932F-01

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TQFP48 EP 7x7, 0.5P
CASE 932F
ISSUE C
SCALE 2:1
D
NOTE 7
D
25
37
NOTE 7
A
NOTES
4&6
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL BE 0.08 MAX. AT MMC. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OF THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSION AND ADJACENT LEAD IS 0.07.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD FLASH, PROTRU­
SIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.25 PER SIDE. DIMENSIONS D1 AND E1
ARE MAXIMUM PLASTIC BODY SIZE INCLUDING MOLD MISMATCH.
5. THE TOP PACKAGE BODY SIZE MAY BE SMALLER THAN THE BOTTOM
PACKAGE SIZE BY AS MUCH AS 0.15.
6. DATUMS A-B AND D ARE DETERMINED AT DATUM PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING
PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
8. DIMENSIONS D AND E TO BE DETERMINED AT DATUM PLANE C.
0.20 C A-B D
NOTE 9
NOTE 7
DATE 16 APR 2013
4X 12 TIPS
B
E1
E
NOTE 9
DIM
A
A1
A2
b
D
D1
D2
E
E1
E2
e
L
L2
M
13
48
1
D1
4X
NOTES 4 & 6
0.20 H A-B D
TOP VIEW
DETAIL A
H
A
L2
A2
0.05
0.08 C
A1
e
48X
SIDE VIEW
DETAIL A
SEATING
C PLANE
b
0.20 C A-B D
M
L
MILLIMETERS
MIN
MAX
0.95
1.25
0.05
0.15
0.90
1.20
0.17
0.27
9.00 BSC
7.00 BSC
4.90
5.10
9.00 BSC
7.00 BSC
4.90
5.10
0.50 BSC
0.45
0.75
0.25 BSC
0°
7°
GENERIC
MARKING DIAGRAM*
NOTE 3
D2
XXXXXXXXXX
XXXXXXXXXX
AWLYYWWG
RECOMMENDED
SOLDERING FOOTPRINT*
E2
9.36
1.13
5.30
BOTTOM VIEW
1
48X
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
9.36 *This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
5.30
1
0.50
PITCH
48X
0.29
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON11438D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD: JEDEC
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
TQFP48 EP 7x7, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON11438D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. J. LETTERMAN.
27 FEB 2002
A
ADDED MARKING DIAGRAM. REQ. BY J. LETTERMAN.
21 MAY 2002
B
REDRAWN TO JEDEC STANDARDS. REQ. BY J. LETTERMAN.
31 JAN 2013
C
REVERSED & CORRECTED TOP VIEW PIN NUMBERS. REQ. BY I. CAMBALIZA.
16 APR 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. C
Case Outline Number:
932F
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