Connected Sensors Building Automation Systems Guide www.ti.com/buildingAutomation2015 Connected Sensors Building Automation Systems Guide Table of Contents and Sensor Solutions Introduction Monitoring devices or nodes in building control systems, fire safety systems, lighting control, and other building automation and Internet of Things (IoT) applications are becoming more prevalent in today’s world. The use of connected sensors has a wide range of uses in building automation applications, from monitoring human safety and security, controlling the environment and ambience specified by the comfort preferences of the end user, or either periodic or continuous data logging of environmental and system data to detect irregular system conditions. Texas Instruments (TI) has a broad portfolio of products that cater to connected sensing in building automation applications. This portfolio ranges from innovative sensor analog front-end products to low-power wireless connectivity solutions. Table of Contents Sensor Solutions 2Temperature Sensing 2 Humidity and Temperature Sensing 2 Ambient Light Sensing 3 Inductance Sensing 3 Capacitance Sensing 3 Hall Effect Sensor Amplifiers and Comparators 4 Low Power Amplifiers 4 General Purpose Amplifiers 4Comparators 4 Analog-to-Digital Converters Power Management 8 8 8 9 9 9 9 DC/DC Switching Regulators Linear Regulators Voltage Reference AC/DC Converters Ultra Low Power Harvester Power Management IC System Timer Load Switches Haptic Drivers 10 Piezo Drivers 10 Haptic Drivers Interface and Protection Wireless Connectivity 11 Integrated ESD Protection 11 High Performance TVs Diodes 11 Peripheral Drivers 11RS-485 11eFuses 5Wi-Fi 5 Sub-1GHz 5Bluetooth® 5ZigBee® 5NFC Embedded Processing Solutions 7 MSP430 Low Power FRAM MCUs 7 MSP430 Low Power MCUs 7 ARM Based MCUs and MPUs Sensor Solutions TI has a rich, five-decade history of sensing innovation and, combined with best-in-class sensing technologies, tools, and resources, we continue to deliver better solutions today and new possibilities for tomorrow. Learn more about sensor solutions at: www.ti.com/sensing Temperature Sensing Part No. LMT70/70A LMT84 Type Analog Analog Local Sensor Accuracy (Max) At Given Temp Range (±°C) ±0.2°C from 20 to 90 ±2.7°C from –50 to 150 Supply Current (Max) (µA) 12 8.1 Supply Range (V) 2.0 to 5.5 1.5 to 5.5 TMP112 Digital ±0.5°C from 0 to 65 10 1.4 to 3.6 TMP75 Digital ±2°C from –25 to 85 85 2.7 to 5.5 TMP007 Contactless ±1°C from –40 to 125 350 2.2 to 5.5 Interface Analog Out Analog Out I2C, SMBus, 2-wire I2C, SMBus, 2-wire I2C, SMBus Infrared Sensor Accuracy (Max) (±°C) – – Operating Temp. (°C) –55 to 150 –50 to 150 Pin / Package 4DSBGA 5SC70 Approx. Price (US$ | 1ku) 0.54 / 0.65 0.18 – –40 to 125 6SOT 0.90 – –40 to 125 8SOIC, 8VSSOP 0.45 3 –40 to 125 8DSBGA 1.90 Humidity and Temperature Sensing Part No. HDC1000/1050 HDC1008 Relative Humidity Accuracy (Typ) (%RH) ±3 ±4 RH Operating Range (Typ) (%RH) 0 - 100 0 - 100 Temperature Accuracy (Typ) (°C) ±0.2 ±0.2 Supply Range (V) 3 to 5 3 to 5 *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 2 | Connected Sensors Building Automation Systems Guide 2015 Average Supply Current (Typ) (µA) 1.2 @ 1 sps 1.2 @ 1 sps Interface I2C I2C Operating Temp. (°C) –40 to 125 –40 to 125 Pin / Package 8DSBGA, 6DFN 8DSBGA Approx. Price (US$ | 1ku) 2.20 1.76 Preview products are listed in bold teal. Texas Instruments Sensor Solutions Ambient Light Sensing Supply Range (Nom) (V) Part No. OPT3001 Iq (Max) (µA) 1.6 to 3.6 Lux Range (Nom) Dark Response @ 0 Lux (Max) 0.01 to 83K 2 Gain Selection Interface Benefits I2C Matches photopic response of the human eye Rejects > 99% (Typ) of IR 11 Gains with Auto-ranging 1 Code Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) –40 to 85 USON 0.99 Inductance Sensing L (Inductance) Resolution (Bits) Supply Range Active State Current (mA) Interface Sensor Frequency (Hz) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Part No. Key Applications Special Features Input