Multi-Output Controller with Integrated MOSFET Drivers for AMD SVI Capable Mobile CPUs ISL6265C Features The ISL6265C is a multi-output controller with embedded gate drivers. A single-phase controller powers the Northbridge (VDDNB) portion of the CPU. The two remaining controller channels can be configured for two-phase or individual single-phase outputs. For uniplane CPU applications, the ISL6265C is configured as a two-phase buck converter. This allows the controller to interleave channels to effectively double the output voltage ripple frequency, and thereby reduce output voltage ripple amplitude with fewer components, lower component cost, reduced power dissipation, and smaller area. For dual-plane processors, the ISL6265C can be configured as independent single-phase controllers powering VDD0 and VDD1. • Core Configuration Flexibility - Dual Plane, Single-Phase Controllers - Uniplane, Two-Phase Controller The heart of the ISL6265C is the patented R3 Technology™, Intersil’s Robust Ripple Regulator modulator. Compared with the traditional buck regulator, the R3 Technology™ has a faster transient response. This is due to the R3 modulator commanding variable switching frequency during a load transient. • Northbridge Lossless rDS(ON) Current Sensing The Serial VID Interface (SVI) allows dynamic adjustment of the Core and Northbridge output voltages independently and in combination from 0.500V to 1.55V. Core and Northbridge output voltages achieve a 0.5% system accuracy over-temperature. • Precision Voltage Regulators - 0.5% System Accuracy Over-temperature • Voltage Positioning with Adjustable Load Line and Offset • Internal Gate Drivers with 2A Driving Capability • Differential Remote CPU Die Voltage Sensing • Core Differential Current Sensing: DCR or Resistor • Serial VID Interface - Two Wire Clock and Data Bus - Supports High-Speed I2C - 0.500V to 1.55V in 12.5mV Steps - Supports PSI_L Power-Saving Mode • Core Outputs Feature Phase Shedding with PSI_L • Adjustable Output-Voltage Offset A unity-gain differential amplifier is provided for remote CPU die sensing. This allows the voltage on the CPU die to be accurately regulated per AMD mobile CPU specifications. Core output current sensing is realized using lossless inductor DCR sensing. All outputs feature overcurrent, overvoltage and undervoltage protection. • Digital Soft-Start of all Outputs Related Literature Applications • See FN6884 for “Multi-Output Controller with Integrated MOSFET Drivers for AMD SVI Capable Mobile CPUs” • AMD Griffin Platform CPU • Static and Dynamic Current Sharing (Uniplane Core) • Overvoltage, Undervoltage, and Overcurrent Protection • Pb-Free (RoHS compliant) POWER STAGE CORE_0 CORE_1 NORTHBRIDGE • Notebook Core/GPU Voltage Regulators POWER STAGE ISL6265C • User Programmable Switching Frequency POWER STAGE FIGURE 1. SIMPLIFIED SYSTEM DIAGRAM January 11, 2013 FN6976.2 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2010, 2013. All Rights Reserved Intersil (and design) is a registered trademark of Intersil Americas Inc. All other trademarks mentioned are the property of their respective owners. ISL6265C Functional Block Diagram RTN_NB COMP_NB FB_NB VSEN_NB FSET_NB PVCC IFSET_NB VNB 1 PWROK NO DROOP PSI_L I_OFS VREF_NB VREF0 SVI INTERFACE AND DAC SVD FLT 1.5kW 1.5kΩ SVC BOOT_NB 3.0kΩ MODULATOR NB E/A VREF_NB MOSFET DRIVER PHASE_NB SHOOT-THRU PROTECTION LGATE_NB DE MODE PGND_NB VIN VREF1 OFS/FIXEN UGATE_NB PSI_L PVCC VCC OCSET_NB FLT VNB V0 V1 ISEN0 ISEN1 FAULT PROTECTION OCSET RBIAS RTN1 POWER-ON RESET AND SOFT-START LOGIC ENABLE PGOOD GND MODE VW0 PVCC IVW0 VIN COMP0 BOOT0 FB0 FLT E/A UGATE0 I_OFS VDIFF0 VSEN0 ISN0 VIN V0 1 RTN0 ISP0 ∑ NO DROOP ISEN0 ISN1 VSEN1 MODULATOR CORE CURRENT SENSE CURRENT SENSE ISEN1 LGATE0 DE MODE PGND0 PSI_L PVCC FLT CURRENT BALANCE BOOT1 UGATE1 MOSFET DRIVER MODE ∑ VREF1 RTN1 VDIFF1 SHOOT-THRU PROTECTION NO DROOP V1 1 PHASE0 MODE MODE ISP1 MOSFET DRIVER VREF0 PHASE1 SHOOT-THRU PROTECTION LGATE1 DE MODE PGND1 E/A I_OFS PSI_L IVW1 FB1 COMP1 VW1 FIGURE 2. SIMPLIFIED FUNCTIONAL BLOCK DIAGRAM OF ISL6265C 2 FN6976.2 January 11, 2013 ISL6265C Ordering Information PART MARKING PART NUMBER (Notes 2, 3) TEMP RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL6265CHRTZ 6265C HRTZ -10 to +100 48 Ld 6x6 TQFN L48.6x6 ISL6265CHRTZ-T (Note 1) 6265C HRTZ -10 to +100 48 Ld 6x6 TQFN Tape and Reel L48.6x6 ISL6265CIRTZ 6265C IRTZ -40 to +100 48 Ld 6x6 TQFN L48.6x6 ISL6265CIRTZ-T (Note 1) 6265C IRTZ -40 to +100 48 Ld 6x6 TQFN Tape and Reel L48.6x6 NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL6265C. For more information on MSL please see techbrief TB363. Pin Configuration UGATE_NB PHASE_NB LGATE_NB PGND_NB OCSET_NB RTN_NB VSEN_NB FSET_NB COMP_NB FB_NB VCC VIN ISL6265C (48 LD TQFN) TOP VIEW 48 47 46 45 44 43 42 41 40 39 38 37 36 BOOT_NB 35 BOOT0 OFS/VFIXEN 1 PGOOD 2 34 UGATE0 33 PHASE0 PWROK 3 SVD 4 SVC 5 32 PGND0 31 LGATE0 49 GND [BOTTOM] ENABLE 6 RBIAS 7 30 PVCC 29 LGATE1 OCSET 8 28 PGND1 27 PHASE1 VDIFF0 9 FB0 10 26 UGATE1 25 BOOT1 COMP0 11 VW0 12 ISN1 VW1 ISP1 COMP1 VDIFF1 FB1 RTN1 VSEN1 RTN0 VSEN0 ISP0 3 ISN0 13 14 15 16 17 18 19 20 21 22 23 24 FN6976.2 January 11, 2013 ISL6265C Pin Descriptions PIN(s) SYMBOL(s) DESCRIPTION 1 OFS/VFIXEN A resistor from this pin to GND programs a DC current source, which generates a positive offset voltage across the resistor between FB and VDIFF pins. In this case, the OFS pin voltage is +1.2V and VFIX mode is not enabled. If OFS is pulled up to +3.3V, VFIX mode is enabled, the DAC decodes the SVC and SVD inputs to determine the programmed voltage, and the OFS function is disabled. If OFS is pulled up to +5V, the OFS function and VFIX mode are disabled. 2 PGOOD Controller power-good open-drain output. This pin is typically pulled up externally by a 2.0kΩ resistor to +3.3V. During normal operation, this pin indicates whether all output voltages are within specified overvoltage and undervoltage limits and no overcurrent condition is present. If any output voltage exceeds these limits or a reset event occurs, the pin is pulled low. This pin is always low prior to the end of soft-start. 3 PWROK System power good input. When this pin is high, the SVI interface is active and I2C protocol is running. While this pin is low, the SVC, SVD, and VFIXEN input states determine the pre-PWROK metal VID or VFIX mode voltage. This pin must be low prior to the ISL6265C PGOOD output going high per the AMD SVI Controller Guidelines. 4 SVD This pin is the serial VID data bidirectional signal to and from the master device on the AMD processor. 5 SVC This pin is the serial VID clock input from the AMD processor. 6 ENABLE 7 RBIAS A 117kΩ resistor from RBIAS to GND sets internal reference currents. The addition of capacitance to this pin must be avoided and can create instabilities in operation. 8 OCSET CORE_0 and CORE_1 common overcurrent protection selection input. The voltage on this pin sets the (ISPx - ISNx) voltage limit for OC trip. 9, 19 VDIFF0, VDIFF1 10, 20 FB0, FB1 11, 21 COMP0, COMP1 12, 22 VW0, VW1 13, 14, 23, 24 ISP0, ISN0, ISP1, ISN1 These pins are used for differentially sensing the corresponding channel output current. The sensed current is used for channel balancing, protection, and core load line regulation. Connect ISN0 and ISN1 to the node between the RC sense elements surrounding the inductor of their respective channel. Tie the ISP0 and ISP1 pins to the VCORE side of their corresponding channel’s sense capacitor. These pins can also be used for discrete resistor sensing. 15, 16 VSEN0, RTN0 Inputs to the CORE_0 VR controller precision differential remote sense amplifier. Connect to the sense pins of the VDD0_FB[H,L] portion of the processor. 18, 17 VSEN1, RTN1 Inputs to the CORE_1 VR controller precision differential remote sense amplifier. Connect to the sense pins of the VDD1_FB[H,L] portion of the processor. The RTN1 pin is also used for detection of the VDD_PLANE_STRAP signal prior to enable. 30 PVCC The power supply pin for the internal MOSFET gate drivers of the ISL6265C. Connect this pin to a +5V power supply. Decouple this pin with a quality 1.0µF ceramic capacitor. 31, 29 LGATE0, LGATE1 Connect these pins to the corresponding lower MOSFET gate(s). 32, 28 PGND0, PGND1 The return path of the lower gate driver for CORE_0 and CORE_1 respectively. Connect these pins to the corresponding sources of the lower MOSFETs. 33, 27 PHASE0, PHASE1 Switch node of the CORE_0 and CORE_1 controllers. Connect these pins to the sources of the corresponding upper MOSFET(s). These pins are the return path for the upper MOSFET drives. 34, 26 UGATE0, UGATE1 Connect these pins to the corresponding upper MOSFET gate(s). These pins control the upper MOSFET gate(s) and are monitored for shoot-through prevention. 35, 25 BOOT0, BOOT1 These pins provide the bias voltage for the corresponding upper MOSFET drives. Connect these pins to appropriately chosen external bootstrap capacitors. Internal bootstrap diodes connected to the PVCC pin provide the necessary bootstrap charge. 4 Digital input enable. A high level logic signal on this pin enables the ISL6265C. Output of the CORE_0 and CORE_1 differential amplifiers. These pins are the output voltage feedback to the inverting input of the CORE_0 and CORE_1 error amplifiers. The output of the CORE_0 and CORE_1 controller error amplifiers respectively. FBx, VDIFFx, and COMPx pins are tied together through external R-C networks to compensate the regulator A resistor from this pin to corresponding COMPx pin programs the switching frequency (for example, 6.81k ~ 300kHz). FN6976.2 January 11, 2013 ISL6265C Pin Descriptions (Continued) PIN(s) SYMBOL(s) 36 BOOT_NB This pin is the upper gate drive supply voltage for the Northbridge controller. Connect an appropriately sized ceramic bootstrap capacitor between the BOOT_NB and PHASE_NB pins. An internal bootstrap diode connected to the PVCC pin provides the necessary bootstrap charge. 