DATASHEET

Precision, Low Noise FGA™ Voltage References with
Disable
ISL21060
Features
The ISL21060 FGA™ voltage references are low power, high
precision voltage references fabricated on Intersil’s proprietary
Floating Gate Analog technology. A new disable feature allows
the device to shut down the output and reduce supply current
drain from 15µA operating to <500nA.
• Reference output voltage . . . . . . . . . . . . . . . . 2.048V, 2.500V,
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.000V, 3.300V, 4.096V
The ISL21060 family features guaranteed initial accuracy as
low as ±1.0mV with drift down to 10ppm/°C. Noise is typically
10µVP-P (10Hz BW). This combination of high initial accuracy,
low power and low output noise performance of the ISL21060
enables versatile high performance control and data acquisition
applications with low power consumption.
Pin Configuration
• Initial accuracy . . . . . . . . . . . . . . . . . . . . . . . . ±1.0mV, ±2.5mV
• Input voltage range
- ISL21060-20 . . . . . . . . . . . . . . . . . . . . . . . . . . .
- ISL21060-25 . . . . . . . . . . . . . . . . . . . . . . . . . . .
- ISL21060-30 . . . . . . . . . . . . . . . . . . . . . . . . . . .
- ISL21060-33 . . . . . . . . . . . . . . . . . . . . . . . . . . .
- ISL21060-41. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5V to 5.5V
2.7V to 5.5V
3.2V to 5.5V
3.5V to 5.5V
4.3V to 5.5V
• Output voltage noise . . . . . . . . . . . . . 10µVP-P (0.1Hz to 10Hz)
• Supply current . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40µA (max)
ISL21060
(6 LD SOT-23)
TOP VIEW
• Tempco . . . . . . . . . . . . . . . . . . . . . . . . 10ppm/°C, 25ppm/°C
• Output current capability . . . . . . . . . . . . . . . . +10.0mA/-5mA
• Operating temperature range. . . . . . . . . . . .-40°C to +125°C
NC
1
6
VOUTF
GND
2
5
VOUTS
• Pb-Free (RoHS compliant)
EN
3
4
VIN
Applications
• Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Ld SOT-23
• High resolution A/Ds and D/As
Pin Descriptions
PIN # PIN NAME
1
NC
2
GND
3
• Digital meters
• Bar code scanners
DESCRIPTION
• Basestations
No Connect; Do Not Connect or Connect to Ground
• Battery management/monitoring
Ground Connection
• Industrial/instrumentation equipment
EN
Enable Input. Active High. Do not Float.
4
VIN
Input Voltage Connection
Related Literature
5
VOUTS
Voltage Reference Output Connection (Sense)
6
VOUTF
Voltage Reference Output Connection (Force)
December 19, 2013
FN6706.6
1
• AN1835 “ISL21060EVAL1Z User’s Guide”
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2008, 2009, 2013. All Rights Reserved
Intersil (and design) and FGA are trademarks owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL21060
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
VOUT OPTION
(V)
GRADE
(mV)
TEMP. RANGE
(ppm/°C)
PACKAGE
(Pb-Free)
ISL21060BFH620Z-TK
GACB (Note 4)
2.048
1.0
10
6 Ld SOT-23
P6.064A
ISL21060CFH620Z-TK
GACD (Note 4)
2.048
2.5
25
6 Ld SOT-23
P6.064A
ISL21060BFH625Z-TK
GAEA (Note 4)
2.500
1.0
10
6 Ld SOT-23
P6.064A
ISL21060CFH625Z-TK
GAGA (Note 4)
2.500
2.5
25
6 Ld SOT-23
P6.064A
ISL21060BFH630Z-TK
GAHA (Note 4)
3.000
1.0
10
6 Ld SOT-23
P6.064A
ISL21060CFH630Z-TK
GAJA (Note 4)
3.000
2.5
25
6 Ld SOT-23
P6.064A
ISL21060CFH633Z-TK
GAPA (Note 4)
3.300
2.5
25
6 Ld SOT-23
P6.064A
ISL21060BFH641Z-TK
GACC (Note 4)
4.096
1.0
10
6 Ld SOT-23
P6.064A
ISL21060CFH641Z-TK
GACE (Note 4)
4.096
2.5
25
6 Ld SOT-23
P6.064A
PKG. DWG. #
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL21060BFH620, ISL21060BFH625, ISL21060BFH630,
ISL21060BFH641, ISL21060CFH620, ISL21060CFH625, ISL21060CFH630, ISL21060CFH633, ISL21060CFH641. For more information on MSL,
please see tech brief TB363.
