DATASHEET

DATASHEET
40V, Low Quiescent Current, 50mA Linear Regulator for
Automotive Applications
ISL78307
Features
The ISL78307 is a high voltage, low quiescent current linear
regulator ideally suited for “always-on” and “keep alive”
automotive applications. The ISL78307 operates from an input
voltage of +6V to +40V under normal operating conditions and
operates down to +3V under a cold crank. It consumes only 18µA
of quiescent current at no load on the adjustable version.
• Optimized for “always-on” automotive applications
The ISL78307 is available in fixed 3.3V, 5V and adjustable output
voltage (2.5V to 12V) options. It features an EN pin that can be
used to put the device into a low-quiescent current shutdown
mode where it draws only 1.8µA of supply current. The device
features over-temperature shutdown and current limit protection.
• 1.8µA of typical shutdown current
The ISL78307 is AEC-Q100 qualified. It is rated over the -40°C to
+125°C automotive temperature range and is available in an
8 Ld EPSOIC with exposed pad package.
• Thermal shutdown and current limit protection
Applications
• 18µA typical quiescent current
• Guaranteed 50mA output current
• Operates through cold crank down to 3V
• 40V tolerant logic level (TTL/CMOS) enable input
• Low dropout voltage of 120mV at 50mA
• Fixed +3.3V, +5.0V and adjustable output voltage options
• Stable operation with 10µF output capacitor
• -40°C to +125°C operating temperature range
• Thermally enhanced 8 Ld exposed pad SOIC package
• AEC-Q100 qualified
• Automotive
• 6kV ESD HBM rated
• Industrial
• Pb-free (RoHS compliant)
• Telecom
VIN = 14V
CIN
0.1µF
VOUT = 12V
OUT
IN
R1
EN
(ISL78307)
VIN = 14V
COUT
10µF
OUT
IN
COUT
10µF
CIN
0.1µF
ADJ
VOUT = 5V
EN
(ISL78307)
R2
GND
GND
FIGURE 1. TYPICAL APPLICATION - ADJ VERSION
FIGURE 2. TYPICAL APPLICATION - FIXED VERSION
70
QUIESCENT CURRENT (µA)
60
LOAD = 50mA
50
40
30
20
LOAD = 0mA
10
0
-50
0
50
100
150
TEMPERATURE (°C)
FIGURE 3. QUIESCENT CURRENT vs LOAD CURRENT (ADJ VERSION AT UNITY GAIN). VIN = 14V
April 7, 2015
FN7658.3
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2011, 2013, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL78307
Block Diagram
VIN
EN
CONTROL
LOGIC
+
THERMAL
SENSOR
EA
FET DRIVER
WITH CURRENT
LIMIT
VOUT
REFERENCE
+
SOFT-START
ADJ
GND
Pin Configuration
ISL78307
(8 LD EPSOIC)
TOP VIEW
IN
1
8
OUT
NC
2
7
ADJ/NC
NC
3
6
NC
EN
4
5
GND
Pin Descriptions
PIN NUMBER
PIN NAME
1
IN
Input voltage pin. A minimum 0.1µF X5R/X7R capacitor is required for proper operation.
2, 3, 6
NC
Pins have internal termination and can be left unconnected. Connection to ground is optional.
4
EN
High on this pin enables the device.
5
GND
7
ADJ/NC
8
OUT
DESCRIPTION
Ground pin.
In the adjustable output voltage option, this pin is connected to the external feedback resistor divider which sets
the LDO output voltage. In the 3.3V and 5V options, this pin is not used and can be connected to ground.
Regulated output voltage. A 10µF X5R/X7R output capacitor is required for stability.
EPAD
It is recommended to solder the EPAD to the ground plane.
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
ENABLE
PIN
OUTPUT VOLTAGE
(V)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL78307FBEAZ
78307 FBEAZ
-40 to +125
Yes
3.3
8 Ld EPSOIC
M8.15B
ISL78307FBEBZ
78307 FBEBZ
-40 to +125
Yes
5.0
8 Ld EPSOIC
M8.15B
ISL78307FBECZ
78307 FBECZ
-40 to +125
Yes
ADJ
8 Ld EPSOIC
M8.15B
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL78307. For more information on MSL please see techbrief TB363.
