Chemical Composition of Diode Green Products

Chemical Composition of Diode (DO-34 26mm)
Solder Dipping
Dice
CCS
H
C
Glass Sleeve
Dumet
Weight: 64.33 mg / pc
CAS No.
Content Spec.
(%)
Content
(%)
15-Nov-07
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.276536
Others
——
0.05 max.
0.03
Pb
7439-92-1
61
61
Si
7440-21-3
32
32
K
7440-09-7
3.8
3.8
B
7440-42-8
3
3
0.54712665
Sb
7440-36-0
0.06
0.06
0.010942533
Others
——
0.14
0.14
0.025532577
Ni
7440-02-0
41-43
42.15
1.81346
Fe
7439-89-6
balance
57.85
2.48893
Cu
7440-50-8
100
100
1.35865
Fe
7439-89-6
82
82
32.8108732
Cu
7440-50-8
18
18
7.2023868
Si
7440-21-3
70.9
70.9
0.022804985
Al
7429-90-5
0.1
0.1
0.000032165
Ag
7440-22-4
28.6
28.6
0.00919919
Ni
7440-02-0
0.4
0.4
0.00013
C
7440-44-0
100
100
0.109361
E
T
M
E
S
Make up of material
Solder Dipping (0.276619 mg)
Glass Sleeve ( 18.237555 mg)
Lead WireDumet
(5.66104 mg)
Core material
(4.30239 mg)
Cladding copper
(1.35865 mg)
Chemical
Composition
0.000083
11.12490855
5.8360176
0.69302709
Lead Wire-CCS (40.01326 mg)
Dice (0.032165 mg)
Ink (0.109361 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (DO-34 52mm)
Solder Dipping
Dice
CCS
H
C
Glass Sleeve
Dumet
Weight: 92 mg / pc
Content
(%)
15-Nov-07
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.39988
Others
——
0.05 max.
0.03
Pb
7439-92-1
61
61
Si
7440-21-3
32
32
K
7440-09-7
3.8
3.8
B
7440-42-8
3
3
0.7824
Sb
7440-36-0
0.06
0.06
0.015648
Others
——
0.14
0.14
0.036512
Ni
7440-02-0
41-43
42.15
2.594754
Fe
7439-89-6
balance
57.85
3.561246
Cu
7440-50-8
100
100
1.944
Fe
7439-89-6
82
82
46.9204
Cu
7440-50-8
18
18
10.2996
Si
7440-21-3
70.9
70.9
0.03545
Al
7429-90-5
0.1
0.1
0.00005
Ag
7440-22-4
28.6
28.6
0.0143
Ni
7440-02-0
0.4
0.4
0.00020
C
7440-44-0
100
100
0.15
E
T
M
E
S
Make up of material
Solder Dipping (0.4 mg)
Glass Sleeve (26.08 mg)
Lead WireDumet
(8.1 mg)
CAS No.
Content Spec.
(%)
Core material
(6.156 mg)
Cladding copper
(1.944 mg)
Chemical
Composition
0.00012
15.9088
8.3456
0.99104
Lead Wire-CCS (57.22 mg)
Dice (0.05 mg)
Ink (0.15 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (DO-35 26mm)
Solder Dipping
Dice
CCS
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.594461608
Others
——
0.05 max.
0.03
0.000178392
Pb
7439-92-1
61
61
11.9701032
Si
7440-21-3
32
32
K
7440-09-7
3.8
3.8
H
C
B
7440-42-8
3
3
0.5886936
Sb
7440-36-0
0.06
0.06
0.011773872
Others
——
0.14
0.14
0.027472368
Ni
7440-02-0
41-43
42.15
2.0953568
Fe
7439-89-6
balance
57.85
2.8758336
Cu
7440-50-8
100
100
1.5698496
Fe
7439-89-6
82
82
38.87429268
Cu
7440-50-8
18
18
8.53338132
Si
7440-21-3
70.9
70.9
0.021079988
Al
7429-90-5
0.1
0.1
0.000029732
Ag
7440-22-4
28.6
28.6
0.008503352
Ni
7440-02-0
0.4
0.4
0.000118928
C
7440-44-0
100
100
0.133794
Glass Sleeve
Dumet
Weight:74.33 mg / pc
15-Nov-07
E
T
M
E
S
Make up of material
Solder Dipping (0.59464 mg)
Glass Sleeve (19.62312 mg)
Lead WireDumet
(6.54104 mg)
Core material
(4.9711904 mg)
Cladding copper
(1.5698496 mg)
Lead Wire-CCS
(47.407674 mg)
6.2793984
0.74567856
Dice (0.029732 mg)
Ink (0.133794 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (DO-35 52mm)
Solder Dipping
Dice
CCS
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.813115992
Others
——
0.05 max.
0.03
0.000244008
Pb
7439-92-1
61
61
16.3729368
Si
7440-21-3
32
32
K
7440-09-7
3.8
3.8
H
C
B
7440-42-8
3
3
0.8052264
Sb
7440-36-0
0.06
0.06
0.016104528
Others
——
0.14
0.14
0.037577232
Ni
7440-02-0
41-43
42.15
2.8660692
Fe
7439-89-6
balance
57.85
3.9336204
Cu
7440-50-8
100
100
2.1472704
Fe
7439-89-6
82
82
53.17300332
Cu
7440-50-8
18
18
11.67212268
Si
7440-21-3
70.9
70.9
0.028833612
Al
7429-90-5
0.1
0.1
0.000040668
Ag
7440-22-4
28.6
28.6
0.011631048
Ni
7440-02-0
0.4
0.4
0.000162672
C
7440-44-0
100
100
0.183006
Glass Sleeve
Dumet
Weight:101.67 mg / pc
15-Nov-07
E
T
M
E
S
Make up of material
Solder Dipping (0.81336 mg)
Glass Sleeve (26.84088 mg)
Lead WireDumet
(8.94696 mg)
Core material
(6.7996896 mg)
Cladding copper
(2.1472704 mg)
Lead Wire-CCS
(64.845126 mg)
8.5890816
1.01995344
Dice (0.040668mg)
Ink (0.183006 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (DO-41 Glass 26mm)
Solder Dipping
Dice
CCS
H
C
Glass Sleeve
Dumet
Weight: 172.67 mg / pc
E
T
M
E
S
Make up of material
15-Nov-07
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
3.417840
Others
——
0.05 max.