4. The part marking is located on the bottom of the part.
2
FN6706.6
December 19, 2013
ISL21060
Absolute Voltage Ratings
Thermal Information
Max Voltage
VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V
VOUT to GND (10s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VOUT + 1V
Voltage on “DNC” pins . . . . . . . . . .No connections permitted to these pins
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5500V
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
Thermal Resistance (Typical)
θJA (°C/W)
6 Ld SOT-23 (Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
230
Continuous Power Dissipation (TA = +70°C, Note 7)
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
6 Ld SOT-23, derate 5.88mW/°C above +70°C . . . . . . . . . . . . . . . 471mW
Pb-free Reflow Profile (Note 6) . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature Range (Industrial) . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted,
all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
NOTE:
5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
6. Post-reflow drift for the ISL21060 devices will range from 100∝V to 1.0mV based on experimental results with devices tested in sockets and also on
FR4 multi-layer PC boards. The design engineer must take this into account when considering the reference voltage after assembly.
Electrical Specifications
(ISL21060-20, VOUT = 2.048V) VIN = 3.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
DESCRIPTION
VOUT
Output Voltage
VOA
VOUT Accuracy @ TA = +25°C
TC VOUT
CONDITIONS
MIN
(Note 10)
TYP
MAX
(Note 10)
2.048
UNIT
V
ISL21060B20
-1.0
+1.0
mV
ISL21060C20
-2.5
+2.5
mV
10
ppm/°C
25
ppm/°C
5.5
V
Output Voltage Temperature Coefficient ISL21060B
(Note 7)
ISL21060C
VIN
Input Voltage Range
IIN
Supply Current
VEN = VIN
16
40
µA
ΔVOUT /ΔVIN
Line Regulation
2.5V < VIN < 5.5V
50
150
µV/V
ΔVOUT/ΔIOUT
Load Regulation
Sourcing: 0mA ≤ IOUT ≤ 10mA
3
50
µV/mA
Sinking: -5mA ≤ IOUT ≤ 0mA
150
400
µV/mA
2.5
ISC
Short Circuit Current
TA = +25°C, VOUT tied to GND
50
mA
tR
Turn-on Settling Time
VOUT = ±0.1%
300
µs
Ripple Rejection
f = 10kHz
75
dB
eN
Output Voltage Noise
0.1Hz ≤ f ≤ 10Hz
10
µVP-P
VN
Broadband Voltage Noise
10Hz ≤ f ≤ 1kHz
2.5
µVRMS
Noise Density
f = 1kHz
60
nV/√Hz
ΔVOUT/ΔTA
Thermal Hysteresis (Note 8)
ΔTA = +165°C
100
ppm
ΔVOUT/Δt
Long Term Stability (Note 9)
TA = +25°C
100
ppm
OUTPUT DISABLE
VENH
Enable Logic High (ON)
VENL
Enable Logic Low (OFF)
IINSD
Shutdown Supply Current
3
1.6
VEN ≤ 0.35V
V
0.4
0.8
V
1.5
µA
FN6706.6
December 19, 2013
ISL21060
Electrical Specifications
(ISL21060-25, VOUT = 2.500V) VIN = 3.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
DESCRIPTION
VOUT
Output Voltage
VOA
VOUT Accuracy @ TA = +25°C
CONDITIONS
MIN
(Note 10)
TYP
MAX
(Note 10)
UNIT
2.500
V
ISL21060B25
-1.0
+1.0
mV
ISL21060C25
-2.5
+2.5
mV
10
ppm/°C
TC VOUT
Output Voltage Temperature Coefficient ISL21060B
(Note 7)
ISL21060C
VIN
Input Voltage Range
IIN
Supply Current
VEN = VIN
16
ΔVOUT /ΔVIN
Line Regulation
2.7V < VIN < 5.5V
50
150
µV/V
ΔVOUT/ΔIOUT
Load Regulation
Sourcing: 0mA ≤ IOUT ≤ 10mA
3
150
µV/mA
130
400
µV/mA
2.7
Sinking: -5mA ≤ IOUT ≤ 0mA
25
ppm/°C
5.5
V
40
µA
ISC
Short Circuit Current
TA = +25°C, VOUT tied to GND
50
mA
tR
Turn-on Settling Time
VOUT = ±0.1%
300
µs
Ripple Rejection
f = 10kHz
75
dB
eN
Output Voltage Noise
0.1Hz ≤ f ≤ 10Hz
10
µVP-P
VN
Broadband Voltage Noise
