567AG

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP35, 3.63x2.68
CASE 567AG−01
ISSUE B
SCALE 4:1
È
È
D
B
A
PIN A1
REFERENCE
0.10 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
DIM
A
A1
A2
b
C
D
E
eD
eE
E
2X
DATE 24 JAN 2011
0.10 C
TOP VIEW
MILLIMETERS
MIN
MAX
1.00
0.84
0.17
0.23
0.72 REF
0.24
0.29
0.125 BSC
3.63 BSC
2.68 BSC
0.25 BSC
0.433 BSC
GENERIC
MARKING DIAGRAM*
A2
0.10 C
XXXXXXXXXXXX
XXXXXXX
AWLYYWWG
A
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
eD
C
35X
b
0.05 C A B
0.03 C
E
= Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking.
eE
D
XXXXXX
A
WL
YY
WW
G
C
RECOMMENDED
SOLDERING FOOTPRINT*
B
A
PACKAGE
OUTLINE
A1
14 13 12 11 10 9 8 7 6 5 4 3 2 1
BOTTOM VIEW
0.433
PITCH
35X
0.25
0.250
PITCH
0.125
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON31202E
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
WLCSP35, 3.63X2.68
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON31202E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM POD #08−0004 TO ON SEMICONDUCTOR.
REQ. BY B. BERGMAN.
09 JUL 2008
A
REFORMATTED DRAWING TO JEDEC STANDARDS. REQ. BY C. CALAME.
02 NOV 2010
B
REVERSED PACKAGE ORIENTATION. REQ. BY C. CALAME.
24 JAN 2011
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 01B
Case Outline Number:
567AG
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