510AZ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WQFN32 5x5, 0.5P / VQFN32U
CASE 510AZ
ISSUE A
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON81349E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
WQFN32 5X5, 0.5P / VQFN32U1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
DATE 05 DEC 2013
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
3
WQFN32 5x5, 0.5P / VQFN32U
CASE 510AZ
ISSUE A
DATE 05 DEC 2013
SOLDERING FOOTPRINT*
4.70
(Unit: mm)
0.20
0.70
(3.5)
4.70
(3.5)
0.30
0.50
NOTES:
1. The measurements are not to guarantee but for reference only.
2. Module level verification after set designing must be implemented. Validating solderbility and
Reliability verification for joint areas such as Exposed Die−pad and must be carried out.
*For additional information on our Pb−Free strategy and soldering details, please download the
ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC MARKING DIAGRAM*
XXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
XXXXXX
YDD
XXXXX = Specific Device Code
Y = Year
DD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON81349E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
WQFN32 5X5, 0.5P / VQFN32U2
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 2 OFXXX
3
DOCUMENT NUMBER:
98AON81349E
PAGE 3 OF 3
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−580 TO ON
SEMICONDUCTOR. REQ. BY D. TRUHITTE.
30 JUN 2012
A
ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQ. BY D.
TRUHITTE.
05 DEC 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2013
December, 2013 − Rev. A
Case Outline Number:
510AZ
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