10Hz ≤ f ≤ 1kHz
2.5
µVRMS
Noise Density
f = 1kHz
60
nV/√Hz
ΔVOUT/ΔTA
Thermal Hysteresis (Note 8)
ΔTA = +165°C
100
ppm
ΔVOUT/Δt
Long Term Stability (Note 9)
TA = +25°C
100
ppm
OUTPUT DISABLE
VENH
Enable Logic High (ON)
VENL
Enable Logic Low (OFF)
IINSD
Shutdown Supply Current
1.6
VEN ≤ 0.35V
V
0.4
0.8
V
1.5
µA
Electrical Specifications
(ISL21060-30, VOUT = 3.000V) VIN = 3.5V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
DESCRIPTION
VOUT
Output Voltage
VOA
VOUT Accuracy @ TA = +25°C
TC VOUT
CONDITIONS
MIN
(Note 10)
TYP
MAX
(Note 10)
3.000
UNIT
V
ISL21060B30
-1.0
+1.0
mV
ISL21060C30
-2.5
+2.5
mV
10
ppm/°C
25
ppm/°C
5.5
V
Output Voltage Temperature Coefficient ISL21060B
(Note 7)
ISL21060C
VIN
Input Voltage Range
IIN
Supply Current
VEN = VIN
16
40
µA
ΔVOUT /ΔVIN
Line Regulation
3.2V < VIN < 5.5V
50
150
µV/V
ΔVOUT/ΔIOUT
Load Regulation
Sourcing: 0mA ≤ IOUT ≤ 10mA
3
50
µV/mA
Sinking: -5mA ≤ IOUT ≤ 0mA
130
400
µV/mA
3.2
ISC
Short Circuit Current
TA = +25°C, VOUT tied to GND
50
mA
tR
Turn-on Settling Time
VOUT = ±0.1%
300
µs
4
FN6706.6
December 19, 2013
ISL21060
Electrical Specifications
(ISL21060-30, VOUT = 3.000V) VIN = 3.5V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
Boldface limits apply across the operating temperature range, -40°C to +125°C. (Continued)
PARAMETER
DESCRIPTION
CONDITIONS
MIN
(Note 10)
TYP
MAX
(Note 10)
UNIT
Ripple Rejection
f = 10kHz
75
dB
eN
Output Voltage Noise
0.1Hz ≤ f ≤ 10Hz
10
µVP-P
VN
Broadband Voltage Noise
10Hz ≤ f ≤ 1kHz
2.5
µVRMS
Noise Density
f = 1kHz
60
nV/√Hz
ΔVOUT/ΔTA
Thermal Hysteresis (Note 8)
ΔTA = +165°C
100
ppm
ΔVOUT/Δt
Long Term Stability (Note 9)
TA = +25°C
100
ppm
OUTPUT DISABLE
VENH
Enable Logic High (ON)
VENL
Enable Logic Low (OFF)
IINSD
Shutdown Supply Current
1.6
VEN ≤ 0.35V
V
0.4
0.8
V
1.5
µA
Electrical Specifications
(ISL21060-33, VOUT = 3.300V) VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
DESCRIPTION
CONDITIONS
VOUT
Output Voltage
VOA
VOUT Accuracy @ TA = +25°C
ISL21060C33
TC VOUT
Output Voltage Temperature Coefficient
(Note 7)
ISL21060C
VIN
Input Voltage Range
IIN
Supply Current
EN = VIN
ΔVOUT /ΔVIN
Line Regulation
ΔVOUT/ΔIOUT
Load Regulation
MIN
(Note 10)
TYP
MAX
(Note 10)
3.300
-2.5
UNIT
V
+2.5
mV
25
ppm/°C
5.5
V
18
40
µA
3.5V < VIN < 5.5V
20
150
µV/V
Sourcing: 0mA ≤ IOUT ≤ 10mA
10
50
µV/mA
120
400
µV/mA
3.5
Sinking: -5mA ≤ IOUT ≤ 0mA
ISC
Short Circuit Current
TA = +25°C, VOUT tied to GND
tR
Turn-on Settling Time
50
mA
VOUT = ±0.1%
300
µs
Ripple Rejection
f = 10kHz
75
dB
eN
Output Voltage Noise
0.1Hz ≤ f ≤ 10Hz
10
µVP-P
VN
Broadband Voltage Noise
10Hz ≤ f ≤ 1kHz
2.5
µVRMS
Noise Density
f = 1kHz
60
nV/√Hz
ΔVOUT/ΔTA
Thermal Hysteresis (Note 8)
ΔTA = +165°C
100
ppm
ΔVOUT/Δt
Long Term Stability (Note 9)
TA = +25°C
100
ppm
OUTPUT DISABLE
VENH
Enable Logic High (ON)
VENL
Enable Logic Low (OFF)
IINSD
Shutdown Supply Current
5
1.6
VEN ≤ 0.35V
V
0.4
0.8
V
1.5
µA
FN6706.6
December 19, 2013
ISL21060
Electrical Specifications (ISL21060-41, VOUT = 4.096V) VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
DESCRIPTION
VOUT
Output Voltage
VOA
VOUT Accuracy @ TA = +25°C
TC VOUT
Output Voltage Temperature Coefficient
(Note 7)
CONDITIONS
MIN
(Note 10)
TYP
MAX
(Note 10)
UNIT
4.096
V
ISL21060B41
-1.0
+1.0
mV
ISL21060C41
-2.5
+2.5
mV
ISL21060B
10
ppm/°C
ISL21060C
25
ppm/°C
5.5
V
VIN
Input Voltage Range
IIN
Supply Current
EN = VIN
20
40
µA
ΔVOUT /ΔVIN
