Connected Sensor for Building Automation Guide

Connected Sensors
Building Automation
Systems Guide
www.ti.com/buildingAutomation2015
Connected Sensors Building Automation Systems Guide
Table of Contents and Sensor Solutions
Introduction
Monitoring devices or nodes in
building control systems, fire safety
systems, lighting control, and other
building automation and Internet
of Things (IoT) applications are
becoming more prevalent in
today’s world.
The use of connected sensors has
a wide range of uses in building
automation applications, from
monitoring human safety and
security, controlling the environment and ambience specified by
the comfort preferences of the end
user, or either periodic or continuous data logging of environmental
and system data to detect irregular
system conditions.
Texas Instruments (TI) has a broad
portfolio of products that cater to
connected sensing in building
automation applications. This
portfolio ranges from innovative
sensor analog front-end products
to low-power wireless connectivity
solutions.
Table of Contents
Sensor Solutions
2Temperature Sensing
2 Humidity and Temperature Sensing
2 Ambient Light Sensing
3 Inductance Sensing
3 Capacitance Sensing
3 Hall Effect Sensor
Amplifiers and Comparators
4 Low Power Amplifiers
4 General Purpose Amplifiers
4Comparators
4 Analog-to-Digital Converters
Power Management
8
8
8
9
9
9
9
DC/DC Switching Regulators
Linear Regulators
Voltage Reference
AC/DC Converters
Ultra Low Power Harvester Power Management IC
System Timer
Load Switches
Haptic Drivers
10 Piezo Drivers
10 Haptic Drivers
Interface and Protection
Wireless Connectivity
11 Integrated ESD Protection
11 High Performance TVs Diodes
11 Peripheral Drivers
11RS-485
11eFuses
5Wi-Fi
5 Sub-1GHz
5Bluetooth®
5ZigBee®
5NFC
Embedded Processing Solutions
7 MSP430 Low Power FRAM MCUs
7 MSP430 Low Power MCUs
7 ARM Based MCUs and MPUs
Sensor Solutions
TI has a rich, five-decade history of sensing innovation and, combined with best-in-class sensing technologies, tools, and
resources, we continue to deliver better solutions today and new possibilities for tomorrow.
Learn more about sensor solutions at: www.ti.com/sensing
Temperature Sensing
Part No.
LMT70/70A
LMT84
Type
Analog
Analog
Local Sensor Accuracy
(Max) At Given Temp
Range (±°C)
±0.2°C from 20 to 90
±2.7°C from –50 to 150
Supply
Current
(Max) (µA)
12
8.1
Supply
Range (V)
2.0 to 5.5
1.5 to 5.5
TMP112
Digital
±0.5°C from 0 to 65
10
1.4 to 3.6
TMP75
Digital
±2°C from –25 to 85
85
2.7 to 5.5
TMP007
Contactless
±1°C from –40 to 125
350
2.2 to 5.5
Interface
Analog Out
Analog Out
I2C, SMBus,
2-wire
I2C, SMBus,
2-wire
I2C, SMBus
Infrared Sensor
Accuracy (Max)
(±°C)
–
–
Operating
Temp.
(°C)
–55 to 150
–50 to 150
Pin / Package
4DSBGA
5SC70
Approx.
Price
(US$ | 1ku)
0.54 / 0.65
0.18
–
–40 to 125
6SOT
0.90
–
–40 to 125
8SOIC, 8VSSOP
0.45
3
–40 to 125
8DSBGA
1.90
Humidity and Temperature Sensing
Part No.
HDC1000/1050
HDC1008
Relative
Humidity
Accuracy
(Typ) (%RH)
±3
±4
RH Operating
Range (Typ)
(%RH)
0 - 100
0 - 100
Temperature
Accuracy
(Typ) (°C)
±0.2
±0.2
Supply
Range
(V)
3 to 5
3 to 5
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 2
| Connected Sensors Building Automation Systems Guide 2015
Average
Supply
Current (Typ)
(µA)
1.2 @ 1 sps
1.2 @ 1 sps
Interface
I2C
I2C
Operating
Temp.
(°C)
–40 to 125
–40 to 125
Pin /
Package
8DSBGA, 6DFN
8DSBGA
Approx. Price
(US$ | 1ku)
2.20
1.76
Preview products are listed in bold teal.
Texas Instruments
Sensor Solutions
Ambient Light Sensing
Supply
Range
(Nom) (V)
Part No.
OPT3001
Iq (Max)
(µA)
1.6 to 3.6
Lux
Range
(Nom)
Dark Response @ 0
Lux (Max)
0.01 to
83K
2
Gain
Selection
Interface
Benefits
I2C
Matches photopic response
of the human eye
Rejects > 99% (Typ) of IR
11 Gains with
Auto-ranging
1 Code
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
–40 to 85
USON
0.99
Inductance Sensing
L
(Inductance)
Resolution
(Bits)
Supply
Range
Active
State
Current
(mA)
Interface
Sensor
Frequency
(Hz)
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
Part No.
Key
Applications
Special Features
Input
Channels
LDC1312/4
• Position
• Sensing
• Angle/Rotation
sensing
• Contactless sensing
• Ultralow cost sensors
(coils, PCB coils)
• Immune to dust, dirt etc.
2/4
12
2.7 to
3.6
2.1
I2C
1k to 10M
–40 to
125
WSON,
WQFN
2.38 /
3.50
LDC1612/4
• Position
Sensing
• Angle/Rotation
sensing
• Contactless sensing
• Ultralow cost sensors
(coils, PCB coils)
• Immune to dust, dirt etc.
2/4
28
2.7 to
3.6
2.1
I 2C
1k to 10M
–40 to
125
WSON,
WQFN
3.25 /
4.75
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
Capacitance Sensing
Shield
Drive
Channels
Special
Features
Supply
Range
Supply
Current
(mA)
Interface
Prog.
