567DC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE E
SCALE 4:1
DATE 19 JAN 2016
A B
E
È
PIN A1
REFERENCE
2X
0.02 C
2X
0.02 C
D
A3
TOP VIEW
DETAIL A
A
0.04 C
A1
C
SIDE VIEW
DIM
A
A1
A2
A3
b
D
E
e
DETAIL A
0.10 C
NOTE 4
A2
OPTIONAL
BACKSIDE COAT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
SEATING
PLANE
NOTE 3
MILLIMETERS
MIN
MAX
0.28
0.38
0.08
0.12
0.23 REF
0.025 REF
0.16
0.20
0.84 BSC
0.86 BSC
0.40 BSC
GENERIC
MARKING DIAGRAM*
b
C A B
e
4X
0.10
M
NOTE 5
e
X
YM
B
A
1
X
Y
M
2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.40
PITCH
PACKAGE
OUTLINE
= Specific Device Code
= Year
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
4X
0.18
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON56821E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP4, 0.84X0.86
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON56821E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY V. CRACIUNOIU.
03 MAY 2011
A
CHANGED DIMENSIONS D AND E TO 0.866 X 0.842. REQ. BY V. CRACIUNOIU.
04 AUG 2011
B
CHANGED DIMENSIONS D AND E TO 0.86 X 0.84. CHANGED DIMENSIONS A, A1
AND A2. REQ. BY V. CRACIUNOIU.
18 JUN 2012
C
REVERSED DIMENSION D AND E LABELS TO 0.84 X 0.86. REQ. BY V. CRACIUNOIU.
28 NOV 2012
D
ADDED DETAIL A AND A3 DIMENSION FOR OPTIONAL DIE COAT REQ. BY V.
CRACIUNOIU.
19 DEC 2012
E
MODIFIED TOLERANCES IN TOP AND SIDE VIEWS. REQ. BY A. SARWARI.
19 JAN 2016
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2016
January, 2016 − Rev. E
Case Outline Number:
567DC
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