Line Regulation
4.3V < VIN < 5.5V
50
150
µV/V
ΔVOUT/ΔIOUT
Load Regulation
Sourcing: 0mA ≤ IOUT ≤ 10mA
10
50
µV/mA
Sinking: -5mA ≤ IOUT ≤ 0mA
130
400
µV/mA
4.3
ISC
Short Circuit Current
TA = +25°C, VOUT tied to GND
50
mA
tR
Turn-on Settling Time
VOUT = ±0.1%
300
µs
Ripple Rejection
f = 10kHz
75
dB
eN
Output Voltage Noise
0.1Hz ≤ f ≤ 10Hz
10
µVP-P
VN
Broadband Voltage Noise
10Hz ≤ f ≤ 1kHz
2.5
µVRMS
Noise Density
f = 1kHz
60
nV/√Hz
ΔVOUT/ΔTA
Thermal Hysteresis (Note 8)
ΔTA = +165°C
100
ppm
ΔVOUT/Δt
Long Term Stability (Note 9)
TA = +25°C
100
ppm
OUTPUT DISABLE
VENH
Enable Logic High (ON)
VENL
Enable Logic Low (OFF)
IINSD
Shutdown Supply Current
1.6
VEN ≤ 0.35V
V
0.4
0.8
V
1.5
µA
NOTES:
7. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the
temperature range; in this case, -40°C to +125°C = +165°C.
8. Thermal Hysteresis is the change of VOUT measured @ TA = +25°C after temperature cycling over a specified range, ΔTA. VOUT is read initially at TA = +25°C
for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25°C. The difference between the initial
VOUT reading and the second VOUT reading is then expressed in ppm. For Δ TA = +165°C, the device under test is cycled from +25°C to +125°C to
-40°C to +25°C.
9. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/√1khrs.
10. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
6
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-30) (R
3.0020
17
3.0015
16
3.0010
UNIT 3
= 100kΩ)
+125°C
15
UNIT 2
3.0000
14
IIN (µA)
3.0005
VOUT (V)
EXT
UNIT 1
2.9995
13
2.9990
12
2.9985
11
2.9980
-40
-20
0
20
40
60
80
100
10
120
+25°C
-40°C
3.0
3.5
4.0
FIGURE 1. VOUT vs TEMPERATURE, 3 UNITS
100
1.8
90
80
+125°C
1.4
-40°C
+25°C
60
IIN (µA)
IIN (µA)
5.5
70
1.2
1.0
0.8
50
+125°C
40
30
0.6
+25°C
0.4
20
10
0.2
0.0
5.0
FIGURE 2. IIN vs VIN, 3 TEMPERATURES
2.0
1.6
4.5
VIN (V)
TEMPERATURE (°C)
-40°C
0
2
1
4
3
0
5
0
1
3
VENABLE (V)
2
VIN (V)
FIGURE 3. IIN vs VIN [SLEEP MODE], 3 TEMPERATURES
4
5
6
FIGURE 4. IIN vs VENABLE, 3 TEMPERATURES
1.2
20
1.0
-10
+125°C
ΔVOUT (µV)
(NORMALIZED TO VIN = 5V)
ΔVOUT (mV)
0.8
0.6
0.4
+25°C
0.2
-40°C
0.0
-0.2
-10
-5
0
OUTPUT CURRENT (mA)
FIGURE 5. LOAD REGULATION
7
5
+25°C
-40
+125°C
-70
-100
-40°C
-130
-160
3.0
3.5
4.0
4.5
5.0
5.5
VIN (V)
FIGURE 6. LINE REGULATION OVER-TEMPERATURE
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-30) (R
= 100kΩ) (Continued)
0
3.30
+125°C
3.25
-10
-20
3.20
+25°C
PSRR (dB)
DROPOUT VOLTAGE (V)
EXT
3.15
3.10
3.05
-30
-40
-50
NO LOAD
-60
-40°C
3.00
10nF
-70
2.95
-10
-8
-6
-4
-2
0
LOAD CURRENT (mA)
-80
10
1nF
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 7. LOAD CURRENT vs DROPOUT
FIGURE 8. PSRR AT DIFFERENT CAPACITIVE LOADS
100
90
NO LOAD
80
CH2 HIGH
4.80V
ZOUT (Ω)
70
1nF
60
50
40
10nF
30
CH2 LOW
-500mV
20
10
0
1
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 10. TURN-ON TIME, NO LOAD
FIGURE 9. ZOUT vs FREQUENCY
CH2 HIGH
4.80V
CH2 LOW
-500mV
FIGURE 11. TURN-ON TIME, 1kΩ
8
FIGURE 12. LOAD TRANSIENT RESPONSE, 1nF LOAD
CAPACITANCE
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-30) (R
EXT
= 100kΩ) (Continued)
FIGURE 14. LINE TRANSIENT RESPONSE, 1nF LOAD
FIGURE 13. LOAD TRANSIENT RESPONSE, 100nF LOAD
CAPACITANCE
3.5
3.0
+125°C
2.5
VOUT (V)
2.0
1.5
1.0
+25°C
0.5
-40°C
0.0
-0.5
FIGURE 15. LINE TRANSIENT RESPONSE, 100nF
9
0
1
2
3
VEN (V)
4
5
6
FIGURE 16. VOUT vs VENABLE
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-41) (R