Sampling Rate
(Typ) (SPS)
4
• Liquid level sensing
(with interferers)
2
Integrated
Shield Drivers
3 to 3.6
0.75
I2C
100 / 200 / 400
–40 to 125
WSON
2.50
FDC2114/12
4/2
• Proximity Sensing
• Liquid Level Sensing
–
EMI
resistant core
2.7 to
3.6
2.1
I2C
40 to 4080
–40 to 125
WQFN
2.38 / 3.50
FDC2214/12
4/2
• Proximity Sensing
• Liquid Level Sensing
–
EMI
resistant core
2.7 to
3.6
2.1
I2C
40 to 13300
–40 to 125
WQFN
3.25 / 4.75
Part No.
Input
Channels
Special Features
FDC1004
Hall Effect Sensor
Output
Bandwidth
(Typ) (kHz)
Operating
Temp. (°C)
Pin / Package
Approx. Price
(US$ | 1ku)
Type
Type
Supply
Range
DRV5013/23/33
Digital
Latch / Switch / Omnipolar Switch
2.5 to 38
Open Drain
–
–40 to 125
SOT-23, TO-92
0.29
DRV5053
Analog
Analog Bipolar
2.5 to 38
0.2 to 1.8 V
10
–40 to 125
SOT-23, TO-92
0.31
Part No.
Output
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red.
Find the Perfect Sensor Reference Design to Get Started
16-Button Keypad using the LDC1314
Inductive-to-Digital Converter
Reference Design - TIDA-00509
Key Features
• Contactless buttons with superior reliability over
electrical/mechanical contact solutions
• Support simultaneous button presses
TI Devices
LDC1314
LP2985-N
MSP430F5528
Backlight and Smart Lighting Control by
Ambient Light and Proximity Sensor
Reference Design - TIDA-00373
Key Features
• Good Human Eye Spectral Matching
• Dynamically Adjusts Backlight Brightness
• UV Filter for Outdoor Using
TI Devices
OPT3001
FDC1004
HDC1000
MSP430FR5969
Spectral Response: The OPT3001 and Human Eye
Ambient Light Sensor with Human Eye Visibility
1
Normalized Response
The OPT3001 is a single-chip lux meter, measuring the intensity of light as
visible by the human eye. The precision spectral response and strong IR
rejection of the device enables the OPT3001 to accurately meter the intensity
of light as seen by the human eye regardless of light source. The strong IR
rejection also aids in maintaining high accuracy when industrial design calls
for mounting the sensor under dark glass for aesthetics.
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
300
400
500
600
700
800
900
1000
Wavelength (nm)
Texas Instruments
Connected Sensors Building Automation Systems Guide 2015
|
3
Amplifier and Comparator Solutions
Texas Instruments delivers a broad portfolio of amplifier and linear solutions including precision and high speed op amps,
instrumentation and differential amplifers along with comparators. TI has an amplifier suited for any application.
Learn more about Amplifier solutions at: www.ti.com/amplifier
Low Power Amplifiers
Slew Rate
(Typ) (V/µs)
CMRR
(Typ)
(dB)
Offset
Voltage @
25°C (Max)
(mV)
Offset
Drift
(Typ)
(µV/°C)
Part No.
Supply
Range (V)
Channels
Iq per
ch. (Max)
(mA)
LMV611/2/4
1.8 to 5.5
1/2/4
0.21
1.5
0.42
60
4
LPV521
1.6 to 5.5
1
0.0004
0.0062
0.0024
102
GBW (Typ)
(MHz)
Rail-Rail
Operating
Temp.
(°C)
Approx.
Price
(US$ | 1ku)
5.5
RRIO
–40 to 125
0.22 / 0.25 /
0.30
1
0.4
RRIO
–40 to 125
0.49
OPA369
1.8 to 5.5
1
0.0012
0.012
0.005
100
0.75
0.4
RRIO
–40 to 85
0.65
OPA349
1.8 to 5.5
1
0.002
0.065
0.02
52
10
15
RRIO
0 to 70
0.50
Offset
Voltage @
25°C (Max)
(mV)
Offset
Drift
(Typ)
(µV/°C)
General Purpose Amplifiers
Supply
Range (V)
Channels
Iq per
ch. (Max)
(mA)
TLC271/2/4
3 to 16
1/2/4
1.6
1.7
3.6
65
10
1.8
LM2904
3 to 26
2
0.6
0.7
0.3
50
7
7
–40 to 125
0.07
LM358
3 to 32
2
0.6
0.7
0.3
65
7
7
0 to 70
0.07
OPAx313
1.8 to 5.5
1, 2, 4
0.06
1
0.5
70
2.5
2
-40 to 125
0.26 / 0.38 / 0.55
OPAx314
1.8 to 5.5
1, 2, 4
0.21
3
1.5
75
2.5
1
-40 to 125
0.30 / 0.45 / 0.65
OPAx316
1.8 to 5.5
1, 2, 4
0.5
10
6
76
2.5
2
-40 to 125
0.48 / 0.72 / 1.08
OPAx170
2.7 to 36
1, 2, 4
0.145
1.2
0.5
104
1.8
0.3
-40 to 125
0.40 / 0.60 / 0.90
OPAx171
2.7 to 36
1, 2, 4
0.595
3
1.5
104
1.8
0.3
-40 to 125
0.40 / 0.60 / 0.90
OPAx172
2.7 to 36
1, 2, 4
1.8
10
10
90
1
0.3
-40 to 125
0.65 / 0.99 / 1.49
Input
Bias
Current
(±) (Max)
(nA)
VICR (V)
Offset
Voltage
@ 25°C
(Max)
(mV)
Operating
Temp.
(°C)
Approx. Price
(US$ | 1ku)
Part No.
