CR0805

MATERIAL DECLARATION SHEET
Material Number
CR0805 Series
Product Line
Compliance Date
Thick Film Chip Resistors
04-01-2003
RoHS Compliant
Yes
MSL
1
Construction
Element (subpart)
Homogeneous
Material
Material
weight [g]
1
Ceramic Substrate
Ceramic
0.00382
2
Conductor Layer
Thick Film
Conductor
0.000083
3
Resistive Element
Thick Film
Resistor
0.000043
4
5
Over Coating
Marking
Epoxy
Epoxy
0.000067
0.0000036
End Terminal
NI-CR
0.0000034
Ni Plating
Nickel
Sn Plating
Tin
Total weight
0.00014
0.00013
0.00429
No.
6
7
8
Homogeneous
Material\
CASRN
Materials
Mass %
Material
Mass % of
total unit wt.
Substances
Aluminum oxide
Silicon dioxide
Silver
Bismuth
Barium
Silicon
Boron
Ruthenium dioxide
Silver
Palladium
Lead
Epoxy
Epoxy
Nickel
Chromium
Nickel
1344-28-1
14808-60-7
7440-22-4
7440-69-9
7440-39-3
7440-21-3
7440-42-8
12036-10-1
7440-22-4
7440-05-3
7439-92-1
29690-82-2
25085-99-8
7440-02-0
7440-47-3
7440-02-0
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
100%
80%
20%
100%
85.56
3.57
1.84
0.02
0.02
0.02
0.02
0.25
0.4
0.15
0.2
1.55
0.08
0.06
0.02
3.29
Tin
7440-31-5
100%
2.94
if applicable
Subpart mass
of total wt. (%)
89.13
1.92
1.01
1.55
0.08
0.08
3.29
2.94
This Document was updated on: 2016-2-5
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I.
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