J2
VCC_VTT VCC_L2
B113
B117
B121
3.3V
C40
R8
FB1
2.21K
C41
COMP1
7
18
6
5
19
16
12
VID0
SPARE SPARE
C42
R10
R9
0.01μF
150K
732K
0.68μF
R23
SPARE
JP0
VID1
JP1
VID2
JP2
VID3
JP3
VID4
JP4
TP7
SS
14
13
R22
C50
C48
0.039μF
17
VID[0]
VID[1]
VID[2]
VID[3]
VID[4]
GND
GND
TP9
JP7
R26
5.1K
VCC_L2
R27
5.1K
CR3
+5VIN
1N4148
PS-ON
JP5
GND
VCC_CORE
Q5
Q6
1/2
RF1K49154
GND
VCC5
1/2
RF1K49154
VCC5 PWRGOOD VID[0] VID[1] VID[2] VID[3] VID[4]
B13, B17, B25, B29, B33, B37 A2, A6, A10, A14, A18, A22, B109
B45, B49, B53, B57, B65, B69 A26,A30, A34, A38, A42, A46,
B73, B77, B85, B89, B93, B97 A50, A54, A58, A62, A66, A70,
B105
A74, A78, A82, A86, A90, A94
J1
A98, A102, A106, A110, A114, A118
8
R4
4.99K
5VSB
9
ATX
1, 2, 11
MOTHERBOARD
CONNECTOR
A1
A3
B5
B9
SPARE
+
C24-36
7x1000μF
VSEN1
R24
5V
14
PGND
11
FAULT / RT
4, 6
19, 20
21
3
FB4
+5VIN
12V
HIP6019
4
R13
+12VIN
10
22
R12
10K
VOUT4
C47
270μF
10
U1
LGATE1
VCC_CORE
2.9μH
CR1
Q2 SPARE
HUF76139S3S
10pF
GATE3
C43-46
4x1000μF
+
15
20
R6
TP8
VCC_CLK
COMP2
24
10pF
SPARE SPARE SPARE
Q4
HUF75307D3S
TP6
VCC_VTT
25
CR2
MBR2535CTL
R5
C37
TP5
R25
Q3
HUF76137S3S
TP2
TP1
23
JP6
+3.3VIN
C14-15
2x1μF
VCC
15A
GND
C16
1μF
C1-13
4x1000μF
A12
B120 A120 A119
B119 A121
SLOT 1 EDGE CONNECTOR
Application Note 9800
Bill of Materials for HIP6017EVAL1
REF
PART #
DESCRIPTION
PACKAGE
C1-4, 23, 28-34, 43-46 EEUFA1A10
Aluminum Capacitor, 10V, 1000μF
Radial 8x20
C5-13, 19-22, 24-27,
35, 36
Spare
Aluminum Capacitor
Radial 8x20
C14
Spare
Ceramic Capacitor
1206
C15, 16
1206YZ105MAT1A
Ceramic Capacitor, X7S, 16V, 1.0μF
1206
C17, 37-39, 49, 50
Spare
Ceramic Capacitor
0805
C18
1000pF Ceramic
Ceramic Capacitor, X7R, 25V
C40
0.68μF Ceramic
C41
QTY
VENDOR
16
Panasonic
3
AVX
0805
1
Various
Ceramic Capacitor, X7R, 16V
1206
1
AVX
10pF Ceramic
Ceramic Capacitor, X7R, 25V
0805
1
Various
C42
0.01μF Ceramic
Ceramic Capacitor, X7R, 16V
0805
1
Various
C47
6MV270GX
Aluminum Capacitor, 6.3V, 270μF
Radial 6.3x11
1
Sanyo
C48
0.039μF Ceramic
Ceramic Capacitor, X7R, 16V
0805
1
Various
CR1
Spare
Schottky Rectifier
DO215AB
CR2
Spare
Schottky Rectifier
D2-PAK
CR3
1N4148
Silicon Rectifier, 100mA, 75V
DO35
1
Motorola
F1
251015A
Miniature Fuse, 15A
Axial
1
Littelfuse
J1
71796-0005
145251-1
Slot 1 Edge Connector
1
Molex
AMP
J2
39-29-9203
20-pin Mini-Fit, Jr.TM Header Connector
1
Molex
JP6, R5, 20
0Ω
Shorting Resistor
0805
3
Various
JP7
16AWG
Jumper, Ni-plated Copper Conductor
L1
PO720
1μH Inductor, 7T of 16AWG on T50-52 Core
Wound Toroid
18x18x9
1
Pulse
L2
Spare
Inductor
Wound Toroid
20x20x10
L3
PO716
2.9μH Inductor, 9T of 16AWG on T60-52 Core Wound Toroid
20x20x10
1
Pulse
Q1, Q2
HUF76139S3S
UltraFET™ MOSFET, 30V, 7.5mΩ
TO-263
2
Intersil
Q3
Spare
MOSFET
TO-263
Q4
HUF75307D3S
UltraFET™ MOSFET, 55V, 90mΩ
TO-252
1
Intersil
Q5, 6
RF1K49154
MegaFET MOSFET, 60V, VGS(MIN) = 2V,
130mΩ
SO-8
1
Intersil
R1, 3, 6, 7, 21-24
Spare
Resistor
0805
R2
1.3kΩ
Resistor, 5%, 0.1W
0805
1
Various
R4
4.99kΩ
Resistor, 1%, 0.1W
0805
1
Various
R8
2.21kΩ
Resistor, 1%, 0.1W
0805
1
Various
R9
732kΩ
Resistor, 1%, 0.1W
0805
1
Various
R10
150kΩ
Resistor, 5%, 0.1W
0805
1
Various
R11
1.87kΩ
Resistor, 1%, 0.1W
0805
1
Various
R12-14, 25
10kΩ
Resistor, 1%, 0.1W