GBW (Typ)
(MHz)
Slew Rate
(Typ) (V/µs)
CMRR
(Typ)
(dB)
Operating
Temp.
(°C)
–40 to 85
Approx. Price
(US$ | 1ku)
0.31 / 0.41 / 0.60
Comparators
Part No.
Type
Supply
Range (V)
Channels
tRESP
Low-toHigh (µs)
Iq per
ch. (Max)
(mA)
TLV3691
Push-Pull
0.9 to 6.5
1
24
0.00015
0.1
-0.1 to 6.6
15
–40 to 85
0.40
TLV3012
Push-Pull
1.8 to 5.5
1
6
0.005
0.01
-0.2 to 5.7
12
–40 to 85
0.75
TLC3702
Push-Pull
3 to 16
2
1.1
0.02
0.03
0 to 15
5
–40 to 85
0.36
TLV1701/2/4
Open
Collector
2.2 to 36
1, 2, 4
0.56
0.075
15
2.2 to 36
2.5
-40 to 125
0.38 / 0.61 / 0.97
Analog-to-Digital Converters
Sample
Rate
(SPS)
Input
Channels
Interface
Supply
Range
(V)
Features
Operating
Temp.
(°C)
Approx. Price
(US$ | 1ku)
Part No.
Type
Resolution
(bits)
ADS7040/1/2/3/4
SAR
8 to 12
1000
1
SPI
0 to 3.6
Nanowatt Power Consumption
-40 to 125
1.00 / 1.60 / 2.10
ADS1018
ΣΔ
12
3300
4
SPI
2 to 5.5
Temp. Sensor (0.5°C accurate)
-40 to 125
1.15
SPI
2.3 to
5.5
Single cycle setting, sensor, IDACs
-40 to 125
3.15 / 3.95
ADS1120/1220
ΣΔ
16, 24
2000
4
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
4
|
Connected Sensors Building Automation Systems Guide 2015
Texas Instruments
Li-Ion
Wireless Connectivity
Smallest Power Source
Required
AAA
With the industry’s broadest wireless connectivity portfolio
TI offers cost-effective, low-power solutions for short-range,
long-range, mesh, and IP networks
No
Battery
Coin
Cell
Learn more about Wireless Connectivity solutions at:
www.ti.com/wireless
Wi-Fi
BLE/ANT
ZigBee
BLE/ANT
Sub-1 GHz RF4CE
2.4 GHz 6LoWPAN
2.4 GHz
NFC/RFID Proprietary
Wi-Fi
Part No.
Technology
Benefits
TI Designs and Development Tools
CC3200
SimpleLink Wi-Fi Wireless MCU with ARM Cortex®-M4, Integrated Wi-Fi Connectivity, security, low power,
ease of use: Certified Wi-Fi modules available
CC3200MODLAUNCHXL, TIDA-00372,
TIDC-CC3200SMARTPLUG,
TIDC-CC3200CAMBOOST
CC3100
SimpleLink Wi-Fi Wireless Network Processor: provides easy Wi-Fi connectivity for building automation
applications. Fully integrated 802.11 b/b/n radio, baseband, and MAC. Connect serialy Interface to
any 8, 16, or 32-bit micro-controllers. Certified Wi-Fi modules available
CC3100MODBOOST
WL1837MOD
High performance, low power, certified combo modules integrating Wi-Fi + Bluetooth + Bluetooth Low
Energy. Connects to any Linux Processor with SDIO interface, available up to 85°C, 2.4GHz and 5GHz
WL1837MODCOM8I
Part No.
Benefits
TI Designs and Development Tools
CC1200
High performance, long distance, low power radio transceiver: optimized for wide band applications
CC1200DK, CC1200EMK-868-930, TIDC-CHN
CC1120
High performance, long distance, low power radio transceiver: optimized for Narrowband
CC1120DK, CC1120EMK-169,
CC1120EMK-420-470, CC1120EMK-868-915,
TIDC-MULTIBAND-WMBUS
CC1101
Ultra-low power radio transceiver
CC1101DK433, CC1101DK868-915,
TIDM-SUB1GHZ-MESH-NETWORK
CC1310
SimpleLink Ultra-low power ARM® Cortex®-M Based Wireless MCU
TIDA-00484
Sub-1GHz
Bluetooth®
Part No.
Benefits
TI Designs and Development Tools
CC2650
SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU: multi-standard supported
Bluetooth Low-Energy, 6LowPAN and ZigBee. Ideal for end point sensors
CC2650DK, CC2650STK,
TIDA-00374
CC2640
SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU supporting Bluetooth LowEnergy: ultra-low power, small size and ease of use. Ideal for end point sensors
CC2650DK, CC2650STK,
TIDA-00374
CC2540T
Extreme temperature Bluetooth Low Energy (up to 125 degree C) wireless MCU combined with low power
and ease of use
CC2541DK-MINI,
TIDC-BLUETOOTH-LOW-ENERGY-LONG-RANGE,
TIDC-BLUETOOTH-SMART-TO-RS-485-GATEWAY
CC2564MODA
Dual Mode Bluetooth (Bluetooth Low energy + Bluetooth Classic) transceivers module with antenna integrated: low-power, stable and robust SW stack
CC256XQFNEM
CC2564MODAEM (RTM September)
Part No.
Benefits
TI Designs and Development Tools
CC2630
SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU : ideal for end point sensors
CC2650DK, CC2650STK,
TIDA-00374
CC2530
ZigBee Wireless MCU: enables robust network nodes to be built with very low total bill-of-material costs
CC2530DK, CC2530EMK,
CC2531EM-IOT-HOME-GATEWAY-RD,
CC2530-CC2592EM-RD
CC2538
512kB ARM® Cortex®-M Based Wireless MCU: handle complex network stacks with security, demanding
applications, and over-the-air download
CC2538DK, CC2538EMK,
TIDC-ZNP-HOST-SW3
Benefits
TI Designs and Development Tools
ZigBee®
NFC
Part No.
transponder chip with a programmable 16-bit MSP430 low-power microcontroller. Optimized
RF430FRL152H 13.56-MHz
for operation in fully passive (battery-less) or single-cell battery-powered (semi-active) mode.