Channels LDC1312/4 • Position • Sensing • Angle/Rotation sensing • Contactless sensing • Ultralow cost sensors (coils, PCB coils) • Immune to dust, dirt etc. 2/4 12 2.7 to 3.6 2.1 I2C 1k to 10M –40 to 125 WSON, WQFN 2.38 / 3.50 LDC1612/4 • Position Sensing • Angle/Rotation sensing • Contactless sensing • Ultralow cost sensors (coils, PCB coils) • Immune to dust, dirt etc. 2/4 28 2.7 to 3.6 2.1 I 2C 1k to 10M –40 to 125 WSON, WQFN 3.25 / 4.75 Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Capacitance Sensing Shield Drive Channels Special Features Supply Range Supply Current (mA) Interface Prog. Sampling Rate (Typ) (SPS) 4 • Liquid level sensing (with interferers) 2 Integrated Shield Drivers 3 to 3.6 0.75 I2C 100 / 200 / 400 –40 to 125 WSON 2.50 FDC2114/12 4/2 • Proximity Sensing • Liquid Level Sensing – EMI resistant core 2.7 to 3.6 2.1 I2C 40 to 4080 –40 to 125 WQFN 2.38 / 3.50 FDC2214/12 4/2 • Proximity Sensing • Liquid Level Sensing – EMI resistant core 2.7 to 3.6 2.1 I2C 40 to 13300 –40 to 125 WQFN 3.25 / 4.75 Part No. Input Channels Special Features FDC1004 Hall Effect Sensor Output Bandwidth (Typ) (kHz) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Type Type Supply Range DRV5013/23/33 Digital Latch / Switch / Omnipolar Switch 2.5 to 38 Open Drain – –40 to 125 SOT-23, TO-92 0.29 DRV5053 Analog Analog Bipolar 2.5 to 38 0.2 to 1.8 V 10 –40 to 125 SOT-23, TO-92 0.31 Part No. Output *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red. Find the Perfect Sensor Reference Design to Get Started 16-Button Keypad using the LDC1314 Inductive-to-Digital Converter Reference Design - TIDA-00509 Key Features • Contactless buttons with superior reliability over electrical/mechanical contact solutions • Support simultaneous button presses TI Devices LDC1314 LP2985-N MSP430F5528 Backlight and Smart Lighting Control by Ambient Light and Proximity Sensor Reference Design - TIDA-00373 Key Features • Good Human Eye Spectral Matching • Dynamically Adjusts Backlight Brightness • UV Filter for Outdoor Using TI Devices OPT3001 FDC1004 HDC1000 MSP430FR5969 Spectral Response: The OPT3001 and Human Eye Ambient Light Sensor with Human Eye Visibility 1 Normalized Response The OPT3001 is a single-chip lux meter, measuring the intensity of light as visible by the human eye. The precision spectral response and strong IR rejection of the device enables the OPT3001 to accurately meter the intensity of light as seen by the human eye regardless of light source. The strong IR rejection also aids in maintaining high accuracy when industrial design calls for mounting the sensor under dark glass for aesthetics. 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 400 500 600 700 800 900 1000 Wavelength (nm) Texas Instruments Connected Sensors Building Automation Systems Guide 2015 | 3 Amplifier and Comparator Solutions Texas Instruments delivers a broad portfolio of amplifier and linear solutions including precision and high speed op amps, instrumentation and differential amplifers along with comparators. TI has an amplifier suited for any application. Learn more about Amplifier solutions at: www.ti.com/amplifier Low Power Amplifiers Slew Rate (Typ) (V/µs) CMRR (Typ) (dB) Offset Voltage @ 25°C (Max) (mV) Offset Drift (Typ) (µV/°C) Part No. Supply Range (V) Channels Iq per ch. (Max) (mA) LMV611/2/4 1.8 to 5.5 1/2/4 0.21 1.5 0.42 60 4 LPV521 1.6 to 5.5 1 0.0004 0.0062 0.0024 102 GBW (Typ) (MHz) Rail-Rail Operating Temp. (°C) Approx. Price (US$ | 1ku) 5.5 RRIO –40 to 125 0.22 / 0.25 / 0.30 1 0.4 RRIO –40 to 125 0.49 OPA369 1.8 to 5.5 1 0.0012 0.012 0.005 100 0.75 0.4 RRIO –40 to 85 0.65 OPA349 1.8 to 5.5 1 0.002 0.065 0.02 52 10 15 RRIO 0 to 70 0.50 Offset Voltage @ 25°C (Max) (mV) Offset Drift (Typ) (µV/°C) General Purpose Amplifiers Supply Range (V) Channels Iq per ch. (Max) (mA) TLC271/2/4 3 to 16 1/2/4 1.6 1.7 3.6 65 10 1.8 LM2904 3 to 26 2 0.6 0.7 0.3 50 7 7 –40 to 125 0.07 LM358 3 to 32 2 0.6 0.7 0.3 65 7 7 0 to 70 0.07 OPAx313 1.8 to 5.5 1, 2, 4 0.06 1 0.5 70 2.5 