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ISL78307
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +45V
IN pin to GND Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to VCC
OUT pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . .. . .GND - 0.3V to 16V
EN pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to VCC
Output Short-circuit Duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating
Human Body Model (Tested per JESD22-A114E) . . . . . . . . . . . . . . . . 6kV
Machine Model (Tested per JESD-A115-A) . . . . . . . . . . . . . . . . . . . 350V
Charge Device Model (Tested per AEC-Q100-011) . . . . . . . . . . . . . 2.2kV
Latch Up (Tested per JESD78B; Class II, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
8 Ld EPSOIC Package (Notes 4, 5) . . . . . . .
50
9
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +175°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
IN pin to GND Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+3V to +40V
OUT pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+2.5V to +12V
EN pin to GND Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to +40V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Recommended Operating Conditions, unless otherwise noted. VIN = 14V, IOUT = 1mA, CIN = 0.1μF,
COUT = 10μF, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at TA = +25°C. Boldface limits apply across the operating
temperature range, -40°C to +125°C.
PARAMETER
SYMBOL
Input Voltage Range
TEST CONDITIONS
VIN
40
V
3
40
V
50
VIN = VOUT + VDO
Output Voltage
VOUT
EN = High
VIN = 14V
IOUT = 0.1mA
3.267
3.3
3.333
V
5V Version
4.950
5
5.050
V
ADJ pin voltage
1.211
1.223
1.235
V
0.04
0.115
%
0.25
0.5
%
IOUT = 1mA, VOUT = 3.3V
10
38
mV
IOUT = 50mA, VOUT = 3.3V
130
340
mV
IOUT = 1mA, VOUT = 5V
10
48
mV
IOUT = 50mA, VOUT = 5V
120
350
mV
1.8
3.64
µA
IOUT = 0mA, ADJ Version, VOUT = VADJ
18
24
µA
IOUT = 1mA, ADJ Version, VOUT = VADJ
22
42
µA
IOUT = 10mA, ADJ Version, VOUT = VADJ
34
60
µA
IOUT = 50mA, ADJ Version, VOUT = VADJ
56
82
µA
IOUT = 0, 3.3V and 5.0V Version
22
28
µA
IOUT = 1mA, 3.3V and 5.0V Version
27
45
µA
IOUT = 10mA, 3.3V and 5.0V Version
37
65
µA
IOUT = 50mA, 3.3V and 5.0V Version
62
90
µA
VOUT/VIN
Load Regulation
VOUT/IOUT VIN = VOUT +VDO
IOUT = 100µA to 50mA
3V  VIN  40V
IOUT = 1mA
Shutdown Current
ISHDN
EN = LOW
Quiescent Current
IQ
EN = High
VIN = 14V
3
mA
3.3V Version
Line Regulation
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MAX
(Note 8) UNIT
6
IOUT
VDO
TYP
Cold Crank condition
Guaranteed Output
Current
Dropout Voltage
(Note 6)
MIN
(Note 8)
FN7658.3
April 7, 2015
ISL78307
Electrical Specifications
Recommended Operating Conditions, unless otherwise noted. VIN = 14V, IOUT = 1mA, CIN = 0.1μF,
COUT = 10μF, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at TA = +25°C. Boldface limits apply across the operating
temperature range, -40°C to +125°C. (Continued)
PARAMETER
SYMBOL
Power Supply
Rejection Ratio
TEST CONDITIONS
PSRR
f = 100Hz; Vin_ripple = 500mVP-P; Load = 50mA
VEN_H
VOUT = Off to On
VEN_L
VOUT = On to Off
MIN
(Note 8)
TYP
MAX
(Note 8) UNIT
58
dB
EN FUNCTION
EN Threshold Voltage
EN Pin Current
IEN
EN to Regulation Time
(Note 7)
tEN
1.485
0.935
VOUT = 0V
V
V
0.026
1.65
µA
1.93
ms
PROTECTION FEATURES
Output Current Limit
ILIMIT
VOUT = 0V
Thermal Shutdown
TSHDN
Junction Temperature Rising
Thermal Shutdown
Hysteresis
THYST
60
118
mA
+165
°C
+20
°C
NOTES:
6. Dropout voltage is defined as (VIN - VOUT) when VOUT is 2% below the value of VOUT when VIN = VOUT + 3V.
7. Enable to Regulation is the time the output takes to reach 95% of its final value with VIN = 14V and EN is taken from VIL to VIH in 5ns. For the
adjustable versions, the output voltage is set at 5V.
8. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
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ISL78307
Typical Performance Curves
VIN = 14V, IOUT = 1mA, VOUT = 5V, TJ = +25 °C unless otherwise specified.
80
30
+125°C
QUIESCENT CURRENT (µA)
QUIESCENT CURRENT (µA)
70
60
50
40
+25°C
30
-40°C
20
10
0
0
10
20
30
40
20
+25°C
10
5
0
10
LOAD CURRENT (mA)
FIGURE 4. QUIESCENT CURRENT vs LOAD CURRENT
20
INPUT VOLTAGE (V)
30
40
FIGURE 5. QUIESCENT CURRENT vs INPUT VOLTAGE (NO LOAD)
0.010
% OUTPUT VOLTAGE VARIATION
3.0
SHUTDOWN CURRENT (µA)
-40°C
15
0
50
+125°C
25
2.5
VIN = 40V
2.0
1.5
VIN = 14V
1.0
0.5
0
-50
0
50
100
150
0.005
5V OPTION
0
-0.005
-0.010
-50
3.3V OPTION
0
50
100
150
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 6. SHUTDOWN CURRENT vs TEMPERATURE (EN = 0)
FIGURE 7. OUTPUT VOLTAGE vs TEMPERATURE (LOAD = 50mA)
5.100
OUTPUT VOLTAGE (V)
5.075
EN at 500mV/DIV
5.050
+125°C
+25°C
5.025
5.000
-40°C
4.975
4.950
VOUT at 1V/DIV
4.925
TIME at 500µs/DIV
4.900
0
10
20
30
40
50
LOAD CURRENT (mA)
FIGURE 8. OUTPUT VOLTAGE vs LOAD CURRENT
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FIGURE 9. START-UP WAVEFORM
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April 7, 2015
ISL78307
Typical Performance Curves
VIN = 14V, IOUT = 1mA, VOUT = 5V, TJ = +25 °C unless otherwise specified. (Continued)
70
60
VOUT = 3.3V
PSRR (dB)
50
40
VOUT at 100mV/DIV
VOUT = 5V
30
50mA
20
IOUT at 0mA
10
0
100
TIME at 5ms/DIV
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 10. POWER SUPPLY REJECTION RATIO (LOAD = 50mA)
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FIGURE 11. LOAD TRANSIENT RESPONSE
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ISL78307
Functional Description
Output Voltage Setting
Functional Overview
For the adjustable version of the ISL78307, the output voltage is
programmed using an external resistor divider as shown in
Figure 12.
The ISL78307 is a high performance, high voltage, low-dropout
regulator (LDO) with 50mA sourcing capability. The part is
qualified to operate over the -40°C to +125°C automotive
temperature range. Featuring ultra-low quiescent current, it
makes an ideal choice for “always-on” automotive applications. It
works well under a “load-dump condition” where the input
voltage could rise up to 40V. The LDO continues to operate down
to 3V under a “cold-crank” condition. The device also features
current limit and thermal shutdown protection.
Enable Control
R1
EN
(ISL78307)
COUT
10µF
ADJ
R2
GND
FIGURE 12. ADJUSTABLE VERSION
The ISL78307 features an enable pin. When it is pulled low, the
IC goes to a shutdown mode. In this condition, the device draws
less than 2µA. Driving the pin high turns the device on.