RF430CL330H
NFC Tag Type 4 device which combines a wireless NFC interface and a wired SPI/I2C interface to connect
the device to a host
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. Texas Instruments
TIDM-RF430-TEMPSENSE,
TIDM-RF430FRLSENSE
TIDA-00217
New products are listed in bold red.
Connected Sensors Building Automation Systems Guide 2015
|
5
Wireless Connectivity
Find the Perfect Connectivity Reference Design to Get Started
SimpleLink™ Bluetooth Smart®/
Multi-Standard SensorTag
Reference Design - CC2650STK-RD
Key Features
• More Sensors! 10 Sensors including light, humidity,
pressure, magnetic, accelerometer, gyroscope, and others
• Flexibility for IoT applications; Enable ZigBee or 6LoWPAN through a firmware upgrade
TI Devices
CC2650
TMP007
OPT3001
HDC1000
Wired (UART or RS-485) to Wi-Fi®
Bridge with 24-VAC Power
Reference Design - TIDA-00375,
TIDA-00485, TIDA-00486
Key Features
• Add Wi-Fi® Connectivity to an existing wired network
• Wide Input Voltage Range of 18- to 30-VAC, 12- to 48-VDC
• Galvanically Isolated or Non-Isolated variations
TI Devices
CC3200MOD
CC3100MOD
LM5160
LMR16006
Battery-less NFC/RFID
Temperature Sensing Patch
Reference Design TIDM-RF430-TEMPSENSE
Key Features
• No batteries required
• “Over the air” configuration of the ADC
• Different antenna configurations allow many form factors
TI Devices
RF430FRL152H
Dynamic Field Powered NFC Reference
Design for Data Logging and Security
Applications
Reference Design - TIDA-00217
Key Features
• User can receive updated information
from a field unit
• Battery-less sensor interface; NFC reader provides
TI Devices
TMP103
RF430CL330H
MSP430FR5969
SimpleLink™ Wi-Fi® CC3200 Smart Plug
Reference Design TIDC-CC3200SMARTPLUG
Key Features
• Single-Phase energy measurement that calculates Current, Voltage, Power, and Energy
• SimpleLink™ Wi-Fi® connectivity over 802.11 b/g/n networks from any mobile device
• Isolated flyback power supply to provide Constant-Voltage and Constant-Current output
regulation without optical coupler”
TI Devices
CC3200
UCC28910
TPS61097A-33
Embedded Processing Solutions
Microcontrollers and processors from Texas Instruments offer a broad range of performance and power consumption options.
From MSP430 MCU with ultra-low power consumption to the Sitara™ AM335x family with integrated multi-protocol industrial
communications support to connect various kinds of sensors in real-time for better automation; TI is tailored to meet your
design challenges.
Learn more about Microcontroller solutions at: www.ti.com/msp430 and www.ti.com/msp432.
Learn more about processor solutions at: www.ti.com/processors.
Non-volatile
Memory (KB)
SRAM (KB)
GPIO
I2C
SPI
UART
DMA
ADC
Comparator
(Channels)
Timers
16-Bit
Multipliers
AES
Additional
Features
Operating
Temp. (°C)
Package
MSP430FR4133
16
15.5
2
60
1
2
1
0
ADC10-10ch
0
2
N/A
N/A
LCD, RTC, BOR,
Temp Sensor
–40 to 85
LQFP,
TSSOP
1.55
MSP430FR5969
16
64
2
40
1
3
2
3
ADC12-16ch
16
5
32x32
AES256
RTC, BOR, IrDA,
Temp Sensor
–40 to 85
VQFN
2.35
MSP430FR6972
16
64
2
51
2
4
2
3
ADC12-8ch
8
5
32x32
AES256
LCD, RTD, BOR,
IrDA, Temp
Sensor
–40 to 85
LQFP
2.55
MSP430FR6989
16
128
2
83
2
4
2
3
ADC12-16ch
16
5
32x32
AES256
LCD, RTC, Scan
I/F, BOR, IrDA,
Temp Sensor
–40 to 85
LQFP
4.50
Part No.
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 6
| Connected Sensors Building Automation Systems Guide 2015
Approx.Price
(US$ | 1ku)
Frequency
(MHz)
MSP430 Low Power FRAM MCUs
New products are listed in bold red.
Texas Instruments
Embedded Processing Solutions
Non-volatile
Memory (KB)
SRAM (KB)
GPIO
I2C
SPI
UART
ADC
Comparator
(Channels)
Timers
16-Bit
Multipliers
Additional
Features
Operating
Temp. (°C)
Package
MSP430G2553
16
16
0.5
24
1
1
1
ADC10-8ch
8
2
N/A
Temp Sensor, BOR, IrDA
–40 to 85
TSSOP,
VQFN
0.90
MSP430G2955
16
56
4
32
1
2
1
ADC10-12ch
8
3
N/A
Temp Sensor, BOR, IrDA
–40 to 85
TSSOP,
VQFN
1.30
MSP430F2274
16
32
1
32
1
1
1
ADC10-12ch
0
2
N/A
Temp Sensor, BOR,
OpAmp
–40 to 105
–40 to 85
DSBGA,
TSSOP,
VQFN
1.80
MSP430I2041
16
32
2
16
1
2
1
SigmaDelta
24-4ch
0
2
16 x16
Temp Sensor, BOR, IrDA
-40 to 105
TSSOP,
VQFN
1.75
Part No.