0.03
0.001026
Pb
7439-92-1
61
61
20.73922103
Si
7440-21-3
32
32
10.87959136
K
7440-09-7
3.8
3.8
1.291951474
B
7440-42-8
3
3
1.01996169
Sb
7440-36-0
0.06
0.06
0.020399233
Others
——
0.14
0.14
0.047598212
Ni
7440-02-0
41-43
42.15
10.326957
Fe
7439-89-6
balance
57.85
14.173534
Cu
7440-50-8
100
100
7.736997
Fe
7439-89-6
82
82
84.13242148
Cu
7440-50-8
18
18
18.46809252
Si
7440-21-3
70.9
70.9
0.085696121
Al
7429-90-5
0.1
0.1
0.000120869
Ag
7440-22-4
28.6
28.6
0.034568534
Ni
7440-02-0
0.4
0.4
0.000483476
C
7440-44-0
100
100
0.293539
Solder Dipping (3.418866 mg)
Glass Sleeve (33.998723 mg)
Lead WireDumet
(32.237489
mg)
Core material
(24.50049164 mg)
Cladding copper
(7.73699736 mg)
Lead Wire-CCS (102.600514 mg)
Dice (0.120869 mg)
Ink (0.293539 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (DO-41 Glass 52mm)
Solder Dipping
Dice
CCS
H
C
Glass Sleeve
Dumet
Weight: 242 mg / pc
E
T
M
E
S
Make up of material
15-Nov-07
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
4.79016252
Others
——
0.05 max.
0.03
0.00143748
Pb
7439-92-1
61
61
29.066378
Si
7440-21-3
32
32
15.247936
K
7440-09-7
3.8
3.8
1.8106924
B
7440-42-8
3
3
1.429494
Sb
7440-36-0
0.06
0.06
0.02858988
Others
——
0.14
0.14
0.06670972
Ni
7440-02-0
41-43
42.15
14.473410
Fe
7439-89-6
balance
57.85
19.864454
Cu
7440-50-8
100
100
10.843536
Fe
7439-89-6
82
82
117.913048
Cu
7440-50-8
18
18
25.883352
Si
7440-21-3
70.9
70.9
0.1201046
Al
7429-90-5
0.1
0.1
0.0001694
Ag
7440-22-4
28.6
28.6
0.0484484
Ni
7440-02-0
0.4
0.4
0.0006776
C
7440-44-0
100
100
0.4114
Solder Dipping (4.7916 mg)
Glass Sleeve (47.6498 mg)
Lead WireDumet
(45.1814 mg)
Core material
(34.337864 mg)
Cladding copper
(10.843536 mg)
Lead Wire-CCS (143.7964 mg)
Dice (0.1694 mg)
Ink (0.4114 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (LS-31)
Glass Sleeve
Plating
Dumet
H
C
Dice
Weight: 12.3 mg / pc
15-Nov-07
E
T
M
E
S
Make up of material
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.249925
Others
——
0.05 max.
0.03
0.000075
Pb
7439-92-1
61
61
Si
7440-21-3
32
32
K
7440-09-7
3.8
3.8
0.1672
B
7440-42-8
3
3
0.132
Sb
7440-36-0
0.06
0.06
0.00264
Others
——
0.14
0.14
0.00616
Ni
7440-02-0
41-43
42.15
2.40255
Fe
7439-89-6
balance
57.85
3.29745
Cu
7440-50-8
100
100
1.8
Si
7440-21-3
70.9
70.9
0.03545
Al
7429-90-5
0.1
0.1
0.00005
Ag
7440-22-4
28.6
28.6
0.0143
Ni
7440-02-0
0.4
0.4
0.0002
C
7440-44-0
100
100
0.1
Plating (0.25 mg)
2.684
1.408
Glass Sleeve (4.4 mg)
Lead WireDumet
(7.5 mg)
Core material
(5.7 mg)
Cladding copper
(1.8 mg)
Dice (0.05 mg)
Ink (0.1 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive(EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (LS-34)
Glass Sleeve
Plating
Dumet
H
C
Dice
Weight: 30.8 mg / pc
15-Nov-07
E
T
M
E
S
Make up of material
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.29991
Others
——
0.05 max.
0.03
0.00009
Pb
7439-92-1
61
61
7.1126
Si
7440-21-3
32
32
3.7312
K
7440-09-7
3.8
3.8
0.44308
B
7440-42-8
3
3
0.3498
Sb
7440-36-0
0.06
0.06
0.006996
Others
——
0.14
0.14
0.016324
Ni
7440-02-0
41-43
42.15
5.958324
Fe
7439-89-6
balance
57.85
8.177676
Cu
7440-50-8
100
100
4.464
Si
7440-21-3
70.9
70.9
0.03545
Al
7429-90-5
0.1
0.1
0.00005
Ag
7440-22-4
28.6
28.6
0.0143
Ni
7440-02-0
0.4
0.4
0.0002
C
7440-44-0
100
100
0.19
Plating (0.3 mg)
Glass Sleeve (11.66 mg)
Lead WireDumet
(18.6 mg)
Core material
(14.136 mg)
Cladding copper
(4.464 mg)
Dice (0.05 mg)
Ink (0.19 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (LL-34)
Glass Sleeve
Plating
Dumet
H
C
Dice
Weight: 30.6 mg / pc
15-Nov-07
Make up of material
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
7440-31-5
99.95 min.
99.97
0.29991
Others
——
0.05 max.
