MATERIAL DECLARATION SHEET Material Number CR0201 Series Product Line Thick Film Chip Resistors Compliance Date 04-01-2003 RoHS Compliant Yes MSL 1 No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Ceramic Substrate Ceramic 0.140536 2 Conductor Layer Thick Film 0.0062 3 Resistive Element Thick Film 0.002774 4 Over Coating Epoxy 0.003425 5 End Terminal NI-CR 0.000599 6 7 Ni Plating Sn Plating Nickel Tin Total weight 0.009368 0.008357 0.171259 This Document was updated on: 2016-2-4 Homogeneous Material\ CASRN Substances if applicable Aluminum oxide Silicon oxide Silver Bismuth Barium Silicon Boron Ruthenium oxide Silver Palladium Lead Epoxy Nickel Chromium Nickel Tin 1344-28-1 14808-60-7 7440-22-4 7440-69-9 7440-39-3 7440-21-3 7440-42-8 12036-10-1 7440-22-4 7440-05-3 7439-92-1 29690-82-2 7440-02-0 7440-47-3 7440-02-0 7440-31-5 Materials Mass % 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 80% 20% 100% 100% Material Mass % of total unit wt. 78.78 3.28 3.54 0.02 0.02 0.02 0.02 0.41 0.65 0.24 0.32 2 0.28 0.07 5.47 4.88 Subpart mass of total wt. (%) 82.06 3.62 1.62 2 0.35 5.47 4.88 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1