CRM2512-FT

MATERIAL DECLARATION SHEET
Material Number
Product Line
CRM2512-FT
Surface Mount Chip Resistor
Compliance Date
RoHS Compliant
No.
1
2
Construction
Element(subpart)
Body
Termination layer
2007-07-27
Yes
MSL
Homogeneous
Material
1
Homogeneous
Material\
Substances
Material
weight [mg]
Substrate
34.7438
Top conductor
0.6157
Side conductor
0.8142
Back conductor
0.3152
Resistor
0.3821
First encapsulating
0.3685
Overcoat
0.8454
Marking
0.0525
Plating (Middle)
Plating (Outer)
0.6872
1.0308
if applicable
aluminum oxide
silicon dioxide
magnesium oxide
silver
silver
lead oxide
chromium III
silver
ruthenium dioxide
silver
silicon dioxide
lead oxide
palladium
boron oxide
lead oxide
silicon dioxide
boron oxide
lead oxide
silicon dioxide
boron oxide
lead oxide
silicon dioxide
boron oxide
1344-28-1
7631-86-9
1309-48-4
7440-22-4
7440-22-4
1317-36-8
7440-47-3
7440-22-4
12036-10-1
7440-22-4
7631-86-9
1317-36-8
7440-05-3
1303-86-2
1317-36-8
7631-86-9
1303-86-2
1317-36-8
7631-86-9
1303-86-2
1317-36-8
7631-86-9
1303-86-2
nickel
7440-02-0
tin (matte)
7440-31-5
Total weight
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CASRN
Materials
Mass %
96
2
2
100
95
3
2
100
30
20
20
8.861
17
4.139.
29.5
60.5
10
29.5
60.5
10
29.5
60.5
10
100
100
Material Mass
% of total unit
wt.
Subpart
mass of
total wt.
(%)
80.54
2.06
5.82
0.89
1.17
95.6893
1.12
2.30
0.28
2.33
3.48
4.3110
39.8551
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MATERIAL DECLARATION SHEET
This Document was updated on:
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemption: 5 – lead in glass ... of electronic components.
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