2 -40 to 125 0.26 / 0.38 / 0.55 OPAx314 1.8 to 5.5 1, 2, 4 0.21 3 1.5 75 2.5 1 -40 to 125 0.30 / 0.45 / 0.65 OPAx316 1.8 to 5.5 1, 2, 4 0.5 10 6 76 2.5 2 -40 to 125 0.48 / 0.72 / 1.08 OPAx170 2.7 to 36 1, 2, 4 0.145 1.2 0.5 104 1.8 0.3 -40 to 125 0.40 / 0.60 / 0.90 OPAx171 2.7 to 36 1, 2, 4 0.595 3 1.5 104 1.8 0.3 -40 to 125 0.40 / 0.60 / 0.90 OPAx172 2.7 to 36 1, 2, 4 1.8 10 10 90 1 0.3 -40 to 125 0.65 / 0.99 / 1.49 Input Bias Current (±) (Max) (nA) VICR (V) Offset Voltage @ 25°C (Max) (mV) Operating Temp. (°C) Approx. Price (US$ | 1ku) Part No. GBW (Typ) (MHz) Slew Rate (Typ) (V/µs) CMRR (Typ) (dB) Operating Temp. (°C) –40 to 85 Approx. Price (US$ | 1ku) 0.31 / 0.41 / 0.60 Comparators Part No. Type Supply Range (V) Channels tRESP Low-toHigh (µs) Iq per ch. (Max) (mA) TLV3691 Push-Pull 0.9 to 6.5 1 24 0.00015 0.1 -0.1 to 6.6 15 –40 to 85 0.40 TLV3012 Push-Pull 1.8 to 5.5 1 6 0.005 0.01 -0.2 to 5.7 12 –40 to 85 0.75 TLC3702 Push-Pull 3 to 16 2 1.1 0.02 0.03 0 to 15 5 –40 to 85 0.36 TLV1701/2/4 Open Collector 2.2 to 36 1, 2, 4 0.56 0.075 15 2.2 to 36 2.5 -40 to 125 0.38 / 0.61 / 0.97 Analog-to-Digital Converters Sample Rate (SPS) Input Channels Interface Supply Range (V) Features Operating Temp. (°C) Approx. Price (US$ | 1ku) Part No. Type Resolution (bits) ADS7040/1/2/3/4 SAR 8 to 12 1000 1 SPI 0 to 3.6 Nanowatt Power Consumption -40 to 125 1.00 / 1.60 / 2.10 ADS1018 ΣΔ 12 3300 4 SPI 2 to 5.5 Temp. Sensor (0.5°C accurate) -40 to 125 1.15 SPI 2.3 to 5.5 Single cycle setting, sensor, IDACs -40 to 125 3.15 / 3.95 ADS1120/1220 ΣΔ 16, 24 2000 4 *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 4 | Connected Sensors Building Automation Systems Guide 2015 Texas Instruments Li-Ion Wireless Connectivity Smallest Power Source Required AAA With the industry’s broadest wireless connectivity portfolio TI offers cost-effective, low-power solutions for short-range, long-range, mesh, and IP networks No Battery Coin Cell Learn more about Wireless Connectivity solutions at: www.ti.com/wireless Wi-Fi BLE/ANT ZigBee BLE/ANT Sub-1 GHz RF4CE 2.4 GHz 6LoWPAN 2.4 GHz NFC/RFID Proprietary Wi-Fi Part No. Technology Benefits TI Designs and Development Tools CC3200 SimpleLink Wi-Fi Wireless MCU with ARM Cortex®-M4, Integrated Wi-Fi Connectivity, security, low power, ease of use: Certified Wi-Fi modules available CC3200MODLAUNCHXL, TIDA-00372, TIDC-CC3200SMARTPLUG, TIDC-CC3200CAMBOOST CC3100 SimpleLink Wi-Fi Wireless Network Processor: provides easy Wi-Fi connectivity for building automation applications. Fully integrated 802.11 b/b/n radio, baseband, and MAC. Connect serialy Interface to any 8, 16, or 32-bit micro-controllers. Certified Wi-Fi modules available CC3100MODBOOST WL1837MOD High performance, low power, certified combo modules integrating Wi-Fi + Bluetooth + Bluetooth Low Energy. Connects to any Linux Processor with SDIO interface, available up to 85°C, 2.4GHz and 5GHz WL1837MODCOM8I Part No. Benefits TI Designs and Development Tools CC1200 High performance, long distance, low power radio transceiver: optimized for wide band applications CC1200DK, CC1200EMK-868-930, TIDC-CHN CC1120 High performance, long distance, low power radio transceiver: optimized for Narrowband CC1120DK, CC1120EMK-169, CC1120EMK-420-470, CC1120EMK-868-915, TIDC-MULTIBAND-WMBUS CC1101 Ultra-low power radio transceiver CC1101DK433, CC1101DK868-915, TIDM-SUB1GHZ-MESH-NETWORK CC1310 SimpleLink Ultra-low power ARM® Cortex®-M Based Wireless MCU TIDA-00484 Sub-1GHz Bluetooth® Part No. Benefits TI Designs and Development Tools CC2650 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU: multi-standard supported Bluetooth Low-Energy, 6LowPAN and ZigBee. Ideal for end point sensors CC2650DK, CC2650STK, TIDA-00374 CC2640 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU supporting Bluetooth LowEnergy: ultra-low power, small size and ease of use. Ideal for end point sensors CC2650DK, CC2650STK, TIDA-00374 CC2540T Extreme temperature Bluetooth Low Energy (up to 125 degree C) wireless MCU