37 UGATE_NB Upper MOSFET gate signal from Northbridge controller. 38 PHASE_NB Switch node of the Northbridge controller. This pin should connect to the source of the Northbridge channel upper MOSFET(s). 39 LGATE_NB Lower MOSFET gate signal from Northbridge controller. 40 PGND_NB The return path of the Northbridge controller lower gate driver. Connect this pin to the source of the lower MOSFET(s). 41 OCSET_NB Overcurrent protection selection input for the Northbridge controller. A resistor from this pin to PHASE_NB sets the OC trip point. 43, 42 VSEN_NB, RTN_NB Remote Northbridge voltage sense input and return. Connect isolated traces from these pins to the Northbridge sense points of the processor. 44 FSET_NB A resistor from this pin to GND programs the switching frequency of the Northbridge controller (for example, 22.1k ~ 260kHz). 45 COMP_NB This pin is the output of the Northbridge controller error amplifier. 46 FB_NB This pin is the output voltage feedback to the inverting input of the Northbridge controller error amplifier. 47 VCC The bias supply for the IC’s control circuitry. Connect this pin to a +5V supply and decouple using a quality 0.1µF ceramic capacitor. 48 VIN Battery supply voltage. It is used for input voltage feed-forward to improve the input line transient performance. - GND The bias and reference ground for the IC. The GND connection for the ISL6265C is through the thermal pad on the bottom of the package. 5 DESCRIPTION FN6976.2 January 11, 2013 ISL6265C Simplified Application Circuit for Dual Plane and Northbridge Support +5V VCC PVCC VIN VIN GND +VIN SVI DATA SVD SVI CLOCK SVC CIN UGATE0 ENABLE EN PWROK PWROK BOOT0 VDDPWRGD PGOOD PHASE0 VSEN0 LGATE0 REMOTE SENSE RTN0 REMOTE SENSE LOUT VDD0 CORE LOAD PGND0 VSEN1 ISP0 RTN1 ISN0 VDD_PLANE_STRAP RBIAS OFS/VFIXEN OCSET VDIFF0 +VIN CIN FB0 UGATE1 COMP0 ISL6265C BOOT1 LOUT VDD1 PHASE1 VW0 LGATE1 CORE LOAD PGND1 VDIFF1 ISP1 ISN1 +VIN FB1 CIN COMP1 UGATE_NB BOOT_NB VW1 LOUT VDDNB PHASE_NB FSET_NB LGATE_NB PGND_NB COMP_NB NB LOAD OCSET_NB VSEN_NB FB_NB RTN_NB FIGURE 3. ISL6265C BASED DUAL-PLANE AND NORTHBRIDGE CONVERTERS WITH INDUCTOR DCR CURRENT SENSING 6 FN6976.2 January 11, 2013 ISL6265C Simplified Application Circuit for Uniplane Core and Northbridge Support VIN +5V +VIN VCC PVCC SVI DATA SVD SVI CLOCK SVC ENABLE EN PWROK PWROK VDDPWRGD PGOOD CIN UGATE0 BOOT0 LOUT PHASE0 LGATE0 CORE LOAD PGND0 VSEN0 REMOTE SENSE GND ISP0 RTN0 ISN0 REMOTE SENSE VSEN1 VDD_PLANE_STRAP RTN1 RBIAS OCSET OFS/VFIXEN VDD0 +VIN VDIFF0 CIN UGATE1 FB0 BOOT1 COMP0 ISL6265C LOUT PHASE1 LGATE1 VW0 CORE LOAD PGND1 ISP1 OPEN VDIFF1 OPEN FB1 OPEN COMP1 OPEN VW1 ISN1 +VIN CIN UGATE_NB BOOT_NB LOUT VDDNB PHASE_NB FSET_NB LGATE_NB PGND_NB COMP_NB NB LOAD OCSET_NB VSEN_NB RTN_NB FB_NB FIGURE 4. ISL6265C BASED UNIPLANE AND NORTHBRIDGE CONVERTERS WITH INDUCTOR DCR CURRENT SENSING 7 FN6976.2 January 11, 2013 ISL6265C Simplified Application Circuit for Dual Layout VIN +5V VCC PVCC SVI DATA SVD SVI CLOCK SVC ENABLE EN PWROK PWROK VDDPWRGD PGOOD UGATE0 BOOT0 LOUT PHASE0 VDD0 LGATE0 CORE LOAD PGND0 ISP0 RTN0 VDD_PLANE_STRAP +1.8V REMOTE SENSE CIN VSEN0 REMOTE SENSE +VIN GND ISN0 RTN1 DNP UNIPLANE VSEN1 RBIAS UNIPLANE VDD0 OCSET OFS/VFIXEN DNP DUAL PLANE +VIN VDIFF0 CIN UGATE1 FB0 BOOT1 COMP0 ISL6265C LOUT PHASE1 LGATE1 VW0 VDD1 CORE LOAD PGND1 ISP1 POPULATION OPTIONAL IN UNIPLANE VDIFF1 ISN1 +VIN FB1 COMP1 CIN UGATE_NB BOOT_NB VW1 FSET_NB VDDNB PHASE_NB LGATE_NB PGND_NB COMP_NB LOUT NB LOAD OCSET_NB VSEN_NB RTN_NB FB_NB FIGURE 5. ISL6265C BASED UNIPLANE OR DUAL PLANE CORE CONVERTER WITH INDUCTOR DCR CURRENT SENSING 8 FN6976.2 January 11, 2013 ISL6265C Table of Contents Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 ISL6265C Gate Driver Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Theory of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Core Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Serial VID Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Pre-PWROK Metal VID. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VFIX MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SVI MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VID-On-the-Fly Transition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SVI WIRE Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SVI Bus Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 16 16 16 18 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Switching Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Current Sense. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Selecting RBIAS For Core Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Offset Resistor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 19 20 20 Internal Driver Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 MOSFET Gate-Drive Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Diode Emulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Power-Savings Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Northbridge And Dual Plane Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Uniplane Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Fault Monitoring and Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power-Good Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overvoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Undervoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 21 22 22 General Application Design Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Selecting the LC Output Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Selection of the Input Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MOSFET Selection and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Selecting The Bootstrap Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 23 23 24 PCB Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Power and Signal Layers Placement on the PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Component Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Signal Ground and Power Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Routing and Connection Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Copper Size for the Phase Node . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 24 24 24 25 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 About Intersil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 9 FN6976.2 January 11, 2013 ISL6265C P Absolute Maximum Ratings Thermal Information Supply Voltage, VCC, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 - +7V Battery Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +28V Boot Voltage (BOOT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +33V Boot to Phase Voltage (BOOT-PHASE) . . . . . . . . . . . . . . . . -0.3V to +7V(DC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +9V (<10ns) Phase Voltage (PHASE) . . . . . . . . . . . . . . . . -7V (<20ns Pulse Width, 10µJ) UGATE Voltage (UGATE) . . . . . . . . . . . . . . . . . . . PHASE -0.3V (DC) to BOOT LGATE Voltage (LGATE) . . . . . . . . . . . . . . . . . . . . . -0.3V (DC) to VCC + 0.3V ALL Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to (VCC + 0.3V) Open Drain Outputs, PGOOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 - +7V Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) TQFN Package (Notes 4, 5) . . . . . . . . . . . . . 28 3.5 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Supply Voltage, VCC, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5% Battery Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6V to 24V Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +100°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications VCC = PVCC = 5V, VIN = 12V, TA = -10°C to +100°C (ISL6265HRTZ), TA = -40°C to +100°C (ISL6265IRTZ), unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +100°C. PARAMETER MIN (Note 6) TYP MAX (Note 6) UNITS EN = 3.3V - 7.8 10 mA EN = 0V - - 1 µA SYMBOL TEST CONDITIONS INPUT POWER SUPPLY +5V Supply Current IVCC POR (Power-On Reset) Threshold Battery Supply Current (VIN) VCC PORr VCC Rising - 4.35 4.5 V VCC PORf VCC Falling 3.9 4.1 - V - - 1 µA -0.5 - 0.5 % -5 - +5 mV -0.8 - 0.8 % -8 - +8 mV IVIN EN = 0V, VIN = 24V SYSTEM AND REFERENCES System Accuracy (Vcore0, Vcore1, Vcore_NB) HRTZ %Error (VCORE) IRTZ %Error (VCORE) No load, closed loop, active mode VID = 0.75V to 1.55V VID = 0.50V to 0.7375V No load, closed loop, active mode VID = 0.75V to 1.55V VID = 0.50V to 0.7375V HRTZ RRBIAS RRBIAS = 117kΩ 1.15 1.17 1.19 V IRTZ RRBIAS RRBIAS = 117kΩ 1.14 1.17 1.20 V Maximum Output Voltage VCOREx (max) SVID = [000_0000b] - 1.55 - V Minimum Output Voltage VCOREx (min) SVID = [101_0100b] - 0.500 - V RBIAS Voltage 10 FN6976.2 January 11, 2013 ISL6265C Electrical Specifications VCC = PVCC = 5V, VIN = 12V, TA = -10°C to +100°C (ISL6265HRTZ), TA = -40°C to +100°C (ISL6265IRTZ), unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +100°C. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN (Note 6) TYP MAX (Note 6) UNITS CHANNEL FREQUENCY HRTZ fSW_core0 VIN = 15.5V, VDAC = 1.55V, VFB0 = 1.60V, force Vcomp_0 = 2V, RVW = 6.81kΩ, 2-Phase Operation 285 300 315 kHz IRTZ fSW_core0 VIN = 15.5V, VDAC = 1.55V, VFB0 = 1.60V, force Vcomp_0 = 2V, RVW = 6.81kΩ, 2-Phase Operation 280 300 320 kHz HRTZ fSW_core_NB RFSET_NB = 22.1kΩ, CFSET_NB = 1nF, VDAC = 0.5V, Vsen_nb = 0.51V 285 300 315 kHz IRTZ fSW_core_NB RFSET_NB = 22.1kΩ, CFSET_NB = 1nF, VDAC = 0.5V, Vsen_nb = 0.51V 280 300 320 kHz Core Frequency Adjustment Range 200 - 500 kHz NB Frequency Adjustment Range 200 - 500 kHz - 90 - dB Nominal CORE Switching Frequency Nominal NB Switching Frequency AMPLIFIERS Error Amp DC Gain (Note 7) AV0 GBW CL = 20pF - 18 - MHz SR CL = 20pF - 5.0 - V/µs Current Imbalance Threshold - 4 - mV Input Bias Current - 20 - nA RTN1 Threshold - 0.8 - V 1.25 1.875 2.50 mV/µs 5 7.5 10 mV/µs Error Amp Gain-Bandwidth Product (Note 7) Error Amp Slew Rate (Note 7) CORE CURRENT SENSE SOFT START/VID-ON-THE-FLY Soft-Start Voltage Transition VSS VID on the Fly Transition GATE DRIVER DRIVING CAPABILITY [CORE AND NB] UGATE Source Resistance (Note 8) RSRC(UGATE) 500mA Source Current - 1 1.5 Ω UGATE Source Current (Note 8) ISRC(UGATE) VUGATE_PHASE = 2.5V - 2 - A UGATE Sink Resistance (Note 8) RSNK(UGATE) 500mA Sink Current - 1 1.5 Ω UGATE Sink Current (Note 8) ISNK(UGATE) VUGATE_PHASE = 2.5V - 2 - A LGATE Source Resistance (Note 8) RSRC(LGATE) 500mA Source Current - 1 1.5 Ω LGATE Source Current (Note 8) ISRC(LGATE) VLGATE = 2.5V - 2 - A LGATE Sink Resistance (Note 8) RSNK(LGATE) 500mA Sink Current - 0.5 0.9 Ω LGATE Sink Current (Note 8) ISNK(LGATE) VLGATE = 2.5V - 4 - A UGATE to PHASE Resistance Rp(UGATE) - 1 - kΩ GATE DRIVER SWITCHING TIMING (Refer to “ISL6265C Gate Driver Timing Diagram” on page 13) UGATE Rise Time (Note 7) tRU PVCC = 5V, 3nF Load - 8.0 - ns LGATE Rise Time (Note 7) tRL PVCC = 5V, 3nF Load - 8.0 - ns UGATE Fall Time (Note 7) tFU PVCC = 5V, 3nF Load - 8.0 - ns LGATE Fall Time (Note 7) tFL PVCC = 5V, 3nF Load - 4.0 - ns UGATE Turn-on Propagation Delay tPDHU PVCC = 5V, Outputs Unloaded - 36 - ns LGATE Turn-on Propagation Delay tPDHL PVCC = 5V, Outputs Unloaded - 20 - ns 11 FN6976.2 January 11, 2013 ISL6265C Electrical Specifications VCC = PVCC = 5V, VIN = 12V, TA = -10°C to +100°C (ISL6265HRTZ), TA = -40°C to +100°C (ISL6265IRTZ), unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +100°C. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN (Note 6) TYP MAX (Note 6) UNITS V BOOTSTRAP DIODE Forward Voltage HRTZ VDDP = 5V, Forward Bias Current = 2mA 0.43 0.58 0.67 IRTZ VDDP = 5V, Forward Bias Current = 2mA Leakage 0.43 0.58 0.70 V VR = 16V - - 5 µA - 0.2 0.5 V -1 - 1 µA POWER-GOOD AND PROTECTION MONITOR PGOOD Low Voltage VOL IPGOOD = 4mA PGOOD Leakage Current IOH PGOOD = 5V PGOOD High After Soft-Start Enable to PGOOD High, VCOREx = 1.1V 570 700 1010 µs PGOOD Low After Fault Fault to PGOOD Low 160 208 250 µs HRTZ UVH VCOREx falls below set-point for 208µs 240 295 350 mV IRTZ UVH VCOREx falls below set-point for 208µs 230 295 350 mV OVHS VO rising above threshold > 0.5µs 1.770 1.800 1.825 V 5 6.0 7 mV Undervoltage Threshold Overvoltage Threshold OVERCURRENT PROTECTION VDD0 AND VDD1 OCSET Reference Voltage (VISPx - VISNx) VOCSET = 180mV; VIN = 15.5V OVERCURRENT PROTECTION VDD_NB OCSET_NB OCP Current HRTZ RBIAS pin to GND = 117kΩ; Trips after 8 PWM cycles 9.2 10 10.8 µA IRTZ RBIAS pin to GND = 117kΩ; Trips after 8 PWM cycles 9.2 10 10.9 µA HRTZ VOFS ROFS = 240kΩ (OFS pin to GND) 1.18 1.2 1.22 V IRTZ VOFS ROFS = 240kΩ (OFS pin to GND) 1.17 1.2 1.23 V IOFS = =10µA 9.0 9.9 10.8 µA OFFSET FUNCTION OFS Pin Voltage For Droop Enabling FB Pin Source Current IFB OFS Pin Voltage Threshold for VFIX Mode and No Droop Operation VOFS - 1.8 - V OFS Pin Voltage Threshold for SVI Mode and No Droop Operation VOFS - 4.0 - V OFS Bias IOFS - 4.0 - µA 1.8V < OFS < VCC LOGIC INPUTS ENABLE Low Threshold VIL(3.3V) - 1.35 0.9 V ENABLE High Threshold VIH(3.3V) 2.0 1.6 - V -1 0 - µA - 0 1 µA PWROK Input Low Threshold - 0.65 0.8 V PWROK Input High Threshold - 0.9 - V ENABLE Leakage Current Logic input is low Logic input is high at 3.3V SVI INTERFACE SVC, SVD Input HIGH (VIH) 1.05 0.87 - V SVC, SVD Input LOW (VIL) - 0.68 0.45 V Schmitt Trigger Input Hysteresis - 0.19 - V 12 FN6976.2 January 11, 2013 ISL6265C Electrical Specifications VCC = PVCC = 5V, VIN = 12V, TA = -10°C to +100°C (ISL6265HRTZ), TA = -40°C to +100°C (ISL6265IRTZ), unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +100°C. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN (Note 6) TYP MAX (Note 6) UNITS SVD Low Level Output Voltage 3mA Sink Current - 0.1 0.285 V SVC, SVD Leakage EN = 0V, SVC, SVD = 0V - < -100 - nA EN = 5V, SVC, SVD = 1.8V - < -100 - nA HRTZ VSEN = 0.5V to 1.55V; RTN = 0 ±0.1V -2 - 2 mV IRTZ VSEN = 0.5V to 1.55V; RTN = 0 ±0.1V -2.5 - 2.5 mV DIFF AMP Accuracy NOTES: 6. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested 7. Limits should be considered typical and are not production tested. 8. Limits established by characterization and are not production tested. ISL6265C Gate Driver Timing Diagram PWM tPDHU tFU tRU 1V UGATE LGATE 1V tFL tRL tPDHL 13 FN6976.2 January 11, 2013 ISL6265C + gmVIN FSET + VW - + PWM VO + gmVO - The hysteresis window voltage is relative to the error amplifier output such that load current transients result in increased switching frequency, which gives the R3 regulator a faster response than conventional fixed frequency PWM controllers. In uniplane configurations, transient load current is inherently shared between active phases due to the use of a common hysteretic window voltage. Individual average phase currents are monitored and controlled to equally share current among the active phases. PWM FREQUENCY CONTROL VR - The heart of the ISL6265C is the R3 Technology™, Intersil's Robust Ripple Regulator modulator. The R3 modulator combines the best features of fixed frequency PWM and hysteretic PWM while eliminating many of their shortcomings. The ISL6265C modulator internally synthesizes an analog of the inductor ripple current and uses hysteretic comparators on those signals to establish PWM pulse widths. Operating on these largeamplitude, noise-free synthesized signals allows the ISL6265C to achieve lower output ripple and lower phase jitter than either conventional hysteretic or fixed frequency PWM controllers. Unlike conventional hysteretic converters, the ISL6265C has an error amplifier that allows the controller to maintain a 0.5% voltage regulation accuracy throughout the VID range from 0.75V to 1.55V. Voltage regulation accuracy is slightly wider, ±5mV, over the VID range from 0.7375V to 0.5V. VIN - The ISL6265C is a flexible multi-output controller supporting Northbridge and single or dual power planes required by Class M AMD Mobile CPUs. In single plane applications, both core voltage regulators operate single-phase. In uniplane core applications, the core voltage regulators are configured to operate as a two-phase regulator. All three regulator outputs include integrated gate drivers for reduced system cost and small board area. The regulators provide optimum steady-state and transient performance for microprocessor applications. System efficiency is enhanced by idling a phase in uniplane configurations at lowcurrent and implementing automatic DCM-mode operation when PSI_L is asserted to logic low. A window voltage VW is referenced with respect to the error amplifier output voltage VCOMP, creating an envelope into which the ripple voltage VR is compared. The amplitude of VW is set by a resistor connected across the FSET and GND pins. The VR, VCOMP, and VW signals feed into a window comparator in which VCOMP is the lower threshold voltage and VW is the higher threshold voltage. Figure 7 shows PWM pulses being generated as VR traverses the VW and VCOMP thresholds. The PWM switching frequency is proportional to the slew rates of the positive and negative slopes of VR; it is inversely proportional to the voltage between VW and VCOMP. - Theory of Operation R Q S VCOMP + CR TO PWM CONTROL + - ISL6265C FIGURE 6. MODULATOR CIRCUITRY RIPPLE CAPACITOR VOLTAGE CR WINDOW VOLTAGE VW ERROR AMPLIFIER VOLTAGE VCOMP Modulator The ISL6265C modulator features Intersil’s R3 technology, a hybrid of fixed frequency PWM control and variable frequency hysteretic control (see Figure 6). Intersil’s R3 technology can simultaneously affect the PWM switching frequency and PWM duty cycle in response to input voltage and output load transients. The R3 modulator synthesizes an AC signal VR, which is an analog representation of the output inductor ripple current. The duty-cycle of VR is the result of charge and discharge current through a ripple capacitor CR. The current through CR is provided by a transconductance amplifier gm that measures the VIN and VO voltages. The positive slope of VR can be written as determined by Equation 1: (EQ. 1) V RPOS = ( g m ) ⋅ ( V IN – V OUT ) The negative slope of VR can be written as determined by Equation 2: V RNEG = g m ⋅ V OUT PWM FIGURE 7. MODULATOR WAVEFORMS DURING LOAD TRANSIENT Initialization Once sufficient bias is applied to the VCC pin, internal logic checks the status of critical pins to determine the controller operation profile prior to ENABLE. These pins include RTN1 which determines single vs two-phase operation and OFS/VFIXEN for enabling/disabling the SVI interface and core voltage droop. Depending on the configuration set by these pins, the controller then checks the state of the SVC and SVD pins to determine the soft-start target output voltage level. (EQ. 2) Where gm is the gain of the transconductance amplifier. 