DATASHEET

ICL7667
Data Sheet
September 4, 2015
FN2853.7
Dual Power MOSFET Driver
Features
The ICL7667 is a dual monolithic high-speed driver designed
to convert TTL level signals into high current outputs at
voltages up to 15V. Its high speed and current output enable
it to drive large capacitive loads with high slew rates and low
propagation delays. With an output voltage swing only
millivolts less than the supply voltage and a maximum supply
voltage of 15V, the ICL7667 is well suited for driving power
MOSFETs in high frequency switched-mode power
converters. The ICL7667’s high current outputs minimize
power losses in the power MOSFETs by rapidly charging
and discharging the gate capacitance. The ICL7667’s inputs
are TTL compatible and can be directly driven by common
pulse-width modulation control ICs.
• Fast Rise and Fall Times
- 30ns with 1000pF Load
Ordering Information
• Pin Equivalent to DS0026/DS0056; TSC426
PART
NUMBER
(Note)
PART
MARKING
TEMP.
RANGE
(°C)
• Wide 15V Supply Voltage Range
- V+ = +4.5V to +15V
- V- = -15V to Ground (0V)
• Low Power Consumption
- 4mW with Inputs Low
- 20mW with Inputs High
• TTL/CMOS Input Compatible Power Driver
- ROUT = 7 Typ
• Direct Interface with Common PWM Control ICs
• Pb-Free Available (RoHS Compliant)
PACKAGE
PKG.
DWG. #
7667 CBA
ICL7667CBA*
(No longer
available,
recommended
replacement:
ICL7667CBAZA)
0 to 70
ICL7667CBAZA
7667 CBAZ
0 to 70
8 Ld SOIC (N) M8.15
(Pb-Free)
ICL7667CPA*
7667 CPA
0 to 70
8 Ld PDIP
E8.3
ICL7667CPAZ
7667 CPAZ
0 to 70
8 Ld PDIP**
(Pb-Free)
E8.3
8 Ld SOIC (N) M8.15
Applications
• Switching Power Supplies
• DC/DC Converters
• Motor Controllers
Pinout
ICL7667
(8 LD PDIP, SOIC)
TOP VIEW
*Add “-T” suffix for tape and reel. Please refer to TB347 for details
on reel specifications.
**Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination
finish, which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations). Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
N/C
1
8
N/C
IN A
2
7
OUT A
V-
3
6
V+
IN B
4
5
OUT B
Functional Diagram (Each Driver)
V+
 2mA
OUT
IN
V-
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas LLC.
Copyright Intersil Americas LLC. 1999, 2006, 2010, 2015. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ICL7667
Absolute Maximum Ratings
Thermal Information
Supply Voltage V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . V- -0.3V to V+ +0.3V
Package Dissipation, TA +25°C . . . . . . . . . . . . . . . . . . . . . . .500mW
Thermal Resistance (Typical, Note 1, 2)
Operating Conditions
ICL7667C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0° to +70°C
Supply Voltages: V+ = +4.5V to +15V; V- = Ground to -15V
Logic Inputs: Logic Low = V- < Vin < 0.8V ; Logic High = 2.0V< Vin <
V+
JA (°C/W)
JC(°C/W)
8 Ld PDIP Package . . . . . . . . . . . . . . .
150
N/A
8 Ld SOIC Package . . . . . . . . . . . . . . .
170
N/A
Maximum Storage Temperature Range . . . . . . . . . . . -65° to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. JA is measured with the component mounted on an evaluation PC board in free air.
2. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
PARAMETER
Parameters with MIN and/or MAX limits are 100% tested at +25°C, V+ = 0V unless otherwise specified.
Temperature limits established by characterization and are not production tested.
