Data Sheet

BCM846BS
NPN/NPN matched double transistor
26 June 2015
Product data sheet
1. General description
NPN/NPN matched double transistor in a very small SOT363 (TSSOP6) SurfaceMounted Device (SMD) plastic package. The transistors are fully isolated internally.
2. Features and benefits
•
•
•
•
Current gain matching
Base-emitter voltage matching
Drop-in replacement for standard double transistors
AEC-Q101 qualified
3. Applications
•
•
Current mirror
Differential amplifier
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter
voltage
open base
-
-
65
V
IC
collector current
-
-
100
mA
200
290
450
[1]
0.9
1
-
[2]
-
-
2
Per transistor
Per transistor
hFE
DC current gain
VCE = 5 V; IC = 2 mA; Tamb = 25 °C
hFE1/hFE2
hFE matching
VCE = 5 V; IC = 2 mA; Tamb = 25 °C
VBE1−VBE2
VBE matching
Per device
[1]
[2]
The smaller of the two values is taken as numerator.
The smaller of the two values is subtracted from the larger value.
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mV
BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
5. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
E
emitter TR1
2
B
base TR1
3
C
collector TR2
4
E
emitter TR2
5
B
base TR2
6
C
collector TR1
Simplified outline
6
5
Graphic symbol
4
6
5
TR2
TR1
1
2
4
3
TSSOP6 (SOT363)
1
2
3
sym020
6. Ordering information
Table 3.
Ordering information
Type number
BCM846BS
Package
Name
Description
Version
TSSOP6
plastic surface-mounted package; 6 leads
SOT363
7. Marking
Table 4.
Marking codes
Type number
Marking code
[1]
BCM846BS
F2%
[1]
BCM846BS
Product data sheet
% = placeholder for manufacturing site code
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
80
V
VCEO
collector-emitter voltage
open base
-
65
V
VEBO
emitter-base voltage
open collector
-
6
V
IC
collector current
-
100
mA
ICM
peak collector current
single pulse; tp ≤ 1 ms
-
200
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
-
200
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
-
300
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
Per transistor
Per device
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
thermal resistance
from junction to
ambient
in free air
thermal resistance
from junction to
ambient
in free air
Min
Typ
Max
Unit
[1]
-
-
625
K/W
[1]
-
-
416
K/W
Per transistor
Rth(j-a)
Per device
Rth(j-a)
[1]
BCM846BS
Product data sheet
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
10. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
collector-base cut-off
current
VCB = 30 V; IE = 0 A; Tamb = 25 °C
-
-
15
nA
VCB = 30 V; IE = 0 A; Tj = 150 °C
-
-
5
µA
IEBO
emitter-base cut-off
current
VEB = 5 V; IC = 0 A; Tamb = 25 °C
-
-
100
nA
hFE
DC current gain
VCE = 5 V; IC = 2 mA; Tamb = 25 °C
200
290
450
VCE = 5 V; IC = 10 µA; Tamb = 25 °C
-
250
-
IC = 10 mA; IB = 0.5 mA; Tamb = 25 °C
-
50
200
mV
IC = 100 mA; IB = 5 mA; pulsed;
-
200
400
mV
[1]
-
910
-
mV
[1]
-
760
-
mV
Per transistor
ICBO
VCEsat
VBEsat
collector-emitter
saturation voltage
base-emitter saturation tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C
voltage
IC = 10 mA; IB = 0.5 mA; Tamb = 25 °C
VBE
base-emitter voltage
VCE = 5 V; IC = 10 mA; Tamb = 25 °C
[2]
-
-
770
mV
VBE
base-emitter voltage
VCE = 5 V; IC = 2 mA; Tamb = 25 °C
[2]
610
660
710
mV
CC
collector capacitance
VCB = 10 V; IE = 0 A; ie = 0 A;
-
-
1.5
pF
-
11
-
pF
100
250
-
MHz
-
3.3
-
dB
-
2.8
-
dB
[3]
0.9
1
-
[4]
-
-
2
f = 1 MHz; Tamb = 25 °C
CE
emitter capacitance
VEB = 0.5 V; IC = 0 A; ic = 0 A;
f = 1 MHz; Tamb = 25 °C
fT
transition frequency
VCE = 5 V; IC = 10 mA; f = 100 MHz;
Tamb = 25 °C
NF
VCE = 5 V; IC = 0.2 mA; RS = 2 kΩ;
noise figure
f = 1 kHz; B = 200 Hz; Tamb = 25 °C
VCE = 5 V; IC = 0.2 mA; RS = 2 kΩ;
Tamb = 25 °C; f = 10 Hz to 15.7 kHz
Per device
hFE1/hFE2
hFE matching
VBE1−VBE2
VBE matching
[1]
[2]
[3]
[4]
BCM846BS
Product data sheet
VCE = 5 V; IC = 2 mA; Tamb = 25 °C
mV
VBEsat decreases by about 1.7 mV/K with increasing temperature.
