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CC3200
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
CC3200 SimpleLink™ Wi-Fi® and Internet-of-Things Solution, a Single-Chip Wireless MCU
1 Device Overview
1.1
Features
1
• CC3200 SimpleLink Wi-Fi—Consists of
Applications Microcontroller, Wi-Fi Network
Processor, and Power-Management Subsystems
• Wi-Fi CERTIFIED™ Chip
• Applications Microcontroller Subsystem
– ARM® Cortex®-M4 Core at 80 MHz
– Embedded Memory
• RAM (Up to 256KB)
• External Serial Flash Bootloader, and
Peripheral Drivers in ROM
– 32-Channel Direct Memory Access (μDMA)
– Hardware Crypto Engine for Advanced Fast
Security, Including
• AES, DES, and 3DES
• SHA2 and MD5
• CRC and Checksum
– 8-Bit Parallel Camera Interface
– 1 Multichannel Audio Serial Port (McASP)
Interface with Support for Two I2S Channels
– 1 SD/MMC Interface
– 2 Universal Asynchronous Receivers and
Transmitters (UARTs)
– 1 Serial Peripheral Interface (SPI)
– 1 Inter-Integrated Circuit (I2C)
– 4 General-Purpose Timers with 16-Bit PulseWidth Modulation (PWM) Mode
– 1 Watchdog Timer
– 4-Channel 12-Bit Analog-to-Digital Converters
(ADCs)
– Up to 27 Individually Programmable, Multiplexed
GPIO Pins
• Dedicated External SPI Interface for Serial Flash
• Wi-Fi Network Processor Subsystem
– Featuring Wi-Fi Internet-On-a-Chip™
– Dedicated ARM MCU
Completely Offloads Wi-Fi and Internet
Protocols from the Application Microcontroller
– Wi-Fi and Internet Protocols in ROM
– 802.11 b/g/n Radio, Baseband, Medium Access
Control (MAC), Wi-Fi Driver, and Supplicant
– TCP/IP Stack
• Industry-Standard BSD Socket Application
Programming Interfaces (APIs)
• 8 Simultaneous TCP or UDP Sockets
• 2 Simultaneous TLS and SSL Sockets
– Powerful Crypto Engine for Fast, Secure Wi-Fi
and Internet Connections with 256-Bit AES
Encryption for TLS and SSL Connections
– Station, AP, and Wi-Fi Direct® Modes
– WPA2 Personal and Enterprise Security
– SimpleLink Connection Manager for
Autonomous and Fast Wi-Fi Connections
– SmartConfig™ Technology, AP Mode, and
WPS2 for Easy and Flexible Wi-Fi Provisioning
– TX Power
• 18.0 dBm @ 1 DSSS
• 14.5 dBm @ 54 OFDM
– RX Sensitivity
• –95.7 dBm @ 1 DSSS
• –74.0 dBm @ 54 OFDM
– Application Throughput
• UDP: 16 Mbps
• TCP: 13 Mbps
• Power-Management Subsystem
– Integrated DC-DC Supports a Wide Range of
Supply Voltage:
• VBAT Wide-Voltage Mode: 2.1 to 3.6 V
• VIO is Always Tied with VBAT
• Preregulated 1.85-V Mode
– Advanced Low-Power Modes
• Hibernate: 4 µA
• Low-Power Deep Sleep (LPDS): 250 µA
• RX Traffic (MCU Active): 59 mA @
54 OFDM
• TX Traffic (MCU Active): 229 mA @
54 OFDM, Maximum Power
• Idle Connected (MCU in LPDS):
825 µA @ DTIM = 1
• Clock Source
– 40.0-MHz Crystal with Internal Oscillator
– 32.768-kHz Crystal or External RTC Clock
• Package and Operating Temperature
– 0.5-mm Pitch, 64-Pin, 9-mm × 9-mm QFN
– Ambient Temperature Range: –40°C to 85°C
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC3200
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
1.2
•
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Applications
For Internet-of-Things applications, such as:
– Cloud Connectivity
– Home Automation
– Home Appliances
– Access Control
– Security Systems
– Smart Energy
1.3
–
–
–
–
–
Internet Gateway
Industrial Control
Smart Plug and Metering
Wireless Audio
IP Network Sensor Nodes
Description
Start your design with the industry’s first Wi-Fi CERTIFIED single-chip microcontroller unit (MCU) with
built-in Wi-Fi connectivity. Created for the Internet of Things (IoT), the SimpleLink CC3200 device is a
wireless MCU that integrates a high-performance ARM Cortex-M4 MCU, allowing customers to develop an
entire application with a single IC. With on-chip Wi-Fi, Internet, and robust security protocols, no prior WiFi experience is required for faster development. The CC3200 device is a complete platform solution
including software, sample applications, tools, user and programming guides, reference designs, and the
TI E2E™ support community. The device is available in a QFN package that is easy to layout.