SYMBOL
TEST CONDITIONS
ICL7667C, M
ICL7667M
TA = +25°C
0°C TA  +70°C
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
DC SPECIFICATIONS
Logic 1 Input Voltage
VIH
V+ = 4.5V
2.0
-
-
2.0
-
-
V
Logic 1 Input Voltage
VIH
V+V+ = 15V
2.0
-
-
2.0
-
-
V
Logic 0 Input Voltage
VIL
V+ = 4.5V
-
-
0.8
-
-
0.5
V
Logic 0 Input Voltage
VIL
V+ = 15V
-
-
0.8
-
-
0.5
V
Input Current
IIL
V+ = 15V, VIN = 0V and 15V
-0.1
-
0.1
-0.1
-
0.1
µA
Output Voltage High
VOH
V+ = 4.5V and 15V
V+ -0.05
V+
-
V+ -0.1
V+
-
V
Output Voltage Low
VOL
V+ = 4.5V and 15V
-
0
0.05
-
-
0.1
V
Output Resistance
ROUT
VIN = VIL, IOUT = -10mA, V+ = 15V
-
7
10
-
-
12

Output Resistance
ROUT
VIN = VIH, IOUT = 10mA, V+ = 15V
-
8
12
-
-
13

Power Supply Current
ICC
V+ = 15V, VIN = 3V both inputs
-
5
7
-
-
8
mA
Power Supply Current
ICC
V+ = 15V, VIN = 0V both inputs
-
150
400
-
-
400
µA
SWITCHING SPECIFICATIONS
Delay Time
TD2
(Figure 3)
-
35
50
-
-
60
ns
Rise Time
TR
(Figure 3)
-
20
30
-
-
40
ns
Fall Time
TF
(Figure 3)
-
20
30
-
-
40
ns
TD1
(Figure 3)
-
20
30
-
-
40
ns
Delay Time
2
FN2853.7
September 4, 2015
ICL7667
Test Circuits
V+ = 15V
+5V
+
4.7µF
90%
INPUT
0.1µF
10%
0.4V
INPUT
TD1
OUTPUT
CL = 1000pF
ICL7667
INPUT RISE AND
FALL TIMES  10ns
TD2
tr
tf
15V
90%
90%
OUTPUT
10%
10%
0V
Typical Performance Curves
1µs
100
V+ = 15V
90
TD1 AND TD2 (ns)
80
tr AND tf (ns)
100
tRISE
10
CL = 1nF
V+ = 15V
70
60
TD2
50
40
TD1
30
20
tFALL
10
1
10
100
1000
10k
0
100k
-55
CL (pF)
FIGURE 1. RISE AND FALL TIMES vs CL
0
25
70
TEMPERATURE (°C)
125
FIGURE 2. TD1, TD2 vs TEMPERATURE
30
50
CL = 1nF
V+ = 15V
40
V+ = 15V
200kHz
10
30
IV+ (mA)
tr AND tf (ns)
tr AND tf
20
20kHz
3.0
10
0
-55
0
25
70
TEMPERATURE (°C)
FIGURE 3. tr , tf vs TEMPERATURE
3
125
1.0
10
100
1k
CL (pF)
10k
100k
FIGURE 4. IV+ vs CL
FN2853.7
September 4, 2015
ICL7667
Typical Performance Curves (Continued)
100
100
IV+ (mA)
IV+ (mA)
V+ = 15V
10
V+ = 15V
10
V+ = 5V
1
1
V+ = 5V
CL = 1nF
100µA
10k
100k
1M
10M
CL = 10pF
100mA
10k
100k
FREQUENCY (Hz)
FIGURE 6. NO LOAD IV+ vs FREQUENCY
50
50
40
40
tr AND tD2 (ns)
tD1 AND tf (ns)
FIGURE 5. IV+ vs FREQUENCY
30
tf
20
tD1
CL = 1nF
10
V+ (V)
30
tr = TD2
20
10
10
0
5
10M
1M
FREQUENCY (Hz)
15
CL = 10pF
0
5
FIGURE 7. DELAY AND FALL TIMES vs V+
10
V+ (V)
15
FIGURE 8. RISE TIME vs V+
Detailed Description
Input Stage
The ICL7667 is a dual high-power CMOS inverter whose
inputs respond to TTL levels while the outputs can swing as
high as 15V. Its high output current enables it to rapidly
charge and discharge the gate capacitance of power
MOSFETs, minimizing the switching losses in switchmode
power supplies. Since the output stage is CMOS, the output
will swing to within millivolts of both V- and V+ without any
external parts or extra power supplies as required by the
DS0026/56 family. Although most specifications are at
V+ = 15V, the propagation delays and specifications are
almost independent of V+.