0.03
0.00009
Pb
7439-92-1
61
61
6.9906
Si
7440-21-3
32
32
3.6672
K
7440-09-7
3.8
3.8
0.43548
B
7440-42-8
3
3
0.3438
Sb
7440-36-0
0.06
0.06
0.006876
Others
——
0.14
0.14
0.016044
Ni
7440-02-0
41-43
42.15
5.958324
Fe
7439-89-6
balance
57.85
8.177676
Cu
7440-50-8
100
100
4.464
Si
7440-21-3
70.9
70.9
0.03545
Al
7429-90-5
0.1
0.1
0.00005
Ag
7440-22-4
28.6
28.6
0.0143
Ni
7440-02-0
0.4
0.4
0.0002
C
7440-44-0
100
100
0.19
Chemical
Composition
CAS No.
Sn
E
T
M
E
S
Plating (0.3 mg)
Glass Sleeve (11.46 mg)
Lead WireDumet
(18.6 mg)
Core material
(14.136 mg)
Cladding copper
(4.464 mg)
Dice (0.05 mg)
Ink (0.19 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (LL-41 Glass)
Glass Sleeve
Plating
Dumet
H
C
Dice
Weight: 129.9 mg / pc
15-Nov-07
Make up of material
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
7440-31-5
99.95 min.
99.97
0.39988
Others
——
0.05 max.
0.03
0.00012
Pb
7439-92-1
61
61
28.91095
Si
7440-21-3
32
32
15.1664
K
7440-09-7
3.8
3.8
1.80101
B
7440-42-8
3
3
1.42185
Sb
7440-36-0
0.06
0.06
0.028437
Others
——
0.14
0.14
0.066353
Ni
7440-02-0
41-43
42.15
26.1525576
Fe
7439-89-6
balance
57.85
35.8938424
Cu
7440-50-8
100
100
19.5936
Si
7440-21-3
70.9
70.9
0.116985
Al
7429-90-5
0.1
0.1
0.000165
Ag
7440-22-4
28.6
28.6
0.04719
Ni
7440-02-0
0.4
0.4
0.00066
C
7440-44-0
100
100
0.3
Chemical
Composition
CAS No.
Sn
E
T
M
E
S
Plating (0.4 mg)
Glass Sleeve (47.395 mg)
Lead WireDumet
(81.64 mg)
Core material
(62.0464 mg)
Cladding copper
(19.5936 mg)
Dice (0.165 mg)
Ink (0.3 mg)
Note: Lead (Pb) in glass of electronic components is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOD-123)
Epoxy Molding
Dice
Plating
Bonding Wire
H
C
Lead Frame
Weight: 9.15 mg / pc
15-Nov-07
Make up of material
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
7440-31-5
99.95 min.
99.97
0.0509847
Others
——
0.05 max.
0.03
0.0000153
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
5.1801244
Cristobalite
14464-46-1
0-1
0.5
0.033121
1675-54-3
3 - 20
10
0.66242
9003-35-4
2 - 15
9.5
0.629299
1309-64-4
0.1 - 3
1.5
0.099363
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0198726
Au
7440-57-5
99.99 min.
99.998
0.007799844
Others
——
0.01 max.
0.002
0.000000156
Alloy (Ni & Fe)
12645-50-0
98.636
98.636
2.38403212
Cu
7440-50-8
0.168
0.168
0.00406056
Ag
7440-22-4
1.196
1.196
0.02890732
Si
7440-21-3
94.1
94.1
0.04705
Al
7429-90-5
0.1
0.1
0.00005
Au
7440-57-5
5.8
5.8
0.0029
Chemical
Composition
CAS No.
Sn
E
T
M
E
S
Plating (0.051 mg)
Epoxy Molding (6.6242 mg)
Bisphenol-A
Epoxy Resin
Phenolic Resin
Water-Soluble
Antimony
Trioxide
Bonding Wire (0.0078 mg)
Lead Frame (2.417 mg)
Basis
Dice (0.05 mg) Obverse Metal
Back Metal
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOD-123 HAF )
Epoxy Molding
Dice
Plating
Bonding Wire
H
C
Lead Frame
Weight: 9.15 mg / pc
16-Apr-09
Make up of material
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.0509847
Others
——
0.05 max.
0.03
Silica Fused
60676-86-0
75-90
85.0
Epoxy Resin
29690-82-2
5-10
8.7
Phenolic Resin
9003-35-4
2-8
6
0.397452
Pigment
1333-86-4
0.1-0.5
0.3
0.0198726
Au
7440-57-5
99.99 min.
99.998
0.007799844
Others
——
0.01 max.
0.002
0.000000156
Alloy (Ni & Fe)
12645-50-0
98.636
98.636
2.38403212
Cu
7440-50-8
0.168
0.168
0.00406056
Ag
7440-22-4
1.196
1.196
0.02890732
Si
7440-21-3
94.1
94.1
0.04705
Al
7429-90-5
0.1
0.1
0.00005
Au
7440-57-5
5.8
5.8
0.0029
E
T
M
E
S
Plating (0.051 mg)
Epoxy Molding (6.6242 mg)
0.0000153
5.63057
0.5763054
Bonding Wire (0.0078 mg)
Lead Frame (2.417 mg)
Basis
Dice (0.05 mg) Obverse Metal
Back Metal
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
䳏䛉ഄഔE-mail: [email protected]
‫ ⳳڇ‬Fax: (852) 2688 6051
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SC-76)
(SOD-323)
Epoxy Molding
Dice
Plating
Bonding Wire
H
C
Lead Frame
Weight: 4.6 mg / pc
Make up of material
Content Spec.
(%)
Content
(%)
15-Nov-07
Substance Weight
(mg)
7440-31-5
99.95 min.
99.97
0.0339898
Others
——
0.05 max.
0.03
0.0000102
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
2.6620844
Cristobalite
14464-46-1
0-1
0.5
0.017021
Bisphenol-A
Epoxy Resin
1675-54-3
3 - 20
10
0.34042
9003-35-4
2 - 15
9.5
0.323399
1309-64-4
0.1 - 3
1.5
0.051063
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0102126
Au
7440-57-5
99.99 min.