The applications MCU subsystem contains an industry-standard ARM Cortex-M4 core running at 80 MHz.
The device includes a wide variety of peripherals, including a fast parallel camera interface, I2S, SD/MMC,
UART, SPI, I2C, and four-channel ADC. The CC3200 family includes flexible embedded RAM for code
and data and ROM with external serial flash bootloader and peripheral drivers.
The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-Chip and contains an additional
dedicated ARM MCU that completely offloads the applications MCU. This subsystem includes an 802.11
b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with
256-bit encryption. The CC3200 device supports Station, Access Point, and Wi-Fi Direct modes. The
device also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi Internet-on-a-chip
includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols.
The power-management subsystem includes integrated DC-DC converters supporting a wide range of
supply voltages. This subsystem enables low-power consumption modes, such as the hibernate with RTC
mode requiring less than 4 μA of current.
Device Information (1)
PART NUMBER
CC3200R1MXRGCR/T (2)
(1)
(2)
2
PACKAGE
BODY SIZE
QFN (64)
9.0 mm x 9.0 mm
For all available packages, see the orderable addendum at the end of the datasheet.
X = 1 (128KB RAM) or 2 (256KB RAM)
Device Overview
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1.4
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
Functional Block Diagram
Figure 1-1 shows the CC3200 hardware overview.
Figure 1-1. CC3200 Hardware Overview
Figure 1-2 shows an overview of the CC3200 embedded software.
User Application
ARM Cortex-M4 80 MHz Processor
Internet Protocols
TLS/SSL
Embedded Internet
TCP/IP
Supplicant
Wi-Fi Driver
Wi-Fi MAC
Embedded Wi-Fi
Wi-Fi Baseband
Wi-Fi Radio
ARM Processor (Wi-Fi Network Processor)
Figure 1-2. CC3200 Embedded Software Overview
Device Overview
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
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Figure 1-3 shows a block diagram of the CC3200 device.
CC3200 MCU + Wi-Fi Network Processor
I2C
Wi-Fi Network Processor
Figure 1-3. CC3200 Functional Block Diagram
4
Device Overview
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
Table of Contents
1
2
3
Device Overview ......................................... 1
Timing and Switching Characteristics ............... 34
Features .............................................. 1
1.2
Applications ........................................... 2
5.1
Overview
1.3
Description ............................................ 2
5.2
Functional Block Diagram ........................... 48
1.4
5
Detailed Description ................................... 48
............................................
48
Functional Block Diagram ............................ 3
5.3
ARM Cortex-M4 Processor Core Subsystem ....... 48
Revision History ......................................... 5
Terminal Configuration and Functions .............. 6
5.4
CC3200 Device Encryption
5.5
Wi-Fi Network Processor Subsystem ............... 50
Pin Attributes and Pin Multiplexing ................... 6
Drive Strength and Reset States for Analog-Digital
Multiplexed Pins ..................................... 26
Pad State After Application of Power To Chip But
Prior To Reset Release ............................. 26
5.6
Power-Management Subsystem .................... 51
5.7
Low-Power Operating Mode ........................ 51
5.8
Memory .............................................. 53
5.9
Boot Modes.......................................... 55
3.1
3.2
3.3
4
4.11
1.1
Specifications ........................................... 27
4.1
Absolute Maximum Ratings ......................... 27
4.2
Handling Ratings .................................... 27
4.3
....................................
