CR0402

MATERIAL DECLARATION SHEET
Material Number
CR0402 Series
Product Line
Thick Film Chip Resistors
Compliance Date
04-01-2003
RoHS Compliant
Yes
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight
[mg]
1
Ceramic
Substrate
Ceramic
0.42805
2
Conductor Layer
Thick Film
0.01078
3
Resistive Element
Thick Film
Resistor
0.00842
4
Over Coating
Epoxy
0.01043
5
End Terminal
NI-CR
0.00185
6
7
Ni Plating
Sn Plating
Nickel
Tin
Total weight
0.02855
0.02547
0.51355
This Document was updated on: 2016-2-4
Homogeneous
Material\
CASRN
Substances
if applicable
Aluminum oxide
Silicon dioxide
Silver
Bismuth
Barium
Silicon
Boron
Ruthenium oxide
Silver
Palladium
Lead
Epoxy
Nickel
Chromium
Nickel
Tin
1344-28-1
14808-60-7
7440-22-4
7440-69-9
7440-39-3
7440-21-3
7440-42-8
12036-10-1
7440-22-4
7440-05-3
7439-92-1
29690-82-2
7440-02-0
7440-47-3
7440-02-0
7440-31-5
Materials
Mass %
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
80%
20%
100%
100%
Material
Mass % of
total unit
wt.
80.02
3.33
2.02
0.02
0.02
0.02
0.02
0.41
0.66
0.24
0.33
2.03
0.29
0.07
5.56
4.96
Subpart
mass of
total wt.
(%)
83.35
2.1
1.64
2.03
0.36
5.56
4.96
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I
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