0805
4
Various
R26, 27
5.1kΩ
Resistor, 5%, 0.1W
0805
2
Various
9
Application Note 9800
Bill of Materials for HIP6017EVAL1
REF
(Continued)
PART #
DESCRIPTION
PACKAGE
QTY
VENDOR
+5VIN, +12VIN,
+3.3VIN, GND,
VCC_CORE,
VCC_CLK, VCC_L2,
VCC_VTT
1514-2
Terminal Post
14
Keystone
TP1,4, 7-9
SPCJ-123-01
Test Point
6
Jolo
TP3
Spare
Test Point
TP2,5,6
1314353-00
Test Point, Scope Probe
3
Tektronics
U1
HIP6017CB
Dual PWM and Dual Linear Controller
1
Intersil
SOIC-28
Bill of Materials for HIP6019EVAL1
REF
PART #
DESCRIPTION
PACKAGE
C1-4, 19-23, 28-34,
43-46
EEUFA1A102
Aluminum Capacitor, 10V, 1000μF
Radial 8x20
C5-13, 24-27, 35, 36
Spare
Aluminum Capacitor
Radial 8x20
C14-16
1206YZ105MAT1A
Ceramic Capacitor, X7S, 16V, 1.0μF
C17-18
1000pF Ceramic
C37, C40
QTY
VENDOR
20
Panasonic
1206
3
AVX
Ceramic Capacitor, X7R, 25V
0805
2
Various
0.68μF Ceramic
Ceramic Capacitor, X7R, 16V
1206
2
AVX
C38, 41
10pF Ceramic
Ceramic Capacitor, X7R, 25V
0805
2
Various
C39
0.1μF Ceramic
Ceramic Capacitor, X7R, 16V
0805
1
Various
C42
0.01μF Ceramic
Ceramic Capacitor, X7R, 16V
0805
1
Various
C47
6MV270GX
Aluminum Capacitor, 6.3V, 270μF
Radial 6.3x11
1
Sanyo
C48
0.039μF Ceramic
Ceramic Capacitor, X7R, 16V
0805
1
Various
C49-50
Spare
Ceramic Capacitor
0805
CR1
Spare
Schottky Rectifier
DO215AB
CR2
MBR2535CTL
Schottky Rectifier, 25A, 35V
D2-PAK
1
Motorola
CR3
1N4148
Silicon Rectifier, 100mA, 75V
DO35
1
Motorola
F1, 2
251015A
Miniature Fuse, 15A
Axial
2
Littelfuse
J1
71796-0005
145251-1
Slot 1 Edge Connector
1
Molex
AMP
J2
39-29-9203
20-pin Mini-Fit, Jr. Header Connector
1
Molex
JP6, 7
Spare
Jumper
L1
PO720
1μH Inductor, 7T of 16AWG on T50-52 Core
Wound Toroid
18x18x9
1
Pulse
L2
PO743
5.2μH Inductor, 13T of 16AWG on T60-52
Core
Wound Toroid
20x20x10
1
Pulse
L3
PO716
2.9μH Inductor, 9T of 16AWG on T60-52 Core Wound Toroid
20x20x10
1
Pulse
Q1, Q2
HUF76139S3S
UltraFET MOSFET, 30V, 7.5mΩ
TO-263
2
Intersil
Q3
HUF76137S3S
UltraFET MOSFET, 30V, 9mΩ
TO-263
1
Intersil
Q4
HUF75307D3S
UltraFET MOSFET, 55V, 90mΩ
TO-252
1
Intersil
Q5, 6
RF1K49154
MegaFET MOSFET, 60V, VGS(MIN) = 2V,
130mΩ
SO-8
1
Intersil
10
Application Note 9800
Bill of Materials for HIP6019EVAL1
REF
(Continued)
PART #
DESCRIPTION
PACKAGE
QTY
VENDOR
R1, 2
1.3kΩ
Resistor, 5%, 0.1W
0805
2
Various
R3, 4
4.99kΩ
Resistor, 1%, 0.1W
0805
2
Various
R5
3.32kΩ
Resistor, 1%, 0.1W
0805
1
Various
R6
5.11kΩ
Resistor, 1%, 0.1W
0805
1
Various
R7
220kΩ
Resistor, 5%, 0.1W
0805
1
Various
R8
2.21kΩ
Resistor, 1%, 0.1W
0805
1
Various
R9
732kΩ
Resistor, 1%, 0.1W
0805
1
Various
R10
150kΩ
Resistor, 5%, 0.1W
0805
1
Various
R11
1.87kΩ
Resistor, 1%, 0.1W
0805
1
Various
R12-14, 25
10kΩ
Resistor, 1%, 0.1W
0805
4
Various
R20-24
Spare
Resistor
0805
R26, 27
5.1kΩ
Resistor, 5%, 0.1W
0805
2
Various
+5VIN, +12VIN, GND,
VCC_CORE,
VCC_CLK, VCC_L2,
VCC_VTT
1514-2
Terminal Post
12
Keystone
TP1, 3, 4, 7-9
SPCJ-123-01
Test Point
6
Jolo
TP2, 5, 6
1314353-00
Test Point, Scope Probe
3
Tektronics
U1
HIP6019CB
Dual PWM and Dual Linear Controller
1
Intersil
SOIC-28
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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11
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