DATASHEET

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MENDE 29044A
R E C OM
ISL
Low Power Ambient Light and Proximity Sensor with
Internal IR-LED and Digital Output
ISL29043
Features
The ISL29043 is an integrated ambient and infrared
light-to-digital converter with a built-in IR LED and I2C Interface
(SMBus Compatible). This device uses two independent ADCs
for concurrently measuring ambient light and proximity in
parallel. The flexible interrupt scheme is designed for minimal
microcontroller utilization.
• Internal LED + Sensor = Complete Solution
• Works Under All Light Sources Including Sunlight
• Dual ADCs Measure ALS/Prox Concurrently
• <1.0μA Supply Current When Powered Down
• Temperature Compensated
• Pb-Free (RoHS compliant)
For ambient light sensor (ALS) data conversions, an ADC
converts photodiode current (with a light sensitivity range up to
2000 Lux) in 100ms per sample. The ADC rejects 50Hz/60Hz
flicker noise caused by artificial light sources.
Intelligent and Flexible Interrupts
• Independent ALS/Prox Interrupt Thresholds
• Adjustable Interrupt Persistency
- 1/4/8/16 Consecutive Triggers Required Before Interrupt
For proximity sensor (Prox) data conversions, the built-in driver
turns on an internal infrared LED and the proximity sensor ADC
converts the reflected IR intensity to digital. This ADC rejects
ambient IR noise (such as sunlight) and has a 540μs
conversion time.
Applications
• Display and Keypad Dimming Adjustment and Proximity
Sensing for:
- Mobile Devices: Smart Phone, PDA, GPS
- Computing Devices: Laptop PC, Netbook, Tablet PC
- Consumer Devices: LCD-TV, Digital Picture Frame, Digital
Camera
- Industrial and Medical Light and Proximity Sensing
The ISL29043 provides low power operation of ALS and
proximity sensing with a typical 136μA normal operation
current (110μA for sensors and internal circuitry, ~28μA for
LED) with 220mA current pulses for a net 100μs, repeating
every 800ms (or under).
The ISL29043 uses both a hardware pin and software bits to
indicate an interrupt event has occurred. An ALS interrupt is
defined as a measurement that is outside a set window. A
proximity interrupt is defined as a measurement over a
threshold limit. The user may also require that both ALS/Prox
interrupts occur at once, up to 16 times in a row before
activating the interrupt pin.
Related Literature
• See AN1436, “Proximity Sensors”
The ISL29043 is designed to operate from 2.25V to 3.63V over
the -40°C to +85°C ambient temperature range. It is packaged in
a clear, lead-free 10 Ld ODFN package.
R2
10kΩ
R1
10kΩ
VDD
C2
1µF
VLED
R3
10kΩ
VI2C PULL-UP
INT
SDA
SCL
SLAVE_0
1 LED+ LEDC1
1.0µF 2 ADDR0 IRDR
3V
INT
DD
C3
4 GND SDA
0.1µF
5 REXT
SCL
I2C MASTER
µCONTROLLER
10
9
SLAVE_1
SDA
8
SCL
I2C SLAVE_n
SDA
SCL
7
6
ISL29043
REXT
499kΩ
PROX COUNTS (8-BIT)
255
204
110mA (18% GREY CARD)
220mA (18% GREY CARD)
153
110mA (WHITE COPY PAPER)
102
220mA (WHITE COPY PAPER)
51
0
0
25
50
75
100
125
150
DISTANCE (mm)
FIGURE 1. TYPICAL APPLICATION DIAGRAM
April 28, 2016
FN7935.2
1
FIGURE 2. PROXIMITY RESPONSE vs DISTANCE
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC. 2012, 2016. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL29043
ISL29043 Block Diagram
VDD
3
ALS PHOTODIODE
ARRAY
COMMAND
REGISTER
LIGHT DATA
PROCESS
ALS AND IR
DUAL CHANNEL
ADCs
DATA
REGISTER
2
I2C
IR PHOTODIODE
ARRAY
SCL
7
SDA
INTERRUPT
8
INT
IR DRIVER
9
IRDR
IREF
FOSC
5
4
1
REXT
GND
LED+
Pin Configuration
1
10
LED-
ADDR0
2
9
IR D R
VDD
3
8
IN T
GND
4
7
SDA
REXT
5
6
SCL
10
LED-
Pin Descriptions
ISL29043
(10 LD 2.1x3.5 (mm) OPTICAL CO-PACKAGE)
TOP VIEW
LED+
ADDR0
6
PIN # PIN NAME
*T H E R M A L P A D M U S T B E L E F T
F L O A T IN G
DESCRIPTION
0
T-PAD
Thermal pad. Floating - do not connect to GND or VDD
1
LED+
Anode of IR-LED
2
ADDR0
I2C address pin - pull high or low (do not float)
3
VDD
Positive supply: 2.25V to 3.63V
4
GND
Ground
5
REXT
External resistor (499k; 1%) connects this pin to
ground.
6
SCL
I2C clock line
7
SDA
I2C data line
8
INT
Interrupt pin; Logic output (open-drain) for interrupt
9
IRDR
IR-LED driver pin - current flows into ISL29043 from
LED cathode
10
LED-
Cathode of IR-LED
The I2C bus lines can be pulled from
1.7V to above VDD, 3.63V max.
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
TEMP. RANGE
(°C)
ISL29043IROMZ-T7
-40 to +85
ISL29043IROMZ-EVALZ
PACKAGE
Tape & Reel
(Pb-free)
10 Ld Optical Co-package
PKG.
