MATERIAL DECLARATION SHEET Material Number CR0603 Series Product Line Thick Film Chip Resistors Compliance Date 04-01-2003 RoHS Compliant Yes MSL 1 Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Ceramic Substrate Ceramic 1.662 2 Conductor Layer Thick Film Conductor 0.045 3 Resistive Element Thick Film Resistor 0.026 4 5 Over Coating Marking Epoxy Epoxy 0.03 0.003 6 End Terminal NI-CR 0.003 7 8 Ni Plating Sn Plating Nickel Tin Total weight 0.088 0.078 1.935 No. Homogeneous Material\ Substances Aluminum oxide Silicon dioxide Silver Bismuth Barium Silicon Boron Ruthenium dioxide Silver Palladium Lead Epoxy Epoxy Nickel Chromium Nickel Tin CASRN if applicable 1344-28-1 14808-60-7 7440-22-4 7440-69-9 7440-39-3 7440-21-3 7440-42-8 12036-10-1 7440-22-4 7440-05-3 7439-92-1 29690-82-2 25085-99-8 7440-02-0 7440-47-3 7440-02-0 7440-31-5 Materials Mass % 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 100% 80% 20% 100% 100% Material Mass % of total unit wt. 82.49 3.44 2.23 0.02 0.02 0.02 0.02 0.33 0.53 0.2 0.26 1.57 0.16 0.1 0.03 4.54 4.04 Subpart mass of total wt. (%) 85.93 2.31 1.32 1.57 0.16 0.13 4.54 4.04 This Document was updated on: 2016-2-5 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1