4.100
= 100kΩ)
24
4.099
23
4.098
UNIT 3
22
4.097
UNIT 1
21
IIN (µA)
VOUT (V)
EXT
25
UNIT 1
4.096
UNIT 2
4.095
20
19
UNIT 2
18
4.094
UNIT 3
17
4.093
16
4.092
-40
10
60
15
4.3
110
4.5
4.7
4.9
FIGURE 17. VOUT vs TEMPERATURE, 3 UNITS
5.3
5.5
FIGURE 18. IIN vs VIN, 3 TEMPERATURES
0.6
100
90
+125°C
0.5
-40°C
+25°C
80
70
0.4
+25°C
60
IIN (µA)
IIN (µA)
5.1
VIN (V)
TEMPERATURE (°C)
0.3
0.2
-40°C
50
+125°C
40
30
20
0.1
10
0.0
2
0
4
0
6
2
0
FIGURE 19. IIN vs VIN[SLEEP MODE], 3 TEMPERATURES
FIGURE 20. IIN vs VENABLE, 3 TEMPERATURES
75
0.8
VOUT (µV)
(NORMALIZED TO VIN = 5V)
0.6
ΔVOUT (mV)
0.4
0.2
+25°C
+125°C
0
-0.2
-40°C
-0.4
-0.6
-12
6
4
VENABLE (V)
VIN (V)
-10
-8
-6
-4
-2
0
LOAD CURRENT (mA)
FIGURE 21. LOAD REGULATION
10
2
4
6
+125°C
25
+25°C
-25
-40°C
-75
-125
-175
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
VIN (V)
FIGURE 22. LINE REGULATION OVER-TEMPERATURE
FN6706.6
December 19, 2013
ISL21060
4.40
0
4.35
-10
+125°C
4.25
EXT
= 100kΩ) (Continued)
1nF
-20
4.30
PSRR (dB)
DROPOUT VOLTAGE (V)
Typical Performance Curves (ISL21060-41) (R
+25°C
4.20
4.15
-30
-40
-50
-40°C
4.10
4.05
-8
-7
-6
-5
10nF
NO LOAD
-60
-70
-4
-3
-2
-1
0
LOAD CURRENT (mA)
-80
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 23. LOAD CURRENT vs DROPOUT
FIGURE 24. PSRR AT DIFFERENT CAPACITIVE LOADS
160
NO LOAD
140
1nF
120
CH2 PK-PK
-5.17V
100nF
ZOUT (Ω)
100
80
10nF
60
40
20
0
1
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 25. ZOUT vs FREQUENCY
FIGURE 26. TURN-ON TIME, NO LOAD
Δ: 8.20V
@: 6.84V
CH2 PK-PK
5.90V
FIGURE 27. TURN-ON TIME, 1kΩ
11
CH2 PK-PK
2.12V
FIGURE 28. LOAD TRANSIENT RESPONSE, 100nF LOAD
CAPACITANCE
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-41) (R
EXT
= 100kΩ) (Continued)
Δ: 2.05V
@: 1.66V
CH2 PK-PK
1.48V
CH2 PK-PK
2.12V
FIGURE 30. LINE TRANSIENT RESPONSE, 1nF LOAD
FIGURE 29. LOAD TRANSIENT RESPONSE, 1nF LOAD
CAPACITANCE
Δ: 2.05V
@: 1.66V
4.5
CH2 PK-PK
1.52V
4.0
3.5
VOUT (V)
3.0
2.5
2.0
1.5
-40°C
1.0
0.5
+125°C
0.0
0
FIGURE 31. LINE TRANSIENT RESPONSE, 100nF LOAD
CAPACITANCE
12
1
2
3
VENABLE (V)
4
5
6
FIGURE 32. VOUT vs VENABLE
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-25) (R
2.5030
16
2.5025
15
2.5020
UNIT 1
IIN (µA)
VOUT (V)
+125°C
+25°C
13
2.5010
2.5005
2.5000
= 100kΩ)
14
UNIT 2
2.5015
EXT
UNIT 3
12
-40°C
11
2.4995
10
2.4990
9
2.4985
2.4980
-50
0
50
100
8
2.5
150
3.0
3.5
4.0
4.5
VIN (V)
TEMPERATURE (°C)
FIGURE 33. VOUT vs TEMPERATURE, 3 UNITS
5.5
6.0
FIGURE 34. IIN vs VIN, 3 TEMPERATURES
0.6
90
-40°C
80
0.5
+125°C
+25°C
70
0.4
60
0.3
IIN (µA)
IIN (µA)
5.0
+25°C
0.2
+125°C
50
40
30
-40°C
20
0.1
10
0.0
1
0
2
3
VIN (V)
5
4
0
0
6
1
FIGURE 35. IIN vs VIN [SLEEP MODE], 3 TEMPERATURES
50
-40°C
0.4
0
ΔVOUT (µV)
ΔVOUT (mV)
0.2
+25°C
0
-50
-100
-40°C
-0.1
-0.2
-0.4
-12
-150
LOAD REGULATION
-0.3
6
5
+25°C
+125°C
+125°C
4
LINE REGULATION NORMALIZED AT VIN = 5
0.3
0.1
3
VENABLE (V)
FIGURE 36. IIN vs VENABLE, 3 TEMPERATURES
0.6
0.5
2
NORMALIZED TO VOUT WITH NO LOAD
-10
-8
-6
-4
-2
0
LOAD CURRENT (mA)
FIGURE 37. LOAD REGULATION
13
2
4
6
-200
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VIN (V)
FIGURE 38. LINE REGULATION OVER-TEMPERATURE
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-25) (R
EXT
= 100kΩ) (Continued)
Δ: 3.80V
@: 8.72V
3.00
CH2 PK-PK
5.83V
DROPOUT VOLTAGE (V)
2.95
2.90
+125°C
2.85
2.80
2.75
2.70
+25°C
2.65
2.60
2.55
-40°C
2.50
2.45
-11