DWG. #
L10.2.1x3.5E
Evaluation Board
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets: molding compounds, die attach materials, NiPdAu plate (e4
termination finish), which are all RoHS compliant. The ISL29043 is compatible with limited SnPb and Pb-free soldering operations. The ISL29043 is
MSL classified. See Tech Brief TB489 (Surface Mount Guidelines for Optical Co-packages) for reflow profile and more information.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL29043. For more information on MSL please see tech brief TB477.
2
FN7935.2
April 28, 2016
ISL29043
Absolute Maximum Ratings
Thermal Information
(TA = +25°C)
VDD Supply Voltage between VDD and GND . . . . . . . . . . . . . . . . . . . . . .4.0V
I2C Bus Pin Voltage (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V
I2C Bus Pin Current (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA
REXT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V
IRDR Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5V
ADDR0 Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V
INT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V
INT Pin Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (Note 6) 2kV
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
10 Ld Optical Module Package (Notes 4, 5)
113
58
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +90°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB489
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. ESD is rated at 2kV HBM on all pins except IRDR, which is rated at 1kV.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise
noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
VDD
VDD = 3.0V, TA = +25°C, REXT = 499kΩ 1% tolerance.
DESCRIPTION
CONDITION
Power Supply Range
MIN
MAX
(Note 7) TYP (Note 7) UNIT
2.25
3.0
3.63
V
SR_VDD
Input Power-up Slew Rate
VDD Rising Edge between 0.4V and 2.25V
IDD_OFF
Supply Current when Powered Down
ALS_EN = 0; PROX_EN = 0
0.1
0.8
µA
Supply Current for ALS+Prox in Sleep Time
ALS_EN = 1; PROX_EN = 1
110
125
µA
Supply Current for Prox in Sleep Time
ALS_EN = 0; PROX_EN = 1
80
µA
Supply Current for ALS
ALS_EN = 1; PROX_EN = 0
96
µA
5.25
MHz
IDD_NORM
IDD_PRX_SLP
IDD_ALS
fOSC
0.5
Internal Oscillator Frequency
tINTGR_ALS
12-bit ALS Integration/Conversion Time
tINTGR_PROX
8-bit Prox Integration/Conversion Time
88
V/ms
100
112
0.54
DATAALS_0
ALS Result when Dark
EAMBIENT = 0 lux, 2k Range
DATAALS_F
Full Scale ALS ADC Code
EAMBIENT > Selected Range Maximum Lux
(Note 10)
1
ms
ms
3
Counts
4095 Counts
Count Output Variation Over Three Light Sources: Ambient Light Sensing
Fluorescent, Incandescent and Sunlight
±10
%
DATAALS_1
Light Count Output with LSB of 0.029 lux/count
E = 47 lux, Green LED (Note 10), ALS_RANGE = 0
1638
Counts
DATAALS_2
Light Count Output With LSB of 0.469 lux/count
E = 288 lux, Green LED, ALS_RANGE = 1
DATAPROX_0
Prox Measurement
IR LED off (Note 8)
DATAPROX_F
Full Scale Prox ADC Code
ΔDATA
DATA
460
614
768
Counts
1
3
Counts
255
Counts
tr
Rise Time for IRDR Sink Current
RLOAD = 15 at IRDR pin, 20% to 80%
500
ns
tf
Fall time for IRDR Sink Current
RLOAD = 15 at IRDR pin, 80% to 20%
500
ns
IIRDR_0
IRDR Sink Current
PROX_DR = 0; VIRDR = 0.5V
IIRDR_1
IRDR Sink Current
PROX_DR = 1; VIRDR = 0.5V
IRDR Leakage Current
PROX_EN = 0; VDD = 3.63V (Note 9)
Acceptable Voltage Range on IRDR Pin
Register bit PROX_DR = 0
IIRDR_LEAK
VIRDR
3
90
110
130
220
0.001
0.5
mA
mA
1
µA
4.3
V
FN7935.2
April 28, 2016
ISL29043
Electrical Specifications
PARAMETER
tPULSE
VDD = 3.0V, TA = +25°C, REXT = 499kΩ 1% tolerance. (Continued)
DESCRIPTION
MIN
MAX
(Note 7) TYP (Note 7) UNIT
CONDITION
Net IIRDR On Time Per PROX Reading
100
µs
VREF
Voltage of REXT Pin
0.52
V
FI2C
I2C Clock Rate Range
VI2C
Supply Voltage Range for I2C Interface
1.7
400
kHz
3.63
V
0.55
V
VIL
SCL and SDA Input Low Voltage
VIH
SCL and SDA Input High Voltage
ISDA
SDA Current Sinking Capability
VOL = 0.4V
3
5
mA
IINT
INT Current Sinking Capability
VOL = 0.4V
3
5
mA
(IIRDR)/(VIRDR)
PROX_DR = 0; VIRDR = 0.5V to 4.3V
3
mA/V
PSRRIRDR
1.25
V
NOTES:
7. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
8. An 850nm infrared LED is used to test PROX/IR sensitivity in an internal test mode.
9. Ability to guarantee IIRDR leakage of ~1nA is limited by test hardware.
10. For ALS applications under light-distorting glass, please see the section titled “ALS Range 1 Considerations” on page 10.
IR-LED Specifications
TA = +25°C
PARAMETER
VF
DESCRIPTION
IR-LED Forward Voltage Drop
CONDITION
MIN
(Note 7)
TYP
MAX
(Note 7)
UNIT
IF = 100mA
1.6
V
IF = 200mA
1.8
V
5
µA
IR
IR-LED Reverse-Bias Current
VR = 5.5V
λP
IR-LED Peak Output Wavelength
IF = 100mA
855
nm
Δλ
IR-LED Spectral Half-Width
IF = 100mA
30
nm
ΦE
IR-LED Radiant Power
IF = 100mA
27
mW
IR-LED Radiant Intensity (in 0.01sr)
IF = 100mA
10
mW/sr
I
I2C Electrical Specifications
(Note 11).
