511BY

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN8 2x3, 0.5P
CASE 511BY
ISSUE O
1
SCALE 2:1
A
D
B
L
DATE 03 JUL 2013
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
PIN ONE
REFERENCE
0.10 C
ÎÎ
ÎÎ
ÎÎ
DETAIL A
ALTERNATE
CONSTRUCTIONS
E
ÎÎÎ
ÏÏÏ
ÎÎÎ
EXPOSED Cu
0.10 C TOP VIEW
0.10 C
0.08 C
NOTE 4
DETAIL B
A
DETAIL B
ALTERNATE
CONSTRUCTIONS
A3
A1
SIDE VIEW
C
0.10
D2
DETAIL A
1
4
M
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
MOLD CMPD
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
1
C A B
L
0.10
M
C A B
XXXXX
A
WL
Y
W
G
E2
8
5
8X
e
BOTTOM VIEW
b
0.10
0.05
M
M
C A B
C NOTE 3
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.40
1.60
3.00 BSC
1.80
2.00
0.50 BSC
0.25
0.35
−−−
0.15
RECOMMENDED
SOLDERING FOOTPRINT*
XXXXX
AWLYWG
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
1.66
8X
0.50
2.04 3.30
1
8X
0.50
PITCH
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON15833F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WDFN8, 2X3, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON15833F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA
DATE
03 JUL 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
June, 2013 − Rev. O
Case Outline Number:
511BY