14 FN6976.2 January 11, 2013 ISL6265C Power-On Reset Mode Selection The ISL6265C requires a +5V input supply tied to VCC and PVCC to exceed a rising power-on reset (POR) threshold before the controller has sufficient bias to guarantee proper operation. Once this threshold is reached or exceeded, the ISL6265C has enough bias to begin checking RTN1, OFS/VFIXEN, ENABLE, and SVI inputs. Hysteresis between the rising the falling thresholds assure the ISL6265C will not inadvertently turn-off unless the bias voltage drops substantially (see “Electrical Specifications” on page 12). The OFS/VFIXEN pin selects between the AMD defined VFIX and SVI modes of operation and enables droop if desired in SVI mode only. If OFS/VFIXEN is tied to VCC, then SVI mode with no droop on the core output(s) is selected. Connected to +3.3V, VFIX mode is active with no droop on the core output(s). SVI mode with droop is enabled when OFS/VFIXEN is tied to ground through a resistor sized to set the core voltage positive offset. Further information is provided in “Offset Resistor Selection” on page 20. Serial VID Interface Core Configuration The on-board Serial VID Interface (SVI) circuitry allows the processor to directly control the Core and Northbridge voltage reference levels within the ISL6265C. The SVC and SVD states are decoded according to the PWROK and VFIXEN inputs as described in the following sections. The ISL6265C uses a digital-to-analog converter (DAC) to generate a reference voltage based on the decoded SVI value. See Figure 8 for a simple SVI interface timing diagram. The ISL6265C determines the core channel requirements of the CPU based on the state of the RTN1 pin prior to ENABLE. If RTN1 is low prior to ENABLE, both VDD0 and VDD1 core planes are required. The core controllers operate as independent single-phase regulators. RTN1 is connected to the CPU Core1 negative sense point. For single core CPU designs (uniplane), RTN1 is tied to a +1.8V or greater supply. Prior to ENABLE, RTN1 is detected as HIGH and the ISL6265C drives the core controllers as a two-phase multi-phase regulator. Dual purpose motherboard designs should include resistor options to open the CPU Core1 negative sense and connect the RTN1 pin to a pull-up resistor. 1 2 3 4 5 6 7 8 9 10 11 12 VCC SVC SVD ENABLE PWROK METAL_VID VDD AND VDDNB V_SVI METAL_VID V_SVI VDDPWRGD (PGOOD) FIXEN Interval 1 to 2: ISL6265C waits to POR. Interval 2 to 3: SVC and SVD are externally set to pre-Metal VID code. Interval 3 to 4: EN locks core output configuration and pre-Metal VID code. All outputs soft-start to this level. Interval 4 to 5: PGOOD signal goes HIGH indicating proper operation. Interval 5 to 6: CPU detects VDDPWRGD high and drives PWROK high to allow ISL6265C to prepare for SVI code. Interval 6 to 7: SVC and SVD data lines communicate change in VID code. Interval 7 to 8: ISL6265C responds to VID-ON-THE-FLY code change. Interval 8 to 9: PWROK is driven low and ISL6265C returns all outputs to pre-PWROK Metal VID level. Interval 9 to 10: PWROK driven high once again by CPU and ISL6265C prepares for SVI code. Interval 10 to 11: SVC and SVD data lines communicate new VID code. Interval 11 to 12: ISL6265C drives outputs to new VID code level. Post 12 : Enable falls and all internal drivers are tri-stated and PGOOD is driven low. FIGURE 8. SVI INTERFACE TIMING DIAGRAM: TYPICAL PRE-PWROK METAL VID STARTUP 15 FN6976.2 January 11, 2013 ISL6265C Pre-PWROK Metal VID SVI MODE Assuming the OFS/VFIXEN pin is not tied to +3.3V during controller configuration, typical motherboard start-up begins with the controller decoding the SVC and SVD inputs to determine the pre-PWROK metal VID setting (see Table 1). Once the enable input (EN) exceeds the rising enable threshold, the ISL6265C decodes and locks the decoded value in an on-board hold register. Once the controller has successfully soft-started and PGOOD transitions high, the processor can assert PWROK to signal the ISL6265C to prepare for SVI commands. The controller actively monitors the SVI interface for set VID commands to move the plane voltages to start-up VID values. Details of the SVI Bus protocol are provided in the AMD Design Guide for Voltage Regulator Controllers Accepting Serial VID Codes specification. The internal DAC circuitry begins to ramp Core and Northbridge planes to the decoded pre-PWROK metal VID output level. The digital soft-start circuitry ramps the internal reference to the target gradually at a fixed rate of approximately 2mV/µs. The controlled ramp of all output voltage planes reduces in-rush current during the soft-start interval. At the end of the soft-start interval, the PGOOD output transitions high indicating all output planes are within regulation limits. Once a set VID command is received, the ISL6265C decodes the information to determine which output plane is affected and the VID target required (see Table 3).The internal DAC circuitry steps the required output plane voltage to the new VID level. During this time, one or more of the planes could be targeted. In the event either core voltage plane, VDD0 or VDD1, is commanded to power-off by serial VID commands, the PGOOD signal remains asserted. The Northbridge voltage plane must remain active during this time. TABLE 1. PRE-PWROK METAL VID CODES SVC SVD OUTPUT VOLTAGE (V) 0 0 1.1 0 1 1.0 1 0 0.9 1 1 0.8 If the EN input falls below the enable falling threshold, the ISL6265C tri-states all outputs. PGOOD is pulled low with the loss of EN. The Core and Northbridge planes will decay based on output capacitance and load leakage resistance. If bias to VCC falls below the POR level, the ISL6265C responds in the same manner previously described. Once VCC and EN rise above their respective rising thresholds, the internal DAC circuitry re-acquires a pre-PWROK metal VID code and the controller soft-starts. VFIX MODE In VFIX Mode, the SVC and SVD levels fixed external to the controller through jumpers to either GND or VDDIO. These inputs are not expected to change. In VFIX mode, the IC decodes the SVC and SVD states per Table 2. TABLE 2. VFIXEN VID CODES SVC SVD OUTPUT VOLTAGE (V) 0 0 1.4 0 1 1.2 1 0 1.0 1 1 0.8 Once enabled, the ISL6265C begins to soft-start both Core and Northbridge planes to the programmed VFIX level. The internal soft-start circuitry slowly ramps the reference up to the target value. The same fixed internal rate of approximately 2mV/µs results in a controlled ramp of the power planes. Once soft-start has ended and all output planes are within regulation limits, the PGOOD pin transitions high. In the same manner described in “Pre-PWROK Metal VID” on page 16, the POR circuitry impacts the internal driver operation and PGOOD status. 16 If the PWROK input is de-asserted, then the controller steps both Core and Northbridge planes back to the stored pre-PWROK metal VID level in the holding register from initial soft-start. No attempt is made to read the SVC and SVD inputs during this time. If PWROK is reasserted, then the on-board SVI interface waits for a set VID command. If EN goes low during normal operation, all internal drivers are tri-stated and PGOOD is pulled low. This event clears the pre-PWROK metal VID code and forces the controller to check SVC and SVD upon restart. A POR event on VCC during normal operation will shutdown all regulators and PGOOD is pulled low. The pre-PWROK metal VID code is not retained. VID-On-the-Fly Transition Once PWROK is high, the ISL6265C detects this flag and begins monitoring the SVC and SVD pins for SVI instructions. The microprocessor will follow the protocol outlined in the following sections to send instructions for VID-on-the-Fly transitions. The ISL6265C decodes the instruction and acknowledges the new VID code. For VID codes higher than the current VID level, the ISL6265C begins stepping the required regulator output(s) to the new VID target with a typical slew rate of 7.5mV/µs, which meets the AMD requirements. When the VID codes are lower than the current VID level, the ISL6265C begins stepping the regulator output to the new VID target with a typical slew rate of -7.5mV/µs. Both Core and NB regulators are always in CCM during a down VID transition. The AMD requirements under these conditions do not require the regulator to meet the minimum slew rate specification of -5mV/µs. In either case, the slew rate is not allowed to exceed 10mV/µs. The ISL6265C does not change the state of PGOOD (VDDPWRGD in AMD specifications) when a VID-on-the-fly transition occurs. SVI WIRE Protocol The SVI wire protocol is based on the I2C bus concept. Two wires (serial clock (SVC) and serial data (SVD)), carry information between the AMD processor (master) and VR controller (slave) on the bus. The master initiates and terminates SVI transactions FN6976.2 January 11, 2013 ISL6265C and drives the clock, SVC, during a transaction. The AMD processor is always the master and the voltage regulators are the slaves. The slave receives the SVI transactions and acts accordingly. Mobile SVI wire protocol timing is based on highspeed mode I2C. See AMD Griffin (Family 11h) processor publications for additional details. TABLE 3. SERIAL VID CODES SVID[6:0] VOLTAGE (V) SVID[6:0] VOLTAGE (V) SVID[6:0] VOLTAGE (V) SVID[6:0] VOLTAGE (V) 000_0000b 1.5500 010_0000b 1.1500 100_0000b 0.7500 110_0000b 0.3500* 000_0001b 1.5375 010_0001b 1.1375 100_0001b 0.7375 110_0001b 0.3375* 000_0010b 1.5250 010_0010b 1.1250 100_0010b 0.7250 110_0010b 0.3250* 000_0011b 1.5125 010_0011b 1.1125 100_0011b 0.7125 110_0011b 0.3125* 000_0100b 1.5000 010_0100b 1.1000 100_0100b 0.7000 110_0100b 0.3000* 000_0101b 1.4875 010_0101b 1.0875 100_0101b 0.6875 110_0101b 0.2875* 000_0110b 1.4750 010_0110b 1.0750 100_0110b 0.6750 110_0110b 0.2750* 000_0111b 1.4625 010_0111b 1.0625 100_0111b 0.6625 110_0111b 0.2625* 000_1000b 1.4500 010_1000b 1.0500 100_1000b 0.6500 110_1000b 0.2500* 000_1001b 1.4375 010_1001b 1.0375 100_1001b 0.6375 110_1001b 0.2375* 000_1010b 1.4250 010_1010b 1.0250 100_1010b 0.6250 110_1010b 0.2250* 000_1011b 1.4125 010_1011b 1.0125 100_1011b 0.6125 110_1011b 0.2125* 000_1100b 1.4000 010_1100b 1.0000 100_1100b 0.6000 110_1100b 0.2000* 000_1101b 1.3875 010_1101b 0.9875 100_1101b 0.5875 110_1101b 0.1875* 000_1110b 1.3750 010_1110b 0.9750 100_1110b 0.5750 110_1110b 0.1750* 000_1111b 1.3625 010_1111b 0.9625 100_1111b 0.5625 110_1111b 0.1625* 001_0000b 1.3500 011_0000b 0.9500 101_0000b 0.5500 111_0000b 0.1500* 001_0001b 1.3375 011_0001b 0.9375 101_0001b 0.5375 111_0001b 0.1375* 001_0010b 1.3250 011_0010b 0.9250 101_0010b 0.5250 111_0010b 0.1250* 001_0011b 1.3125 011_0011b 0.9125 101_0011b 0.5125 111_0011b 0.1125* 001_0100b 1.3000 011_0100b 0.9000 101_0100b 0.5000 111_0100b 0.1000* 001_0101b 1.2875 011_0101b 0.8875 101_0101b 0.4875* 111_0101b 0.0875* 001_0110b 1.2750 011_0110b 0.8750 101_0110b 0.4750* 111_0110b 0.0750* 001_0111b 1.2625 011_0111b 0.8625 101_0111b 0.4625* 111_0111b 0.0625* 001_1000b 1.2500 011_1000b 0.8500 101_1000b 0.4500* 111_1000b 0.0500* 001_1001b 1.2375 011_1001b 0.8375 101_1001b 0.4375* 111_1001b 0.0375* 001_1010b 1.2250 011_1010b 0.8250 101_1010b 0.4250* 111_1010b 0.0250* 001_1011b 1.2125 011_1011b 0.8125 101_1011b 0.4125* 111_1011b 0.0125* 001_1100b 1.2000 011_1100b 0.8000 101_1100b 0.4000* 111_1100b OFF 001_1101b 1.1875 011_1101b 0.7875 101_1101b 0.3875* 111_1101b OFF 001_1110b 1.1750 011_1110b 0.7750 101_1110b 0.3750* 111_1110b OFF 001_1111b 1.1625 011_1111b 0.7625 101_1111b 0.3625* 111_1111b OFF NOTE: *Indicates a VID not required for AMD Family 10h processors. 