PARAMETER
For SCL and SDA unless otherwise noted, VDD = 3V, TA = +25°C, REXT = 499kΩ 1% tolerance
DESCRIPTION
CONDITION
MIN
(Note 7)
MAX
TYP (Note 7) UNIT
1.7
3.63
V
VI2C
Supply Voltage Range for I2C Interface
fSCL
SCL Clock Frequency
400
kHz
VIL
SCL and SDA Input Low Voltage
0.55
V
VIH
SCL and SDA Input High Voltage
Vhys
Hysteresis of Schmitt Trigger Input
VOL
Low-level Output Voltage (Open-drain) at 4mA Sink
Current
Ii
Input Leakage for each SDA, SCL Pin
1.25
V
0.05VDD
V
-10
0.4
V
10
µA
tSP
Pulse Width of Spikes that must be Suppressed by
the Input Filter
50
ns
tAA
SCL Falling Edge to SDA Output Data Valid
900
ns
10
pF
Ci
Capacitance for each SDA and SCL Pin
4
FN7935.2
April 28, 2016
ISL29043
I2C Electrical Specifications
(Note 11). (Continued)
PARAMETER
tHD:STA
For SCL and SDA unless otherwise noted, VDD = 3V, TA = +25°C, REXT = 499kΩ 1% tolerance
DESCRIPTION
CONDITION
MIN
(Note 7)
MAX
TYP (Note 7) UNIT
Hold Time (Repeated) START Condition
After this period, the first clock pulse is
generated.
600
ns
tLOW
LOW Period of the SCL Clock
Measured at the 30% of VDD crossing.
1300
ns
tHIGH
HIGH period of the SCL Clock
600
ns
tSU:STA
Set-up Time for a Repeated START Condition
600
ns
tHD:DAT
Data Hold Time
30
ns
tSU:DAT
Data Set-up Time
100
ns
tR
Rise Time of both SDA and SCL Signals
(Note 12)
20 + 0.1xCb
ns
tF
Fall Time of both SDA and SCL Signals
(Note 12)
20 + 0.1xCb
ns
Set-up Time for STOP Condition
600
ns
Bus Free Time Between a STOP and START Condition
1300
ns
tSU:STO
tBUF
Cb
Capacitive Load for Each Bus Line
400
Maximum is determined by tR and tF
1
pF
Rpull-up
SDA and SCL System Bus Pull-up Resistor
k
tVD;DAT
Data Valid Time
0.9
µs
tVD:ACK
Data Valid Acknowledge Time
0.9
µs
VnL
Noise Margin at the Low Level
0.1VDD
V
VnH
Noise Margin at the High Level
0.2VDD
V
NOTES:
11. All parameters in I2C Electrical Specifications table are guaranteed by design and simulation.
12. Cb is the capacitance of the bus in pF.
FIGURE 3. I2C TIMING DIAGRAM
5
FN7935.2
April 28, 2016
ISL29043
Register Map
There are ten 8-bit registers accessible via I2C. Registers 0x1 and 0x2 define the operation mode of the device. Registers 0x3 through 0x7
store the various ALS/IR/Prox thresholds, which trigger interrupt events. Registers 0x8 through 0xA store the results of ALS/IR/Prox ADC
conversions.
TABLE 1. ISL29043 REGISTERS AND REGISTER BITS
BIT
ADDR
REG NAME
7
6
5
4
3
2
1
0
DEFAULT
PROX_DR
ALS_EN
ALS_RANGE
ALSIR_MODE
0x00
INT_CTRL
0x00
0x00
(n/a)
0x01
CONFIGURE
PROX EN
(Reserved)
0x02
INTERRUPT
PROX_FLAG
0x03
PROX_LT
PROX_LT[7:0]
0x04
PROX_HT
PROX_HT[7:0]
0xFF
0x05
ALSIR_TH1
ALSIR_LT[7:0]
0x00
0x06
ALSIR_TH2
0x07
ALSIR_TH3
0x08
PROX_DATA
PROX_DATA[7:0]
0x00
0x09
ALSIR_DT1
ALSIR_DATA[7:0]
0x00
0x0A
ALSIR_DT2
0x0E
TEST1
(Write as 0x00)
0x00
0x0F
TEST2
(Write as 0x00)
0x00
PROX_SLP[2:0]
PROX_PRST[1:0]
(Write 0)
ALS_FLAG
ALSIR_HT[3:0]
(n/a)
ALS_PRST[1:0]
0x00
ALSIR_LT[11:8]
ALSIR_HT[11:4]
(Unused)
6
0xF0
0xFF
ALSIR_DATA[11:8]
0x00
FN7935.2
April 28, 2016
ISL29043
Register Descriptions
TABLE 2. REGISTER 0x00 (RESERVED)
BIT #
ACCESS
DEFAULT
NAME
7:0
RO
(n/a)
(n/a)
FUNCTION/OPERATION
Reserved - no need to read or write
TABLE 3. REGISTER 0x01 (CONFIGURE) - PROX/ALS CONFIGURATION
BIT #
ACCESS
DEFAULT
NAME
FUNCTION/OPERATION
7
RW
0x00
PROX_EN
(Prox Enable)
When = 0, proximity sensing is disabled
When = 1, continuous proximity sensing is enabled. Prox data will be ready 0.54ms after this
bit is set high
6:4
RW
0x00
PROX_SLP
(Prox Sleep)
For bits 6:4 = (see the following)
111; sleep time between prox IR LED pulses is 0.0ms (run continuously)
110; sleep time between prox IR LED pulses is 12.5ms
101; sleep time between prox IR LED pulses is 50ms
100; sleep time between prox IR LED pulses is 75ms
011; sleep time between prox IR LED pulses is 100ms
010; sleep time between prox IR LED pulses is 200ms
001; sleep time between prox IR LED pulses is 400ms
