PANASONIC EXC24CP221U

2 mode Noise Filters
2 mode Noise Filters
Type:
EXC24CB/CP
EXC24CN
■ Features
● Burst/radiation noise filtering for audio circuits
● The optimally magnetic-coupled ferrite beads allow for
the filtering of both common and normal mode noises
● The strong multi-layer structure provides high resistance
to reflow soldering heat and a high mounting reliability
● Magnetic shield type
● High Impedance : 220 to 1 k액（EXC24CB type)
● Low Resistance Value : 0.4 액 max. (EXC24CP type)
● High Impedance : 600 액,
Low Resistance Value : 0.9 액 max. (EXC24CN type)
■ Recommended Applications
● Receiver lines, speaker lines, microphone lines and
headset of mobile phones.
● Audio signal lines of Portable audio equipment, PCs,
PDAs.
■ Explanation of Part Numbers
● EXC24CB/CP Type
1
2
3
4
5
6
7
8
9
10
11
E
X
C
2
4
C
B
1
0
2
U
Size
Number of
Terminals
Product Code
Noise Filter
Code Dimensions(mm)
2
4 Terminals
Coupled
type
C
1.25 ҂ 1.00 ҂ 0.50
(L) ҂ (W) ҂ (H)
Type Characteristics
Nominal Impedance
Form
The first two digits are
significant figure of
impedance value, and the
third one denotes the
number of zeros following
B High Impedance Type
P Low DCR Type
12
Suffix
Code
Packing
U
Embossed Carrier Taping
● EXC24CN Type
1
2
3
4
5
6
7
8
9
10
11
E
X
C
2
4
C
N
6
0
1
X
Size
Number of
Terminals
Product Code
Noise Filter
Code Dimensions(mm)
2
4 Terminals
C
Coupled
type
Type Characteristics
N
Nominal Impedance
High Impedance Type
and Low DCR Type
1.25 ҂ 1.00 ҂ 0.50
(L) ҂ (W) ҂ (H)
■ Construction
Form
The first two digits are
significant figure of
impedance value, and the
third one denotes the
number of zeros following
12
Suffix
Code
Packing
X
Pressed Carrier Taping
■ Dimensions in mm (not to scale)
F
D
Ferrite
C
E
A
B
Electrode
Inner Conductor
Type
(inches)
Dimensions (mm)
A
B
C
D
E
F
EXC24C 1.00±0.15 1.25±0.15 0.50±0.10 0.20±0.15 0.65±0.10 0.35±0.10
(0504)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mass
(Weight)
[mg/pc.]
3
Feb. 2008
2 mode Noise Filters
■ Circuit Configuration (No Polarity)
4
3
4
3
1
2
1
2
■ Ratings
Impedance (Open mode)
Part Number
(액) at 100 MHz
EXC24CP121U
120
EXC24CP221U
220
EXC24CB221U
220
EXC24CB102U
1000
Rated Voltage
(V DC)
Tolerance(%)
±25
DC Resistance
(액) max.
500
0.3
350
0.4
100
0.7
50
1.5
5
Impedance (Common mode)
Part Number
Rated Current
(mA DC)
(액) at 100 MHz
Tolerance(%)
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Resistance
(액) max.
600
±25
5
200
0.9
EXC24CN601X
■ Impedance Characteristics (Typical)
● EXC24CP221U
500
500
400
400
Normal mode
Impedance(액)
Impedance(액)
● EXC24CP121U
300
Open mode
200
100
1
10
100
1000
Frequency(MHz)
100
Common mode
0
1
10
100
1000
Frequency(MHz)
10000
● EXC24CB102U
1200
500
400
1000
Open mode
Impedance(액)
Impedance(액)
200
10000
● EXC24CB221U
300
Normal mode
200
100
0
Open mode
300
Common mode
0
Normal mode
100
1000
Frequency(MHz)
Common mode
600
400
0
10
Normal mode
200
Common mode
1
Open mode
800
10000
1
10
100
1000
Frequency(MHz)
10000
● Measurement Circuit
(A)Open Mode
(B)Common Mode
Z
(C)Normal Mode
Z
Z
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2008
2 mode Noise Filters
■ Impedance Characteristics (Typical)
● EXC24CN601X
● Measurement Circuit
1600
(A)Open Mode
Differential mode
(B)Common Mode
Impedance(액)
1400
1200
Open mode
1000
Z
800
Z
600
400
200
–
Common mode
1
10
100
1000
Frequency(MHz)
(C)Differential Mode
10000
Z
■ Packaging Methods (Taping)
● Standard Quantity
Part Number
EXC24CP첸첸첸U
EXC24CB첸첸첸U
EXC24CN첸첸첸X
Kind of Taping
Pitch (P1)
Quantity
Embossed Carrier Taping
4 mm
5000 pcs./reel
Pressed Carrier Taping
2 mm
10000 pcs./reel
● Embossed Carrier Taping
Sprocket hole φD0
Compartment
P0 P2
φD0
F
B
W
B
F E
E
Sprocket hole
A
P1
t2
P2
A
t2
P0
P1
Chip component
Chip component
W
t1
● Pressed Carrier Taping
Tape running direction
Compartment
Tape running direction
● Taping Reel
T
φB
φC
φD
E
φA
W
t
Embossed Carrier Dimensions (mm)
Part Number
A
B
W
EXC24CP첸첸첸U
1.20±0.15 1.45±0.15 8.0±0.2
EXC24CB첸첸첸U
F
φB
60.0±1.0
P1
3.5±0.1 1.75±0.10 4.0±0.1
Pressed Carrier Dimensions (mm)
Part Number
A
B
W
EXC24CN첸첸첸X 1.20±0.15 1.45±0.15 8.0±0.2
Standard Reel Dimensions (mm)
Part Number
φA
EXC24C첸첸첸첸U 180.0±3.0
E
P2
P0
2.0±0.1
4.0±0.1
F
E
P1
3.5±0.1 1.75±0.10 2.0±0.1
φC
13.0±0.5
φD
21.0±0.8
E
2.0±0.5
P2
2.0±0.1
φD0
t1
t2
1.5±0.1 0.25±0.05 0.90±0.15
P0
4.0±0.1
W
9.0±0.3
t2
φD0
1.5±0.1 0.68±0.10
T
11.4±1.5
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
t
1.2±0.2
Feb. 2008
2 mode Noise Filters
■ Recommended Land Pattern Design
B
F
E
D
E
C
D
A
Dimension (mm)
A
1.50 to 1.90
B
1.10
C
0.50
D
0.50 to 0.70
E
0.40
F
0.30
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn-37Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 10 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temperature
Time
Preheating
150 °C to 170 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. When possible, do not mount 2 mode Noise Filters (hereafter called the filters) by flow soldering. It is highly
possible that flow soldering may cause bridges between the electrodes.
2. Use rosin-based flux or halogen-free flux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
4. Do not apply shock to the filters or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies
may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle
with care.
5. Store the filters in a location with a temperature ranging from −5 °C to +40 °C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
6. Use the filters within half a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jul. 2008
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Jan. 2008
– EL113 –