CR2010

MATERIAL DECLARATION SHEET
Material Number
CR2010 series
Product Line
Thick Film Chip Resistors
Compliance Date
04-01-2003
RoHS Compliant
Yes
MSL
1
No.
Construction
Element (subpart)
Homogeneous
Material
Material
weight [g]
1
Ceramic Substrate
Ceramic
0.02036
2
Conductor Layer
Thick Film
Conductor
0.00034
3
Resistive Element
Thick Film
Resistor
0.00027
4
Over Coating
Epoxy
5
Marking
Epoxy
0.0004
0.00002
End Terminal
NI-CR
0.00001
7
Ni Plating
Nickel
8
Sn Plating
Tin
0.00058
0.00052
0.0225
6
Total weight
Homogeneous
Material\Substances
CASRN
Materials
Mass %
Material
Mass % of
total unit wt.
Aluminum oxide
Silicon dioxide
Silver
Bismuth
Barium
Silicon
Boron
Ruthenium dioxide
Silver
Palladium
Lead
Epoxy
1344-28-1
14808-60-7
7440-22-4
7440-69-9
7440-39-3
7440-21-3
7440-42-8
12036-10-1
7440-22-4
7440-05-3
7439-92-1
29690-82-2
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
86.85
3.62
1.43
0.02
0.02
0.02
0.02
0.3
0.48
0.18
0.24
1.75
Epoxy
Nickel
Chromium
Nickel
25085-99-8
7440-02-0
7440-47-3
7440-02-0
100%
80%
20%
100%
0.11
0.03
0.01
2.59
0.11
Tin
7440-31-5
100%
2.32
2.32
Subpart
mass of total
wt. (%)
90.47
1.51
1.21
1.75
0.04
2.59
This Document was updated on: 2014/Feb/5
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I.
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