Approx.Price
(US$ | 1ku)
Frequency
(MHz)
MSP430 Low Power MCUs
ARM Based MCUs and MPUs
Part No.
MSP432P401R
AM3352
ARM CPU
Benefits
TI Designs and Dev. Tools
ARM Cortex-M4F
MSP432P4x microcontrollers are the ideal combination of TI's MSP430 low-power DNA, advanced mixed-signal
features, and the high-performance processing capabilities of ARM®'s 32-bit Cortex®-M4F RISC engine.
MSP-EXP432P401R
ARM Cortex-A8
Sitara™ AM335x ARM Cortex-A8 Processors deliver the right balance of performance (300 MHz to 1 GHz of
processing power), Interfaces (DDR3, LCD, Touch Screen Controller), and Connectivity (UART and Industrial
Protocols)
Beaglebk, TMDXEVM3358
New products are listed in bold red.
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
Find the Perfect MCU Reference Design to Get Started
Thermostat Implementation with
FRAM Microcontroller
Reference Design - TIDM-FRAM-THERMOSTAT
Key Features
• 0°C to 35°C Temperature Measurement with 0.1°C Resolution
• 3.4 inch LCD Display
• Ultra-Low Power: 1.8 µA Standby Current
FRAM Technology
All-in-one: FRAM MCU delivers max benefits
Ferroelectric Random Access Memory (FRAM) is a
memory technology that combines the best of Flash
and SRAM. It is non-volatile like Flash, but offers fast
and low power writes, write endurance of 1015 cycles,
code and data security that is less vulnerable to
attackers than Flash/EEPROM, resistance to radiation
and electromagnetic fields, and unmatched flexibility.
This memory technology has been around for decades,
but is now being integrated in MSP430 ultra-low-power
microcontrollers (MCUs) to bring its unique advantages
to real-world applications such as energy harvesting,
data security, remote sensing or data logging, and
many others.
Specifications
Texas Instruments
TI Devices
MSP430FR4133
SN65HVD75
TPS782
FRAM
SRAM
EEPROM
Flash
Yes
No
Yes
Yes
10ms
<10ms
2 secs
1 sec
Average active Power [µA/MHz]
16 bit word access by the CPU
100
<60
50,000+
230
Write
endurance
1015
Unlimited
100,000
10,000
Soft Errors
Below
Measurable Limits
Yes
Yes
Yes
Bit-wise
programmable
Yes
Yes
No
No
Unified Memory
Flexible code and data partitioning
Yes
No
No
No
Non-volatile
Retains data w/o power
Write speed
(13 KB)
Connected Sensors Building Automation Systems Guide 2015
|
7
Power Management
Texas Instruments offers complete power solutions with a full line of high-performance products. These products, which
range from standard linear regulators to highly efficient DC/DC converters and battery management, are tailored to meet your
design challenges.
Learn more about Power Management solutions at: www.ti.com/power and www.ti.com/powerlab
DC/DC Switching Regulators
Topology
Supply
Range (V)
Output
Voltage (V)
Output
Current
(Max) (A)
Switching
Frequency
(Max) (kHz)
Duty Cycle
(Max) (%)
Iq (Typ)
(mA)
Operating
Temp. (°C)
Pin / Package
Approx.
Price
(US$ | 1ku)
Buck Module
2.2 to 5.5
1.8 to 2.5
0.2
2000
100
0.00036
–40 to 85
9uSIP
1.50
Part No.
Vin < 24V
TPS82740A
TPS62730
Buck
1.9 to 3.9
1.9, 2.1, 2.3
0.1
3000
100
0.025
–40 to 85
6SON
0.55
TPS62080
Buck
2.3 to 6
0.5 to 6
1.2
2000
100
0.0045
–40 to 85
8WSON
0.75
TPS62160
Buck
3 to 17
0.9 to 6
1
2500
100
0.017
–40 to 85
8VSSOP, 8WSON
0.80
TPS61291
Boost
0.9 to 5.0
2.5, 3.0, 3.3
0.2
–
–
0.005
–40 to 85
6SON
0.68
TPS61098
Boost
0.7 to 4.5
2.2 to 4.3
0.1
–
–
0.0003
-40 to 85
6WSON
0.72
TPS61220
Boost
0.7 to 5.5
1.8 to 5.5
0.1
2000
90
0.005
–40 to 85
6SC70
0.43
Wide Vin (Vin ≥ 24V)
TPS62175
Buck
4.7 to 28
1 to 6
0.5
1000
100
0.0048
-40 to 85
10WSON
0.70
LM25017/8/9
Buck
7.5 to 48
1.25 to 40
0.65 / 0.3
/ 0.1
1000
90
1.75
–40 to 125
8WSON, 8SO
PowerPAD
1.25 / 1.12 /
0.81
TPS54160A
Buck
3.5 to 60
0.8 to 58
1.5
2500
98
0.138
–40 to 125
10MSOP/10SON
1.58
TPS54060A
Buck
3.5 to 60
0.8 to 58
0.5
2500
98
0.116
–40 to 150
10MSOP/10SON
1.27
TPS54061
Buck
4.7 to 60
0.8 to 58
0.2
1100
98
0.09
–40 to 150
8SON
1.04
Linear Regulators
Supply
Range (V)
Output
Voltage (V)
Output
Current
(Max) (A)
Iq (Typ)
(mA)
Output
Options
Accuracy
(Max) (%)
PSRR @
100kHz (dB)
Operating
Temp.
