Catalog

X-ray TDI camera
C10650 series
High speed readout
Large field of view
High resolution
High sensitivity
High quality image output with high resolution
achieved by TDI technology
High speed readout
10.7
m/min.
Detection area
Max.
586
mm
Horizontal spatial
resolution
Max.
6144×2
pixels
X-ray TDI camera C10650 series is useful for in-line
applications requiring high-speed operation with high
sensitivity. TDI imaging is appropriate for applications where
it is desired to record a linear movement, or where the aspect
ratio of the subject being imaged is significantly asymmetric.
Low brightness under high resolution usage, a problem with
conventional line sensor cameras, is improved with this X-ray
TDI camera, making it suitable for applications which require
high resolution. Vertical X-ray TDI cameras that can be
installed in narrow spaces are new additions to the series.
Printed circuit board (PCB) inspection
Surface-mounted component inspection
Lithium-ion battery inspection
High-resolution in-line non-destructive inspection
TDI technology
Time Delay Integration is a scanning technology in
which a frame transfer device produces a continuous
video image of a moving object by means of a stack
of linear arrays aligned with and synchronized to the
motion of the object to be imaged in such a way that,
as the image moves from one line to the next, the
integrated charge moves along with it, providing
higher resolution at lower light levels than is possible
with a line-scan camera.
Shield box
X-ray source
Object Motion
Object
X-ray TDI camera
Conveyor belt
TDI sensor
Signal intensity
Features
High S/N ratio with 12 bit / 16 bit output
Camera Link interface (Base configuration)
Single power supply (+15 V) operation
Real time dark current / shading correction function
Frame readout mode for easy installation alignment
High-resolution, High-speed Camera with a Large Field of View for In-line
100 % X-ray Inspection
High speed readout
Large field of view
High resolution
High sensitivity
TDI technology offers all four simultaneously.
High resolution
image acquisition
X-ray Source
Large field of view
Object
Detect dark sample with high sensitivity
X-ray
TDI Camera
High speed readout
PRODUCT LINEUP
Standard type
Type number
Sensor number
X-ray sensitive area
C10650-221
2
145.9 mm
C10650-321
3
221.1 mm
C10650-261
2
146.9 mm
C10650-361
3
220.2 mm
C10650-461
4
293.4 mm
C10650-261V
2
146.9 mm
C10650-361V
3
220.2 mm
C10650-461V
4
293.4 mm
C10650-361W
7
513.2 mm
C10650-461W
8
586.4 mm
Horizontal chassis / Overlapped type
Type number
Sensor number
X-ray sensitive area
Vertical chassis / Overlapped type
Type number
Sensor number
X-ray sensitive area
Vertical chassis / Overlapped type (2 cameras output)
Type number
Sensor number
X-ray sensitive area
C10650-261W
6
439.9 mm
SPECIFICATIONS
Type number
C10650-221
C10650-321
C10650-461
C10650-461V
Scintillator
CsI Scintillator
Window
FOS (Fiber optic plate with scintillator)
Effective X-ray tube voltage range
Approx. 25 kV to 90 kV *1
CCD pixel size
48 μm × 48 μm
6144 (H) × 128 (V) *2
Number of pixels
3040 (H) × 128 (V)
4608 (H) × 128 (V)
293.4 mm (H) × 6.1 mm (V) *2
X-ray sensitive area
145.9 mm (H) × 6.1 mm (V) 221.1 mm (H) × 6.1 mm (V)
TDI line rate 1 × 1
Max. 2.109 kHz (6.073 m/min)
Binning 2 × 2
Max. 1.858 kHz (10.702 m/min)
CCD pixel clock
4.0 MHz
A/D converter
12 bit
16 bit
Digital interface
Camera Link
Interface (Camera Link)
Base Configuration
Pixel clock (Camera Link)
16.0 MHz
Output signals (Image data)
12 bit digital output
16 bit digital output
Power supply
DC +15 V
Power consumption
Approx. 30 VA
C10650-461W
6144(H)×128(V)+6144(H)×128(V) *2
586.4 mm (H) × 6.1 mm (V)*2
Approx. 30 VA + Approx. 30 VA *3
*1 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance.
*2 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary.
*3 2 units of the power supply unit and the power cable are necessary for C10650-461W.
MEASUREMENT EXAMPLES
Inspection of a solder's back fillet
If the back fillet of the solder on a PCB has a defect, a
connection error will occur even with small vibrations. For
observation of the back fillet part, X-ray transmission
technique has been applied but only with an off-line system.