000; sleep time between prox IR LED pulses is 800ms
3
RW
0x00
PROX_DR
(Prox Drive)
When = 0, IRDR behaves as a pulsed 110mA current sink
When = 1, IRDR behaves as a pulsed 220mA current sink
2
RW
0x00
ALS_EN
(ALS Enable)
When = 0, ALS/IR sensing is disabled
When = 1, continuous ALS/IR sensing is enabled with new data ready every 100ms
1
RW
0x00
ALS_RANGE
(ALS Range)
When = 0, ALS is in low-lux range
When = 1, ALS is in high-lux range
0
RW
0x00
ALSIR_MODE
(ALSIR Mode)
When = 0, ALS/IR data register contains visible ALS sensing data
When = 1, ALS/IR data register contains IR spectrum sensing data
TABLE 4. REGISTER 0x02 (INTERRUPT) - PROX/ALS INTERRUPT CONTROL
BIT #
7
ACCESS
FLAG
DEFAULT
BIT NAME
0x00
PROX_FLAG
(Prox Flag)
When = 0, no Prox interrupt event has occurred since power-on or last “clear”
When = 1, a Prox interrupt event occurred. Clearable by writing “0”
For bits 6:5 = (see the following)
00; set PROX_FLAG if 1 conversion result trips the threshold value
01; set PROX_FLAG if 4 conversion results trip the threshold value
10; set PROX_FLAG if 8 conversion results trip the threshold value
11; set PROX_FLAG if 16 conversion results trip the threshold value
6:5
RW
0x00
PROX_PRST
(Prox Persist)
4
RW
0x00
Unused
(Write 0)
3
FLAG
0x00
ALS_FLAG
(ALS FLAG)
2:1
RW
0x00
0
RW
0x00
ALS_PRST
(ALS Persist)
FUNCTION/OPERATION
Unused register bit - write 0
When = 0, no ALS interrupt event has occurred since power-on or last “clear”
When = 1, an ALS interrupt event occurred. Clearable by writing “0”
For bits 2:1 = (see the following)
00; set ALS_FLAG if 1 conversion is outside the set window
01; set ALS_FLAG if 4 conversions are outside the set window
10; set ALS_FLAG if 8 conversions are outside the set window
11; set ALS_FLAG if 16 conversions are outside the set window
INT_CTRL
When = 0, set INT pin low if PROX_FLAG or ALS_FLAG high (logical OR)
(Interrupt Control) When = 1, set INT pin low if PROX_FLAG and ALS_FLAG high (logical AND)
TABLE 5. REGISTER 0x03 (PROX_LT) - INTERRUPT LOW THRESHOLD FOR PROXIMITY SENSOR
BIT #
ACCESS
DEFAULT
BIT NAME
7:0
RW
0x00
PROX_LT
(Prox Threshold)
7
FUNCTION/OPERATION
8-bit interrupt low threshold for
proximity sensing
FN7935.2
April 28, 2016
ISL29043
TABLE 6. REGISTER 0x04 (PROX_HT) - INTERRUPT HIGH THRESHOLD FOR PROXIMITY SENSOR
BIT #
ACCESS
DEFAULT
BIT NAME
FUNCTION/OPERATION
7:0
RW
0xFF
PROX_HT
(Prox Threshold)
8-bit interrupt high threshold for proximity sensing
TABLE 7. REGISTER 0x05 (ALSIR_TH1) - INTERRUPT LOW THRESHOLD FOR ALS/IR
BIT #
ACCESS
DEFAULT
BIT NAME
0x00
ALSIR_LT[7:0]
(ALS/IR Low Thr.)
FUNCTION/OPERATION
Lower 8 bits (of 12 bits) for ALS/IR low interrupt threshold
7:0
RW
BIT #
ACCESS
DEFAULT
BIT NAME
7:4
RW
0x0F
ALSIR_HT[3:0]
(ALS/IR High Thr.)
Lower 4 bits (of 12 bits) for ALS/IR high interrupt threshold
3:0
RW
0x00
ALSIR_LT[11:8]
(ALS/IR Low Thr.)
Upper 4 bits (of 12 bits) for ALS/IR low interrupt threshold
TABLE 8. REGISTER 0x06 (ALSIR_TH2) - INTERRUPT LOW/HIGH THRESHOLDS FOR ALS/IR
FUNCTION/OPERATION
TABLE 9. REGISTER 0x07 (ALSIR_TH3) - INTERRUPT HIGH THRESHOLD FOR ALS/IR
BIT #
7:0
ACCESS
RW
DEFAULT
BIT NAME
0xFF
ALSIR_HT[11:4]
(ALS/IR High Thr.)
FUNCTION/OPERATION
Upper 8 bits (of 12 bits) for ALS/IR high interrupt threshold
TABLE 10. REGISTER 0x08 (PROX_DATA) - PROXIMITY SENSOR DATA
BIT #
7:0
ACCESS
RO
DEFAULT
BIT NAME
0x00
PROX_DATA
(Proximity Data)
FUNCTION/OPERATION
Results of 8-bit proximity sensor ADC conversion
TABLE 11. REGISTER 0x09 (ALSIR_DT1) - ALS/IR SENSOR DATA (LOWER 8 BITS)
BIT #
7:0
ACCESS
RO
DEFAULT
BIT NAME
0x00
ALSIR_DATA
(ALS/IR Data)
FUNCTION/OPERATION
Lower 8 bits (of 12 bits) from result of ALS/IR sensor conversion
TABLE 12. REGISTER 0x0A (ALSIR_DT2) - ALS/IR SENSOR DATA (UPPER 4 BITS)
BIT #
ACCESS
DEFAULT
BIT NAME
7:4
RO
0x00
(Unused)
3:0
RO
0x00
ALSIR_DATA
(ALS/IR Data)
FUNCTION/OPERATION
Unused bits.