Current Limit Protection
The ISL78307 has internal current limit functionality to protect
the regulator during fault conditions. During current limit, the
output sources a fixed amount of current largely independent of
the output voltage. If the short or overload is removed from VOUT,
the output returns to normal voltage regulation mode.
Thermal Fault Protection
In the event the die temperature exceeds typically +165°C, the
output of the LDO will shut down until the die temperature cools
down to typically +145°C. The level of power dissipated,
combined with the ambient temperature and the thermal
impedance of the package, will determine if the junction
temperature exceeds the thermal shutdown temperature. See
section on “Power Dissipation”.
Application Information
Input and Output Capacitors
For the output, a ceramic capacitor (X5R or X7R) with a
capacitance of 10µF is recommended for the ISL78307 to
maintain stability. The ground connection of the output capacitor
should be routed directly to the GND pin of the device and also
placed close to the IC. A minimum of 0.1µF (X5R or X7R) is
recommended at the input.
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OUT
IN
CIN
0.1µF
7
The output voltage is calculated using Equation 1:
 R1

V OUT = 1.223V   ------- + 1
 R2

(EQ. 1)
Power Dissipation
The junction temperature must not exceed the range specified in
“Recommended Operating Conditions” on page 3. The power
dissipation can be calculated using Equation 2:
P D =  V IN – V OUT   I OUT + V IN  I GND
(EQ. 2)
The maximum allowable junction temperature, TJ(MAX) and the
maximum expected ambient temperature, TA(MAX) will determine
the maximum allowable junction temperature rise (TJ), as shown
in Equation 3:
T J = T J  MAX  – T A  MAX 
(EQ. 3)
To calculate the maximum ambient operating temperature, use
the junction-to-ambient thermal resistance (JA) as shown in
Equation 4:
T J  MAX  = P D  MAX  x  JA + T A
(EQ. 4)
Board Layout Recommendations
A good PCB layout is important to achieve expected
performance. Consideration should be taken when placing the
components and routing the trace to minimize the ground
impedance, and keep the parasitic inductance low. The input and
output capacitors should have a good ground connection and be
placed as close to the IC as possible. The feedback trace in the
adjustable version should be away from other noisy traces.
Connect EPAD to the ground plane for better heat dissipation.
Thermal vias on the EPAD increase heat dissipation.
FN7658.3
April 7, 2015
ISL78307
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
CHANGE
April 7, 2015
FN6705.2
“Absolute Maximum Ratings” on page 3,Charged device Model(tested per JESD22-C101C)....2.2kV to
Charged device Model(tested per AEC-Q100-011).....2.2kV
December 7, 2013
FN7658.2
Page 9 - 2nd line of the disclaimer changed from:
"Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted"
to:
"Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949
quality systems as noted".
May 13, 2011
FN7658.1
Page 4, Removed the EN Pin Current MAX spec; added TYP spec of 0.026.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
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FN7658.3
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ISL78307
Small Outline Exposed Pad Plastic Packages (EPSOIC)
M8.15B
N
INDEX
AREA
H
0.25(0.010) M
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
B M
E
INCHES
-B1
2
3
TOP VIEW
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
B
C
0.10(0.004)
0.25(0.010) M
C A M
B S
SIDE VIEW
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.056
0.066
1.43
1.68
-
A1
0.001
0.005
0.03
0.13
-
B
0.0138
0.0192
0.35
0.49
9
C
0.0075
0.0098
0.19
0.25
-
D
0.189
0.196
4.80
4.98
3
E
0.150
0.157
3.81
3.99
4
e

A1
MILLIMETERS
0.050 BSC
1.27 BSC
-
H
0.230
0.244
5.84
6.20
-
h
0.010
0.016
0.25
0.41
5
L
0.016
0.035
0.41
0.89
6
N
8
8
7

0°
8°
0°
8°
-
P
-
0.094
-
2.387
11
P1
-
0.094
-
2.387
11
Rev. 5 8/10
NOTES:
1
2
3
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
P1
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
N
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
P
BOTTOM VIEW
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count and body size.
For additional products, see www.intersil.com/en/products.html
Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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