V6208610

REVISIONS
LTR
DESCRIPTION
A
Add device -01XE. Add case Y JC limit. - ro
DATE
APPROVED
11-01-04
C. SAFFLE
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
Phu H. Nguyen
Original date of drawing
YY-MM-DD
CHECKED BY
08-01-16
Phu H. Nguyen
APPROVED BY
Thomas M. Hess
SIZE
A
REV
AMSC N/A
CODE IDENT. NO.
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
TITLE
MICROCIRCUIT, DIGITAL-LINEAR, SINGLE
SYNCHRONOUS BUCK PULSE MODULATION
(PWM) CONTROLLER, MONOLITHIC SILICON
DWG NO.
V62/08610
16236
A
PAGE
1
OF
13
5962-V024-11
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance single synchronous buck pulse width
modulation (PWM) controller microcircuit, with an operating temperature range of -55C to +125C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/08610
-
Drawing
number
01
X
B
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Generic
Device type
01
Circuit function
ISL6406
Single synchronous buck pulse width
modulation (PWM) controller
1.2.2 Case outline(s). The case outlines are as specified herein.
Outline letter
Number of pins
X
Y
16
16
JEDEC PUB 95
Package style
N/A
MO-153
Plastic quad flat
Plastic thin shrink small outline
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture:
Finish designator
A
B
C
D
E
Z
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
2
1.3 Absolute maximum ratings.
1/
Supply voltage range, ( VCC ) .............................................................................................. +7.0 V
Absolute boot voltage, (VBOOT) ........................................................................................... +15.0 V
Upper driver supply voltage, VBOOT – VPHASE ................................................................... +6.0 V
Input, Output or I/O voltage ..................................................................................................
Maximum junction temperature range ..................................................................................
Maximum storage temperature range ..................................................................................
Thermal resistance, junction to ambient (θJA) :
Case X ..............................................................................................................................
Case Y ..............................................................................................................................
Thermal resistance, junction to case (θJC) :
Case X ..............................................................................................................................
Case Y (top) .....................................................................................................................
Electrostatic discharge (ESD) ..............................................................................................
GND -0.3 V to VCC +0.3 V
-55C to 150C 2/
-65C to 150C
35C/W
90C/W
3/
4/
4.5C/W 5/
27C/W
Class 2
1.4 Recommended operating conditions.
Supply voltage range ( VCC ) ................................................................................................... 3.3 V ±10%
Operating free-air temperature range ( TA ) ............................................................................. -55C to +125C
1/
2/
3/
4/
5/
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied.
Continuous operation at a TJ  125C and at maximum conditions will reduce the life expectancy of the device to as little as two
years.
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See manufacturer data for more information.
JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See manufacturer
data for more information.
JC, the “case temp” location is the center of the exposed metal pad on the package underside.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
3
2. APPLICABLE DOCUMENTS
JEDEC PUB 95
–
Registered and Standard Outlines for Semiconductor Devices
(Applications for copies should be addressed to the JEDEC Office, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201-2107
or online at http://www.jedec.org)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