(°C)
Pin / Package
Approx. Price
(US$ | 1ku)
2.7 to 6.5
1.2 to 4.5
0.2
0.04
Adj. or Fixed
2
38
–40 to 125
5DSBGA, 5SOT, 6SON
0.28
TLV1117
2.7 to 15
1.25 to 13.7
0.8
0.08
Adjustable
1
28
–40 to 125
3TO, 4SOT, 8SON
0.18
TPS7A37
2.2 to 5.5
1.2 to 5.4
1
0.4
Adj. or Fixed
1
32
–40 to 125
6SON
0.66
LP5907
2.2 to 5.5
1.2 to 4.5
0.25
0.012
Fixed
2
60
–40 to 125
4DSBGA, 4X2SON, 5SOT-23
0.14
TPS709
LP2951/LP2951-N
TPS7A16
LM317
2.7 to 30
2 to 30
3 to 60
3 to 40
1.2 to 6
1.2 to 29
1.2 to 18.5
1.25 to 37
0.15
0.1
0.1
1.5
0.001
0.075
0.005
0.05
Fixed
Adjustable
Adj. or Fixed
Adjustable
2
2
2
4
26
53
26
–
–40 to 125
–40 to 125
–40 to 125
0 to 125
0.39
0.18
1.39
0.18
LM2936
5.5 to 60
3 to 5
0.05
0.015
Fixed
3
35
–40 to 125
5SOT-23, 6SON
8SOIC
8SON, 8MSOP-PowerPAD
4SOT, 3TO, 2PFM
3TO-92, 4SOT-223, 8SOIC,
8VSSOP, 3TO-252
Iout/Iz
(Max)
(mA)
Iq (Typ)
(µA)
Initial
Accuracy
(%)
0.1-10Hz
Noise (Max)
(µVpp)
Temp.
Coeff (Typ)
(ppm/°C)
Operating
Temp. (°C)
Pin / Package
Approx.
Price
(US$ | 1ku)
Part No.
Vin < 24V
TPS799
Wide Vin (Vin ≥ 24V)
0.62
Voltage Reference
Part No.
Supply
Range (V)
Output
Voltage (V)
REF3312
2.7 to 5.5
2.5
5
3.9
0.15
70
9
–40 to 125
3SC70, 5SOT-23, 8UQFN
0.85
REF5030
3.2 to 18
3
10
800
0.05
9
3
–40 to 125
8SOIC, 8VSSOP
1.35
–
–40 to 125
–40 to 85
3SOT-23
0.19
ATL431
2.5 to 36
2.5 to 36
100
20
0.5
1
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 8
|
Connected Sensors Building Automation Systems Guide 2015
–
New products are listed in bold red.
Texas Instruments
Power Management
AC/DC Converters
Power
Level
(Typ) (W)
Part No.
Current
Mode
Maximum
Practical
Frequency
Topologies
700-V
Start-Up
Circuit
Soft
Start
110-V
Start-Up
Circuit
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
Green Mode PWM Controllers
UCC28722
Up to 25
3
Flyback w/PSR for Bipolar Power Device
80 kHz
3
UCC28700/1/2/3
Up to 30
3
Flyback w/PSR
130 kHz
3
3
-40 to 125
6SOT-23
0.25
-20 to 125
6SOT-26
0.35
Switchers with Integrated FETs
UCC28880
<5
UCC28910
<10
3
High Voltage Switcher for Non-Isolated
AC/DC Conversion
66 kHz
3
3
-40 to 125
7SOIC
0.55
High Voltage Flyback Switcher w/PSR
115 kHz
3
3
-40 to 125
7SOIC
0.75
Ultra Low Power Harvester Power Management IC
Part No.
BQ25570
BQ25505
Description
Power Management IC which efficiently extracts microwatts (uW) to milliwatts (mW)
of power generated from high output impedance DC Sources like photo voltaic
(solar) or thermal electric generators (TEG).
Benefits
TI Designs
Integrates nanopower buck converter and high efficient boost charger
TIDA-00242
A high efficiency nano-boost charger that charges a rechargeable
energy resevoir, and also provides battery back-up though a
nonrechargeable battery to extend run-time.
TIDA-00100
System Timer
Part No.
Supply
Current
(Typ) (µA)
Supply
Range
Prog. Delay
Range
Manual
Reset
TPL5100
0.030
1.8 to 5
Yes
No
TPL5110
0.035
1.8 to 5
Yes
Yes
Yes
TPL5111
0.035
1.8 to 5
Yes
Additional Notes
Programmable
Timer Interval
(s)
Timekeeping
Accuracy
(Typ) (%)
Operating
Temp. (°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
MOS-Driver
0.1 to 7200
1
–40 to 105
6SOT
0.40
MOS-Driver
0.1 to 7200
1
–40 to 105
6SOT
0.40
Active Low MOS-Driver,
Active High LDO Enable
0.1 to 7200
1
–40 to 105
6SOT
–
Operating
Temp. (°C)
Pin / Package
Approx.
Price
(US$ | 1ku)
Load Switches
Part No.
Vin (Max)
(V)
Imax (A)
Ron @ 3.6V
(Typ) (mΩ)
Leakage
Current
(µA) (Typ)
Channels
Special
Features
Single Channel Devices
TPS22860
1.65 to 5.5
0.1
1300
0.02
1
–
–40 to 85
6SC70, 6SOT-23
0.25
TPS22907
1.1 to 3.6
1
44
0.5
1
–
–40 to 85
4CSP (0.5 pitch)
0.22
TPS22918
1.05 to 5.5
2
46
2
1
–
–40 to 85
6SOT-23
–
TPS22954
0.7 to 5.5
5
14
5
1
Voltage Monitor (PG Pin)
–40 to 105
10SON
0.36
0.5/ch
435
0.47
2
–
–40 to 85
8SOT-23, 8µQFN
0.36
Multi-channel Devices
TPS22960
1.62 to 5.5
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. Duty-Cycled Power Design Theory for Star Networks
One method to achieve extremely long battery life is through
the use of a nano-power system timer. This type of device
is intended to replace the internal timer of any standard
microcontroller with a discrete analog system timer that
consumes much less power than the MCUs internal timer.