VBE decreases by about 2 mV/K with increasing temperature.
The smaller of the two values is taken as numerator.
The smaller of the two values is subtracted from the larger value.
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
006aaa533
600
0.20
IC
(A)
hFE
0.16
400
006aaa532
IB (mA) = 4.50
4.05
3.60
3.15
2.70
2.25
1.80
1.35
(1)
0.12
0.90
(2)
0.08
200
0.45
(3)
0.04
0
10- 2
10- 1
1
10
0
102
103
IC (mA)
VCE = 5 V
2
4
6
8
VCE (V)
10
Tamb = 25 °C
(1) Tamb = 100 °C
Fig. 2.
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig. 1.
0
Collector current as a function of collectoremitter voltage; typical values
DC current gain as a function of collector
current; typical values
006aaa536
1
006aaa534
1.3
VBEsat
(V)
1.1
VBE
(V)
0.8
0.9
(1)
(2)
0.7
(3)
0.6
0.5
0.3
0.4
10- 1
Fig. 3.
1
10
102
IC (mA)
0.1
10- 1
103
1
VCE = 5 V; Tamb = 25 °C
IC/IB = 20
Base-emitter voltage as a function of collector
current; typical values
(1) Tamb = −55 °C
Product data sheet
102
IC (mA)
103
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig. 4.
BCM846BS
10
Base-emitter saturation voltage as a function of
collector current; typical values
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
006aaa535
10
006aaa537
103
VCEsat
(V)
fT
(MHz)
1
102
10- 1
(1)
(2)
(3)
10- 2
10- 1
1
102
10
IC (mA)
10
103
IC/IB = 20
Fig. 6.
(2) Tamb = 25 °C
(3) Tamb = −55 °C
102
Transition frequency as a function of collector
current; typical values
006aaa538
4
3
11
2
9
1
7
0
2
4
6
8
VCB (V)
006aaa539
15
Ce
(pF)
13
0
Fig. 7.
IC (mA)
Collector-emitter saturation voltage as a
function of collector current; typical values
5
Cc
(pF)
10
VCE = 5 V; Tamb = 25 °C
(1) Tamb = 100 °C
Fig. 5.
1
5
10
0
2
4
VEB (V)
6
f = 1 MHz; Tamb = 25 °C
f = 1 MHz; Tamb = 25 °C
Collector capacitance as a function of collector- Fig. 8.
base voltage; typical values
Emitter capacitance as a function of emitterbase voltage; typical values
BCM846BS
Product data sheet
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
11. Package outline
2.2
1.8
6
2.2 1.35
2.0 1.15
1.1
0.8
5
4
2
3
0.45
0.15
pin 1
index
1
0.65
1.3
0.3
0.2
0.25
0.10
Dimensions in mm
Fig. 9.
14-10-03
Package outline TSSOP6 (SOT363)
12. Soldering
2.65
solder lands
2.35 1.5
0.4 (2×)
0.6 0.5
(4×) (4×)
solder resist
solder paste
0.5
(4×)
0.6
(2×)
0.6
(4×)
occupied area
Dimensions in mm
1.8
sot363_fr
Fig. 10. Reflow soldering footprint for TSSOP6 (SOT363)
BCM846BS
Product data sheet
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
1.5
solder lands
0.3 2.5
4.5
1.5
solder resist
occupied area
Dimensions in mm
1.3
preferred transport
direction during soldering
1.3
2.45
5.3
sot363_fw
Fig. 11. Wave soldering footprint for TSSOP6 (SOT363)
BCM846BS
Product data sheet
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
13. Revision history
Table 8.
Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
BCM846BS v.2
20150626
Product data sheet
-
BCM846BS v.1
Modification:
•
BCM846BS v.1
20150424
-
-
BCM846BS
Product data sheet
Product status changed
Objective data sheet
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
14. Legal information
14.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
14.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
BCM846BS
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
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BCM846BS
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NPN/NPN matched double transistor
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
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Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Bitsound, CoolFlux, CoReUse, DESFire, FabKey, GreenChip,
HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, MIFARE,
MIFARE Plus, MIFARE Ultralight, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP
Semiconductors N.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
BCM846BS
Product data sheet
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BCM846BS
NXP Semiconductors
NPN/NPN matched double transistor
15. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 2
6
Ordering information ............................................. 2
7
Marking ................................................................... 2
8
Limiting values .......................................................3
9
Thermal characteristics .........................................3
10
Characteristics ....................................................... 4
11
Package outline ..................................................... 7
12
Soldering ................................................................ 7
13
Revision history ..................................................... 9
14
14.1
14.2
14.3
14.4
Legal information .................................................10
Data sheet status ............................................... 10
Definitions ...........................................................10
Disclaimers .........................................................10
Trademarks ........................................................ 11
© NXP Semiconductors N.V. 2015. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 26 June 2015
BCM846BS
Product data sheet
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