3.5.3 Block diagram. The block diagram shall be as shown in figure 3.
3.5.4 RT versus frequency. RT versus frequency shall be as shown in figure 4.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
4
TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Conditions 2/
unless otherwise specified
Limits
Min
Unit
Typical
Max
20
55
µA
9.8
11.5
mA
VCC supply section
Shutdown supply current
SYNC/EN = GND
Operating supply current
3/
6.5
RT = 64.9 k
Reference voltage section
Nominal reference voltage
0.8
Reference voltage tolerance
V
-2.1
2.1
Error amplifier section
Open loop voltage gain
4/
Gain bandwidth product
4/
Slew rate
82
dB
14
4/
MHz
COMP = 10 pF
4.65
6.0
9.2
V/µs
VCC = 3.3 V, no load
4.7
5.1
5.5
V
5.1
%
Charge pump section
Nominal charge pump output
Charge pump output regulation
-5.1
Power on reset section
Rising CPVOUT POR threshold
4.1
4.35
4.6
CPVOUT POR threshold hysteresis
0.3
0.5
0.9
RT = 200 k
77
100
122
RT = 64.9 k
247
300
341
RT = 26.1 k
646
715
775
Peak-to-peak ∆VOSC
1.1
1.4
1.7
V
1.1 times the natural switching
frequency
110
770
kHz
100
ns
V
Oscillator section
Gate output frequency range
Sawtooth amplitude
Synchronous frequency range
4/
Minimum synchronous pulse width
4/
40
PWM maximum duty cycle
kHz
96
%
See footnote at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
5
TABLE I. Electrical performance characteristics - Continued. 1/
Test
Gate driver output section
Upper gate source current
Symbol
Limits
Conditions 2/
unless otherwise specified
Min
Typical
Max
4/
VBOOT – VPHASE = 4 V
Upper gate sink current
Lower gate source current
Unit
VVCC = 3.3 V, VLGATE = 4 V
Lower gate sink current
-1
A
1
A
-1
A
2
A
Soft start section
Soft start slew rate
f = 300 kHz
6.2
Internal digital circuit clock count
(Soft start time varies with frequency)
6.7
7.8
ms
Clk
cycles
2048
Overcurrent section
OCSET current source
16
20
23
µA
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the
specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not
necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or
design.
2/
Over recommended operating conditions. All typical values are for TA = +25C and VCC = 3.3 V, unless otherwise noted.
3/
This is the VCC current consumed when the device is active but not switching.
4/
Guaranteed by design.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
6
Case X
Symbol
A
A1
A2
b
D/E
Dimension
Millimeters
Symbol
Min
Max
0.80
1.00
D1/E1
0.05
e
1.00
e1
0.28
0.40
S
5.00 BSC
P
Millimeters
Min
Max
4.75 BSC
0.80 BSC
2.40 BSC
0.35
0.75
0.60
NOTES:
1. Dimension b applies to the metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip.
2. The configuration of the pin 1 identifier is optional, but must be located within the zone indicated. The pin 1 identifier may
be either a mold or mark feature.
3. Nominal dimensions are provided to assist with printed circuit board land pattern design efforts, see manufacturer data for
more information.
4. Features and dimensions A2, D1, E1 and P are present when anvil singulation method is used and not present for saw
singulation
FIGURE 1. Case outlines.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
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Case Y
Symbol
A
A1
A2
b
c
D
Dimension
Millimeters
Symbol
Min
Max
1.10
E
0.05
0.15
e
0.80
1.05
E1
0.19
0.30
L
0.09
0.20
α
4.90
5.10
Millimeters
Min
Max
4.30
4.50
0.65 BSC
6.25
6.50
0.50
0.70
0o
8o
NOTES:
1. These package dimensions are within allowable dimensions of JEDEC MO-153 AB.
2. Dimensions “D and E1” do not include mold flash, interlead flash, protrusion or gate burrs. Mold flash, interlead flash,
protrusion or gate burrs shall not exceed 0.15 mm per side.
3. “L” is the length of terminal for soldering to a substrate.
4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of “b”
dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07 mm.
FIGURE 1. Case outlines – Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
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Terminal
number
Case X
Case Y
Terminal symbol
Terminal symbol
1
CPVOUT
GND
2
OCSET
LGATE
3
CT1
CPVOUT
4
CT2
OCSET
5
RT
CT1
6
SYNC/EN
CT2
7
FB
RT
8
VOUT
SYNC/EN
9
COMP
FB
10
CPGND
VOUT
11
VCC
COMP
12
PHASE
CPGND
13
BOOT
VCC
14
UGATE
PHASE
15
GND
BOOT
16
LGATE
UGATE
FIGURE 2. Terminal connections.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
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DWG NO.