99.998
0.006799864
Others
——
0.01 max.
0.002
0.000000136
Alloy (Ni & Fe)
12645-50-0
98.636
98.636
1.0899278
Cu
7440-50-8
0.168
0.168
0.0018564
Ag
7440-22-4
1.196
1.196
0.0132158
Si
7440-21-3
94.1
94.1
0.04705
Al
7429-90-5
0.1
0.1
0.00005
Au
7440-57-5
5.8
5.8
0.0029
Chemical
Composition
CAS No.
Sn
E
T
M
E
S
Plating (0.034 mg)
Epoxy Molding (3.4042 mg)
Phenolic Resin
Water-Soluble
Antimony
Trioxide
Bonding Wire (0.0068 mg)
Lead Frame (1.105 mg)
Basis
Dice (0.05 mg) Obverse Metal
Back Metal
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SC-76
(SOD-323
HAF)
HAF)
Epoxy Molding
Dice
Plating
Bonding Wire
H
C
Lead Frame
Weight: 4.6 mg / pc
16-Apr-09
Substance
Weight
(mg)
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Sn
7440-31-5
99.95 min.
99.97
0.0339898
Others
——
0.05 max.
0.03
0.0000102
Silica Fused
60676-86-0
75-90
85.0
2.8935700
Epoxy Resin
29690-82-2
5-10
8.7
0.2961654
Phenolic Resin
9003-35-4
2-8
6.0
0.2042520
Pigment
1333-86-4
0.1-0.5
0.3
0.0102126
Au
7440-57-5
99.99 min.
99.998
0.00679986
Others
——
0.01 max.
0.002
0.00000014
Alloy (Ni & Fe)
12645-50-0
98.636
98.636
1.0899278
Cu
7440-50-8
0.168
0.168
0.0018564
Ag
7440-22-4
1.196
1.196
0.0132158
Basis
Si
7440-21-3
94.1
94.1
0.04705
Obverse Metal
Al
7429-90-5
0.1
0.1
0.00005
Back Metal
Au
7440-57-5
5.8
5.8
0.0029
Make up of material
E
T
M
E
S
Plating (0.034 mg)
Epoxy Molding (3.4042 mg)
Bonding Wire (0.0068 mg)
Lead Frame (1.105 mg)
Dice
(0.05 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOD-523)
Epoxy Molding
Dice
Plating
Bonding Wire
H
C
Lead Frame
Weight: 1.47 mg / pc
Content Spec.
(%)
Content
(%)
15-Nov-07
Substance Weight
(mg)
7440-31-5
99.95 min.
99.97
0.0179946
Others
——
0.05 max.
0.03
0.0000054
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
0.6607118
Cristobalite
14464-46-1
0-1
0.5
0.0042245
Bisphenol-A
Epoxy Resin
1675-54-3
3 - 20
10
0.08449
9003-35-4
2 - 15
9.5
0.0802655
1309-64-4
0.1 - 3
1.5
0.0126735
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0025347
Au
7440-57-5
99.99 min.
99.998
0.006099878
Others
——
0.01 max.
0.002
0.000000122
Alloy (Ni & Fe)
12645-50-0
98.636
98.636
0.54545708
Cu
7440-50-8
0.168
0.168
0.00092904
Ag
7440-22-4
1.196
1.196
0.00661388
Basis
Si
7440-21-3
94.1
94.1
0.045168
Obverse Metal
Al
7429-90-5
0.1
0.1
0.000048
Back Metal
Au
7440-57-5
5.8
5.8
0.002784
Make up of material
Chemical
Composition
CAS No.
Sn
E
T
M
E
S
Plating (0.018 mg)
Epoxy Molding (0.8449 mg)
Phenolic Resin
Water-Soluble
Antimony
Trioxide
Bonding Wire (0.0061 mg)
Lead Frame (0.553 mg)
Dice
(0.048 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOD-523 HAF)
Epoxy Molding
Dice
Plating
Bonding Wire
H
C
Lead Frame
Weight: 1.47 mg / pc
16-Apr-09
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.0179946
Others
——
0.05 max.
0.03
0.0000054
Silica Fused
60676-86-0
75-90
85.0
0.718165
Epoxy Resin
29690-82-2
5-10
8.7
0.0735063
Phenolic Resin
9003-35-4
2-8
6
0.050694
Pigment
1333-86-4
0.1-0.5
0.3
0.0025347
Au
7440-57-5
99.99 min.
99.998
0.006099878
Others
——
0.01 max.
0.002
0.000000122
Alloy (Ni & Fe)
12645-50-0
98.636
98.636
0.54545708
Cu
7440-50-8
0.168
0.168
0.00092904
Ag
7440-22-4
1.196
1.196
0.00661388
Basis
Si
7440-21-3
94.1
94.1
0.045168
Obverse Metal
Al
7429-90-5
0.1
0.1
0.000048
Back Metal
Au
7440-57-5
5.8
5.8
0.002784
Make up of material
E
T
M
E
S
Plating (0.018 mg)
Epoxy Molding (0.8449 mg)
Bonding Wire (0.0061 mg)
Lead Frame (0.553 mg)
Dice
(0.048 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOD-723)
Epoxy Molding
Dice
Plating
Bonding Wire
H
C
Lead Frame
Weight:0.8470mg / pc
2011-6-21
E
T
M
E
S
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.03239028
Others
——
0.05 max.
0.03
0.00000972
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
0.114563
Cristobalite
14464-46-1
0-1
0.5
0.0007325
1675-54-3
3- 20
10
0.01465
9003-35-4
2- 15
9.5
0.0139175
1309-64-4
0.1 - 3
1.5
0.0021975
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0004395
Au
7440-57-5
99.99 min.
99.998
0.00349993
Others
——
0.01 max.