combined with low power and ease of use CC2541DK-MINI, TIDC-BLUETOOTH-LOW-ENERGY-LONG-RANGE, TIDC-BLUETOOTH-SMART-TO-RS-485-GATEWAY CC2564MODA Dual Mode Bluetooth (Bluetooth Low energy + Bluetooth Classic) transceivers module with antenna integrated: low-power, stable and robust SW stack CC256XQFNEM CC2564MODAEM (RTM September) Part No. Benefits TI Designs and Development Tools CC2630 SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU : ideal for end point sensors CC2650DK, CC2650STK, TIDA-00374 CC2530 ZigBee Wireless MCU: enables robust network nodes to be built with very low total bill-of-material costs CC2530DK, CC2530EMK, CC2531EM-IOT-HOME-GATEWAY-RD, CC2530-CC2592EM-RD CC2538 512kB ARM® Cortex®-M Based Wireless MCU: handle complex network stacks with security, demanding applications, and over-the-air download CC2538DK, CC2538EMK, TIDC-ZNP-HOST-SW3 Benefits TI Designs and Development Tools ZigBee® NFC Part No. transponder chip with a programmable 16-bit MSP430 low-power microcontroller. Optimized RF430FRL152H 13.56-MHz for operation in fully passive (battery-less) or single-cell battery-powered (semi-active) mode. RF430CL330H NFC Tag Type 4 device which combines a wireless NFC interface and a wired SPI/I2C interface to connect the device to a host *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. Texas Instruments TIDM-RF430-TEMPSENSE, TIDM-RF430FRLSENSE TIDA-00217 New products are listed in bold red. Connected Sensors Building Automation Systems Guide 2015 | 5 Wireless Connectivity Find the Perfect Connectivity Reference Design to Get Started SimpleLink™ Bluetooth Smart®/ Multi-Standard SensorTag Reference Design - CC2650STK-RD Key Features • More Sensors! 10 Sensors including light, humidity, pressure, magnetic, accelerometer, gyroscope, and others • Flexibility for IoT applications; Enable ZigBee or 6LoWPAN through a firmware upgrade TI Devices CC2650 TMP007 OPT3001 HDC1000 Wired (UART or RS-485) to Wi-Fi® Bridge with 24-VAC Power Reference Design - TIDA-00375, TIDA-00485, TIDA-00486 Key Features • Add Wi-Fi® Connectivity to an existing wired network • Wide Input Voltage Range of 18- to 30-VAC, 12- to 48-VDC • Galvanically Isolated or Non-Isolated variations TI Devices CC3200MOD CC3100MOD LM5160 LMR16006 Battery-less NFC/RFID Temperature Sensing Patch Reference Design TIDM-RF430-TEMPSENSE Key Features • No batteries required • “Over the air” configuration of the ADC • Different antenna configurations allow many form factors TI Devices RF430FRL152H Dynamic Field Powered NFC Reference Design for Data Logging and Security Applications Reference Design - TIDA-00217 Key Features • User can receive updated information from a field unit • Battery-less sensor interface; NFC reader provides TI Devices TMP103 RF430CL330H MSP430FR5969 SimpleLink™ Wi-Fi® CC3200 Smart Plug Reference Design TIDC-CC3200SMARTPLUG Key Features • Single-Phase energy measurement that calculates Current, Voltage, Power, and Energy • SimpleLink™ Wi-Fi® connectivity over 802.11 b/g/n networks from any mobile device • Isolated flyback power supply to provide Constant-Voltage and Constant-Current output regulation without optical coupler” TI Devices CC3200 UCC28910 TPS61097A-33 Embedded Processing Solutions Microcontrollers and processors from Texas Instruments offer a broad range of performance and power consumption options. From MSP430 MCU with ultra-low power consumption to the Sitara™ AM335x family with integrated multi-protocol industrial communications support to connect various kinds of sensors in real-time for better automation; TI is tailored to meet your design challenges. Learn more about Microcontroller solutions at: www.ti.com/msp430 and www.ti.com/msp432. Learn more about processor solutions at: www.ti.com/processors. Non-volatile Memory (KB) SRAM (KB) GPIO I2C SPI UART DMA ADC Comparator (Channels) Timers 16-Bit Multipliers AES Additional Features Operating Temp. (°C) Package MSP430FR4133 16 15.5 2 60 1 2 1 0 ADC10-10ch 0 2 N/A N/A LCD, RTC, BOR, Temp Sensor –40 to 85 LQFP, TSSOP 1.55 MSP430FR5969 16 64 2 40 1 3 2 3 ADC12-16ch 16 5 32x32 AES256 RTC, BOR, IrDA, Temp Sensor –40 to 85 VQFN 2.35 MSP430FR6972 16 64 2 51 2 4 2 3 ADC12-8ch 8 5 32x32 AES256 LCD, RTD, BOR, IrDA, Temp Sensor –40 to 85 LQFP 2.55 MSP430FR6989 16 128 2 83 2 4 2 3 ADC12-16ch 16 5 32x32 AES256 LCD, RTC, Scan I/F, BOR, IrDA, Temp Sensor –40 to 85 LQFP 4.50 Part No. *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 6 | Connected Sensors Building Automation Systems Guide 2015 Approx.Price (US$ | 1ku) Frequency (MHz) MSP430 Low Power FRAM MCUs New products are listed in bold red. Texas Instruments Embedded Processing Solutions Non-volatile Memory (KB) SRAM (KB) GPIO I2C SPI UART ADC Comparator (Channels) Timers 16-Bit Multipliers Additional Features Operating Temp. (°C) Package MSP430G2553 16 16 0.5 24 1 1 1 ADC10-8ch 8 2 N/A Temp Sensor, BOR, IrDA –40 to 85 TSSOP, VQFN 0.90 MSP430G2955 16 56 4 32 1 2 1 ADC10-12ch 8 3 N/A Temp Sensor, BOR, IrDA –40 to 85 TSSOP, VQFN 1.30 MSP430F2274 16 32 1 32 1 1 1 ADC10-12ch 0 2 N/A Temp Sensor, BOR, OpAmp –40 to 105 –40 to 85 DSBGA, TSSOP, VQFN 1.80 MSP430I2041 16 32 2 16 1 2 1 SigmaDelta 24-4ch 0 2 16 x16 Temp Sensor, BOR, IrDA -40 to 105 TSSOP, VQFN 1.75 Part No. Approx.Price (US$ | 1ku) Frequency (MHz) MSP430 Low Power MCUs ARM Based MCUs and MPUs Part No. MSP432P401R AM3352 ARM CPU Benefits TI Designs and Dev. Tools ARM Cortex-M4F MSP432P4x microcontrollers are the ideal combination of TI's MSP430 low-power DNA, advanced mixed-signal features, and the high-performance processing capabilities of ARM®'s 32-bit Cortex®-M4F RISC engine. MSP-EXP432P401R ARM Cortex-A8 Sitara™ AM335x ARM Cortex-A8 Processors deliver the right balance of performance (300 MHz to 1 GHz of processing power), Interfaces (DDR3, LCD, Touch Screen Controller), and Connectivity (UART and Industrial Protocols) Beaglebk, TMDXEVM3358 New products are listed in bold red. *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. Find the Perfect MCU Reference Design to Get Started Thermostat Implementation with FRAM Microcontroller Reference Design - TIDM-FRAM-THERMOSTAT Key Features • 0°C to 35°C Temperature Measurement with 0.1°C Resolution • 3.4 inch LCD Display • Ultra-Low Power: 1.8 µA Standby Current FRAM Technology All-in-one: FRAM MCU delivers max benefits Ferroelectric Random Access Memory (FRAM) is a memory technology that combines the best of Flash and SRAM. It is non-volatile like Flash, but offers fast and low power writes, write endurance of 1015 cycles, code and data security that is less vulnerable to attackers than Flash/EEPROM, resistance to radiation and electromagnetic fields, and unmatched flexibility. This memory technology has been around for decades, but is now being integrated in MSP430 ultra-low-power microcontrollers (MCUs) to bring its unique advantages to real-world applications such as energy harvesting, data security, remote sensing or data logging, and many others. Specifications Texas Instruments TI Devices MSP430FR4133 SN65HVD75 TPS782 FRAM SRAM EEPROM Flash Yes No Yes Yes 10ms <10ms 2 secs 1 sec Average active Power [µA/MHz] 16 bit word access by the CPU 100 <60 50,000+ 230 Write endurance 1015 Unlimited 100,000 10,000 Soft Errors Below Measurable Limits Yes Yes Yes Bit-wise programmable Yes Yes No No Unified Memory Flexible code and data partitioning Yes No No No Non-volatile Retains data w/o power Write speed (13 KB) Connected Sensors Building Automation Systems Guide 2015 | 7 Power Management Texas Instruments offers complete power solutions with a full line of high-performance products. These products, which range from standard linear regulators to highly efficient DC/DC converters and battery management, are tailored to meet your design challenges. Learn more about Power Management solutions at: www.ti.com/power and www.ti.com/powerlab DC/DC Switching Regulators Topology Supply Range (V) Output Voltage (V) Output Current (Max) (A) Switching Frequency (Max) (kHz) Duty Cycle (Max) (%) Iq (Typ) (mA) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Buck Module 2.2 to 5.5 1.8 to 2.5 0.2 2000 100 0.00036 –40 to 85 9uSIP 1.50 Part No. Vin < 24V TPS82740A TPS62730 Buck 1.9 to 3.9 1.9, 2.1, 2.3 0.1 3000 100 0.025 –40 to 85 6SON 0.55 TPS62080 Buck 2.3 to 6 0.5 to 6 1.2 2000 100 0.0045 –40 to 85 8WSON 0.75 TPS62160 Buck 3 to 17 0.9 to 6 1 2500 100 0.017 –40 to 85 8VSSOP, 8WSON 0.80 TPS61291 Boost 0.9 to 5.0 2.5, 3.0, 3.3 0.2 – – 0.005 –40 to 85 6SON 0.68 TPS61098 Boost 0.7 to 4.5 2.2 to 4.3 0.1 – – 0.0003 -40 to 85 6WSON 0.72 TPS61220 Boost 0.7 to 5.5 1.8 to 5.5 0.1 2000 90 0.005 –40 to 85 6SC70 0.43 Wide Vin (Vin ≥ 24V) TPS62175 Buck 4.7 to 28 1 to 6 0.5 1000 100 0.0048 -40 to 85 10WSON 0.70 LM25017/8/9 Buck 7.5 to 48 1.25 to 40 0.65 / 0.3 / 0.1 1000 90 1.75 –40 to 125 8WSON, 8SO PowerPAD 1.25 / 1.12 / 0.81 TPS54160A Buck 3.5 to 60 0.8 to 58 1.5 2500 98 0.138 –40 to 125 10MSOP/10SON 1.58 TPS54060A Buck 3.5 to 60 0.8 to 58 0.5 2500 98 0.116 –40 to 150 10MSOP/10SON 1.27 TPS54061 Buck 4.7 to 60 0.8 to 58 0.2 1100 98 0.09 –40 to 150 8SON 1.04 Linear Regulators Supply Range (V) Output Voltage (V) Output Current (Max) (A) Iq (Typ) (mA) Output Options Accuracy (Max) (%) PSRR @ 100kHz (dB) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) 2.7 to 6.5 1.2 to 4.5 0.2 0.04 Adj. or Fixed 2 38 –40 to 125 5DSBGA, 5SOT, 6SON 0.28 TLV1117 2.7 to 15 1.25 to 13.7 0.8 0.08 Adjustable 1 28 –40 to 125 3TO, 4SOT, 8SON 0.18 TPS7A37 2.2 to 5.5 1.2 to 5.4 1 0.4 Adj. or Fixed 1 32 –40 to 125 6SON 0.66 LP5907 2.2 to 5.5 1.2 to 4.5 0.25 0.012 Fixed 2 60 –40 to 125 4DSBGA, 4X2SON, 5SOT-23 0.14 TPS709 LP2951/LP2951-N TPS7A16 LM317 2.7 to 30 2 to 30 3 to 60 3 to 40 1.2 to 6 1.2 to 29 1.2 to 18.5 1.25 to 37 0.15 0.1 0.1 1.5 0.001 0.075 0.005 0.05 Fixed Adjustable Adj. or Fixed Adjustable 2 2 2 4 26 53 26 – –40 to 125 –40 to 125 –40 to 125 0 to 125 0.39 0.18 1.39 0.18 LM2936 5.5 to 60 3 to 5 0.05 0.015 Fixed 3 35 –40 to 125 5SOT-23, 6SON 8SOIC 8SON, 8MSOP-PowerPAD 4SOT, 3TO, 2PFM 3TO-92, 4SOT-223, 8SOIC, 8VSSOP, 3TO-252 Iout/Iz (Max) (mA) Iq (Typ) (µA) Initial Accuracy (%) 0.1-10Hz Noise (Max) (µVpp) Temp. Coeff (Typ) (ppm/°C) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Part No. Vin < 24V TPS799 Wide Vin (Vin ≥ 24V) 0.62 Voltage Reference Part No. Supply Range (V) Output Voltage (V) REF3312 2.7 to 5.5 2.5 5 3.9 0.15 70 9 –40 to 125 3SC70, 5SOT-23, 8UQFN 0.85 REF5030 3.2 to 18 3 10 800 0.05 9 3 –40 to 125 8SOIC, 8VSSOP 1.35 – –40 to 125 –40 to 85 3SOT-23 0.19 ATL431 2.5 to 36 2.5 to 36 100 20 0.5 1 *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 8 | Connected Sensors Building Automation Systems Guide 2015 – New products are listed in bold red. Texas Instruments Power Management AC/DC Converters Power Level (Typ) (W) Part No. Current Mode Maximum Practical Frequency Topologies 700-V Start-Up Circuit Soft Start 110-V Start-Up Circuit Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Green Mode PWM Controllers UCC28722 Up to 25 3 Flyback w/PSR for Bipolar Power Device 80 kHz 3 UCC28700/1/2/3 Up to 30 3 Flyback w/PSR 130 kHz 3 3 -40 to 125 6SOT-23 0.25 -20 to 125 6SOT-26 0.35 Switchers with Integrated FETs UCC28880 <5 UCC28910 <10 3 High Voltage Switcher for Non-Isolated AC/DC Conversion 66 kHz 3 3 -40 to 125 7SOIC 0.55 High Voltage Flyback Switcher w/PSR 115 kHz 3 3 -40 to 125 7SOIC 0.75 Ultra Low Power Harvester Power Management IC Part No. BQ25570 BQ25505 Description Power Management IC which efficiently extracts microwatts (uW) to milliwatts (mW) of power generated from high output impedance DC Sources like photo voltaic (solar) or thermal electric generators (TEG). Benefits TI Designs Integrates nanopower buck converter and high efficient boost charger TIDA-00242 A high efficiency nano-boost charger that charges a rechargeable energy resevoir, and also provides battery back-up though a nonrechargeable battery to extend run-time. TIDA-00100 System Timer Part No. Supply Current (Typ) (µA) Supply Range Prog. Delay Range Manual Reset TPL5100 0.030 1.8 