The nano-power timer can also bring an MCU out of sleep
mode by means of a pin interrupt, or to completely shut
off power to the system, in whole, or in part. This reduces
the system off-state current draw to the tens or hundreds
of nanoamps.
New products are listed in bold red. Preview products are listed in bold teal.
Coin Cell
TPS61291
VBATT
(DC/DC
Battery
(CR2032)
TPL5111
(Nano-power
system timer)
Boost)
DRV
TPS22860
VOUT
(3.3V or
VBATT)
HDC1000
(Humidity &
Temp. Sensor)
I2C
(Ultra-low leakage
load switch)
3.3V
Duty Cycled
System
CC1310
(ARM + Sub-1
GHZ)
TIDA-00484 Block Diagram which Demonstrates a Duty-Cycled Sensor Node
Texas Instruments
Connected Sensors Building Automation Systems Guide 2015
|
9
Power Management
Find the Perfect Low Power Reference Design to Get Started
Humidity & Temp Sensor Node for 2.4-GHz Star
Networks Enabling 10+ Year Coin Cell Battery Life
Reference Design - TIDA-00374
Key Features
• Use of nano-power system timer results in 10+ years
of battery life on a coin cell battery
• ±3% relative humidity accuracy, ±0.2°C temperature accuracy
Humidity & Temp Sensor Node for Sub 1-GHz Star
Networks Enabling 10+ Year Coin Cell Battery Life
Reference Design - TIDA-00484
Key Features
• Use of nano-power system timer results in 10+ years
of battery life on a coin cell battery
• ±3% relative humidity accuracy, ±0.2°C temperature accuracy
Energy Buffering for Long-Life Battery Applications
Reference Design - PMP9753
Key Features
• Efficient Super Capacitor Charging
• Peak Power Assistance
• Longer Battery Runtime
110-VAC to 5-VDC @ 30-mA Non-Isolated Power
Supply Reference Design
Reference Design - TIDA-00379
Key Features
• Solution does not require a custom transformer
• Optimized, low-cost BOM
• Output ripple of less than 10-mV
TI Devices
TPL5110
TS5A3160
CC2650
HDC1000
TI Devices
TPL5111
TPS22860
TPS61291
CC1310
TI Devices
TPL5110
TS5A3160
CC2650
HDC1000
TI Devices
UCC28880
LP2985-50
Haptic
Texas Instruments offers a complete line of haptic devices which have the ability to drive eccentric rotating mass (ERM), linear
resonant actuator (LRA), and piezoelectric actuators. With TI’s haptic drivers you can add that extra sensory element that is
missing in modern day touch interfaces.
Learn more about Haptic Feedback solutions at: www.ti.com/haptics
Piezo Driver
Part No.
Maximum
Differential
Output Voltage
(Vpp)
Maximum SingleEnded Output
Voltage (Vp)
Supply
Voltage (V)
Small-signal
Bandwidth
(kHz)
GainBandwidth
(kHz)
Load
Capacitance
(µF)
Slew Rate
(V/µs)
Operating
Temp. (°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
DRV2700
±100
1000
3 to 5.5
20
550
4.7
0.6
–40 to 85
QFN
4.95
Haptic Driver
Haptic
Acutator Type
Input
Signal
Supply
Voltage (V)
Startup
Time (ms)
Vout (Max)
(V)
Iq (Typ)
(mA)
Shutdown Current
(Typ) (uA)
Operating
Temp. (°C)
Pin /
Package
Approx. Price
(US$ | 1ku)
DRV2605L
ERM, LRA
PWM,
Analog, I2C
2 to 5.2
0.7
5.5
0.5
4
–40 to 85
10VSSOP,
9DSBGA
1.65
DRV2667
Piezo
PWM,
Analog, I2C
3 to 5.5
2
200
0.13
–
–40 to 85
20QFN
2.95
Part No.
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red.
Find the Perfect Haptic Reference Design to Get Started
10
Touch on Metal Buttons with Integrated
Haptic Feedback
Reference Design - TIDA-00314
Key Features
• Replaces Mechanical Buttons with Inductive-Sensing Based Touch on Metal Detection
• Customizable Haptic Feedback and Waveforms Provide High Quality User Experience
• Programmable Button Sensitivity (from Light Touch to Hard Press)
TI Devices
DRV2605L
DRV2667
LDC1614
MSP430F5528
Piezo Speaker Strobe Notification
Reference Design
Reference Design - TIDA-00376
Key Features
• 86.5 dBA @ 3m (520 Hz Square Wave)
• 80.5 dBA @ 3m (2.84 kHz Sine Wave)
• 77.5 dBA @ 3m (Pre-Recorded Speech)
• 300 candela @ 3m (Flash Mode)
TI Devices
DRV2700
LMV344
LM3550
MSP430FR5969
| Connected Sensors Building Automation Systems Guide 2015
Texas Instruments
Interface and Protection
Texas Instruments offers a comprehensive interface portfolio enabling system connectivity. With a variety of communication
standards such as CAN, UART, USB, RS-232, RS-485 and 10-/100-Mbit Ethernet, TI delivers a variety of options for your
interface needs.
Learn more about Wired Connectivity solutions at: www.ti.com/interface and www.ti.com/esd
Integrated ESD Protection
Part No.
