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TERSIL
1-888-IN
5962-0623501, 5962-0623502
November 3, 2011
FN6472.2
500MHz Rail-to-Rail Amplifiers
Features
The 5962-0623501QPC, 5962-0623502QPC are fully DLA
SMD compliant parts and the SMD data sheets are available
on the DLA website
(http://www.landandmaritime.dla.mil/Programs/MilSpec/Doc
Search.aspx). The 5962-0623501QPC is electrically
equivalent to the EL8102 and the 5962-0623502QPC is
electrically equivalent to the EL8103, reference these data
sheets for additional information. These parts are single railto-rail amplifiers with a -3dB bandwidth of 500MHz and slew
rate of 600V/µs. Running off a very low 11mA supply current,
the
5962-0623501QPC, 5962-0623502QPC also feature inputs
that go to 0.15V below the VS- rail.
• 500MHz -3dB bandwidth
The 5962-0623501QPC includes a fast-acting
disable/power-down circuit. With a 25ns disable and a 200ns
enable, the 5962-0623501QPC is ideal for multiplexing
applications.
• Portable/hand-held products
The 5962-0623501QPC, 5962-0623502QPC are designed
for a number of general purpose video, communication,
instrumentation, and industrial applications. Both parts are
available in 8 Ld SBDIP. All are specified for operation over
the -55°C to +125°C temperature range.
• 600V/µs slew rate
• Low supply current = 11mA
• Supplies from 3V to 5.0V
• Rail-to-rail output
• Input to 0.15V below VS• Fast 25ns disable (5962-0623501QPC only)
Applications
• Video amplifiers
• Communications devices
Pinouts
5962-0623501QPC
(8 LD SBDIP)
TOP VIEW
IN- 2
Ordering Information
PART
NUMBER
PART
TEMP.
PKG.
MARKING RANGE (°C) PACKAGE DWG. #
8 ENABLE
NC 1
IN+ 3
+
VS- 4
7 VS+
6 OUT
5 NC
5962-0623501QPC 5962-0623 -55 to +125 8 Ld SBDIP D8.3
501QPC
5962-0623502QPC 5962-0623 -55 to +125 8 Ld SBDIP D8.3
502QPC
5962-0623502QPC
(8 LD SBDIP)
TOP VIEW
NC 1
IN- 2
IN+ 3
VS- 4
1
+
8
NC
7
VS+
6
OUT
5
NC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007, 2011. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
5962-0623501, 5962-0623502
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Supply Voltage from VS+ to VS-. . . . . . . . . . . . . . . . . . . . . . . . . 5.5V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to VS- -0.3V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V
Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60.5mW
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Ambient Operating Temperature . . . . . . . . . . . . . . .-55°C to +125°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are
at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
VS+ = 5V, VS- = GND, TA = +25°C, VCM = 2.5V, RL to 2.5V, AV = 1, Unless Otherwise Specified
DESCRIPTION
CONDITIONS
MIN
TYP
MAX
UNIT
INPUT CHARACTERISTICS
RIN
Input Resistance
CIN
Input Capacitance
Common Mode
3.5
M
0.5
pF
30
m
OUTPUT CHARACTERISTICS
ROUT
Output Resistance
AV = +1
ENABLE (5962-0623501QPC ONLY)
tEN
Enable Time
200
ns
tDS
Disable Time
25
ns
AV = +1, RF = 0, CL = 5pF
500
MHz
AV = -1, RF = 1k, CL = 5pF
140
MHz
AV = +2, RF = 1k, CL = 5pF
165
MHz
AV = +10, RF = 1k, CL = 5pF
18
MHz
AC PERFORMANCE
BW
-3dB Bandwidth
BW
±0.1dB Bandwidth
AV = +1, RF = 0, CL = 5pF
35
MHz
Peak
Peaking
AV = +1, RL = 1k, CL = 5pF
1
dB
GBWP
Gain Bandwidth Product
200
MHz
PM
Phase Margin
RL = 1k, CL = 5pF
55
°
SR
Slew Rate
AV = 2, RL = 100, VOUT = 0.5V to 4.5V
600
V/µs
tR
Rise Time
2.5VSTEP, 20% to 80%
4
ns
tF
Fall Time
2.5VSTEP, 20% to 80%
2
ns
OS
Overshoot
200mV step
10
%
tPD
Propagation Delay
200mV step
1
ns
tS
0.1% Settling Time
200mV step
15
ns
dG
Differential Gain
AV = +2, RF = 1k, RL = 150
0.01
%
dP
Differential Phase
AV = +2, RF = 1k, RL = 150
0.01
°
eN
Input Noise Voltage
f = 10kHz
12
nV/Hz
iN+
Positive Input Noise Current
f = 10kHz
1.7
pA/Hz
iN-
Negative Input Noise Current
f = 10kHz
1.3
pA/Hz
2
FN6472.2
November 3, 2011
5962-0623501, 5962-0623502
Pin Descriptions
PART
5962-0623501QPC
5962-0623502QPC
PIN NAME
1, 5
1, 5, 8
NC
Not connected
2
2
IN-
Inverting input
3
3
IN+
Non-inverting input
4
4
VS-
Negative power supply
6
6
OUT
Amplifier output
7
7
VS+
Positive power supply
8
FUNCTION
ENABLE
Enable and disable input
Simplified Schematic Diagram
VS+
I1
I2
R7
R6
Q5
R8
VBIAS1
Q6
Q7
R3
R1
IN+
Q1
R2
Q2
DIFFERENTIAL TO
SINGLE ENDED
DRIVE
GENERATOR
IN-
VBIAS2
Q3
OUT
Q4
Q8
R4
R5
R9
VS-
3
FN6472.2
November 3, 2011
5962-0623501, 5962-0623502
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1
-A-
D8.3 MIL-STD-1835 CDIP2-T8 (D-4, CONFIGURATION C)
LEAD FINISH
8 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
-DBASE
METAL
E
b1
M
(b)
M
-Bbbb S C A - B S
(c)
SECTION A-A
D S
D
BASE
PLANE
Q
S2
-C-
SEATING
PLANE
A
L
S1
eA
A A
b2
b
e
eA/2
c
aaa M C A - B S D S
ccc M C A - B S D S
NOTES:
INCHES
SYMBOL
MIN
MILLIMETERS
MAX
MIN
MAX
NOTES
A
-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.405
-
10.29
-
E
0.220
0.310
5.59
7.87
-
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1
0.005
-
0.13
-
6
S2
0.005
-
0.13
-
7

90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
bbb
-
0.030
-
0.76
-
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
N
8
8
5. Dimension Q shall be measured from the seating plane to the
base plane.
8
Rev. 0 4/94
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
4
FN6472.2
November 3, 2011
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