The input stage is a large N-Channel FET with a P-Channel
constant-current source. This circuit has a threshold of about
1.5V, relatively independent of the V+ voltage. This means
that the inputs will be directly compatible with TTL over the
entire 4.5V - 15V V+ range. Being CMOS, the inputs draw
less than 1µA of current over the entire input voltage range
of V- to V+. The quiescent current or no load supply current
of the ICL7667 is affected by the input voltage, going to
nearly zero when the inputs are at the 0 logic level and rising
to 7mA maximum when both inputs are at the 1 logic level. A
small amount of hysteresis, about 50mV to 100mV at the
input, is generated by positive feedback around the second
stage.
In addition to power MOS drivers, the ICL7667 is well suited
for other applications such as bus, control signal, and clock
drivers on large memory of microprocessor boards, where
the load capacitance is large and low propagation delays are
required. Other potential applications include peripheral
power drivers and charge-pump voltage inverters.
4
Output Stage
The ICL7667 output is a high-power CMOS inverter,
swinging between V- and V+. At V+ = 15V, the output
impedance of the inverter is typically 7. The high peak
FN2853.7
September 4, 2015
ICL7667
current capability of the ICL7667 enables it to drive a
1000pF load with a rise time of only 40ns. Because the
output stage impedance is very low, up to 300mA will flow
through the series N-Channel and P-Channel output devices
(from V+ to V-) during output transitions. This crossover current
is responsible for a significant portion of the internal power
dissipation of the ICL7667 at high frequencies. It can be
minimized by keeping the rise and fall times of the input to the
ICL7667 below 1µs.
Application Notes
Although the ICL7667 is simply a dual level-shifting inverter,
there are several areas to which careful attention must be
paid.
Grounding
Since the input and the high current output current paths
both include the V- pin, it is very important to minimize and
common impedance in the ground return. Since the ICL7667
is an inverter, any common impedance will generate
negative feedback, and will degrade the delay, rise and fall
times. Use a ground plane if possible, or use separate
ground returns for the input and output circuits. To minimize
any common inductance in the ground return, separate the
input and output circuit ground returns as close to the
ICL7667 as is possible.
Bypassing
The rapid charging and discharging of the load capacitance
requires very high current spikes from the power supplies. A
parallel combination of capacitors that has a low impedance
over a wide frequency range should be used. A 4.7µF
tantalum capacitor in parallel with a low inductance 0.1µF
capacitor is usually sufficient bypassing.
Output Damping
Ringing is a common problem in any circuit with very fast
rise or fall times. Such ringing will be aggravated by long
inductive lines with capacitive loads. Techniques to reduce
ringing include:
• Reduce inductance by making printed circuit board traces
as short as possible.
• Reduce inductance by using a ground plane or by closely
coupling the output lines to their return paths.
• Use a 10 to 30 resistor in series with the output of the
ICL7667. Although this reduces ringing, it will also slightly
increase the rise and fall times.
• Use good by-passing techniques to prevent supply
voltage ringing.
Power Dissipation
The power dissipation of the ICL7667 has three main
components:
1. Input inverter current loss
5
2. Output stage crossover current loss
3. Output stage I2R power loss
The sum of the above must stay within the specified limits for
reliable operation.
As noted above, the input inverter current is input voltage
dependent, with an IV+ of 0.1mA maximum with a logic 0
input and 6mA maximum with a logic 1 input.
The output stage crowbar current is the current that flows
through the series N-Channel and P-Channel devices that
form the output. This current, about 300mA, occurs only
during output transitions. Caution: The inputs should never
be allowed to remain between VIL and VIH since this could
leave the output stage in a high current mode, rapidly
leading to destruction of the device. If only one of the drivers
is being used, be sure to tie the unused input to V- or
ground. NEVER leave an input floating. The average supply
current drawn by the output stage is frequency dependent,
as can be seen in Figure 5 (IV+ vs Frequency graph in the
Typical Characteristics Graphs).