V62/08610
PAGE
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Terminal
symbol
Terminal Description
CPVOUT
This pin represents the output of the charge pump. The voltage at this pin is the bias voltage for the integrated circuit.
Connect a decoupling capacitor from this pin to ground. The value of the decoupling capacitor should be at least 10x the
value of the charge pump capacitor. This pin may be tied to the bootstrap circuit as the source for creating the BOOT
voltage.
CT1, CT2
These pins are the connections for the external charge pump capacitor. A minimum of a 0.1 µF ceramic capacitor is
recommended for proper operation of the integrated circuit.
Connect a resistor (ROCSET) from this pin to the drain of the upper MOSFET(VIN). ROCSET, an internal 20 µA current
OCSET
source (IOCSET), and the upper metal oxide semiconductor field effect transistor (MOSFET) on resistance (rDS(ON)) set
(I
)(ROCSET )
the converter overcurrent (OC) trip point according to this equation: IPEAK = OCSET
An overcurrent trip
r
DS( ON)
cycles the soft start function.
VOUT
VCC
This pin is not used and should be left open.
This pin provides bias supply for the integrated circuit. Connect a well decoupled 3.3 V supply to this pin.
PHASE
Connect this pin to the upper MOSFET’s source. This pin is used to monitor the voltage drop across the upper MOSFET
for overcurrent protection.
RT
Connect an external resistor from this pin to ground for frequency selection. Refer to RT versus frequency curve shown
in figure 4
BOOT
This pin provides ground referenced bias voltage to the upper MOSFET driver. A bootstrap circuit is used to create a
voltage suitable to drive a logic level N-Channel MOSFET. A large (~1 M) resistor should be connected from the pin to
GND. The purpose of this resistor is to discharge the BOOT pin during a shutdown condition, SYNC/EN = LOW so that
the gate drivers are quickly powered off by this bleed resistor.
UGATE
Connect this pin to the upper MOSFET’s gate. This pin provides the PWM controlled gate drive for the upper MOSFET.
This pin is also monitored by the adaptive shoot-through protection circuitry to determine when the upper MOSFET has
turned off.
GND
This pin represents the signal and power ground for the integrated circuit. Tie this pin to the ground island/plane through
the lowest impedance connection available.
LGATE
Connect this pin to the lower MOSFET’s gate. This pin provides the PWM controlled gate drive for the lower MOSFET.
This pin is also monitored by the adaptive shoot-through protection circuitry to determine when the lower MOSFET has
turned off.
CMOP, FB
COMP and FB are the available external pins of the error amplifier. The FB pin is the inverting input of the internal error
amplifier and the COMP pin is the error amplifier output. These pins are used to compensate the control feedback loop
of the converter.
CPGND
SYNC/EN
This pin represents the signal and power ground for the charge pump. Tie this pin to the ground island/plane through
the lowest impedance connection available.
This is a dual function pin. To synchronize with an external clock, apply a clock with a frequency 1.1 to 2.0 times higher
than the part’s natural frequency to this pin. The device may be disabled by tying this pin to ground. In this shutdown
mode, all functions are disabled and the device will draw 55 µA supply current.
FIGURE 2. Terminal connections - Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
10
FIGURE 3. Block diagram.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
11
FIGURE 4. RT versus frequency.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
12
4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Vendor part number 2/
Top side
marking
V62/08610-01XB
34371
ISL6406MREP
ISL6406MREP
V62/08610-01YB
34371
ISL6406MVEP
ISL6406MVEP
V62/08610-01XE
34371
ISL6406MREPZ
ISL6406MREPZ
1/ The vendor item drawing establishes an administrative control number for
identifying the item on the engineering documentation.
2/ Add –TK suffix to vendor part number for 1000 piece quantity with tape and reel
packaging option.
CAGE code
34371
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Intersil Corporation
1001 Murphy Ranch Road
Milpitas, CA 95035-6803
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/08610
PAGE
13