0.002
0.00000007
Alloy (Ni & Fe)
12645-50-0
98.636
98.636
0.611148656
Cu
7440-50-8
0.168
0.168
0.001040928
Ag
7440-22-4
1.196
1.196
0.007410416
Basis
Si
7440-21-3
94.1
94.1
0.042345
Obverse Metal
Al
7429-90-5
0.1
0.1
0.000045
Back Metal
Au
7440-57-5
5.8
5.8
0.00261
Make up of material
Plating (0.0324)mg
Epoxy Molding (0.1465mg)
Bonding Wire (0.0035mg)
Lead Frame (0.6196mg)
Dice (0.045mg)
Bisphenol-A
Epoxy Resin
Phenolic Resin
Water-Soluble
Antimony
Trioxide
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOD-723 HAF)
Epoxy Molding
Dice
Plating
Bonding Wire
H
C
Lead Frame
Weight:0.8470mg / pc
2011-6-21
E
T
M
E
S
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.03239028
Others
——
0.05 max.
0.03
0.00000972
Silica Fused
60676-86-0
75-90
85.0
0.12376
Epoxy Resin
29690-82-2
5-10
8.7
0.0126672
Phenolic Resin
9003-35-4
2-8
6
0.008736
Pigment
1333-86-4
0.1-0.5
0.3
0.0004368
Au
7440-57-5
99.99 min.
99.998
0.00349993
Others
——
0.01 max.
0.002
0.00000007
Alloy (Ni & Fe)
12645-50-0
98.636
98.636
0.611148656
Cu
7440-50-8
0.168
0.168
0.001040928
Ag
7440-22-4
1.196
1.196
0.007410416
Basis
Si
7440-21-3
94.1
94.1
0.042345
Obverse Metal
Al
7429-90-5
0.1
0.1
0.000045
Back Metal
Au
7440-57-5
5.8
5.8
0.00261
Make up of material
Plating (0.0324mg)
Epoxy Molding (0.1456mg)
Bonding Wire (0.0035mg)
Lead Frame (0.6196mg)
Dice
(0.0450mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (TO-236
(SOT-23Single
SingleDiode)
Diode)
Bonding Wire
Epoxy Molding
Plating
Lead Frame
H
C
Dice
E
T
M
E
S
Weight: 8.72 mg / pc
15-Nov-07
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.139958
Others
——
0.05 max.
0.03
0.000042
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
4.7198001
Cristobalite
14464-46-1
0-1
0.5
0.03017775
1675-54-3
3 - 20
10
0.603555
9003-35-4
2 - 15
9.5
0.57337725
Antimony Trioxide
1309-64-4
0.1 - 3
1.5
0.09053325
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.01810665
Au
7440-57-5
99.99 min.
99.998
0.005749885
Others
——
0.01 max.
0.002
0.000000115
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
2.47727346
Cu
7440-50-8
0.381
0.381
0.00962406
Ag
7440-22-4
1.548
1.548
0.03910248
Basis
Si
7440-21-3
94.1
94.1
0.0119507
Obverse Metal
Al
7429-90-5
0.1
0.1
0.0000127
Back Metal
Au
7440-57-5
5.8
5.8
0.0007366
Make up of material
Plating (0.14 mg)
Epoxy Molding (6.03555mg)
Bisphenol-A Epoxy
Resin
Phenolic Resin
Water-Soluble
Bonding Wire (0.00575mg)
Lead Frame (2.526 mg)
Dice
(0.0127 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-23
(TO-236 Single
Single Diode
DiodeHAF)
HAF)
Epoxy Molding
Bonding Wire
Plating
Lead Frame
H
C
Dice
Weight: 8.72 mg / pc
16-Apr-09
E
T
M
E
S
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.139958
Others
——
0.05 max.
0.03
0.000042
Silica Fused
60676-86-0
75-90
85.0
5.1302175
Epoxy Resin
29690-82-2
5-10
8.7
0.52509285
Phenolic Resin
9003-35-4
2-8
6
0.362133
Pigment
1333-86-4
0.1-0.5
0.3
0.01810665
Au
7440-57-5
99.99 min.
99.998
0.005749885
Others
——
0.01 max.
0.002
0.000000115
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
2.47727346
Cu
7440-50-8
0.381
0.381
0.00962406
Ag
7440-22-4
1.548
1.548
0.03910248
Basis
Si
7440-21-3
94.1
94.1
0.0119507
Obverse Metal
Al
7429-90-5
0.1
0.1
0.0000127
Back Metal
Au
7440-57-5
5.8
5.8
0.0007366
Make up of material
Plating (0.14 mg)
Epoxy Molding (6.03555 mg)
Bonding Wire (0.00575 mg)
Lead Frame (2.526 mg)
Dice
(0.0127 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (TO-236
(SOT-23Double
DoubleDiode)
Diode)
Dice
Bonding Wire
Plating
Lead Frame
H
C
Epoxy Molding
Weight: 8.72 mg / pc
E
T
M
E
S
15-Nov-07
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.139958
Others
——
0.05 max.
0.03
0.000042
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
4.7053722
Cristobalite
14464-46-1
0-1
0.5
0.0300855
1675-54-3
3 - 20
10
0.60171
9003-35-4
2 - 15
9.5
0.5716245
Antimony Trioxide
1309-64-4
0.1 - 3
1.5
0.0902565
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0180513
Au
7440-57-5
99.99 min.
99.998
0.01149977
Others
ũũ
0.01 max.
0.002
0.00000023
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
2.47727346
Cu
7440-50-8
0.381
0.381
0.00962406
Ag
7440-22-4
1.548
1.548
0.03910248
Basis
Si
7440-21-3
94.1
94.1
0.0239014
Obverse Metal
Al
7429-90-5
0.1
0.1
0.0000254
Back Metal
Au
7440-57-5
5.8
5.8
0.0014732
Make up of material
Plating (0.14 mg)
Bisphenol-A
Epoxy Resin
Phenolic Resin
Water-Soluble
Epoxy Molding (6.0171mg)
Bonding Wire (0.0115 mg)
Lead Frame (2.526 mg)
Dice (0.0254 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diodes (TO-236
(SOT-23Double
DoubleDiode
DiodeHAF)
HAF)
Dice
Bonding Wire
Plating
Lead Frame
H
C
Epoxy Molding
Weight: 8.72 mg / pc
E
T
M
E
S
16-Apr-09
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.139958
Others
——
0.05 max.