Interface
Channels
IO
Capacitance
(Typ) (pF)
TPD4F003
LCD
Display,
Memory /
SIM Card
4
17
Breakdown
Voltage
(Min) (V)
IEC
61000-4-2
Contact
(+/- kV)
IEC
61000-4-2\
Air-Gap
(+/- kV)
Special
Features
Current Limit
Rating
(Min) (mA)
Operating
Temperature
Range(C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
6
12
20
EMI Filter
–
–40 to 85
WSON
0.18
High Performance TVS Diodes
Breakdown
Voltage
(Min) (V)
IEC
61000-4-2
Contact
(+/- kV)
IEC
61000-4-2
Air-Gap
(+/- kV)
Bi-/
Uni-Directional
Operating
Temp. (°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
Interface
Channels
IO
Capacitance
(Typ) (pF)
TPD1E10B06
Audio, General
Purpose
1
12
6
30
30
Bi-Directional
–40 to 125
X1SON
0.05
TPD2E007
RS-232/485,
CAN, Audio
2
15
14
8
15
Bi-Directional
–40 to 85
DSLGA, SC70
0.20
Part No.
Peripheral Drivers
Part No.
Type
Peak Output Current
(mA)
Output
Voltage
(Max) (V)
Delay Time
(Typ) (ns)
Input Compatibility
Drives per
Package
Gate
Output
Clamp
Diodes
Operating
Temp. (°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
TPL7407L
NMOS Array
600
40
250
CMOS, TTL
7
INVERT
Yes
–40 to 125
16SOIC,
16TSSOP
0.20
ULN2003A
Darlington
Transistor
Array
500
50
250
CMOS, TTL
7
INVERT
Yes
–20 to 70
16SO,
16SOIC,
16TSSOP
0.14
Approx.
Price
(US$ | 1ku)
RS-485
TX/RX
Duplex
Supply
Voltage
(V)
SN65HVD72
1/1
Half
3.3
High Hysteresis, ±12kV IEC
61000-4-2 ESD, ±4kV EFT
0.25
15
Short, Open,
Idle
256
8SOIC,
8SON,
*VSSOP
0.70
SN65HVD82
1/1
Half
5
Low Power, ±12kV IEC
61000-4-2 ESD, ±4kV EFT
0.25
16
Short, Open,
Idle
256
8SOIC
1.00
SN65HVD3082E/5E/8E
1/1
Half
5
Ultra-Low Power, Optimized
for Low, Medium, & High
Speeds
0.2, 1, 20
15
Short, Open,
Idle
256
8SOIC,
8MSOP,
8PDIP
0.90, 1.00,
1.10
Approx.
Price
(US$ | 1ku)
Part No.
Features
Signaling Rate
(Mbps)
HBM ESD
(kV)
Receiver
Fail-Safe
Nodes
Pin /
Package
eFuses
Part No.
Supply
Range (V)
Vabsmax_
cont (V)
Current Limit
Threshold (A)
Current
Limit
Accuracy
Internal
FET RON
(mOhm)
Fault
Response
On_Off
Control
Input(s)
Special Features
Pin /
Package
90
Auto Retry
ENUV, OV
No Rsense Required
8SOIC
0.50
TPS25921A
4.5 to 18
20
0.4 to 1.6
±2% @
1A
TPS25926
4.5 to 13.8
20
2 to 5
±8% @
3.7A
30
Auto Retry
ENUV
BLK FET Driver, Output
Clamp, No Rsense Required
10VSON
0.55
TPS25927
4.5 to 18
20
1 to 5
±15% @
2.1A
30
Auto Retry
ENUV
BLK FET Driver, No Rsense
Required
10VSON
0.55
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
Texas Instruments
Connected Sensors Building Automation Systems Guide 2015
|
11
TI Worldwide Technical Support
Internet
Asia
TI Semiconductor Product Information Center Home Page
support.ti.com
TI E2E™ Community Home Page
e2e.ti.com
Product Information Centers
Americas
Brazil
Mexico
Phone
+1(512) 434-1560
Phone0800-891-2616
Phone0800-670-7544
Fax
+1(972) 927-6377
Internet/Emailsupport.ti.com/sc/pic/americas.htm
Europe, Middle East, and Africa
Phone
European Free Call
00800-ASK-TEXAS
(00800 275 83927)
International
+49 (0) 8161 80 2121
Russian Support
+7 (4) 95 98 10 701
Note: The European Free Call (Toll Free) number is not active in all c­ ountries.
If you have technical difficulty calling the free call number, please use the
­international number above.
Fax
+(49) (0) 8161 80 2045
Internetwww.ti.com/asktexas
Direct Email
asktexas@ti.com
Japan
Phone
Domestic (toll-free number)
0120-92-3326
FaxInternational +81-3-3344-5317
Domestic
0120-81-0036
Internet/Email Internationalsupport.ti.com/sc/pic/japan.htm
Domestic www.tij.co.jp/pic
© 2015 Texas Instruments Incorporated
Printed in U.S.A. by (Printer, City, State)
Phone
Toll-Free Number
Note: Toll-free numbers may not support
mobile and IP phones.
Australia
1-800-999-084
China
800-820-8682
Hong Kong
800-96-5941
India
000-800-100-8888
Indonesia
001-803-8861-1006
Korea
080-551-2804
Malaysia
1-800-80-3973
New Zealand
0800-446-934
Philippines
1-800-765-7404
Singapore
800-886-1028
Taiwan
0800-006800
Thailand
001-800-886-0010
International+86-21-23073444
Fax+86-21-23073686
Emailtiasia@ti.com or ti-china@ti.com
Internetsupport.ti.com/sc/pic/asia.htm
Important Notice: The products and services of Texas Instruments
Incorporated and its subsidiaries described herein are sold subject to TI’s
standard terms and conditions of sale. Customers are advised to obtain
the most current and complete information about TI products and services
before placing orders. TI assumes no liability for applications assistance,
customer’s applications or product designs, software performance, or
infringement of patents. The publication of information regarding any
other company’s products or services does not constitute TI’s approval,
warranty or endorsement thereof.
B012014
The platform bar and E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
SZZY004
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated