PANASONIC MN101E33G

MN101E33G, MN101E33K
MN101E33G
Type
MN101E33K
Mask ROM
Internal ROM type
MN101EF33N
FLASH
ROM (byte)
128K
256K
512K
RAM (byte)
6K
12K
30K
Package (Lead-free)
Minimum Instruction
Execution Time
QFP100-P-1818B (Under planning)
QFP100-P-1818B (Under development)
0.05 µs (at 3.0 V to 3.6 V, 20 MHz at internal 2, 4, 8 times oscillation))
0.0588 µs (at 2.7 V to 3.6 V, 17 MHz)
0.05 µs (at 3.0 V to 3.6 V, 20 MHz)
30.6 µs (at 2.7 V to 3.6 V, 32.768 kHz)
 Interrupts
RESET, Watchdog, External 0 to 5, Timer 0 to 3, Timer 6, Timer 7 (2 systems), Timer A to E, Time base, Serial 0 (2 systems), Serial
1 (2 systems), Serial 2, Serial 3 (2 systems), Serial 4 (2 systems), Automatic transfer finish (2 systems), A/D conversion finish, Key
interrupts, IEBus*
* IEBus is a trademark of NEC Electronics Corporation.
 Timer Counter
Timer counter 0 : 8-bit × 1
(square-wave/8-bit PWM output, event count, simple pulse width measurement, real time output control)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 0
Timer counter 1 : 8-bit × 1
(square-wave output, event count, synchronous output event, 16-bit timer with casscade connection (Timer 0 and
connection), serial clocke output)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit × 1
(square-wave/8-bit PWM output, event count, synchronous output event, pulse width measurement, real time output
control, serial baud rate timer)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 2
Timer counter 0, 1, 2 can be cascade-connected.
Timer counter 3 : 8-bit × 1 (square-wave output, event count, serial baud rate timer)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 0, 1, 2, 3 can be cascade-connected.
Timer counter 6 : 8-bit freerun timer , time base timer
Clock source................ 1/1 of system clock frequency; 1/1, 1/4096, 1/8192 of OSC oscillation clock frequency; 1/1, 1/4096,
1/8192 of XI oscillation clock frequency
Interrupt generating cycle.... 1/128, 1/256, 1/512, 1/1024, 1/8192 1/32768 of OSC oscillation clock frequency; 1/128, 1/256, 1/512,
1/1024, 1/8192, 1/32768 of XI oscillation clock frequency
Interrupt source ........... coincidence with compare register 6
MAD00065BEM
MN101E33G, MN101E33K
Timer counter 7 : 16-bit × 1
(square-wave/16-bit PWM output, cycle / duty continuous variable, event count, synchronous output evevt, pulse width
measurement, input capture)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 7 (2 lines)
Timer counter A, B, C, D, E : 8-bit × 5
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/2, 1/4, 1/8, 1/16. 1/32 of OSC oscillation clock frequency
Interrupt source ........... coincidence with compare register A, B, C, D, E
Time base timer (one-minute count setting)
Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency
Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768 of clock source frequency
Watchdog timer
Interrupt source ........... 1/65536, 1/262144, 1/1048576, 1/4194304 of system clock frequency
 Serial interface
Serial 0 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, A; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency
Serial 1 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 3, B; 1/2, 1/4, 1/8, 1/16, 1/64 of OSC
oscillation clock frequency
Serial 2 : synchronous type/single-master I²C × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 3, C; 1/2, 1/4, 1/16, 1/32 of OSC
oscillation clock frequency
Serial 3 : synchronous type/ I²C × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, D; 1/2, 1/4, 1/16, 1/32 of OSC
oscillation clock frequency
Serial 4 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, E ; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency
 IEBus Interface
Serial 0 : asynchronous
Clock source
1/2, 1/3 of system clock frequency
 DMA controller
Nomber of channels : 2
Max. Transfer cycles : 255
Starting factor : external request, various types of interrupt, software
Transfer mode : 1-byte transfer, word transfer, burst transfer
 I/O Pins
I/O
22
(5 V IF port) Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
62
(3 V IF port) Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
1
(3 V IF port) Common use
 A/D converter
10-bit × 8-ch. (with S/H)
 Special Ports
Buzzer output, high-current drive port
 ROM Correction
Correcting address designation : up to 7 addresses possible
MAD00065BEM
 Development tools
In-circuit Emulator (under development)
MN101E33K
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
VDD5 = 2.7 V to 5.5 V
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
SBO0A, TXD0A, P00
SBI0A, RXD0A, P01
SBT0A, P02
SBO2A, SDA2A, P03
SBI2A, P04
SBT2A, SCL2A, P05
BUZZER, P06
TM0IO, P10
TM1IO, P11
TM2IO, P12
MMOD
OSC2
OSC1
VSS
XI
XO
VDD33
VDD18
NRST, P27
TM3IO, P13
TM7IOA, P14
TM7OB, P15
TM7OC, P16
SYSCLK, P17
IRQ0A, P20
SBO0B, TXD0B, P90
SBI0B, RXD0B, P91
SBT0B, P92
SBO3B, SDA3B, P93
SBI3B, P94
SBT3B, SCL3B, P95
SBO2B, SDA2B, PD0
SBI2B, PD1
SBT2B, SCL2B, PD2
IRQ0B, PD3
IRQ1B, PD4
IETX, IRQ2B, PD5
IERX, IRQ3B, PD6
VDD5
PD7
VSS
AN0, PA0
AN1, PA1
AN2, PA2
AN3, PA3
AN4, PA4
AN5, PA5
AN6, PA6
AN7, PA7
VREF+
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P43
P42, SBT4
P41, SBI4, RXD4
P40, SBO4, TXD4
P87, LED7, D7
P86, LED6, D6
P85, LED5, D5
P84, LED4, D4
P83, LED3, D3
P82, LED2, D2
P81, LED1, D1
P80, LED0, D0
VSS
P77, SD7, NDK
P76, SD6, NWE
P75, SD5, NRE
P74, SD4, NCS
P73, SD3, A19
P72, SD2, A18
P71, SD1, A17
P70, SD0, A16
P67, KEY7, A15
P66, KEY6, A14
P65, KEY5, A13
P64, KEY4, A12
 Pin Assignment
P63, KEY3, A11
P62, KEY2, A10
P61, KEY1, A9
P60, KEY0 , A8
P57, A7
P56, A6
P55, A5
P54, A4
P53, A3
P52, A2
P51, A1
VSS
P50, A0
VDD18
P35, SBT3A, SCL3A
P34, SBI3
P33, SBO3A, SDA3A
P32, SBT1
P31, SBI1, RXD1
P30, SBO1, TXD1
P25, IRQ5
P24, IRQ4
P23, IRQ3A
P22, IRQ2A
P21, IRQ1A
VDD33 = 2.7 V to 3.6 V
QFP100-P-1818B
MAD00065BEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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Electric Industrial Co., Ltd. Industrial Co., Ltd.