17 FN6976.2 January 11, 2013 PSI_L ISL6265C 6 5 4 3 2 1 7 0 (See Table 3) SVID 6 5 4 3 2 1 0 SVC STOP ACK DATA PHASE ACK SLAVE ADDRESS PHASE WRITE START SVD FIGURE 9. SEND BYTE EXAMPLE SVI Bus Protocol The AMD processor bus protocol is compliant with SMBus send byte protocol for VID transactions (see Figure 9). During a send byte transaction, the processor sends the start sequence followed by the slave address of the VR for which the VID command applies. The address byte must be configured according to Table 4. The processor then sends the write bit. After the write bit, if the ISL6265C receives a valid address byte, it sends the acknowledge bit. The processor then sends the PSI-L bit and VID bits during the data phase. The Serial VID 8-bit data field encoding is outlined in Table 5. If ISL6265C receives a valid 8-bit code during the data phase, it sends the acknowledge bit. Finally, the processor sends the stop sequence. After the ISL6265C has detected the stop, it can then proceed with the VID-on-the-fly transition. TABLE 4. SVI SEND BYTE ADDRESS DESCRIPTION BITS 6:4 DESCRIPTION Always 110b 3 Reserved by AMD for future use 2 VDD1, if set then the following data byte contains the VID for VDD1 1 VDD0, if set then the following data byte contains the VID for VID0 0 VDDNB, if set then the following data byte contains the VID for VIDNB TABLE 5. SERIAL VID 8-BIT DATA FIELD ENCODING BITS DESCRIPTION 7 PSI_L: =0 means the processor is at an optimal load for the regulator(s) to enter power-savings mode =1 means the processor is not at an optimal load for the regulator(s) to enter power-saving mode 6:0 SVID[6:0] as defined in Table 3. Operation After the start-up sequence, the ISL6265C begins regulating the core and Northbridge output voltages to the pre-PWROK metal VID programmed. The controller monitors SVI commands to determine when to enter power-savings mode, implement dynamic VID changes, and shutdown individual outputs. 18 The ISL6265C controls the no-load output voltage of core and Northbridge output to an accuracy of ±0.5% over-the-range of 0.75V to 1.5V. A fully differential amplifier implements core voltage sensing for precise voltage control at the microprocessor die. Switching Frequency The R3 modulator scheme is a variable frequency PWM architecture. The switching frequency increases during the application of a load to improve transient performance. It also varies slightly due to changes in input and output voltage and output current. This variation is normally less than 10% in continuous conduction mode. CORE FREQUENCY SELECTION A resistor connected between the VW and COMP pins of the Core segment of the ISL6265C adjusts the switching window and therefore adjusts the switching frequency. The RFSET resistor that sets up the switching frequency of the converter operating in CCM can be determined using Equation 3, where RFSET is in kΩ and the switching period is in ms. Designs for 300kHz switching frequency would result in a RFSET value of 6.81kΩ. R FSET ( kΩ ) = ( Period ( μs ) – 0.4 ) × 2.33 (EQ. 3) In discontinuous conduction mode (DCM) the ISL6265C runs in period stretching mode. NORTHBRIDGE FREQUENCY SELECTION The Northbridge switching frequency to programmed by a resistor connected from the FSET_NB pin to the GND pin. The approximate PWM switching frequency is written as shown in Equation 4: 1 F SW = ----------------------------------K ⋅ R FSETNB (EQ. 4) Estimating the value of RFSET_NB is written as shown in Equation 5: 1 R FSET = --------------------K ⋅ F SW (EQ. 5) Where FSW is the PWM switching frequency, RFSET_NB is the programming resistor and K = 1.5 x 10-10. It is recommended that whenever the control loop compensation network is modified, the switching frequency should be checked and adjusted by changing RFSET_NB if necessary. FN6976.2 January 11, 2013 ISL6265C Current Sense Core and Northbridge regulators feature two different types of current sense circuits. CORE CONTINUOUS CURRENT SENSE The ISL6265C provides for load current to be measured using either resistors in series with the individual output inductors or using the intrinsic series resistance of the inductors as shown in the applications circuits in Figures 3 and 4. The load current in a particular output is sampled continuously every switching cycle. During this time, the current-sense amplifier uses the current sense inputs to reproduce a signal proportional to the inductor current. This sensed current is a scaled version of the inductor current. I VIN L UGATE L MOSFET LGATE + VL(s) R1 COUT VC(s) - + INDUCTOR C1 R2 ISL6265C INTERNAL CIRCUIT RNTC ISP CURRENT SENSE VOUT - DRIVER DCR R3 OPTIONAL NTC NETWORK ISN FIGURE 10. DCR SENSING COMPONENTS Inductor windings have a characteristic distributed resistance or DCR (Direct Current Resistance). For simplicity, the inductor DCR is considered as a separate lumped quantity, as shown in Figure 10. The inductor current, IL, flowing through the inductor, passes through the DCR. Equation 6 shows the s-domain equivalent voltage, VL, across the inductor. V L ( s ) = I L ⋅ ( s ⋅ L + DCR ) (EQ. 6) A simple R-C network across the inductor (R1, R2 and C) extracts the DCR voltage, as shown in Equation 7. The voltage across the sense capacitor, VC, can be shown to be proportional to the output current IL, shown in Equation 7. s⋅L ⎛ ------------+ 1⎞ ⎝ DCR ⎠ V C ( s ) = ----------------------------------------------------------- ⋅ K ⋅ DCR ⋅ I L ( ⋅ R ) R ⎛ ⎞ 1 2 ⎜ s ⋅ ------------------------ ⋅ C 1 + 1⎟ R1 + R2 ⎝ ⎠ (EQ. 7) Where: R2 K = --------------------R2 + R1 (EQ. 8) Sensing the time varying inductor current accurately requires that the parallel R-C network time constant match the inductor L/DCR time constant. If the R-C network components are 19 selected, such that the R-C time constant matches the inductor L/DCR time constant (see Equation 9), then VC is equal to the voltage drop across the DCR multiplied by the ratio of the resistor divider, K. R1 ⋅ R2 L ------------- = -------------------- ⋅ C1 DCR R1 + R2 (EQ. 9) The inductor current sense information is used for current balance in dual plane applications, overcurrent detection in core outputs and output voltage droop depending on controller configuration. CORE DCR TEMPERATURE COMPENSATION It may also be necessary to compensate for changes in inductor DCR due to temperature. DCR shifts due to temperature cause time constant mismatch, skewing inductor current accuracy. Potential problems include output voltage droop and OC trip point, both shifting significantly from expected levels. The addition of a negative temperature coefficient (NTC) resistor to the R-C network compensates for the rise in DCR due to temperature. Typical NTC values are in the 10kΩ range. A second resistor, R3, in series with the NTC allows for more accurate timeconstant and resistor-ratio matching as the pair of resistors are placed in parallel with R2 (Figure 10). The NTC resistor must be placed next to the inductor for good heat transfer, while R1, R2, R3, and C1 are placed close to the controller for interference immunity. CORE DCR COMPONENT SELECTION FOR DROOP By adjusting the ratio between inductor DCR drop and the voltage measured across the sense capacitor, the load line can be set to any level, giving the converter the correct amount of droop at all load currents. Equation 10 shows the relation between droop voltage, maximum output current (IMAX), OC trip level and current sense capacitor voltage at the OC current level, VC(OC). I MAX V DROOP = -------------- ⋅ 5 ⋅ V C, OC I OC (EQ. 10) AMD specifications do not require droop and provide no load line guidelines. Tight static output voltage tolerance limits push acceptable level of droop below a useful level for Griffin applications. Care must be taken in applications which implement droop to balance time constant mismatch, sense capacitor resistor ratio, OC trip and droop equations. Temperature shifts related to DCR must also be addressed, as outlined in the previous section. NORTHBRIDGE CURRENT SENSE During the off-time following a PHASE transition low, the Northbridge controller samples the voltage across the lower MOSFET rDS(ON). A ground-referenced amplifier is connected to the PHASE node through a resistor, ROCSET_NB. The voltage across ROCSET_NB is equal to the voltage drop across the rDS(ON) of the lower MOSFET while it is conducting. The resulting current into the OCSET_NB pin is proportional to the inductor current. The sensed inductor current is used for overcurrent protection and described in the “Fault Monitoring and Protection” on page 21. The Northbridge controller does not support output voltage droop. FN6976.2 January 11, 2013 ISL6265C Selecting RBIAS For Core Outputs To properly bias the ISL6265C, a reference current is established by placing a 117kΩ, 1% tolerance resistor from the RBIAS pin to ground. This will provide a highly accurate, 10µA current source from which OC reference current is derived. Care must be taken in layout to place the resistor very close to the RBIAS pin. A good quality signal ground should be connected to the opposite end of the RBIAS resistor. Do not connect any other components to this pin as this would negatively impact performance. Capacitance on this pin could create instabilities and is to be avoided. A resistor divider off this pin is used to set the Core side OC trip level. Additional direction on how to size is provided in “Fault Monitoring and Protection” on page 21 on how to size the resistor divider. Offset Resistor Selection If the OFS pin is connected to ground through a resistor, the ISL6265C operates in SVI mode with droop active. The resistor between the OFS pin and ground sets the positive Core voltage offset per Equation 11. 