CR0603

MATERIAL DECLARATION SHEET
Material Number
CR0603 Series
Product Line
Thick Film Chip Resistors
Compliance Date
04-01-2003
RoHS Compliant
Yes
MSL
1
Construction
Element(subpart)
Homogeneous
Material
Material
weight
[mg]
1
Ceramic Substrate
Ceramic
1.662
2
Conductor Layer
Thick Film
Conductor
0.045
3
Resistive Element
Thick Film
Resistor
0.026
4
5
Over Coating
Marking
Epoxy
Epoxy
0.03
0.003
6
End Terminal
NI-CR
0.003
7
8
Ni Plating
Sn Plating
Nickel
Tin
Total weight
0.088
0.078
1.935
No.
Homogeneous
Material\
Substances
Aluminum oxide
Silicon dioxide
Silver
Bismuth
Barium
Silicon
Boron
Ruthenium dioxide
Silver
Palladium
Lead
Epoxy
Epoxy
Nickel
Chromium
Nickel
Tin
CASRN
if applicable
1344-28-1
14808-60-7
7440-22-4
7440-69-9
7440-39-3
7440-21-3
7440-42-8
12036-10-1
7440-22-4
7440-05-3
7439-92-1
29690-82-2
25085-99-8
7440-02-0
7440-47-3
7440-02-0
7440-31-5
Materials
Mass %
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
100%
80%
20%
100%
100%
Material
Mass %
of total
unit wt.
82.49
3.44
2.23
0.02
0.02
0.02
0.02
0.33
0.53
0.2
0.26
1.57
0.16
0.1
0.03
4.54
4.04
Subpart
mass of
total wt.
(%)
85.93
2.31
1.32
1.57
0.16
0.13
4.54
4.04
This Document was updated on: 2016-2-5
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I
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