0.03
0.000042
Silica Fused
60676-86-0
75-90
85.0
5.114535
Epoxy Resin
29690-82-2
5-10
8.7
0.5234877
Phenolic Resin
9003-35-4
2-8
6
0.361026
Pigment
1333-86-4
0.1-0.5
0.3
0.0180513
Au
7440-57-5
99.99 min.
99.998
0.01149977
Others
ũũ
0.01 max.
0.002
0.00000023
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
2.47727346
Cu
7440-50-8
0.381
0.381
0.00962406
Ag
7440-22-4
1.548
1.548
0.03910248
Basis
Si
7440-21-3
94.1
94.1
0.0239014
Obverse Metal
Al
7429-90-5
0.1
0.1
0.0000254
Back Metal
Au
7440-57-5
5.8
5.8
0.0014732
Make up of material
Plating (0.14 mg)
Epoxy Molding (6.0171 mg)
Bonding Wire (0.0115 mg)
Lead Frame (2.526 mg)
Dice (0.0254 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-323 Single Diode)
Epoxy Molding
Dice
Bonding Wire
Plating
H
C
Lead Frame
Weight: 5 mg / pc
E
T
M
E
S
15-Nov-07
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.079976
Others
——
0.05 max.
0.03
0.000024
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
2.6986038
Cristobalite
14464-46-1
0-1
0.5
0.0172545
1675-54-3
3 - 20
10
0.34509
9003-35-4
2 - 15
9.5
0.3278355
Antimony Trioxide
1309-64-4
0.1 - 3
1.5
0.0517635
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0103527
Au
7440-57-5
99.99 min.
99.998
0.008399832
Others
ũũ
0.01 max.
0.002
0.000000168
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
1.42006808
Cu
7440-50-8
0.381
0.381
0.00551688
Ag
7440-22-4
1.548
1.548
0.02241504
Basis
Si
7440-21-3
94.1
94.1
0.0119507
Obverse Metal
Al
7429-90-5
0.1
0.1
0.0000127
Back Metal
Au
7440-57-5
5.8
5.8
0.0007366
Make up of material
Plating (0.08 mg)
Bisphenol-A
Epoxy Resin
Phenolic Resin
Water-Soluble
Epoxy Molding (3.4509 mg)
Bonding Wire (0.0084 mg)
Lead Frame (1.448 mg)
Dice (0.0127 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-323 Single Diode HAF)
Epoxy Molding
Dice
Bonding Wire
Plating
H
C
Lead Frame
Weight: 5 mg / pc
E
T
M
E
S
15-Nov-07
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.079976
Others
——
0.05 max.
0.03
0.000024
Silica Fused
60676-86-0
75-90
85.0
2.933265
Epoxy Resin
29690-82-2
5-10
8.7
0.3002283
Phenolic Resin
9003-35-4
2-8
6
0.207054
Pigment
1333-86-4
0.1-0.5
0.3
0.0103527
Au
7440-57-5
99.99 min.
99.998
0.008399832
Others
ũũ
0.01 max.
0.002
0.000000168
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
1.42006808
Cu
7440-50-8
0.168
0.168
0.00551688
Ag
7440-22-4
1.196
1.196
0.02241504
Basis
Si
7440-21-3
94.1
94.1
0.0119507
Obverse Metal
Al
7429-90-5
0.1
0.1
0.0000127
Back Metal
Au
7440-57-5
5.8
5.8
0.0007366
Make up of material
Plating (0.08 mg)
Epoxy Molding (3.4509 mg)
Bonding Wire (0.0084 mg)
Lead Frame (1.448 mg)
Dice (0.0127 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-323 Double Diode)
Epoxy Molding
Dice
Bonding Wire
Plating
Lead Frame
Weight: 5 mg / pc
H
C
E
T
M
E
S
15-Nov-07
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.079976
Others
——
0.05 max.
0.03
0.000024
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
2.692035
Cristobalite
14464-46-1
0-1
0.5
0.0172125
1675-54-3
3 - 20
10
0.34425
9003-35-4
2 - 15
9.5
0.3270375
Antimony Trioxide
1309-64-4
0.1 - 3
1.5
0.0516375
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0103275
Au
7440-57-5
99.99 min.
99.998
0.016799664
Others
ũũ
0.01 max.
0.002
0.000000336
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
1.42006808
Cu
7440-50-8
0.381
0.381
0.00551688
Ag
7440-22-4
1.548
1.548
0.02241504
Basis
Si
7440-21-3
94.1
94.1
0.0119507
Obverse Metal
Al
7429-90-5
0.1
0.1
0.0000127
Back Metal
Au
7440-57-5
5.8
5.8
0.0007366
Make up of material
Plating (0.08 mg)
Bisphenol-A
Epoxy Resin
Phenolic Resin
Water-Soluble
Epoxy Molding (3.4425 mg)
Bonding Wire (0.0168mg)
Lead Frame (1.448 mg)
Dice (0.0127 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-323 Double Diode HAF)
Epoxy Molding
Dice
Bonding Wire
Plating
Lead Frame
Weight: 5 mg / pc
H
C
E
T
M
E
S
15-Nov-07
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.079976
Others
——
0.05 max.
0.03
0.000024
Silica Fused
60676-86-0
75-90
85.0
2.926125
Epoxy Resin
29690-82-2
5-10
8.7
0.2994975
Phenolic Resin
9003-35-4
2-8
6
0.20655
Pigment
1333-86-4
0.1-0.5
0.3
0.0103275
Au
7440-57-5
99.99 min.
99.998
0.016799664
Others
ũũ
0.01 max.
