485EF

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN28 5x5, 0.5P
CASE 485EF
ISSUE A
DATE 25 NOV 2015
1 28
SCALE 2:1
A
B
D
PIN ONE
REFERENCE
ÏÏ
ÏÏ
L
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
0.15 C
0.15 C
ÏÏ
ÎÎ
EXPOSED Cu
TOP VIEW
A
DETAIL B
0.10 C
(A3)
A1
DETAIL B
ALTERNATE
CONSTRUCTION
0.08 C
C
SIDE VIEW
NOTE 4
DETAIL A
SEATING
PLANE
D2
GENERIC
MARKING DIAGRAM*
1
8
28X
MOLD CMPD
MILLIMETERS
MIN
MAX
1.00
0.80
0.00
0.05
0.20 REF
0.18
0.30
5.00 BSC
3.75
3.45
5.00 BSC
3.45
3.75
0.50 BSC
0.35
0.45
−−−
0.15
XXXXXXXX
XXXXXXXX
AWLYYWWG
G
15
L
E2
1
28
22
28X
e
b
0.10
M
C A B
0.05
M
C
BOTTOM VIEW
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
5.30
28X
0.60
3.80
XXXXX = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
1
3.80 5.30
0.50
PITCH
28X
0.32
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON04196G
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN28 5X5, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON04196G
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM AXSEM. REQ. BY D. TRUHITTE.
30 AUG 2015
A
JEDEC FORMATTED DRAWING ADDED. REQ. BY D. TRUHITTE.
25 NOV 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. A
Case Outline Number:
485EF