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
LOAD CURRENT (mA)
FIGURE 39. LOAD CURRENT vs DROPOUT
FIGURE 40. TURN-ON TIME, NO LOAD
Δ: 3.80V
@: 8.72V
Δ: 1.90V
@: 3.40V
CH2 PK-PK
5.80V
CH2 PK-PK
1.54V
FIGURE 42. LOAD TRANSIENT RESPONSE, 1nF LOAD
CAPACITANCE
FIGURE 41. TURN-ON TIME, 1kΩ
Δ: 1.90V
@: 3.40V
CH2 PK-PK
1.30V
FIGURE 43. LOAD TRANSIENT RESPONSE, 100nF LOAD
CAPACITANCE
14
Δ: 1.90V
@: 4.44V
CH2 PK-PK
2.84V
FIGURE 44. LINE TRANSIENT RESPONSE, 1nF LOAD
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-25) (R
EXT
= 100kΩ) (Continued)
3.0
2.5
-40°C
2.0
VOUT (V)
1.5
1.0
+125°C
0.5
0
-0.5
+25°C
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VENABLE (V)
FIGURE 45. LINE TRANSIENT RESPONSE, 100nF
FIGURE 46. VOUT vs VENABLE
Typical Performance Curves (ISL21060-20) (R
2.052
= 100kΩ)
14
13
2.051
UNIT 2
+125°C
12
2.050
11
IIN (µA)
VOUT (V)
EXT
UNIT 1
2.049
UNIT 3
2.048
10
9
8
2.047
7
2.046
-50
0
50
TEMPERATURE (°C)
100
6
150
3
2
5
4
VIN (V)
6
FIGURE 48. IIN vs VIN, 3 TEMPERATURES
FIGURE 47. VOUT vs TEMPERATURE, 3 UNITS
90
0.7
+125°C
0.6
80
-40°C
70
0.5
+25°C
60
0.4
IIN (µA)
IIN (µA)
-40°C
+25°C
0.3
50
+125°C
40
-40°C
+25°C
30
0.2
20
0.1
0
10
0
1
3
2
4
5
VIN (V)
FIGURE 49. IIN vs VIN [SLEEP MODE], 3 TEMPERATURES
15
6
0
0
1
2
3
4
5
6
VENABLE (V)
FIGURE 50. IIN vs VENABLE, 3 TEMPERATURES
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-20) (R
0.6
50
-40°C
0.2
CHANGE IN OUTPUT (µV)
VOLTAGE DIFF (mV)
= 100kΩ) (Continued)
100
0.4
+25°C
0
-0.2
EXT
+125°C
-0.4
+25°C
0
-50
-100
-40°C
-150
-200
+125°C
-250
-300
-0.6
-12
-10
-8
-6
-4
-2
0
2
4
-350
6
2
3
4
VIN (V)
LOAD (mA)
FIGURE 51. LOAD REGULATION
5
6
FIGURE 52. LINE REGULATION OVER-TEMPERATURE
2.8
0
2.7
-10
2.6
-20
+125°C
2.5
PSRR (dB)
DROPOUT VOLTAGE
NO LOAD
2.4
+25°C
2.3
1nF
-30
-40
-50
10nF
-60
2.2
-40°C
2.1
2.0
-12
-10
-70
-8
-6
-4
-2
0
LOAD CURRENT (mA)
-80
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 53. LOAD CURRENT vs DROPOUT
FIGURE 54. PSRR AT DIFFERENT CAPACITIVE LOADS
90
80
NO LOAD
70
ZOUT (Ω)
60
10nF
50
40
1nF
30
20
10
0
1
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 55. ZOUT vs FREQUENCY
16
FIGURE 56. TURN-ON TIME, NO LOAD
FN6706.6
December 19, 2013
ISL21060
Typical Performance Curves (ISL21060-20) (R
FIGURE 57. TURN-ON TIME, 1kΩ
EXT
= 100kΩ) (Continued)
FIGURE 58. LOAD TRANSIENT RESPONSE, 1nF LOAD
CAPACITANCE
FIGURE 60. LINE TRANSIENT RESPONSE, 1nF LOAD
FIGURE 59. LOAD TRANSIENT RESPONSE, 100nF LOAD
CAPACITANCE
2.5
2.0
-40°C
VOUT (V)
1.5
1.0
0.5
+125°C
0.0
-0.5
FIGURE 61. LINE TRANSIENT RESPONSE, 100nF
17
+25°C
0
1
2
3
VENABLE (V)
4
5
6
FIGURE 62. VOUT vs VENABLE
FN6706.6
December 19, 2013
ISL21060
FGA Technology
Board Assembly Considerations
The ISL21060 voltage reference floating gate references possess
very low drift and supply current. The charge stored on a floating
gate cell is set precisely in manufacturing. The reference voltage
output itself is a buffered version of the floating gate voltage. The
resulting reference device has excellent characteristics which are
unique in the industry and include very low temperature drift, high
initial accuracy, and almost zero supply current. Also, the reference
voltage itself is not limited by voltage bandgaps or zener settings,
so a wide range of reference voltages can be programmed
(standard voltage settings are provided, but customer-specific
voltages are available).