0.002
0.000000336
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
1.42006808
Cu
7440-50-8
0.168
0.168
0.00551688
Ag
7440-22-4
1.196
1.196
0.02241504
Basis
Si
7440-21-3
94.1
94.1
0.0119507
Obverse Metal
Al
7429-90-5
0.1
0.1
0.0000127
Back Metal
Au
7440-57-5
5.8
5.8
0.0007366
Make up of material
Plating (0.08 mg)
Epoxy Molding (3.4425 mg)
Bonding Wire (0.0168 mg)
Lead Frame (1.448 mg)
Dice (0.0127 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-363)
Lead Frame
Bonding Wire
Epoxy Molding
Plating
Dice
H
C
Adhesive
Weight: 6.99 mg/ pc
Make up of material
Chemical Composition
CAS No.
Content Spec.
(%)
Content
(%)
2013-6-27
Substance Weight
(mg)
99.85
0.29955000
0.15
0.00045000
13.0
0.56030000
10
0.43100000
2
0.08620000
72.3
3.11613000
E
T
M
E
S
Sn
7440-31-5
99.9 min.
Others
——
0.02-0.1
Epoxy Resin
29690-82-2
3-20
Phenolic Resin Water-Soluble
9003-35-4
2-15
Antimony Trioxide
1309-64-4
0.1-3
Silicon dioxide
60676-86-0
70-90
Cristobalite
14464-46-1
0-1
0.5
0.02155000
Briminated Epoxy Resin
40039-93-8
0.5-3
2
0.08620000
Carbon Black
1333-86-4
0.1-0.5
0.2
0.00862000
Ag
7440-22-4
70-80
77
0.27720000
Bisphenol F
28064-14-4
10-20
15
0.05400000
2-Ethyl Henxyl Glycidyl Ether
2461-15-6
0-10
8
0.02880000
Au
7440-57-5
99.99 min.
99.99
0.00999900
Others
——
0.01 max.
0.01
0.00000100
Cu
7440-50-8
0.15 max.
0.12
0.00193200
Ni
7440-02-0
40-42.5
40.98
0.65977800
Fe
7439-89-6
58 max.
57.5
0.92575000
Ag
7440-22-4
1.5 Max
1.40
0.02254000
Si
7440-21-3
91.8
91.8
0.36720000
Al
7429-90-5
4.36
4.36
0.01744000
Au
7440-57-5
3.84
3.84
0.01536000
Plating˄0.3mg˅
Epoxy Molding ˄4.31mg˅
Adhesive ( 0.36 mg)
Bonding Wire˄0.010mg˅
Lead Frame˄1.61mg˅
Dice ˄0.4mg˅
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-363 HAF )
Lead Frame
Bonding Wire
Epoxy Molding
Plating
Dice
H
C
Adhesive
Weight: 6.99 mg/ pc
Make up of material
99.85
0.29955000
0.15
0.00045000
83.8
3.61178000
9
0.38790000
7
0.30170000
CAS No.
Sn
7440-31-5
99.9 min.
Others
——
0.02-0.1
Silica Fused
60676-86-0
75-90
Epoxy Resin
29690-82-2
5-10
Phenolic Resin
9003-35-4
2-8
Carbon Black
1333-86-4
0.1-0.5
0.2
0.00862000
Ag
7440-22-4
70-80
77
0.27720000
Bisphenol F
28064-14-4
10-20
15
0.05400000
2-Ethyl Henxyl Glycidyl Ether
2461-15-6
0-10
8
0.02880000
Au
7440-57-5
99.99 min.
99.99
0.00999900
Others
——
0.01 max.
0.01
0.00000100
Cu
7440-50-8
0.15 max.
0.12
0.00193200
Ni
7440-02-0
40-42.5
40.98
0.65977800
Fe
7439-89-6
58 max.
57.5
0.92575000
Ag
7440-22-4
1.5 Max
1.40
0.02254000
Si
7440-21-3
91.8
91.8
0.36720000
Al
7429-90-5
4.36
4.36
0.01744000
Au
7440-57-5
3.84
3.84
0.01536000
E
T
M
E
S
Adhesive ( 0.36 mg)
2013-6-27
Substance Weight
(mg)
Chemical Composition
Plating(0.3mg˅
Epoxy Molding ˄4.31mg˅
Content
(%)
Content Spec.
(%)
Bonding Wire (0.010mg)
Lead Frame˄1.61mg˅
Dice ˄0.4mg˅
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-523)
Bonding Wire
Epoxy Molding
Plating
Lead Frame
H
C
Dice
E
T
M
E
S
Weight: 2.390mg / pc
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.07357792
Others
——
0.05 max.
0.03
0.00002208
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
1.07251300
Cristobalite
14464-46-1
0-1
0.5
0.00685750
1675-54-3
3 - 20
10
0.13715000
9003-35-4
2 - 15
9.5
0.13029250
Antimony Trioxide
1309-64-4
0.1 - 3
1.5
0.02057250
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.00411450
Au
7440-57-5
99.99 min.
99.998
0.00449991
Others
——
0.01 max.
0.002
0.00000009
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
0.87518560
Cu
7440-50-8
0.381
0.381
0.00340004
Ag
7440-22-4
1.548
1.548
0.01381435
Basis
Si
7440-21-3
94.1
94.1
0.045168
Obverse Metal
Al
7429-90-5
0.1
0.1
0.000048
Back Metal
Au
7440-57-5
5.8
5.8
0.002784
Make up of material
Plating
(0.0736mg)
Epoxy Molding
(1.3715mg)
Bonding Wire
(0.0045mg)
Lead Frame
(0.8924mg)
Dice
(0.0480mg)
2007-11-15
Bisphenol-A Epoxy
Resin
Phenolic Resin
Water-Soluble
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (SOT-523 HAF)
Dice
Bonding Wire
Plating
Lead Frame
Epoxy Molding
H
C
Weight: 2.394mg / pc
Make up of material
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
E
T
M
E
S
Sn
7440-31-5
99.95 min.
99.97
0.07357792
Others
——
0.05 max.