The output stage I2R power dissipation is nothing more than
the product of the output current times the voltage drop
across the output device. In addition to the current drawn by
any resistive load, there will be an output current due to the
charging and discharging of the load capacitance. In most
high frequency circuits the current used to charge and
discharge capacitance dominates, and the power dissipation
is approximately:
(EQ. 1)
P AC = CV V 2 f
where C = Load Capacitance, f = Frequency
In cases where the load is a power MOSFET and the gate
drive requirement are described in terms of gate charge, the
ICL7667 power dissipation will be:
(EQ. 2)
P AC = QGV V f
where QG = Charge required to switch the gate, in
Coulombs, f = Frequency.
Power MOS Driver Circuits
Power MOS Driver Requirements
Because it has a very high peak current output, the ICL7667
the at driving the gate of power MOS devices. The high
current output is important since it minimizes the time the
power MOS device is in the linear region. Figure 9 is a
typical curve of Charge vs Gate voltage for a power
MOSFET. The flat region is caused by the Miller
capacitance, where the drain-to-gate capacitance is
multiplied by the voltage gain of the FET. This increase in
capacitance occurs while the power MOSFET is in the linear
region and is dissipating significant amounts of power. The
very high current output of the ICL7667 is able to rapidly
FN2853.7
September 4, 2015
ICL7667
SG1525 IC, except that the outputs are inverted. This
inversion is needed since ICL7667 is an inverting buffer.
overcome this high capacitance and quickly turns the
MOSFET fully on or off.
Transformer Coupled Drive of MOSFETs
18
GATE TO SOURCE VOLTAGE
Transformers are often used for isolation between the logic
and control section and the power section of a switching
regulator. The high output drive capability of the ICL7667
enables it to directly drive such transformers. Figure 11
shows a typical transformer coupled drive circuit. PWM ICs
with either active high or active low output can be used in
this circuit, since any inversion required can be obtained by
reversing the windings on the secondaries.
ID = 1A
16
14
VDD = 50V
12
10
VDD = 375V
680pF
8
6
VDD = 200V
4
630pF
2
Buffered Drivers for Multiple MOSFETs
212pF
0
In very high power applications which use a group of
MOSFETs in parallel, the input capacitance may be very large
and it can be difficult to charge and discharge quickly.
Figure 13 shows a circuit which works very well with very
large capacitance loads. When the input of the driver is zero,
Q1 is held in conduction by the lower half of the ICL7667 and
Q2 is clamped off by Q1. When the input goes positive, Q1 is
turned off and a current pulse is applied to the gate of Q2 by
the upper half of the ICL7667 through the transformer, T1.
After about 20ns, T1 saturates and Q2 is held on by its own
CGS and the bootstrap circuit of C1, D1 and R1. This
bootstrap circuit may not be needed at frequencies greater
than 10kHz since the input capacitance of Q2 discharges
slowly.
-2
0
2
4
6
8
10
12
14
16
18
GATE CHARGE - QG (NANO-COULOMBS)
20
FIGURE 9. MOSFET GATE DYNAMIC CHARACTERISTICS
Direct Drive of MOSFETs
Figure 11 shows interfaces between the ICL7667 and typical
switching regulator ICs. Note that unlike the DS0026, the
ICL7667 does not need a dropping resistor and speedup
capacitor between it and the regulator IC. The ICL7667, with
its high slew rate and high voltage drive can directly drive the
gate of the MOSFET. The SG1527 IC is the same as the
15V
+165VDC
V+
+VC
IRF730
A
ICL7667
SG1527
IRF730
B
GND
V-
FIGURE 10A.
6
FN2853.7
September 4, 2015
ICL7667
15V
+165VDC
1k
+VC
IRF730
V+
VOUT
C1
E1
ICL7667
TL494
IRF730
C2
GND
E2
V-
1k
+15V
FIGURE 10B.