1.2V ⋅ R FB R OFS = ---------------------------V OFS (EQ. 11) Where VOFS is the user defined output voltage offset. Typically, VOFS is determined by taking half the total output voltage droop. The resulting value centers the overall output voltage waveform around the programmed SVID level. For example, RFB of 1kΩ and a total output droop of 24mV would result in an offset voltage of 12mV and a ROFS of 100kΩ. Internal Driver Operation The ISL6265C features three internal gate-drivers to support the Core and Northbridge regulators and to reduce solution size. The drivers include a diode emulation mode, which helps to improve light-load efficiency. MOSFET Gate-Drive Outputs The ISL6265C has internal gate-drivers for the high-side and lowside N-Channel MOSFETs. The low-side gate-drivers are optimized for low duty-cycle applications where the low-side MOSFET conduction losses are dominant, requiring a low r DS(ON) MOSFET. The LGATE pull-down resistance is low in order to strongly clamp the gate of the MOSFET below the VGS(th) at turn-off. The current transient through the gate at turn-off can be considerable because the gate charge of a low r DS(ON) MOSFET can be large. Adaptive shoot-through protection prevents a gate-driver output from turning on until the opposite gate-driver output has fallen below approximately 1V. The high-side gate-driver output voltage is measured across the UGATE and PHASE pins while the low-side gate-driver output voltage is measured across the LGATE and PGND pins. The power for the LGATE gate driver is sourced directly from the PVCC pin. The power for the UGATE gate-driver is sourced from a “boot” capacitor connected across the BOOT and PHASE pins. The boot capacitor is charged from a 5V bias supply through a “boot diode” each time the low-side MOSFET turns on, pulling the 20 PHASE pin low. The ISL6265C has an integrated boot diode connected from the PVCC pin to the BOOT pin. Diode Emulation The ISL6265C implements forced continuous-conduction-mode (CCM) at heavy load and diode-emulation-mode (DE) at light load, to optimize efficiency in the entire load range. The transition is automatically achieved by detecting the inductor current when PSI_L is low. If PSI_L is high, the controller disables DE and forces CCM on both Core and NB regulators. Positive-going inductor current flows either from the source of the high-side MOSFET, or into the drain of the low-side MOSFET. Negative-going inductor current flows into the drain of the lowside MOSFET. When the low-side MOSFET conducts positive inductor current, the phase voltage is negative with respect to the GND and PGND pins. Conversely, when the low-side MOSFET conducts negative inductor current, the phase voltage is positive with respect to the GND and PGND pins. The ISL6265C monitors the phase voltage when the low-side MOSFET is conducting inductor current to determine the direction of the inductor current. When the output load current is less than half the inductor ripple current, the inductor current goes negative. Sinking the negative inductor through the low-side MOSFET lowers efficiency by preventing DCM period stretching and allowing unnecessary conduction losses. In DE, the ISL6265C Core regulators automatically enter DCM after the PHASE pin has detected positive voltage and LGATE was allowed to go high. The NB regulator enters DCM after the PHASE pin has detected positive voltage and LGATE was allowed to go high for eight consecutive PWM switching cycles. The ISL6265C turns off the low-side MOSFET once the phase voltage turns positive, indicating negative inductor current. The ISL6265C returns to CCM on the following cycle after the PHASE pin detects negative voltage, indicating that the body diode of the low-side MOSFET is conducting positive inductor current. Efficiency can be further improved with a reduction of unnecessary switching losses by reducing the PWM frequency. It is characteristic of the R3 architecture for the PWM frequency to decrease while in diode emulation. The extent of the frequency reduction is proportional to the reduction of load current. Upon entering DCM, the PWM frequency makes an initial step-reduction because of a 33% step-increase of the window voltage V W. Power-Savings Mode The ISL6265C has two operating modes to optimize efficiency based on the state of the PSI_L input from the AMD SVI control signal. When this input is low, the controller expects to deliver low power and enters a power-savings mode to improve efficiency in this low power state. The controller’s operational modes are designed to work in conjunction with the AMD SVI control signal to maintain the optimal system configuration for all conditions. Northbridge and Dual Plane Core While PSI_L is high, the controller operates all three regulators in forced CCM. If PSI_L is asserted low by the SVI interface, the FN6976.2 January 11, 2013 ISL6265C ISL6265C initiates DE in all three regulators. This transition allows the controller to achieve the highest possible efficiency over the entire load range for each output. A smooth transition is facilitated by the R3 technology™, which correctly maintains the internally synthesized ripple current throughout mode transitions of each regulator. Uniplane Core In uniplane mode, the ISL6265C Core regulator is in 2-phase multiphase mode. The controller operates with both phases fully active, responding rapidly to transients and delivering the maximum power to the load. When the processor asserts PSI_L low under reduced load levels, the ISL6265C sheds one phase to eliminate switching losses associated with the idle channel. Even with the regulator operating in single-phase mode, transient response capability is maintained. While operating in single-phase DE with PSI_L low, the lower MOSFET driver switches the lower MOSFET off at the point of zero inductor current to prevent discharge current from flowing from the output capacitor bank through the inductor. In DCM, switching frequency is proportionately reduced, thus greatly reducing both conduction and switching loss. In DCM, the switching frequency is defined by Equation 12. controller uses lower MOSFET rDS(ON) sensing to detect output current. CORE OC DETECTION Core outputs feature an OC monitor which compares a voltage set at the OCSET pin to the voltage measured across the current sense capacitor, VC. When the voltage across the current sense capacitor exceeds the programmed trip level, the comparator signals an OC fault. Figure 11 shows the basic OC functions within the IC. CURRENT SENSE ISP 5x 5 x VC(OC) @ OC TRIP CURRENT OC RBIAS 10µA + VOCSET 6 6 OCSET + Vc _ 1.17V RBIAS VOCSET ROCSET ISL6265C (EQ. 12) Where FCCM is equivalent to the Core frequency set by Equation 3. Fault Monitoring and Protection The ISL6265C actively monitors Core and Northbridge output voltages and currents to detect fault conditions. These fault monitors trigger protective measures to prevent damage to the processor. One common power good indicator is provided for linking to external system monitors. Power-Good Signal The power-good pin (PGOOD) is an open-drain logic output that signals if the ISL6265C is not regulating Core and Northbridge output voltages within the proper levels or output current in one or more outputs has exceeded the maximum current setpoint. This pin must be tied to a +3.3V or +5V source through a resistor. During shutdown and soft-start, PGOOD is pulled low and is released high only after a successful soft-start has raised Core and Northbridge output voltages within operating limits. PGOOD is pulled low when an overvoltage, undervoltage, or overcurrent (OC) condition is detected on any output or when the controller is disabled by a POR or forcing enable (EN) low. Once a fault condition is triggered, the controller acts to protect the processor. The controller latches off and PGOOD is pulled low. Toggling EN or VCC initiates a soft-start of all outputs. In the event of an OV, the controller will not initiate a soft-start by toggling EN, but requires VCC be lowered below the falling POR threshold to reset. Overcurrent Protection Core and Northbridge outputs feature two different methods of current sensing. Core output current sensing is achieved via inductor DCR or discrete resistor sensing. The Northbridge 21 ISN BIAS CKT 2 2 ⋅ L ⋅ IO F CCM F DCM = ------------------- ⋅ ------------------------------------2 VO ⎞ ⎛ 1.33 V O ⋅ ⎜ 1 – ---------⎟ V ⎝ IN⎠ SEE FIGURE 9 FOR ADDITIONAL DETAIL FIGURE 11. OC TRIP CIRCUITRY The sense capacitor voltage, VC, will increase as inductor current rises per Equation 7. When the inductor current rises to the OC trip level, the voltage across the sense capacitor will reach a maximum based on the resistor ratio K. This maximum value, VC(OC), is gained up by a factor of 5 and compared to the static OC trip level set by the OCSET pin. The recommended voltage range for VC,OC is 6mV to 25mV, which sets the resistor divider ratio K, where IOC is the user-defined OC trip level (see Equation 13). Typical inductor DCR values are on the order of 1mΩ which result in more than enough voltage drop to support this VC,OC range. V C ( OC ) K = ---------------------------I OC ⋅ DCR (EQ. 13) The resistor divider components also impact time-constant matching, these components need to meet the parallel combination requirements of Equation 9. Based on the selected VC(OC) level, the required OC monitor trip level is set. The recommended VC(OC) level range will result in an OC monitor