1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin SHIELDING: BRASS MATT TIN PLATED A ENVIRONMENTAL OPERATING TEMPERATURE: -20 up to +85°C COMPLIANCE: RoHS & LEAD FREE AS PER DIRECTIVE 2002/95/EC HALOGEN FREE COMPLIANT AS PER IEC 61249-2-21 ELECTRICAL CURRENT RATING: - PIN 1 & PIN 4 (Vbus & corresponding ground PIN) 1.8A Max - OTHER PINS 0.25 A Max WORKING VOLTAGE: 30Vac DIELECTRIC WITHSTANDING VOLTAGE: 100Vac/min INSULATION RESISTANCE: > 100MΩ CONTACT RESISTANCE: - PIN 1 & PIN 4: 30mΩ Max - OTHER PINS: 50mΩ Max B STANDARD CERTIFIED: E323964 / MODEL NUMBER 692122030100 MECHANICAL INSERTION FORCE: 35.0N Max EXTRACTION FORCE: 10.0N min QUALITY CLASS: 5000 MATING CYCLES SOLDERING REFLOW PROCESS AS PER JEDEC J-STD-020D PACKAGING TAPE & REEL C PCB LAYOUT * - COMPONENT VIEW RoHS Compliant * NOTE: THE RECOMMENDED PCB LAYOUT IS FOR AN OPTIMIZED RETENTION FORCE OF CONNECTOR ON PCB BUT IT IMPLIES INSERTION FORCE THAT A LOT OF PICK AND PLACE MACHINES ARE NOT ABLE TO HANDLE. THEREFORE IT MIGHT BE NECESSARY TO DRILL BIGGER HOLES FOR THE CLIPS. PLEASE CHECK THIS CARFULLY. PROJECTION: GENERAL TOLERANCE G 01-APR-14 SOLDERING QL F 17-SEP-13 CHARACTERISTICS QL E 10-SEP-13 DIM UPDATE QL D 09-NOV-11 STENCIL GG C 21-SEP-11 NOTE GG B 10-MAY-11 04-AUG-10 UL PDF GG JP SCALE: FILE BY DRAW: JOE A REV DATE .X = +/- 0.2 .XX = +/- 0.15 APPROVAL: RJ UNIT: MM SHEET: 1/3 DESCRIPTION: USB 3.0 HORIZONTAL TYPE A SIZE WERI PART NO: 692 122 030 100 A4 D 1 2 3 4 5 A B C RoHS Compliant PROJECTION: G F .X = +/- 0.2 .XX = +/- 0.15 E D C APPROVAL: RJ B A REV GENERAL TOLERANCE DATE FILE BY UNIT: MM DESCRIPTION: USB 3.0 HORIZONTAL TYPE A SIZE SCALE: SHEET: 2/3 WERI PART NO: 692 122 030 100 A4 DRAW: JOE D 1 2 3 Stencil information for Through Hole Reflow soldering 4 5 PCB cross section A Hole Volume Pin Volume 7 3,5 Free volume for solder paste 1,8 B 2 2,15 0,9 Theoritical Formula for Through Hole pins Volume of the stencil aperture = (Hole volume - Pin volume) x 2 or Volume of solder paste = (Hole volume - Pin volume) x 2 2,6 1,96 Stencil Stencil Thickness: 150 µm STENCIL LAYOUT * - COMPONENT VIEW PCB PCB thickness: 1.6mm RoHS Compliant * NOTE: SEE PCB LAYOUT PAGE 1/3 FOR MISSING DIMENSIONS PROJECTION: G F GENERAL TOLERANCE .X = +/- 0.2 .XX = +/- 0.15 E D C APPROVAL: RJ B UNIT: MM DESCRIPTION: USB 3.0 HORIZONTAL TYPE A SIZE WERI PART NO: 692 122 030 100 A4 SCALE: SHEET: 3/3 A REV C DATE FILE BY DRAW: JOE D