Upper 4 bits (of 12 bits) from result of ALS/IR sensor conversion
TABLE 13. REGISTER 0x0E (TEST1) - TEST MODE
BIT #
ACCESS
DEFAULT
BIT NAME
7:0
RW
0x00
(Write as 0x00)
FUNCTION/OPERATION
Test mode register. When 0x00, in normal operation.
TABLE 14. REGISTER 0x0F (TEST2) - TEST MODE 2
BIT #
ACCESS
DEFAULT
BIT NAME
7:0
RW
0x00
(Write as 0x00)
8
FUNCTION/OPERATION
Test mode register. When 0x00, in normal operation.
FN7935.2
April 28, 2016
ISL29043
I2C DATA
DEVICE ADDRESS
START
I2C SDA
MASTER
REGISTER ADDRESS
W A
A6 A5 A4 A3 A2 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A
I2C SDA
SLAVE (ISL29043)
SDA DRIVEN BY MASTER
I2C CLK
1
2
3
4
5
6
7
A
8
9
2
3
4
5
6
7
8
SDA DRIVEN BY MASTER
1
9
2
3
4
5
6
DATA BYTE0
A
A6 A5 A4 A3 A2 A1 A0 W
A
SDA DRIVEN BY MASTER
1
DEVICE ADDRESS
STOP START
SDA DRIVEN BY ISL29043
A
A D7 D6 D5 D4 D3 D2 D1 D0
7
8
9
1
2
3
4
5
6
7
8
9
FIGURE 4. I2C DRIVER TIMING DIAGRAM FOR MASTER AND SLAVE CONNECTED TO COMMON BUS
from I2C registers 0x9 and 0xA when the ADC conversion is
completed.
Principles of Operation
I2C Interface
The ISL29043’s I2C interface slave address is internally hardwired
as 0b100010<x>, where “0b” signifies binary notation and x
represents the logic level on pin ADDR0.
Figure 4 shows a sample one-byte read. The I2C bus master
always drives the SCL (clock) line, while either the master or the
slave can drive the SDA (data) line. Every I2C transaction begins
with the master asserting a start condition (SDA falling while SCL
remains high). The first transmitted byte is initiated by the
master and includes 7 address bits and a R/W bit. The slave is
responsible for pulling SDA low during the ACK bit after every
transmitted byte.
Each I2C transaction ends with the master asserting a stop
condition (SDA rising while SCL remains high).
For more information about the I2C standard, please consult the
Philips™ I2C specification documents.
Photodiodes and ADCs
The ISL29043 contains two photodiode arrays which convert
photons (light) into current. The ALS photodiodes are constructed to
mimic the human eye’s wavelength response curve to visible light
(see Figure 11). The ALS photodiodes’ current output is digitized by a
12-bit ADC in 100ms. These 12 bits can be accessed by reading
The ALS converter is a charge-balancing integrating 12-bit ADC.
Charge-balancing is best for converting small current signals in the
presence of periodic AC noise. Integrating over 100ms highly rejects
both 50Hz and 60Hz light flicker by picking the lowest integer
number of cycles for both 50Hz/60Hz frequencies.
The proximity sensor is an 8-bit ADC, which operates in a similar
fashion. When proximity sensing is enabled, the IRDR pin will
drive the internal infrared LED, the emitted IR reflects off an object
(e.g., a human head) back into the ISL29043, and a sensor
converts the reflected IR wave to a current signal in 0.54ms. The
ADC subtracts the IR reading before and after the LED is driven
(to remove ambient IR such as sunlight), and converts this value
to a digital count stored in Register 0x8.
The ISL29043 is designed to run two conversions concurrently: a
proximity conversion and an ALS (or IR) conversion. Please note that
because of the conversion times, the user must let the ADCs perform
one full conversion first before reading from I2C Registers
PROX_DATA (wait 0.54ms) or ALSIR_DT1/2 (wait 100ms). The timing
between ALS and Prox conversions is arbitrary (as shown in Figure 5).
The ALS runs continuously with new data available every 100ms. The
proximity sensor runs continuously with a time between conversions
decided by PROX_SLP (Register 1 Bits [6:4]).
ALS CONVERSION TIME =
100ms (FIXED)
SEVERAL µs BETWEEN
CONVERSIONS
ALS
ACTIVE
100ms
PROX
SENSOR
ACTIVE
100ms
100ms
100ms
100ms
TIME
0.54ms FOR PROX
CONVERSION
TIME
IRDR
(CURRENT
DRIVER)
SERIES OF
CURRENT PULSES
TOTALING 0.1ms
TIME
SLEEP TIME
(PROX_SLP)
FIGURE 5. TIMING DIAGRAM FOR PROX/ALS EVENTS - NOT TO SCALE
9
FN7935.2
April 28, 2016
ISL29043
Ambient Light and IR Sensing
The ISL29043 is set for ambient light sensing when Register bit
ALSIR_MODE = 0 and ALS_EN = 1. The light-wavelength response of
the ALS appears as shown in Figure 11. ALS measuring mode (as
opposed to IR measuring mode) is set by default.
When the part is programmed for infrared (IR) sensing
(ALSIR_MODE = 1; ALS_EN = 1), infrared light is converted into a
current and digitized by the same ALS ADC. The result of an IR
conversion is strongly related to the amount of IR energy incident
on our sensor, but is unitless and is referred to in digital counts.
