493-02

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE D
DATE 15 JUL 2015
SCALE 4 :1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.14MM (0.0055”) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
AND PROTRUSION SHALL NOT EXCEED 0.14MM
(0.0055”) PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203MM (0.003−0.008”).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508MM (0.0002”).
X Y
A
8
J
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
SEATING
PLANE
T
K
D
0.10 (0.004)
H
0.10 (0.004) T
M
N
R 0.10 TYP
T X Y
V
M
F
DETAIL E
RECOMMENDED
SOLDERING FOOTPRINT*
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
0_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.128
0_
6_
0_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
GENERIC
MARKING DIAGRAM*
8
8X
0.30
XX MG
G
8X
0.68
3.40
1
XX
M
G
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON04475D
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
US8
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON04475D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ BY R. FORNESS
19 MAR 2001
A
CHANGED DIM “P” TO 0.23 MM MIN, 0.34 MM MAX AND 0.010 IN MIN, 0.013 IN
MAX. REQ BY J. MILLER
25 JUN 2003
B
ADDED SOLDERING FOOTPRINT. REQ. BY D. TRUHITTE.
13 APR 2006
C
MODIFIED SOLDERING FOOTPRINT. REQ. BY B. BECKER.
23 MAR 2015
D
MODIFIED DIMENSION A MIN VALUE AND DIMENSION C MAX VALUE FOR MM.
REQ. BY R. AVILA.
15 JUL 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. D
Case Outline Number:
493−02
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