to 5 Yes No TPL5110 0.035 1.8 to 5 Yes Yes Yes TPL5111 0.035 1.8 to 5 Yes Additional Notes Programmable Timer Interval (s) Timekeeping Accuracy (Typ) (%) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) MOS-Driver 0.1 to 7200 1 –40 to 105 6SOT 0.40 MOS-Driver 0.1 to 7200 1 –40 to 105 6SOT 0.40 Active Low MOS-Driver, Active High LDO Enable 0.1 to 7200 1 –40 to 105 6SOT – Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Load Switches Part No. Vin (Max) (V) Imax (A) Ron @ 3.6V (Typ) (mΩ) Leakage Current (µA) (Typ) Channels Special Features Single Channel Devices TPS22860 1.65 to 5.5 0.1 1300 0.02 1 – –40 to 85 6SC70, 6SOT-23 0.25 TPS22907 1.1 to 3.6 1 44 0.5 1 – –40 to 85 4CSP (0.5 pitch) 0.22 TPS22918 1.05 to 5.5 2 46 2 1 – –40 to 85 6SOT-23 – TPS22954 0.7 to 5.5 5 14 5 1 Voltage Monitor (PG Pin) –40 to 105 10SON 0.36 0.5/ch 435 0.47 2 – –40 to 85 8SOT-23, 8µQFN 0.36 Multi-channel Devices TPS22960 1.62 to 5.5 *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. Duty-Cycled Power Design Theory for Star Networks One method to achieve extremely long battery life is through the use of a nano-power system timer. This type of device is intended to replace the internal timer of any standard microcontroller with a discrete analog system timer that consumes much less power than the MCUs internal timer. The nano-power timer can also bring an MCU out of sleep mode by means of a pin interrupt, or to completely shut off power to the system, in whole, or in part. This reduces the system off-state current draw to the tens or hundreds of nanoamps. New products are listed in bold red. Preview products are listed in bold teal. Coin Cell TPS61291 VBATT (DC/DC Battery (CR2032) TPL5111 (Nano-power system timer) Boost) DRV TPS22860 VOUT (3.3V or VBATT) HDC1000 (Humidity & Temp. Sensor) I2C (Ultra-low leakage load switch) 3.3V Duty Cycled System CC1310 (ARM + Sub-1 GHZ) TIDA-00484 Block Diagram which Demonstrates a Duty-Cycled Sensor Node Texas Instruments Connected Sensors Building Automation Systems Guide 2015 | 9 Power Management Find the Perfect Low Power Reference Design to Get Started Humidity & Temp Sensor Node for 2.4-GHz Star Networks Enabling 10+ Year Coin Cell Battery Life Reference Design - TIDA-00374 Key Features • Use of nano-power system timer results in 10+ years of battery life on a coin cell battery • ±3% relative humidity accuracy, ±0.2°C temperature accuracy Humidity & Temp Sensor Node for Sub 1-GHz Star Networks Enabling 10+ Year Coin Cell Battery Life Reference Design - TIDA-00484 Key Features • Use of nano-power system timer results in 10+ years of battery life on a coin cell battery • ±3% relative humidity accuracy, ±0.2°C temperature accuracy Energy Buffering for Long-Life Battery Applications Reference Design - PMP9753 Key Features • Efficient Super Capacitor Charging • Peak Power Assistance • Longer Battery Runtime 110-VAC to 5-VDC @ 30-mA Non-Isolated Power Supply Reference Design Reference Design - TIDA-00379 Key Features • Solution does not require a custom transformer • Optimized, low-cost BOM • Output ripple of less than 10-mV TI Devices TPL5110 TS5A3160 CC2650 HDC1000 TI Devices TPL5111 TPS22860 TPS61291 CC1310 TI Devices TPL5110 TS5A3160 CC2650 HDC1000 TI Devices UCC28880 LP2985-50 Haptic Texas Instruments offers a complete line of haptic devices which have the ability to drive eccentric rotating mass (ERM), linear resonant actuator (LRA), and piezoelectric actuators. With TI’s haptic drivers you can add that extra sensory element that is missing in modern day touch interfaces. Learn more about Haptic Feedback solutions at: www.ti.com/haptics Piezo Driver Part No. Maximum Differential Output Voltage (Vpp) Maximum SingleEnded Output Voltage (Vp) Supply Voltage (V) Small-signal Bandwidth (kHz) GainBandwidth (kHz) Load Capacitance (µF) Slew Rate (V/µs) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) DRV2700 ±100 1000 3 to 5.5 20 550 4.7 0.6 –40 to 85 QFN 4.95 Haptic Driver Haptic Acutator Type Input Signal Supply Voltage (V) Startup Time (ms) Vout (Max) (V) Iq (Typ) (mA) Shutdown Current (Typ) (uA) Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) DRV2605L ERM, LRA PWM, Analog, I2C 2 to 5.2 0.7 5.5 0.5 4 –40 to 85 10VSSOP, 9DSBGA 1.65 DRV2667 Piezo PWM, Analog, I2C 3 to 5.5 2 200 0.13 – –40 to 85 20QFN 2.95 Part No. *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. New products are listed in bold red. Find the Perfect Haptic Reference Design to Get Started 10 Touch on Metal Buttons with Integrated Haptic Feedback Reference Design - TIDA-00314 Key Features • Replaces Mechanical Buttons with Inductive-Sensing Based Touch on Metal Detection • Customizable Haptic Feedback and Waveforms Provide High Quality User Experience • Programmable Button Sensitivity (from Light Touch to Hard Press) TI Devices DRV2605L DRV2667 LDC1614 MSP430F5528 Piezo Speaker Strobe Notification Reference Design Reference Design - TIDA-00376 Key Features • 86.5 dBA @ 3m (520 Hz Square Wave) • 80.5 dBA @ 3m (2.84 kHz Sine Wave) • 77.5 dBA @ 3m (Pre-Recorded Speech) • 300 candela @ 3m (Flash Mode) TI Devices DRV2700 LMV344 LM3550 MSP430FR5969 | Connected Sensors Building Automation Systems Guide 2015 Texas Instruments Interface and Protection Texas Instruments offers a comprehensive interface portfolio enabling system connectivity. With a variety of communication standards such as CAN, UART, USB, RS-232, RS-485 and 10-/100-Mbit Ethernet, TI delivers a variety of options for your interface needs. Learn more about Wired Connectivity solutions at: www.ti.com/interface and www.ti.com/esd Integrated ESD Protection Part No. Interface Channels IO Capacitance (Typ) (pF) TPD4F003 LCD Display, Memory / SIM Card 4 17 Breakdown Voltage (Min) (V) IEC 61000-4-2 Contact (+/- kV) IEC 61000-4-2\ Air-Gap (+/- kV) Special Features Current Limit Rating (Min) (mA) Operating Temperature Range(C) Pin / Package Approx. Price (US$ | 1ku) 6 12 20 EMI Filter – –40 to 85 WSON 0.18 High Performance TVS Diodes Breakdown Voltage (Min) (V) IEC 61000-4-2 Contact (+/- kV) IEC 61000-4-2 Air-Gap (+/- kV) Bi-/ Uni-Directional Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) Interface Channels IO Capacitance (Typ) (pF) TPD1E10B06 Audio, General Purpose 1 12 6 30 30 Bi-Directional –40 to 125 X1SON 0.05 TPD2E007 RS-232/485, CAN, Audio 2 15 14 8 15 Bi-Directional –40 to 85 DSLGA, SC70 0.20 Part No. Peripheral Drivers Part No. Type Peak Output Current (mA) Output Voltage (Max) (V) Delay Time (Typ) (ns) Input Compatibility Drives per Package Gate Output Clamp Diodes Operating Temp. (°C) Pin / Package Approx. Price (US$ | 1ku) TPL7407L NMOS Array 600 40 250 CMOS, TTL 7 INVERT Yes –40 to 125 16SOIC, 16TSSOP 0.20 ULN2003A Darlington Transistor Array 500 50 250 CMOS, TTL 7 INVERT Yes –20 to 70 16SO, 16SOIC, 16TSSOP 0.14 Approx. Price (US$ | 1ku) RS-485 TX/RX Duplex Supply Voltage (V) SN65HVD72 1/1 Half 3.3 High Hysteresis, ±12kV IEC 61000-4-2 ESD, ±4kV EFT 0.25 15 Short, Open, Idle 256 8SOIC, 8SON, *VSSOP 0.70 SN65HVD82 1/1 Half 5 Low Power, ±12kV IEC 61000-4-2 ESD, ±4kV EFT 0.25 16 Short, Open, Idle 256 8SOIC 1.00 SN65HVD3082E/5E/8E 1/1 Half 5 Ultra-Low Power, Optimized for Low, Medium, & High Speeds 0.2, 1, 20 15 Short, Open, Idle 256 8SOIC, 8MSOP, 8PDIP 0.90, 1.00, 1.10 Approx. Price (US$ | 1ku) Part No. Features Signaling Rate (Mbps) HBM ESD (kV) Receiver Fail-Safe Nodes Pin / Package eFuses Part No. Supply Range (V) Vabsmax_ cont (V) Current Limit Threshold (A) Current Limit Accuracy Internal FET RON (mOhm) Fault Response On_Off Control Input(s) Special Features Pin / Package 90 Auto Retry ENUV, OV No Rsense Required 8SOIC 0.50 TPS25921A 4.5 to 18 20 0.4 to 1.6 ±2% @ 1A TPS25926 4.5 to 13.8 20 2 to 5 ±8% @ 3.7A 30 Auto Retry ENUV BLK FET Driver, Output Clamp, No Rsense Required 10VSON 0.55 TPS25927 4.5 to 18 20 1 to 5 ±15% @ 2.1A 30 Auto Retry ENUV BLK FET Driver, No Rsense Required 10VSON 0.55 *Quantities of 1,000 begin at this suggested resale price in U.S. dollars. 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