trip level range of 30mV to 125mV based on the internal gain of 5. This OC monitor trip level sets the voltage level required at the OCSET pin to create an OC fault at the user-defined OC trip level. A resistor divider from the RBIAS pin to ground with the mid-point connected to OCSET sets the voltage at the pin (see Figure 11). This voltage is internally divided by 6 and compared with VC(OC). Working backwards, the voltage required at the OCSET pin to achieve this OC trip level ranges from 180mV to 0.750mV as defined in Equation 14. V OCSET = V C ( OC ) ⋅ 30 (EQ. 14) FN6976.2 January 11, 2013 ISL6265C The resistor divider ratio used to determine the RBIAS and ROCSET values is shown in Equation 15. value by a nominal 295mV for 205µs. The PWM outputs turn off both Core and Northbridge internal drivers and PGOOD goes low. V OCSET R OCSET ----------------------------------------------- = ----------------------R OCSET + R BIAS 1.17V General Application Design Guide (EQ. 15) The resistor values must also meet the RBIAS requirement that the total series resistance to ground equal 117kΩ. An OC condition must be sustained for 100µs before action is taken by the controller in response to the OC fault. A short-circuit OC loop is also active based on the same sense elements outlined above with a threshold set to 2.25x the OCSET threshold set. The controller takes immediate action when this fast OC fault is detected. NORTHBRIDGE OC DETECTION Northbridge OC sensing is achieved via rDS(ON) sensing across the lower MOSFET. An internal 10µA current source develops a voltage across ROCSET_NB, which is compared with the voltage developed across the low-side MOSFET as measured at the PHASE pin. When the voltage drop across the MOSFET exceeds the voltage drop across the resistor, an OC event occurs. The OCSET_NB resistor is selected based on the relationship in Equation 16. I OC ⋅ r DS ( ON ) R OCSETNB = ------------------------------------10μA (EQ. 16) Where IOC is the OC trip level selected for the Northbridge application and rDS(ON) is the drain-source ON-resistance of the lower MOSFET. OC FAULT RESPONSE When an OC fault occurs on any combination of outputs, both Core and Northbridge regulators shutdown and the driver outputs are tri-stated. The PGOOD signal transitions low indicating a fault condition. The controller will not attempt to restart the regulators and the user must toggle either EN or VCC to clear the fault condition. Overvoltage Protection The ISL6265C monitors the individual Core and Northbridge output voltages using differential remote sense amplifiers. The ISL6265C features a severe overvoltage (OV) threshold of 1.8V. If any of the outputs exceed this voltage, an OV fault is immediately triggered. PGOOD is latched low and the low-side MOSFETs of the offending output(s) are turned on. The low-side MOSFETs will remain on until the output voltage is pulled below 0.85V at which time all MOSFETs are turned off. If the output again rises above 1.8V, the protection process repeats. This offers protection against a shorted high-side MOSFET while preventing output voltage from ringing below ground. The OV is reset by toggling EN low. OV detection is active at all times that the controller is enabled including after one of the other faults occurs so that the processor is protected against high-side MOSFET leakage while the MOSFETs are commanded off. Undervoltage Protection Undervoltage protection is independent of the OC limit. A fault latches if any of the sensed output voltages are less than the VID set 22 This design guide is intended to provide a high-level explanation of the steps necessary to design a single-phase power converter. It is assumed that the reader is familiar with many of the basic skills and techniques referenced in the following section. In addition to this guide, Intersil provides complete reference designs that include schematics, bills of materials, and example board layouts. Selecting the LC Output Filter The output inductor and output capacitor bank form a low-pass filter responsible for smoothing the pulsating voltage at the phase node. The output filter also must support the transient energy required by the load until the controller can respond. Because it has a low bandwidth compared to the switching frequency, the output filter limits the system transient response. The output capacitors must supply or sink load current while the current in the output inductors increases or decreases to meet the demand. The duty cycle of an ideal buck converter is a function of the input and the output voltage. This relationship is written as Equation 17: VO D = --------V IN (EQ. 17) The output inductor peak-to-peak ripple current is written as Equation 18: VO • ( 1 – D ) I P-P = -----------------------------f SW • L (EQ. 18) For this type of application, a typical step-down DC/DC converter has an IP-P of 20% to 40% of the maximum DC output load current. The value of IP-P is selected based upon several criteria such as MOSFET switching loss, inductor core loss, and the resistive loss of the inductor winding. The DC copper loss of the inductor can be estimated by Equation 19: P COPPER = I LOAD 2 • DCR (EQ. 19) Where ILOAD is the converter output DC current. The copper loss can be significant so attention must be given to the DCR selection. Another factor to consider when choosing the inductor is its saturation characteristics at elevated temperature. A saturated inductor could cause destruction of circuit components as well as nuisance OCP faults. A DC/DC buck regulator must have output capacitance CO into which ripple current IP-P can flow. Current IP-P develops a corresponding ripple voltage VP-P across CO, which is the sum of the voltage drop across the capacitor ESR and of the voltage change stemming from charge moved in and out of the capacitor. These two voltages are written as shown in Equation 20: ΔV ESR = I PP • E SR (EQ. 20) FN6976.2 January 11, 2013 ISL6265C and Equation 21: Where: (EQ. 21) SW If the output of the converter has to support a load with high pulsating current, several capacitors will need to be paralleled to reduce the total ESR until the required VP-P is achieved. The inductance of the capacitor can cause a brief voltage dip if the load transient has an extremely high slew rate. Capacitor ESL can significantly impact output voltage ripple. Low inductance capacitors should be considered. A capacitor dissipates heat as a function of RMS current and frequency. Be sure that IP-P is shared by a sufficient quantity of paralleled capacitors so that they operate below the maximum rated RMS current at FSW. Take into account that the rated value of a capacitor can degrade as much as 50% as the DC voltage across it increases. Selection of the Input Capacitor The input capacitors are responsible for sourcing the AC component of the input current flowing into the upper MOSFETs. Their RMS current capability must be sufficient to handle the AC component of the current drawn by the upper MOSFETs, which is related to duty cycle and the number of active phases. The important parameters for the bulk input capacitance are the voltage rating and the RMS current rating. For reliable operation, select bulk capacitors with voltage and current ratings above the maximum input voltage and capable of supplying the RMS current required by the switching circuit. Their voltage rating should be at least 1.25x greater than the maximum input voltage, while a voltage rating of 1.5x is a preferred rating. Figure 12 is a graph of the input RMS ripple current, normalized relative to output load current, as a function of duty cycle for a single-phase regulator that is adjusted for converter efficiency. 0.60 NORMALIZED INPUT RMS RIPPLE CURRENT (IRMS/IO) IP-P,N = 0.50 IP-P,N = 1 0.55 IP-P,N = 0 0.35 0.30 IP-P,N = 0.25 0.20 0.15 0.10 0.05 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 DUTY CYCLE (VIN/VO) FIGURE 12. NORMALIZED RMS INPUT CURRENT FOR SINGLE PHASE CONVERTER The normalized RMS current calculation is written as Equation 22: I IN_RMS, N = 2 D D ⋅ ( 1 – D ) + ⎛ ------⎞ ⋅ I PP ,N ⎝ 12⎠ - where η is converter efficiency Figure 13 provides the same input RMS current information for two-phase designs. 0.3 0.2 IP-P,N = 0.5 IP-P,N = 0.75 0.1 IP-P,N = 0 0 0 0.2 0.4 0.8 1.0 FIGURE 13. NORMALIZED RMS INPUT CURRENT FOR 2-PHASE CONVERTER In addition to the bulk capacitance, some low ESL ceramic capacitance is recommended to decouple between the drain of the high-side MOSFET and the source of the low-side MOSFET. (EQ. 22) There are several power MOSFETs readily available that are optimized for DC/DC converter applications. The preferred highside MOSFET emphasizes low gate charge so that the device spends the least amount of time dissipating power in the linear region. The preferred low-side MOSFET emphasizes low r DS(ON) when fully saturated to minimize conduction loss. For the low-side (LS) MOSFET, the power loss can be assumed to be conductive only and is written as Equation 24: 2 P CON_LS ≈ I LOAD ⋅ r DS ( ON )_LS • ( 1 – D ) 23 0.6 DUTY CYCLE (VIN/VO) Typically, a MOSFET cannot tolerate even brief excursions beyond their maximum drain to source voltage rating. The MOSFETs used in the power stage of the converter should have a maximum VDS rating that exceeds the sum of the upper voltage tolerance of the input power source and the voltage spike that occurs when the MOSFETs switch. 