Our X-ray TDI camera realizes in-line inspection because it
can acquire high speed profile data with high sensitivity. 3D
brightness level can be displayed using software.
Soldering failure
Normal soldering
Line scan
Line scan
Lithium-ion battery inspection
In case of 2D sensor, the dimensional measurement cannot
be implemented correctly because the image is distorted on
the corner areas of the X-ray irradiation. The long length
sample needs to be located on center of X-ray source, so
the sample has to be relocated each time. X-ray TDI
camera can capture the image with no distortion by line
scan method, so it is not necessary to relocate the samples
and it enables the continuous inspection for long length
object without stopping.
Not necessary to relocate
the samples and possible
to inspect the long length
object with no distortion.
Inspection by 2D sensor
Inspection by X-ray TDI camera
Profile
X-ray image intensifier (I.I.) camera :
The image is distorted on the corner
areas in thickness direction, and the
dimensional measurement cannot be
implemented correctly.
X-ray TDI camera :
The non-distortion image can be realized
since X-ray is radiated vertically to the
object and the dimensional measurement
can be implemented correctly.
Slack of rolling
3D display
Defect point
Short of the solution
Condition of the connection on electrode
Dead space between chips
Wide detection width with no dead areas
The overlapped type offers a wide detection area with no dead areas
due to its staggered sensors.
(Unit: mm)
C10650-221
10 pixels
C10650-321
C10650-461
Dead space 1
Center chip
Left chip
Edge pixel
Dead space 2
Right chip
Center chip
Overlapped type measurement example
Dead space 2:
130 μm min.
200 μm max.
±50 μm MAX.
Edge pixel
±50 μm MAX.
Dead space 1:
250 μm min.
350 μm max.
(Min. 4 pixels,
Max. 16 pixels)
15.1±0.5
Standard type has a following dead space between chips.
DIMENSIONAL OUTLINES
C10650-261V, -361V, -461V (Approx. 7 kg)
441
30
32.9
17
10.7
50
65
16
80
73.764
6
5
C10650-321 (Approx. 5 kg)
360
300
221 (Sensor range)
175
30
32.9
6(Sensor range)
123
134
112
64
11
2-Φ8.2
146 (Sensor range : C10650-261V)
220 (Sensor range : C10650-361V)
293 (Sensor range : C10650-461V)
5.5
4-Φ4.5
407
130
39 (Sensor position)
6(Sensor range)
123
134
112
64
10.6
145 (Sensor range)
15.1
360
300
11
C10650-221 (Approx. 5 kg)
(Unit: mm)
50
10.7
5.5
4-Φ4.5
371
C10650-261, -361, -461 (Approx. 7 kg)
C10650-261W, -361W, -461W (Approx. 16 kg)
370
(15.1)
10.6
293 (Sensor range : C10650-461)
5
175
(Sensor position)
50
42.4
6-Φ4.5
65
80
439 (Sensor range : C10650-261W)
513 (Sensor range: C10650-361W)
586 (Sensor range : C10650-461W)
6
8.3 (Sensor position)
73.764
(38.264)
22
239
250
228
220 (Sensor range : C10650-361)
2-Φ8.2
130
39 (Sensor position)
50.05
10.6
15.1
146 (Sensor range : C10650-261)
734
700
17
5.5
160
11
160
(Sensor position)
25
664
A8206-35 (Option) (Approx. 2 kg)
270
302.2
66
32.5
147
16.1
2-M4 D=6
OPTIONS
Power supply unit : A8206-35
Power cable 5 m : A10847-05
Software API Support (Microsoft Windows) : DCAM-API (http://www.dcamapi.com)
Additional function module 64 gain : M8815-01
Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.
Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications and external appearance are subject to change without notice.
© 2016 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Systems Division
812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected]
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, NJ 08807, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected]
Germany: Hamamatsu Photonics Deutschland GmbH.: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-265-8 E-mail: [email protected]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court,10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, UK, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected]
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01 E-mail: [email protected]
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-935-81-733, Fax: (39)02-935-81-741 E-mail: [email protected]
China: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, 27 Dongsanhuan Beilu, Chaoyang District, 100020 Beijing, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected]
Taiwan: Hamamatsu Photonics Taiwan Co., Ltd.: 8F-3, No.158, Section2, Gongdao 5th Road, East District, Hsinchu, 300, Taiwan R.O.C. Telephone: (886)03-659-0080, Fax: (886)07-811-7238 E-mail: [email protected]
Cat. No. SFAS0025E09
JUN/2016 HPK
Created in Japan
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