download 692122030100.pdf

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TECHNICAL CHARACTERISTICS
MATERIAL
INSULATOR: LCP
FLAMABILITY RATING: UL94-V0
COLOR: BLUE
CONTACT MATERIAL: PHOSPHORE BRONZE
CONTACT TYPE: STAMPED
CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni
CONTACT AREA 0.76 µm Gold
SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
SHIELDING: BRASS MATT TIN PLATED
A
ENVIRONMENTAL
OPERATING TEMPERATURE: -20 up to +85°C
COMPLIANCE: RoHS & LEAD FREE AS PER DIRECTIVE 2002/95/EC
HALOGEN FREE COMPLIANT AS PER IEC 61249-2-21
ELECTRICAL
CURRENT RATING:
- PIN 1 & PIN 4 (Vbus & corresponding ground PIN) 1.8A Max
- OTHER PINS 0.25 A Max
WORKING VOLTAGE: 30Vac
DIELECTRIC WITHSTANDING VOLTAGE: 100Vac/min
INSULATION RESISTANCE: > 100MΩ
CONTACT RESISTANCE:
- PIN 1 & PIN 4: 30mΩ Max
- OTHER PINS: 50mΩ Max
B
STANDARD
CERTIFIED: E323964 / MODEL NUMBER 692122030100
MECHANICAL
INSERTION FORCE: 35.0N Max
EXTRACTION FORCE: 10.0N min
QUALITY CLASS: 5000 MATING CYCLES
SOLDERING
REFLOW PROCESS AS PER JEDEC J-STD-020D
PACKAGING
TAPE & REEL
C
PCB LAYOUT * - COMPONENT VIEW
RoHS Compliant
* NOTE: THE RECOMMENDED PCB LAYOUT IS FOR AN OPTIMIZED RETENTION FORCE OF CONNECTOR ON PCB BUT IT IMPLIES INSERTION FORCE THAT A LOT OF PICK AND PLACE MACHINES ARE NOT ABLE TO HANDLE. THEREFORE IT MIGHT BE NECESSARY TO
DRILL BIGGER HOLES FOR THE CLIPS. PLEASE CHECK THIS CARFULLY.
PROJECTION:
GENERAL TOLERANCE
G
01-APR-14
SOLDERING
QL
F
17-SEP-13
CHARACTERISTICS
QL
E
10-SEP-13
DIM UPDATE
QL
D
09-NOV-11
STENCIL
GG
C
21-SEP-11
NOTE
GG
B
10-MAY-11
04-AUG-10
UL
PDF
GG
JP
SCALE:
FILE
BY
DRAW: JOE
A
REV
DATE
.X = +/- 0.2
.XX = +/- 0.15
APPROVAL: RJ
UNIT: MM
SHEET: 1/3
DESCRIPTION: USB 3.0 HORIZONTAL TYPE A
SIZE
WERI PART NO: 692 122 030 100
A4
D
1
2
3
4
5
A
B
C
RoHS Compliant
PROJECTION:
G
F
.X = +/- 0.2
.XX = +/- 0.15
E
D
C
APPROVAL: RJ
B
A
REV
GENERAL TOLERANCE
DATE
FILE
BY
UNIT: MM
DESCRIPTION: USB 3.0 HORIZONTAL TYPE A
SIZE
SCALE:
SHEET: 2/3
WERI PART NO: 692 122 030 100
A4
DRAW: JOE
D
1
2
3
Stencil information for Through Hole Reflow soldering
4
5
PCB cross section
A
Hole
Volume
Pin Volume
7
3,5
Free volume for solder paste
1,8
B
2
2,15
0,9
Theoritical Formula for Through Hole pins
Volume of the stencil aperture = (Hole volume - Pin volume) x 2
or
Volume of solder paste = (Hole volume - Pin volume) x 2
2,6
1,96
Stencil
Stencil Thickness: 150 µm
STENCIL LAYOUT * - COMPONENT VIEW
PCB
PCB thickness: 1.6mm
RoHS Compliant
* NOTE: SEE PCB LAYOUT PAGE 1/3 FOR MISSING DIMENSIONS
PROJECTION:
G
F
GENERAL TOLERANCE
.X = +/- 0.2
.XX = +/- 0.15
E
D
C
APPROVAL: RJ
B
UNIT: MM
DESCRIPTION: USB 3.0 HORIZONTAL TYPE A
SIZE
WERI PART NO: 692 122 030 100
A4
SCALE:
SHEET: 3/3
A
REV
C
DATE
FILE
BY
DRAW: JOE
D
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