506DC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
Ç
ÇÇ
ÇÇ
ÇÇÇ
UDFN8, 4x3, 0.8P
CASE 506DC
ISSUE O
1
SCALE 2:1
DATE 05 FEB 2015
A
B
D
ÉÉ
ÉÉ
ÉÉ
PIN ONE
REFERENCE
0.15 C
2X
L1
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
G
L
L1
0.15 C TOP VIEW
2X
ÇÇÇÇ
0.08 C
ÇÇÇ
ÉÉÉ
EXPOSED Cu
DETAIL B
0.10 C
10X
L
L
A
(A3)
NOTE 4
MOLD CMPD
DETAIL B
A1
C
SIDE VIEW
ALTERNATE
CONSTRUCTIONS
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
G
DETAIL A
2X
ÇÇ
ÇÇÇ
ÇÇ
ÇÇ
ÇÇÇ
ÇÇ
1
8X
L
MILLIMETERS
MIN
MAX
0.50
0.60
0.00
0.05
0.152 REF
0.25
0.35
4.00 BSC
0.70
0.90
3.00 BSC
0.10
0.30
0.80 BSC
1.60 BSC
0.55
0.65
−−−
0.15
8
D2
0.10
M
XXXXX
XXXXX
AYWWG
G
C A B
4
2X
E2
0.10
5
8X
e
e/2
C A B
M
b
0.10
M
C A B
0.05
M
C
XXXXX
A
Y
WW
G
NOTE 3
BOTTOM VIEW
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
2.60
2X
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
8X
0.83
1.00
3.30
PACKAGE
OUTLINE
2X
0.40
1
0.80
PITCH
8X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON95010F
ON SEMICONDUCTOR STANDARD
1
© Semiconductor Components Industries, LLC, 2004
March, 2004 − Rev. P1
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
UDFN8, 4X3, 0.8P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except
whenOrder
stamped
Publication
Number:
NCP623/D
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON95010F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA.
DATE
05 FEB 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. O
Case Outline Number:
506DC
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