485M

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN52 8x8, 0.5P
CASE 485M−01
ISSUE C
1
52
D
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
PIN ONE
REFERENCE
DATE 16 FEB 2010
B
DIM
A
A1
A2
A3
b
D
D2
E
E2
e
K
L
E
2X
0.15 C
2X
0.15 C
A2
0.10 C
GENERIC MARKING
DIAGRAM
A
0.08 C
SEATING PLANE
A3
A1
1
REF
C
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
D2
14
52 X
L
26
27
13
XXXXXXXXX
A
WL
YY
WW
G
E2
39
1
52 X
K
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.60
0.80
0.20 REF
0.18
0.30
8.00 BSC
6.50
6.80
8.00 BSC
6.50
6.80
0.50 BSC
0.20
--0.30
0.50
52
40
e
52 X
b
= Device Code
= Assembly Site
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
RECOMMENDED
SOLDERING FOOTPRINT
NOTE 3
0.10 C A B
8.30
0.05 C
52X
0.62
6.75
6.75
PKG
OUTLINE
DOCUMENT NUMBER:
98AON12057D
0.50
PITCH
8.30
52X
0.30
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STANDARD
STATUS:
© Semiconductor Components
Industries,ON
LLC,SEMICONDUCTOR
2002
1
Outline
Number:
versions are uncontrolled exceptCase
when
stamped
October, 2002 − Rev. 01O
485M
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case
Outline
Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
2
52 PIN QFN, 8X8, 0.5P
1
DOCUMENT NUMBER:
98AON12057D
PAGE 2 OF 2
ISSUE
REVISION
DATE
A
CHANGED DIMENSIONS B AND L. REQ. BY P. CELAYA.
30 JUN 2005
B
CORRECTED DIMENSION L LABEL REFERENCE ON BOTTOM VIEW. REQ. BY
P. CELAYA
14 OCT 2008
C
ADDED SOLDERING FOOTPRINT. REQ. BY E. RUPNOW.
16 FEB 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 01C
Case Outline Number:
485M
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