Proximity Sensing
When proximity sensing is enabled (PROX_EN = 1), the internal
IR LED is driven for 0.1ms by the built-in IR LED driver through
the IRDR pin. The amplitude of the IR LED current depends on
Register 1 bit 3: PROX_DR. If this bit is low, the load will see a
fixed 110mA current pulse. If this bit is high, the load on IRDR
will see a fixed 220mA current pulse, as seen in Figure 6.
LED+
INTERNAL IR-LED
LED-
220mA
(PROX_DR = 1)
PCB TRACE
110mA
(PROX_DR = 0)
(IRDR IS HI-Z WHEN
NOT DRIVING)
FIGURE 6. CURRENT DRIVE MODE OPTIONS
When the IR from the LED reaches an object and gets reflected
back into the ISL29043, the reflected IR light is converted into
current as per the IR spectral response shown in Figure 11. One
entire proximity measurement takes 0.54ms for one conversion
(which includes 0.1ms spent driving the LED), and the period
between proximity measurements is decided by PROX_SLP
(sleep time) in Register 1 Bits 6:4.
Average LED driving current consumption is given by Equation 1.
(EQ. 1)
A typical IRDR scheme is 220mA amplitude pulses every 800ms,
which yields 28μA DC.
Total Current Consumption
Total current consumption is the sum of IDD and IIRDR. The IRDR
pin sinks current (as shown in Figure 6) and the average IRDR
current can be calculated using Equation 1. IDD depends on
voltage and the mode-of-operation, as seen in Figure 15.
Interrupt Function
The ISL29043 has an intelligent interrupt scheme designed to
shift some logic processing away from intensive microcontroller
I2C polling routines (which consume power) and towards a more
independent light sensor, which can instruct a system to “wake
up” or “go to sleep”.
10
A proximity interrupt event (PROX_FLAG) is governed by the high
and low thresholds in registers 3 and 4 (PROX_LT and PROX_HT).
PROX_FLAG is set when the measured proximity data is more
than the higher threshold X-times-in-a-row (X is set by user; see
next paragraph). The proximity interrupt flag is cleared when the
prox data is lower than the low proximity threshold
X-times-in-a-row, or when the user writes “0” to PROX_FLAG.
Interrupt persistency is another useful option available for both
ALS and proximity measurements. Persistency requires X-in-arow interrupt flags before the INT pin is driven low. Both ALS and
Prox have their own independent interrupt persistency options.
See ALS_PRST and PROX_PRST bits in Register 2.
The final interrupt option is the ability to AND or OR the two
interrupt flags using Register 2 Bit 0 (INT_CTRL). If the user
wants both ALS/Prox interrupts to happen at the same time
before changing the state of the interrupt pin, set this bit high. If
the user wants the interrupt pin to change state when either the
ALS or the Proximity interrupt flag goes high, leave this bit to its
default of 0.
ALS Range 1 Considerations
IRDR
I lRDR ;PEAK  100s
I lRDR ;AVE = -------------------------------------------------------T SLEEP
An ALS interrupt event (ALS_FLAG) is governed by Registers 5
through 7. The user writes a high and low threshold value to these
registers and the ISL29043 will issue an ALS interrupt flag if the
actual count stored in Registers 0x9 and 0xA are outside the user’s
programmed window. The user must write 0 to clear the ALS_FLAG.
When measuring ALS counts higher than 1800 on range 1
(ALSIR_MODE = 0, ALS_RANGE = 0, ALS_DATA > 1800), switch
to range 2 (change the ALS_RANGE bit from “0” to “1”) and
re-measure ALS counts. This recommendation pertains only to
applications where the light incident upon the sensor is IR-heavy
and is distorted by tinted glass that increases the ratio of infrared
to visible light. For more information, please contact the factory.
VDD Power-up and Power Supply
Considerations
Upon power-up, please ensure a VDD slew rate of 0.5V/ms or greater.
After power-up, or if the user’s power supply temporarily deviates
from our specification (2.25V to 3.63V), Intersil recommends the
user write the following: write 0x00 to register 0x01, write 0x29 to
register 0x0F, write 0x00 to register 0x0E, and write 0x00 to register
0x0F. The user should then wait ~1ms or more and then rewrite all
registers to the desired values. If the user prefers a hardware reset
method instead of writing to test registers: set VDD = 0V for 1 second
or more, power back up at the required slew rate, and write registers
to the desired values.
Power-Down
To put the ISL29043 into a power-down state, the user can set both
PROX_EN and ALS_EN bits to 0 in Register 1. Or more simply, set all
of Register 1 to 0x00.
Calculating Lux
The ISL29043’s ADC output codes are directly proportional to lux
when in ALS mode (see ALSIR_MODE bit).
E calc =  RANGE  OUT ADC
(EQ. 2)
FN7935.2
April 28, 2016
ISL29043
In Equation 2, Ecalc is the calculated lux reading and OUT
represents the ADC code. The constant  to plug in is determined
by the range bit ALS_RANGE (register 0x1 bit 1) and is
independent of the light source type.
Table 15 shows two different scale factors: one for the low range
(ALS_RANGE = 0) and the other for the high range
(ALS_RANGE = 1).
be attached to the PCB with a dispensed adhesive. Typical
ISL29043 package height is 0.65 mm (see “Package Outline
Drawing” on page 16) and the inside lower cavity of the baffle is
0.4mm deep. With the cavity depth less than the package height,
the baffle does not reach fully to the PCB surface. This insures
that the internal barrier rests squarely on the top surface of the
package to prevent reflection of the IR-LED illumination toward
the sensor. The example Light Baffle in Figure 7 is shown with a
height of 1.1mm. However, the specific design-appropriate
height varies according to actual system design requirements. If
another material is chosen for a Light Baffle, the material should
be soft and compliant and also should be matte black in finish to
prevent reflection of the IR-LED illumination within a Light Baffle
and surrounding structures underneath the cover-glass.