0.25 0 (EQ. 23) The choice of MOSFETs depends on the current each MOSFET will be required to conduct, the switching frequency, the capability of the MOSFETs to dissipate heat, and the availability and nature of heat sinking and air flow. 0.45 0.40 VO D = -----------------V IN ⋅ η MOSFET Selection and Considerations IP-P,N = 0.75 0.50 - IMAX is the maximum continuous ILOAD of the converter - IPP,N is the ratio of inductor peak-to-peak ripple current to IMAX - D is the duty cycle that is adjusted to take into account the efficiency of the converter which is written as: NORMALIZED INPUT RMS RIPPLE CURRENT (IRMS/IO) I PP ΔV C = ----------------------------8 • CO • f (EQ. 24) FN6976.2 January 11, 2013 ISL6265C For the high-side (HS) MOSFET, the its conduction loss is written as Equation 25: P CON_HS = I LOAD 2 • r DS ( ON )_HS • D (EQ. 25) For the high-side MOSFET, the switching loss is written as Equation 26: V IN • I VALLEY • t ON • f V IN • I PEAK • t OFF • f SW SW P SW_HS = ----------------------------------------------------------------- + ------------------------------------------------------------2 2 (EQ. 26) Where: - IVALLEY is the difference of the DC component of the inductor current minus 1/2 of the inductor ripple current - IPEAK is the sum of the DC component of the inductor current plus 1/2 of the inductor ripple current - tON is the time required to drive the device into saturation - tOFF is the time required to drive the device into cut-off Selecting The Bootstrap Capacitor All three integrated drivers feature an internal bootstrap Schottky diode. Simply adding an external capacitor across the BOOT and PHASE pins completes the bootstrap circuit. The bootstrap function is also designed to prevent the bootstrap capacitor from overcharging due to the large negative swing at the PHASE node. This reduces voltage stress on the BOOT and PHASE pins. The bootstrap capacitor must have a maximum voltage rating above PVCC + 4V and its capacitance value is selected per Equation 27: Qg C BOOT ≥ -----------------------ΔV BOOT (EQ. 27) Where: - Qg is the total gate charge required to turn on the high-side MOSFET - ΔVBOOT, is the maximum allowed voltage decay across the boot capacitor each time the high-side MOSFET is switched on As an example, suppose the high-side MOSFET has a total gate charge Qg, of 25nC at VGS = 5V, and a ΔVBOOT of 200mV. The calculated bootstrap capacitance is 0.125µF; for a comfortable margin, select a capacitor that is double the calculated capacitance. In this example, 0.22µF will suffice. Use a low temperature-coefficient ceramic capacitor. PCB Layout Considerations Power and Signal Layers Placement on the PCB As a general rule, power layers should be close together, either on the top or bottom of the board, with the weak analog or logic signal layers on the opposite side of the board. The ground-plane layer should be adjacent to the signal layer to provide shielding. The ground plane layer should have an island located under the IC, the compensation components, and the FSET components. The island should be connected to the rest of the ground plane layer at one point. 24 Component Placement There are two sets of critical components in a DC/DC converter; the power components and the small signal components. The power components are the most critical because they switch large amount of energy. The small signal components connect to sensitive nodes or supply critical bypassing current and signal coupling. The power components should be placed first and these include MOSFETs, input and output capacitors, and the inductor. It is important to have a symmetrical layout for each power train, preferably with the controller located equidistant from each power train. Symmetrical layout allows heat to be dissipated equally across all power trains. Keeping the distance between the power train and the control IC short helps keep the gate drive traces short. These drive signals include the LGATE, UGATE, PGND, PHASE and BOOT. VIAS TO GROUND PLANE GND VOUT INDUCTOR PHASE NODE HIGH-SIDE MOSFETS VIN OUTPUT CAPACITORS SCHOTTKY DIODE LOW-SIDE MOSFETS INPUT CAPACITORS FIGURE 14. TYPICAL POWER COMPONENT PLACEMENT When placing MOSFETs, try to keep the source of the upper MOSFETs and the drain of the lower MOSFETs as close as thermally possible (see Figure 14). Input high-frequency capacitors should be placed close to the drain of the upper MOSFETs and the source of the lower MOSFETs. Place the output inductor and output capacitors between the MOSFETs and the load. High-frequency output decoupling capacitors (ceramic) should be placed as close as possible to the decoupling target (microprocessor), making use of the shortest connection paths to any internal planes. Place the components in such a way that the area under the IC has less noise traces with high dV/dt and di/dt, such as gate signals and phase node signals. Signal Ground and Power Ground The bottom of the ISL6265C QFN package is the signal ground (GND) terminal for analog and logic signals of the IC. Connect the GND pad of the ISL6265C to the island of ground plane under the top layer using several vias, for a robust thermal and electrical conduction path. Connect the input capacitors, the output capacitors, and the source of the lower MOSFETs to the power ground plane. Routing and Connection Details Specific pins (and the trace routing from them), require extra attention during the layout process. The following sub-sections outline concerns by pin name. FN6976.2 January 11, 2013 ISL6265C PGND PINS FSET_NB PIN This is the return path for the pull-down of the LGATE low-side MOSFET gate driver. Ideally, PGND should be connected to the source of the low-side MOSFET with a low-resistance, lowinductance path. This pin requires a quiet environment. The resistor RFSET should be placed directly adjacent to this pin. Keep fast moving nodes away from this pin. VIN PIN The LGATE trace has a signal going through it that is both high dV/dt and di/dt, with high peak charging and discharging current. Route this trace in parallel with the trace from the PGND pin. These two traces should be short, wide, and away from other traces. There should be no other weak signal traces in proximity with these traces on any layer. The VIN pin should be connected close to the drain of the highside MOSFET, using a low- resistance and low-inductance path. VCC PIN For best performance, place the decoupling capacitor very close to the VCC and GND pins. PVCC PIN For best performance, place the decoupling capacitor very close to the PVCC and respective PGND pins, preferably on the same side of the PCB as the ISL6265C IC. ENABLE AND PGOOD PINS These are logic signals that are referenced to the GND pin. Treat as a typical logic signal. FB PINS The input impedance of the FB pin is high, so place the voltage programming and loop compensation components close to the COMP, FB, and GND pins keeping the high impedance trace short. 25 LGATE ROUTING BOOT AND PHASE ROUTING The signals going through these traces are both high dv/dt and high di/dt, with high peak charging and discharging current. Route the UGATE and PHASE pins in parallel with short and wide traces. There should be no other weak signal traces in proximity with these traces on any layer. Copper Size for the Phase Node The parasitic capacitance and parasitic inductance of the phase node should be kept very low to minimize ringing. It is best to limit the size of the PHASE node copper in strict accordance with the current and thermal management of the application. An MLCC should be connected directly across the drain of the upper MOSFET and the source of the lower MOSFET to suppress the turn-off voltage. FN6976.2 January 11, 2013 ISL6265C Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION CHANGE November 7, 2012 FN6976.2 Converted to new template. page 3 - Ordering Information table, added industrial part number ISL6265CIRTZ. In “Electrical Specifications” table, corrected conditions and standard over temp note in common conditions of Spec table from: "VCC = PVCC = 5V, VIN = 12V, Boldface limits apply over the operating temperature range, -10°C to +100°C." to: “VCC = PVCC = 5V, VIN = 12V, TA = -10°C to +100°C (ISL6265HRTZ), TA = -40°C to +100°C (ISL6265IRTZ), unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +100°C.” July 23, 2010 FN6976.1 Added “Related Literature*” on page 1. On page 3; corrected part marking in “Ordering Information” from ISL6265C HRTZ to 6265C HRTZ In “Thermal Information” on page 10, corrected Theta JC from 32 to 28 In “Electrical Specifications” table, corrected standard over temp note in common conditions of Spec table from "Boldface limits apply over the operating temperature range, -40°C to +85°C." to "Boldface limits apply over the operating temperature range, -10°C to +100°C." On “Overvoltage Threshold” on page 12; changed typical from 1.795V to 1.800V and maximum from 1.820V to 1.825V. March 10, 2010 FN6976.0 Initial Release. About Intersil Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management semiconductors. The company's products address some of the fastest growing markets within the industrial and infrastructure, personal computing and high-end consumer markets. For more information about Intersil or to find out how to become a member of our winning team, visit our website and career page at www.intersil.com. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective product information page. Also, please check the product information page to ensure that you have the most updated datasheet: ISL6265C To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff Reliability reports are available from our website at: http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 26 FN6976.2 January 11, 2013 ISL6265C Package Outline Drawing L48.6x6 48 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 4/07 4X 4.4 6.00 44X 0.40 A B 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA 48 37 1 6.00 36 4 .40 ± 0.15 25 12 0.15 (4X) 13 24 0.10 M C A B 0.05 M C TOP VIEW 48X 0.45 ± 0.10 4 48X 0.20 BOTTOM VIEW SEE DETAIL "X" 0.10 C BASE PLANE MAX 0.80 ( SEATING PLANE 0.08 C ( 44 X 0 . 40 ) ( 5. 75 TYP ) C SIDE VIEW 4. 40 ) C 0 . 2 REF 5 ( 48X 0 . 20 ) 0 . 00 MIN. 0 . 05 MAX. ( 48X 0 . 65 ) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 27 FN6976.2 January 11, 2013