0.03
0.00002208
Silica Fused
60676-86-0
75-90
85
1.165435
Epoxy Resin
29690-82-2
5-10
8.7
0.1192857
Phenolic Resin
9003-35-4
2-8
6
0.082266
Pigment
1333-86-4
0.1-0.5
0.3
0.0041133
Au
7440-57-5
99.99 min.
99.998
0.008899822
Others
——
0.01 max.
0.002
0.000000178
Alloy(Ni&Fe)
69012-55-1
98.071
98.071
0.875185604
Cu
7440-50-8
0.381
0.381
0.003400044
Ag
7440-22-4
1.548
1.548
0.013814352
Basis
Si
7440-21-3
94.1
94.1
0.045168
Obverse Metal
Al
7429-90-5
0.1
0.1
0.000048
Back Metal
Au
7440-57-5
5.8
5.8
0.002784
Plating (0.0736mg)
Epoxy Molding (1.3711mg)
Bonding Wire (0.0089mg)
Lead Frame (0.8924mg)
Dice
(0.0480mg)
2011-6-27
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (DO-213AA)
Epoxy Molding
Lead Wire
Solder
Plating
Dice
Ink
H
C
Weight: 33mg / pc
Make up of material
14-May-09
Chemical Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.0659800
Others
——
0.05 max.
0.03
0.0000200
Pb
7439-92-1
92.5
92.5
0.7566500
Sn
7440-31-5
5
5
0.0409000
Ag
7440-22-4
2.5
2.5
0.0204500
SiO2
60676-86-0
70-90
78.2
4.6794880
Epoxy Resin
29690-82-2
10-30
10
0.5984000
Phenolic Resin
9003-35-4
5-20
10
0.5984000
Antimony Trioxide
1309-64-4
0-5
1.5
0.0897600
Carbon Black
1333-86-4
0-5
0.3
0.0179520
Cu
7440-50-8
20-24
20
5.1456000
Fe
7439-89-6
76-80
75
19.2960000
Ni
7440-02-0
5
5
1.2864000
Si
7440-21-3
95.49
95.49
0.3762306
Au
7440-57-5
3.50
3.50
0.0137900
Al
7429-90-5
1.00
1.00
0.0039400
Others
——
0.01
0.01
0.0000394
C
7440-44-0
100
100
0.0100000
E
T
M
E
S
Plating (0.066 mg)
Solder (0.818 mg)
Epoxy Molding (5.984mg)
Lead Wire-CCS
(25.728mg)
Dice (0.394 mg)
Ink (0.01mg)
Note: Lead(Pb) in high melting temperature type solders is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (DO-213AA HAF)
Epoxy Molding
Lead Wire
Solder
Plating
Dice
Ink
H
C
Weight: 33mg / pc
Make up of material
14-May-09
Chemical Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.0659800
0.03
0.0000200
92.5
0.7566500
5
0.0409000
2.5
0.0204500
6.00
0.3590400
2.50
0.1496000
Plating (0.066 mg)
E
T
M
E
S
Others
——
0.05 max.
Pb
7439-92-1
92.5
Sn
7440-31-5
5
Ag
7440-22-4
2.5
Epoxy Resin
29690-82-2
5-10
Phenolic Resin
9003-35-4
2-8
Hardener
98-67-9
5-10
6.00
0.3590400
Accelerator
2451-62-9
1
0.40
0.0239360
Silica Fused
60676-86-0
75-90
76.00
4.5478400
Coupling Agent
18171-19-2
1
0.40
0.0239360
Modifier
546-68-9
5
2.00
0.1196800
Wax
64742-51-4
1
0.40
0.0239360
Flame Retardant
1309-42-8
5-10
6.00
0.3590400
Pigment
1333-86-4
0.1-0.5
0.30
0.0179520
Cu
7440-50-8
20-24
20
5.1456000
Fe
7439-89-6
76-80
75
19.2960000
Ni
7440-02-0
5
5
1.2864000
Si
7440-21-3
95.49
95.49
0.3762306
Au
7440-57-5
3.50
3.50
0.0137900
Al
7429-90-5
1.00
1.00
0.0039400
Others
——
0.01
0.01
0.0000394
C
7440-44-0
100
100
0.0100000
Solder (0.818 mg)
Epoxy Molding (5.984mg)
Lead Wire-CCS
(25.728mg)
Dice (0.394 mg)
Ink (0.01mg)
Note: Lead(Pb) in high melting temperature type solders is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Diode (DO-213AB)
Epoxy Molding
Lead Wire
Solder
Plating
Dice
Ink
Cristobalite
14464-46-1
0-1
H
C
0.5
0.0560
Bisphenol-A Epoxy
Resin
1675-54-3
3 - 20
10
1.1200
Phenolic Resin
Water-Soluble
9003-35-4
2 - 15
9.5
1.0640
Antimony Trioxide
1309-64-4
0.1 - 3
1.5
0.1680
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0336
Cu
7440-50-8
100
100
126.0000
Si
7440-21-3
90.80
90.80
1.2712
P
7723-14-0
2.50
2.50
0.0350
Ni
7440-02-0
5.00
5.00
0.0700
Be
7440-41-7
1.70
1.70
0.0238
C
7440-44-0
100
100
0.0400
Weight: 140.04mg / pc
Make up of material
10-Jan-09
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
Substance Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.279916
Plating (0.28 mg)
E
T
M
E
S
Solder (1.12 mg)
Epoxy Molding (11.2mg)
Lead Wire-CCS (126mg)
Others
——
0.05 max.
0.03
0.000084
Pb
7439-92-1
92.5
92.5
1.0360
Ag
7440-22-4
5
5
0.0560
Cu
7440-50-8
2.5
2.5
0.0280
Crystalline Silica
(Quartz)
14808-60-7
70 - 90
78.2
8.7584
Dice (1.4 mg)
Ink
Note: Lead(Pb) in high melting temperature type solders is exempted from RoHS directive (EU Directive 2011/65/EU)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
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