FIGURE 10. DIRECT DRIVE OF MOSFET GATES
18V
CA
CB
VIN
V+
1µF
+165V
IRF730
EA
0V
470
ICL7667
CA1524
1µF
IRF730
EB
-165V
470
V-
VOUT
FIGURE 11. TRANSFORMER COUPLED DRIVE CIRCUIT
V+
0.1µF
4.7µF
0.1µF
IN914
D1
+
4.7F
R1
10k
Q2
1/2
ICL7667
0V - 5V
INPUT
FROM
PWM IC
2200pF
FF10
1000pF
C1
IRFF120
5FF10
ZL
1/2
ICL7667
IRFF120
Q1
FIGURE 12. VERY HIGH SPEED DRIVER
7
FN2853.7
September 4, 2015
ICL7667
-4
f = 10kHz
-6
+15V
+
-
-13.5V
10µF
1/2
ICL7667
-8
IN4001
IN4001
47µF
+
VOUT (V)
1kHz - 250kHz
SQUARE
WAVE
IN TTL
LEVELS
SLOPE = 60
-10
-12
-14
5
FIGURE 13A.
20
40
60
IOUT (mA)
80
100
FIGURE 13B. OUTPUT CURRENT vs OUTPUT VOLTAGE
FIGURE 13. VOLTAGE INVERTER
Other Applications
Clock Driver
Relay and Lamp Drivers
The ICL7667 is suitable for converting low power TTL or
CMOS signals into high current, high voltage outputs for
relays, lamps and other loads. Unlike many other level
translator/driver ICs, the ICL7667 will both source and sink
current. The continuous output current is limited to 200mA
by the I2R power dissipation in the output FETs.
Charge Pump or Voltage Inverters and Doublers
The low output impedance and wide V+ range of the
ICL7667 make it well suited for charge pump circuits. Figure
13A shows a typical charge pump voltage inverter circuit and
a typical performance curve. A common use of this circuit is
to provide a low current negative supply for analog circuitry
or RS232 drivers. With an input voltage of +15V, this circuit
will deliver 20mA at -12.6V. By increasing the size of the
capacitors, the current capability can be increased and the
voltage loss decreased. The practical range of the input
frequency is 500Hz to 250kHz. As the frequency goes up,
the charge pump capacitors can be made smaller, but the
internal losses in the ICL7667 will rise, reducing the circuit
efficiency.
Some microprocessors (such as the CDP68HC05 families)
use a clock signal to control the various LSI peripherals of
the family. The ICL7667s combination of low propagation
delay, high current drive capability and wide voltage swing
make it attractive for this application. Although the ICL7667
is primarily intended for driving power MOSFET gates at
15V, the ICL7667 also works well as a 5V high-speed buffer.
Unlike standard 4000 series CMOS, the ICL7667 uses short
channel length FETs and the ICL7667 is only slightly slower
at 5V than at 15V.
+15
+15V
1kHz - 250kHz
SQUARE
WAVE
IN TTL
LEVELS
IN4001
+
1/2
ICL7667
-
10µF
28.5V
IN4001
+
47µF
FIGURE 14. VOLTAGE DOUBLER
Figure 14, a voltage doubler, is very similar in both circuitry
and performance. A potential use of Figure 13 would be to
supply the higher voltage needed for EEPROM or EPROM
programming.
8
FN2853.7
September 4, 2015
ICL7667
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE
REVISION
CHANGE
September 4, 2015
FN2853.7
Updated the Ordering Information table on page 1.
Added Revision History and About Intersil sections.
Updated Package Outlind Drawing M8.15 to the latest revision.
-Rev 1 to Rev 2 changes - Updated to new POD format by removing table and moving dimensions onto
drawing and adding land pattern
-Rev 2 to Rev 3 changes - Changed in Typical Recommended Land Pattern the following:
2.41(0.095) to 2.20(0.087)
0.76 (0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
-Rev 3 to Rev 4 changes - Changed Note 1 "1982" to "1994"
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support.
9
FN2853.7
September 4, 2015
ICL7667
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
6.20 (0.244)
5.80 (0.228)
AREA
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
1
2
8°
0°
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
SEATING PLANE
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
1
8
2
7
0.60 (0.023)
1.27 (0.050)
3
6
4
5
-C-
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
0.25(0.010)
0.10(0.004)
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
10
FN2853.7
September 4, 2015
ICL7667
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AD
E
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
0.204
C
D
0.355
0.400
9.01
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
eA
0.300 BSC
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
eB
-
L
0.115
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
0.355
10.16
N
2.54 BSC
-
7.62 BSC
0.430
-
0.150
2.93
8
6
10.92
7
3.81
4
8
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
11
FN2853.7
September 4, 2015
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