506BU

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN44 8.9x5, 0.4P
CASE 506BU--01
ISSUE O
SCALE 2:1
A
B
D
DATE 15 JUN 2010
L
L
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
PIN ONE
LOCATION
0.15 C
EXPOSED Cu
0.15 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MOLD CMPD
TOP VIEW
(A3)
DETAIL B
0.10 C
DETAIL B
ALTERNATE
CONSTRUCTIONS
A
0.08 C
A1
NOTE 4
C
SIDE VIEW
0.10
SEATING
PLANE
D2
DETAIL A
GENERIC
MARKING DIAGRAM*
C A B
M
MILLIMETERS
MIN
MAX
0.80
0.90
0.00
0.05
0.20 REF
0.15
0.25
8.90 BSC
8.20
8.40
5.00 BSC
3.50
3.70
0.40 BSC
0.20
-- -- -0.30
0.50
0.00
0.15
1
1
0.10
M
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
C A B
K
E2
44X
e
e/2
L
44X
b
0.07
M
C A B
0.05
M
C
BOTTOM VIEW
XXXXX
A
WL
YY
WW
G
NOTE 3
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb--Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
8.40
44X
0.63
3.70
44X
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb--Free Package
5.30
0.26
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON51797E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
DESCRIPTION:
October, 2002
- Rev. 0
DFN44, 8.9x5, 0.4P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON51797E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. B. JENSEN.
DATE
15 JUN 2010
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2010
June, 2010 - Rev. 01O
Case Outline Number:
506BU
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