FGA™ references provide high accuracy and low temperature
drift but some PC board assembly precautions are necessary.
Normal Output voltage shifts of 100µV to 1mV can be expected
with Pb-free reflow profiles or wave solder on multi-layer FR4 PC
boards. Precautions should be taken to avoid excessive heat or
extended exposure to high reflow or wave solder temperatures,
this may reduce device initial accuracy.
The process used for these reference devices is a floating gate
CMOS process, and the amplifier circuitry uses CMOS transistors
for amplifier and output drive. This circuitry provides excellent
accuracy with a trade-off in output noise level and load
regulation due to the MOS device characteristics. These
limitations are addressed with circuit techniques discussed in
other sections.
Micropower Supply Current and Output
Enable
The ISL21060 consumes extremely low supply current due to the
proprietary FGA technology. Low noise performance is achieved
using optimized biasing techniques. Supply current is typically
16µA and noise is 10µVP-P, benefitting precision, low noise
portable applications, such as handheld meters and instruments.
The ISL21060 devices have the EN pin, which is used to
Enable/Disable the output of the device. When disabled, the
reference circuitry itself remains biased at a highly accurate and
reliable state. When enabled, the output is driven to the reference
voltage in a relatively short time (about 300∝s). This feature
allows multiple references to be connected and one of them
selected. Another application is to disable any loads that draw
significant current, saving power in standby or shutdown modes.
Board Mounting Considerations
For applications requiring the highest accuracy, board mounting
location should be reviewed. The device uses a plastic SOIC
package, which will subject the die to mild stresses when the PC
board is heated and cooled and slightly changes shape. Placing
the device in areas subject to slight twisting can cause
degradation of the accuracy of the reference voltage due to these
die stresses. It is normally best to place the device near the edge
of a board, or the shortest side, as the axis of bending is most
limited at that location. Mounting the device in a cutout also
minimizes flex. Obviously, mounting the device on flexprint or
extremely thin PC material will likewise cause loss of reference
accuracy.
18
Post-assembly x-ray inspection may also lead to permanent
changes in device output voltage and should be minimized or
avoided. If x-ray inspection is required, it is advisable to monitor
the reference output voltage to verify excessive shift has not
occurred. If large amounts of shift are observed, it is best to add an
X-ray shield consisting of thin zinc (300µm) sheeting to allow clear
imaging, yet block x-ray energy that affects the FGA™ reference.
Special Applications Considerations
In addition to post-assembly examination, there are also other
X-ray sources that may affect the FGA™ reference long term
accuracy. Airport screening machines contain X-rays and will
have a cumulative effect on the voltage reference output
accuracy. Carry-on luggage screening uses low level X-rays and is
not a major source of output voltage shift, although if a product
is expected to pass through that type of screening over 100 times
it may need to consider shielding with copper or aluminum.
