PANASONIC XP1554

Composite Transistors
XP01554 (XP1554)
Silicon NPN epitaxial planar type
For high-speed switching
Unit: mm
(0.425)
0.20±0.05
4
5˚
■ Features
0.2±0.1
1.25±0.10
2.1±0.1
5
0.12+0.05
–0.02
• Two elements incorporated into one package
(Emitter-coupled transistors)
• Reduction of the mounting area and assembly cost by one half
• Low collector-emitter saturation voltage VCE(sat)
1
3
2
(0.65) (0.65)
1.3±0.1
2.0±0.1
0.9±0.1
■ Basic Part Number
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
40
V
Collector-emitter voltage (E-B short)
VCEO
40
V
Emitter-base voltage (Collector open)
VCBO
5
V
Collector current
IC
100
mA
Peak collector current
ICP
300
mA
Total power dissipation
PT
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
0 to 0.1
• 2SC3757 × 2
0.9+0.2
–0.1
10˚
1: Base (Tr1)
2: Emitter
3: Base (Tr2)
EIAJ: SC-88A
4: Collector (Tr2)
5: Collector (Tr1)
SMini5-G1 Package
Marking Symbol: EU
Internal Connection
5
4
Tr1
Tr2
1
2
3
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Conditions
Collector-base cutoff current (Emitter open)
ICBO
VCB = 15 V, IE = 0
0.1
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 4 V, IC = 0
0.1
µA
200

0.25
V
hFE
VCE = 1 V, IC = 10 mA
Collector-emitter saturation voltage
VCE(sat)
IC = 10 mA, IB = 1 mA
Base-emitter saturation voltage
VBE(sat)
IC = 10 mA, IB = 1 mA
Forward current transfer ratio
Transition frequency
fT
VCB = 10 V, IE = −10 mA, f = 200 MHz
Min
Typ
60
0.17
Max
1.0
450
Unit
V
MHz
Cob
VCB = 10 V, IE = 0, f = 1 MHz
2
Turn-on time
ton
Refer to the switching time measurement
17
ns
Turn-off time
toff
circuit
17
ns
Storage time
tstg
10
ns
Collector output capacitance
(Common base, input open circuited)
6
pF
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Note) The part number in the parenthesis shows conventional part number.
Publication date: February 2004
SJJ00150BED
1
XP01554
PC  Ta
Switching time measurement circuit
tstg test circuit
0.1 µF
250
0.1 µF
VOUT
VOUT
A
220 Ω
50 Ω
VIN = 10 V 3.3 kΩ
VCC = 3 V
3.3 kΩ
50 Ω
VIN = 10 V 0.1 µF
VBB = −3 V
90 Ω
500 Ω
VCC = 10 V
500 Ω
50 Ω
VBB = 2 V
10%
VIN
1 kΩ
910 Ω
Total power dissipation PT (mW)
ton , toff test circuit
10%
VIN
10%
90%
VOUT
VOUT
90%
ton
toff
10%
200
150
100
50
tstg
(Waveform at A)
0
0
40
80
120
160
Ambient temperature Ta (°C)
VCE(sat)  IC
IB = 3.0 mA
2.5 mA
80
2.0 mA
1.5 mA
60
1.0 mA
40
0.5 mA
20
0
0
0.2
0.4
0.6
0.8
1.0
1.2
10
1
25°C
0.01
0.1
Transition frequency fT (MHz)
Forward current transfer ratio hFE
300
Ta = 75°C
25°C
−25°C
10
Collector current IC (mA)
2
0.1
100
1
100
400
300
200
100
−10
−100
Emitter current IE (mA)
SJJ00150BED
100
1 000
Cob  VCB
500
0
−1
10
Collector current IC (mA)
VCB = 10 V
Ta = 25°C
400
1
10
Ta = −25°C
25°C
75°C
1
fT  I E
500
0
0.1
10
0.01
1
600
VCE = 1 V
100
100
Collector current IC (mA)
hFE  IC
200
Ta = 75°C
−25°C
0.1
Collector-emitter voltage VCE (V)
600
VBE(sat)  IC
IC / IB = 10
Base-emitter saturation voltage VBE(sat) (V)
100
100
−1 000
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Collector current IC (mA)
Ta = 25°C
Collector-emitter saturation voltage VCE(sat) (V)
IC  VCE
120
6
IE = 0
f = 1 MHz
Ta = 25°C
5
4
3
2
1
0
1
10
Collector-base voltage VCB (V)
100
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and semiconductors described in this material
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the products or technical information described in this material and controlled under the "Foreign Exchange
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Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
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(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
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2003 SEP