CR0201

MATERIAL DECLARATION SHEET
Material Number
CR0201 Series
Product Line
Thick Film Chip Resistors
Compliance Date
04-01-2003
RoHS Compliant
Yes
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight
[mg]
1
Ceramic Substrate
Ceramic
0.140536
2
Conductor Layer
Thick Film
0.0062
3
Resistive Element
Thick Film
0.002774
4
Over Coating
Epoxy
0.003425
5
End Terminal
NI-CR
0.000599
6
7
Ni Plating
Sn Plating
Nickel
Tin
Total weight
0.009368
0.008357
0.171259
This Document was updated on: 2016-2-4
Homogeneous
Material\
CASRN
Substances
if applicable
Aluminum oxide
Silicon oxide
Silver
Bismuth
Barium
Silicon
Boron
Ruthenium oxide
Silver
Palladium
Lead
Epoxy
Nickel
Chromium
Nickel
Tin
1344-28-1
14808-60-7
7440-22-4
7440-69-9
7440-39-3
7440-21-3
7440-42-8
12036-10-1
7440-22-4
7440-05-3
7439-92-1
29690-82-2
7440-02-0
7440-47-3
7440-02-0
7440-31-5
Materials
Mass %
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
80%
20%
100%
100%
Material
Mass % of
total unit
wt.
78.78
3.28
3.54
0.02
0.02
0.02
0.02
0.41
0.65
0.24
0.32
2
0.28
0.07
5.47
4.88
Subpart
mass of
total wt.
(%)
82.06
3.62
1.62
2
0.35
5.47
4.88
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I
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