Checked luggage X-rays are higher intensity and can cause
output voltage shift in much fewer passes, so devices expected to
go through those machines should definitely consider shielding.
Note that just two layers of 1/2 ounce copper planes will reduce
the received dose by over 90%. The leadframe for the device
which is on the bottom also provides similar shielding.
If a device is expected to pass through luggage X-ray machines
numerous times, it is advised to mount a 2-layer (minimum) PC
board on the top, and along with a ground plane underneath will
effectively shield it from 50 to 100 passes through the machine.
Since these machines vary in X-ray dose delivered, it is difficult to
produce an accurate maximum pass recommendation.
Noise Performance and Reduction
The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically
10µVP-P. The noise measurement is made with a bandpass filter
made of a 1-pole high-pass filter with a corner frequency at 0.1Hz
and a 2-pole low-pass filter with a corner frequency at 12.6Hz to
create a filter with a 9.9Hz bandwidth. Noise in the 10kHz to 1MHz
bandwidth is approximately 100µVP-P with no capacitance on the
output. This noise measurement is made with a 2 decade
bandpass filter made of a 1-pole high-pass filter with a corner
frequency at 1/10 of the center frequency and 1-pole low-pass filter
with a corner frequency at 10x the center frequency. Load
capacitance up to 1µF can be added to improve transient response.
FN6706.6
December 19, 2013
ISL21060
Turn-On Time
The ISL21060 devices have low supply current and thus the time
to bias-up internal circuitry to final values will be longer than with
higher power references. Normal turn-on time is typically 300µs.
Circuit design must take this into account when looking at
power-up delays or sequencing.
Temperature Coefficient
The limits stated for temperature coefficient (tempco) are
governed by the method of measurement. The overwhelming
standard for specifying the temperature drift of a reference is to
measure the reference voltage at two temperatures take the
total variation, (VHIGH – VLOW), and divide by the temperature
extremes of measurement (THIGH – TLOW). The result is divided by
the nominal reference voltage (at T = +25°C) and multiplied by
106 to yield ppm/°C. This is the “Box” method for specifying
temperature coefficient.
VOUT Kelvin Sensing
The voltage output for the ISL21060 has both a force and a sense
output. This enables remote kelvin sensing for highly accurate
voltage setting with long traces and higher current loads. The VOUTF
(force) can be routed to the load with the shortest, widest trace
possible. The VOUTS (sense) is routed with a narrower trace to the
point of the actual load where it is connected to the VOUTF trace.
The VOUTF and VOUTS traces must always be connected. If there
is only a short trace to the load or even a very light load, then
they can be connected at or near the ISL21060 device.
19
FN6706.6
December 19, 2013
ISL21060
Typical Application Circuits
+2.7 TO 5.5V
10µF
0.1µF
LOGIC
ENABLE
VIN
EN
VOUTF
VOUTS
ISL21060-25
VOUT = 2.50V
GND
0.001µF
VCC
RH
VOUT
X9119
(UNBUFFERED)
+
SDA
2-WIRE BUS
EL8178
SCL
VSS
-
VOUT
(BUFFERED)
RL
FIGURE 63. 2.5V FULL SCALE LOW-DRIFT, 10-BIT ADJUSTABLE VOLTAGE SOURCE WITH LOW POWER DISABLE
+2.75V TO 5.5V
0.1µF
LOGIC
ENABLE
10µF
VIN
EN
VOUTF
VOUTS
ISL21060-25
VOUT = 2.50V
GND
VOUT SENSE
SEPARATE COPPER TRACE FOR
SENSE INPUT
LOAD
FIGURE 64. KELVIN SENSED LOAD
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
20
FN6706.6
December 19, 2013
ISL21060
Package Outline Drawing
P6.064A
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 0, 2/10
1.90
0-3°
0.95
D
0.08-0.20
A
5
6
4
PIN 1
INDEX AREA
2.80
3
1.60
3
0.15 C D
2x
1
(0.60)
3
2
0.20 C
2x
0.40 ±0.05
B
5
SEE DETAIL X
3
0.20 M C A-B
D
TOP VIEW
2.90
5
END VIEW
10° TYP
(2 PLCS)
0.15 C A-B
2x
H
1.14 ±0.15
C
SIDE VIEW
0.10 C
0.05-0.15
1.45 MAX
SEATING PLANE
DETAIL "X"
(0.25) GAUGE
PLANE
0.45±0.1
4
(0.60)
(1.20)
NOTES:
(2.40)
(0.95)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3.
Dimension is exclusive of mold flash, protrusions or gate burrs.
4.
Foot length is measured at reference to guage plane.
5.
This dimension is measured at Datum “H”.
6.
Package conforms to JEDEC MO-178AA.
(1.90)
TYPICAL RECOMMENDED LAND PATTERN
21
FN6706.6
December 19, 2013
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