4100T

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V SC
AV ER OM
AI SIO PL
LA N IA
BL S NT
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Features
RoHS compliant* (see How to Order
“Termination” option)
■ Custom circuits available per factory
*R
■
For information on thin film applications,
download Bourns’ Thin Film Application
Note.
4100T - Thin Film Molded DIP
Environmental Characteristics
TESTS PER MIL-STD-202........ ∆R MAX.
Thermal Shock .............................. 0.1 %
Low Temperature Operation ....... 0.25 %
Short Time Overload ..................... 0.1 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Mechanical Shock....................... 0.25 %
Life ................................................ 0.5 %
High Temperature Storage ............ 0.2 %
Low Temperature Storage............. 0.1 %
Physical Characteristics
Lead Frame Material
..........................Copper, solder coated
Body Material Flammability
...........................Conforms to UL94V-0
Body Material ..................Novolac Epoxy
Package Power Temp. Derating Curve
(
)
3.00
2.50
4118T
2.25
4116T
2.00
4114T
.89 ± .25
(.035 ± .010)
TYP.
1.75
Consult factory for other available options.
4.57 + .12/ - .28
(.180 + .005/ - .011)
8.40
MAX.
(.331)
1.25
4108T
1.00
0
25
70
125
150
AMBIENT TEMPERATURE ( ° C )
2.54 ± .25
(.100 ± .010*)
TYP.
NON-ACCUM.
RESISTANCE
CODE (4 DIGIT)
PIN ONE
INDICATOR
CIRCUIT
TC CODE
4116T-2-2203BC
YYWW
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.65 + .12/ - .07
(.065 + .005/ - .003)
7.87 ± .25
(.310 ± .010)
TO OUTSIDE
WHEN PINS
ARE PARALLEL
Typical Part Marking
Represents total content. Layout may vary.
2.03 ± .12
(.080 ± .005)
.438 ± .050
TYP.
(.019 ± .002)
Package Power Ratings at 70 °C
4108T ......................................1.09 watts
4114T ......................................2.00 watts
4116T ......................................2.25 watts
4118T ......................................2.50 watts
4120T ......................................2.80 watts
41 16 T - 2 - 2222 F A B __
Model
(41 = Molded Dip)
Number of Pins
Physical Config.
•T = Thin Film
Electrical Configuration
•2 = Bussed
•1 = Isolated
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •B = ±0.1% to R1
•D = ±0.5% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
27.05
MAX.
(1.065)
24.51
MAX.
(.965)
21.97
MAX.
(.865)
19.43
MAX.
(.765)
11.81
(.465)
MAX.
1.50
PART
NUMBER
How To Order
Product Dimensions
.635
(.025)
PIN #1 REF.
4120T
2.75
WATTS
Product Characteristics
Resistance Range ........50 to 100K ohms
Resistance Tolerance
..........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range
.................................-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
6.71 ± .10
(.264 ± .004)
.254 ± .050
(.010 ± .002)
8.64 ± .50
(.340 ± .020)
ABSOLUTE
TOLERANCE CODE
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
DATE CODE
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
MANUFACTURER'S
TRADEMARK
Isolated Resistors (1 Circuit)
Available in 8, 14, 16, 18, and 20 Pin
14
8
1
7
Bussed Resistors (2 Circuit)
Available in 8, 14, 16, 18, and 20 Pin
14
8
1
7
These models incorporate 4, 7, 8, 9, or
10 thin-film resistors of equal value,
each connected between a separate pin.
These models incorporate 7, 13, 15, 17,
or 19 thin-film resistors of equal value,
each connected by a common pin.
Power Rating per Resistor..........0.2 watt
Resistance Range .......50 to 100K ohms
Power Rating per Resistor........0.12 watt
Resistance Range .........50 to 50K ohms
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
REV. 09/07