Noise Rejection
Suggested Light Baffle PCB Footprint
Charge balancing ADC’s have excellent noise-rejection
characteristics for periodic noise sources whose frequency is an
integer multiple of the conversion rate. For instance, a 60Hz AC
unwanted signal’s sum from 0ms to k*16.66ms (k = 1,2...ki) is zero.
Similarly, setting the device’s integration time to be an integer
multiple of the periodic noise signal greatly improves the light
sensor output signal in the presence of noise. Since wall sockets
may output at 60Hz or 50Hz, our integration time is 100ms: the
lowest common integer number of cycles for both frequencies.
The Light Baffle fits down over the entire ISL29043 package. The
lower wall thickness of the Light Baffle around the ISL29043
package is 0.3mm. Therefore, the PCB layout should allow for a
0.3mm clear-zone immediately around the ISL29043 with no
other surface components within this zone.
TABLE 15. ALS SENSITIVITY AT DIFFERENT RANGES
RANGE
ALS_RANGE
(Lux/Count)
1
0.029
2
0.469
Proximity Detection of Various Objects
Proximity sensing relies on the amount of IR reflected back from
objects. A perfectly black object would absorb all light and reflect
no photons. The ISL29043 is sensitive enough to detect black ESD
foam, which reflects only 1% of IR. For biological objects, blonde
hair reflects more than brown hair and customers may notice that
skin tissue is much more reflective than hair. IR penetrates into
the skin and is reflected or scattered back from within. As a result,
the proximity count peaks at contact and monotonically decreases
as skin moves away. The reflective characteristics of skin are very
different from that of paper.
Typical Opto-Mechanical Configuration
Typical applications for the ISL29043 involve use under a
cover-glass, or optical window. Typically, these glass components
are not coated to prevent unwanted reflections. Standard glass
and many plastic materials will reflect 4% of the incident light at
each surface. Reflected light emanating from the internal IR-LED
may be incident on the ALS/Proximity sensor and cause
significant DC-Offset in the detected signals. To prevent this
situation, the device should be used with a Light Baffle, as shown
in Figure 7. A Light Baffle prevents unwanted illumination from
the IR-LED from reaching the ALS/Proximity sensors while not
interfering with normal Ambient Light Sensing or Proximity
detection. The Baffle should be the limiting aperture for both the
IR-LED and the ALS/Prox sensor. Care should be taken to insure
there is no other obstruction in the light path.
Operation Without a Light Baffle
For some product designs, it may be advantageous to use the
ISL29043 under the cover-glass without a Light Baffle. For these
applications, it is recommended that the opto-mechanical design
place the top surface of the ISL29043 package in direct contact
with the inside surface of the cover-glass. This configuration
significantly reduces the IR-LED illumination reflection from the
inside surface of the cover-glass and reduces the DC-Offset of the
proximity sensor. For typical operational performance
comparison, Figure 8 shows a graph of the proximity response
for a standard 18% Kodak Gray Card target over a range of 0 to
100 mm for the same ISL29043 device with:
a. No cover-glass,
b. Cover-glass (0.9 mm thick, ~75%T at 850nm) with Light Baffle,
c. Cover-glass (0.9 mm thick, ~75%T at 850nm) without Light
Baffle and in contact with cover-glass, and,
d. Cover-glass (0.9 mm thick, ~75%T at 850nm) without Light
Baffle and spaced 0.1 mm below cover-glass.
Also, it is highly recommended that only IRDR = 110mA be used
when operating the ISL29043 without a a Light Baffle as the
IRDR = 220mA setting may cause a large DC-Offset even with
the ISL29043 placed in direct contact with the inside surface of
the cover glass.
A Light Baffle is made from a soft, compliant plastic, or rubber
material such as urethane, or silicone. The material should be
mechanically compliant since a designer desires it to fill the
separation between the PCB and the cover-glass and should not
produce undue stress on the thin cover-glass. A Light Baffle is
designed to fit completely over the ISL29043 package and may
11
FN7935.2
April 28, 2016
ISL29043
FIGURE 7. EXAMPLE LIGHT BAFFLE DESIGN
Suggested PCB Footprint
PROX ADC COUNT
250
It is important that users check the “Surface Mount Assembly
Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”
before starting ODFN product board mounting. However, this
device requires a special solder reflow profile as mentioned in
Figure 4 in TB489 (Surface Mount Guidelines for Optical
Co-packages).
NO BAFFLE, 0.1mm FROM GLASS
200
AGAINST GLASS, NO BAFFLE
150
NO COVER GLASS
100
0
http://www.intersil.com/data/tb/TB489.pdf
GLASS W/ BAFFLE
50
Layout Considerations
0
10
20
30
40
50
60
DISTANCE (mm)
70
80
90
FIGURE 8. PROXIMITY COMPARISON WITHOUT LIGHT BAFFLE
(IRDR = 110mA)
Typical Circuit
A typical application for the ISL29043 is shown in Figure 9. The
ISL29043’s I2C address is internally hardwired as 0b100010<x>,
with x representing the logic state of input I2C address pin
ADDR0. The device can be tied onto a system’s I2C bus together
with other I2C compliant devices.
The ISL29043 is relatively insensitive to layout. Like other I2C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I2C traces as far as possible from all
sources of noise. 0.1µF and 1µF power supply decoupling
capacitors need to be placed close to the device.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic ODFN
package requires a custom reflow soldering profile pursuant to
Figure 4 in TB489 (Surface Mount Assembly Guidelines for
Optical Dual Flat No Lead (ODFN) Co-Packages).
