940AK

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SSOP24 NB EP
CASE 940AK
ISSUE O
DATE 24 APR 2012
SCALE 1:1
2X
0.20 C A-B
NOTE 4
NOTE 6
D
D
A
2X
24
L1
H
13
L2
0.20 C
NOTE 5
GAUGE
PLANE
ÉÉÉ
ÉÉÉ
E1
PIN 1
REFERENCE
e
E
L
DETAIL A
A1
C
NOTE 7
1
12
B
24X
NOTE 6
TOP VIEW
SEATING
PLANE
0.20 C
b
0.12
A
2X 12 TIPS
M
C A-B D
DETAIL A
A2
h
h
0.10 C
M
0.10 C
24X
SIDE VIEW
0.15
M
C A-B D
A1
C
SEATING
PLANE
c
END VIEW
NOTE 8
D2
0.15
E2
M
C A-B D
NOTE 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
BE 0.10 MAX. AT MMC. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OF THE
FOOT. DIMENSION b APPLIES TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.10 TO 0.25
FROM THE LEAD TIP.
4. DIMENSION D DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 PER SIDE. DIMENSION D IS
DETERMINED AT DATUM PLANE H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25 PER
SIDE. DIMENSION E1 IS DETERMINED AT
DATUM PLANE H.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
8. CONTOURS OF THE THERMAL PAD ARE UNCONTROLLED WITHIN THE REGION DEFINED
BY DIMENSIONS D2 AND E2.
DIM
A
A1
A2
b
c
D
D2
E
E1
E2
e
h
L
L1
L2
M
MILLIMETERS
MIN
MAX
--1.70
0.00
0.10
1.10
1.65
0.19
0.30
0.09
0.20
8.64 BSC
5.28
5.58
6.00 BSC
3.90 BSC
2.44
2.64
0.65 BSC
0.25
0.50
0.40
0.85
1.00 REF
0.25 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT
XXXXXXXXXG
AWLYYWW
5.63
XXXX = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
24X
1.15
2.84 6.40
1
24X
0.65
PITCH
0.40
*This information is generic. Please refer
to device data sheet for actual part
marking.
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
STATUS:
98AON79998E
ON SEMICONDUCTOR STANDARD
1
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SSOP24 NB EP
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON79998E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. FONTES.
DATE
24 APR 2012
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2012
April, 2012 − Rev. O
Case Outline Number:
940AK
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