12
FN7935.2
April 28, 2016
ISL29043
VI2C PULL-UP
R2
10k
R1
10k
I2C MASTER
R3
10k
MICROCONTROLLER
INT
SDA
SCL
VDD
VLED
SLAVE_0
C1
1.0µF
1 LED+
C3
0.1µF
10
I2C SLAVE_n
SLAVE_1
2
3
C2
1µF
LED-
4
5
ADDR0
IRDR
VDD
INT
GND
SDA
REXT
SCL
REXT
499k
9
8
SDA
SDA
SCL
SCL
7
6
ISL29043
FIGURE 9. ISL29043 TYPICAL CIRCUIT
Typical Performance Curves
VDD = 3.0V, REXT = 499kΩ.
1.0
1.0
0.9
FLUORESCENT
NORMALIZED RESPONSE
NORMALIZED INTENSITY
0.8
0.7
0.6
HALOGEN
0.5
INCAND.
SUN
0.4
HUMAN EYE
0.9
0.3
0.2
0.1
0.8
IR/PROX
ALS
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
350
550
750
0.0
300
950
400
500
600
1.0
4500
0.9
4000
0.8
0.7
0.6
0.5
0.4
0.3
3500
3000
500
30
FIGURE 12. ANGULAR SENSITIVITY
13
1100
60
90
FLUORESCENT
1500
1000
0
ANGLE (°)
1000
2000
0.1
-30
900
HALOGEN INCANDESCENT
2500
0.2
-60
800
FIGURE 11. ISL29043 SENSITIVITY TO DIFFERENT WAVELENGTHS
ALS CODE (1-2 BIT)
NORMALIZED SENSITIVITY
FIGURE 10. SPECTRUM OF FOUR LIGHT SOURCES NORMALIZED BY
LUMINOUS INTENSITY (LUX)
0
-90
700
WAVELENGTH (nm)
WAVELENGTH (nm)
0
0
500
1000
1500
2000
LUX METER READING (lx)
FIGURE 13. ALS LINEARITY OVER 2 LIGHT SOURCES (2000 LUX
RANGE)
FN7935.2
April 28, 2016
ISL29043
Typical Performance Curves
VDD = 3.0V, REXT = 499kΩ. (Continued)
160
255
MEASURED IDD (µA)
PROX COUNTS (8-BIT)
ALS+PROX (DURING PROX SLEEP)
140
204
110mA (18% GREY CARD)
220mA (18% GREY CARD)
153
110mA (WHITE COPY PAPER)
102
220mA (WHITE COPY PAPER)
ALS-ONLY
120
100
51
0
80
PROX (DURING PROX SLEEP)
60
0
25
50
75
100
125
40
2.25
150
2.40
2.55
2.70
220mA-MODE (PROX_DR = 1)
IIRDR (mA)
200
180
160
140
120
110mA-MODE (PROX_DR = 0)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VIRDR (V)
FIGURE 16. IRDR PULSE AMPLITUDE vs VIRDR
FIGURE 18. IR-LED LATERAL EMISSION PATTERN (NORMALIZED
INTENSITY vs ΘLAT)
14
3.15
3.30
3.45 3.60
5.0
10
8
6
4
2
0
-2
-4
-6
-8
-10
"
240
100
3.00
FIGURE 15. VDD vs IDD FOR VARIOUS MODES OF OPERATION
ALS OUTPUT CHANGE FROM +25°C (%)
FIGURE 14. PROX COUNTS vs DISTANCE WITH 10cmx10cm
REFLECTORS
220
2.85
INPUT VDD (V)
DISTANCE (mm)
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
FIGURE 17. STABILITY OF ALS COUNT OVER TEMP (AT 325 LUX)
FIGURE 19. IR-LED TRANSVERSE EMISSION PATTERN (NORMALIZED
INTENSITY vs ΘTRANS)
FN7935.2
April 28, 2016
ISL29043
Typical Performance Curves
VDD = 3.0V, REXT = 499kΩ. (Continued)
Lateral
Transverse
FIGURE 20. DEFINITION OF LATERAL AND TRANSVERSE AXES
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
CHANGE
April 28, 2016
FN7935.2
Added Related Literature section.
April 21, 2016
FN7935.1
Removed the Related Literature section.
February 9, 2012
FN7935.0
Initial release.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on
intersil.com: ISL29043
To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff
FITs are available from our website at: http://rel.intersil.com/reports/sear
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
15
FN7935.2
April 28, 2016
ISL29043
Package Outline Drawing
L10.2.1X3.5E
10 LEAD OPTICAL CO-PACKAGE
Rev 2, 1/12
0.37
A
2.10
0.36
B
PIN # 1
0.37
(0.39)
6
PIN 1
INDEX AREA
0.36
10
0.37
1.24
0.25
1.00
0.20
4
ISL29028
3.50
0.90
0.50
29030
0.49
6
(4X)
5
0.10
0.10 M C A B
0.63
0.63
0.41
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
C
BASE PLANE
SEATING PLANE
0.08 C
0.20
(0.17)
0.68 ± 0.065
SIDE VIEW
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
0.86
PACKAGE
OUTLINE
0.44
0.37
0.03
(0.20)
SIDE VIEW
0.37
1.00
0.15
NOTES:
0.50
0.20
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance: Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.015mm and 0.30mm from the terminal tip.
0.81
2.49
0.44
TYPICAL RECOMMENDED LAND PATTERN
16
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is guaranteed by the
non-symmetry of the package created by the 2 omitted pads.
FN7935.2
April 28, 2016
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