Recommended Operating Conditions ...............
Brown-Out and Black-Out ...........................
Electrical Characteristics (3.3 V, 25°C) .............
WLAN Receiver Characteristics ....................
WLAN Transmitter Characteristics ..................
Current Consumption ...............................
Thermal Characteristics for RGC Package .........
Power-On Hours
4.4
4.5
4.6
4.7
4.8
4.9
4.10
Applications and Implementation ................... 58
7
Device and Documentation Support ............... 62
6.1
27
28
29
31
31
34
49
6
27
31
.........................
8
Application Information .............................. 58
7.1
Device Support ...................................... 62
7.2
Documentation Support ............................. 63
7.3
Community Resources .............................. 63
7.4
Trademarks.......................................... 63
7.5
Electrostatic Discharge Caution ..................... 63
7.6
Glossary ............................................. 63
Mechanical Packaging and Orderable
Information .............................................. 64
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (August 2014) to Revision F
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Page
Added Wi-Fi CERTIFIED ............................................................................................................ 1
Added application throughput in Section 1.1, Features ......................................................................... 1
Changed LPDS drain value from 120 µA in Section 1.1, Features ............................................................ 1
Changed idle connected from 695 µA in Section 1.1, Features ............................................................... 1
Added note defining X in part number in Device Information table ............................................................ 2
Changed part number in Device Information table from CC3200 .............................................................. 2
Changed SDCARD signal names for pins 6, 7, 8, and 64 in Table 3-1 ....................................................... 8
Changed use of pin 61 from no in Table 3-1 ................................................................................... 19
Added note in Section 4.4, Recommended Operating Conditions, on avoiding the PA auto-protect feature ........... 27
Added Table 4-1 .................................................................................................................... 28
Added note in Section 4.6, Electrical Characteristics (3.3 V, 25°C), on proper device reset ............................. 29
Changed Figure 4-8 to reflect T2, T3, and T4 measurements ................................................................ 36
Changed Table 4-4 to reflect T2, T3, and T4 timing items .................................................................... 36
Changed frequency accuracy from ±20 ppm in Table 4-5 .................................................................... 38
Added 4.11.3.6, WLAN Filter Requirements .................................................................................... 39
Deleted I3 (tLP) and I4 (tHP) from Table 4-10 ..................................................................................... 41
Deleted I3 (tLP) and I4 (tHP) from Table 4-11 ..................................................................................... 41
Changed TCP of throughput in Table 5-1 item 17 from 12 Mbps ............................................................ 50
Changed part number of item 17 from CC3200R1-M2RTDR in Table 6-1 .................................................. 59
Added note following Table 6-1 ................................................................................................... 59
Changed part number of item 16 from CC3200R1-M2RTDR in Table 6-2 .................................................. 61
Added note following Table 6-2 ................................................................................................... 61
Revision History
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3 Terminal Configuration and Functions
Figure 3-1 shows pin assignments for the 64-pin QFN package.
Figure 3-1. QFN 64-Pin Assignments (Top View)
3.1
Pin Attributes and Pin Multiplexing
The device makes extensive use of pin multiplexing to accommodate the large number of peripheral
functions in the smallest possible package. To achieve this configuration, pin multiplexing is controlled
using a combination of hardware configuration (at device reset) and register control.
NOTE
TI highly recommends using the CC3200 pin multiplexing utility to obtain the desired pinout.
The board and software designers are responsible for the proper pin multiplexing configuration. Hardware
does not ensure that the proper pin multiplexing options are selected for the peripherals or interface mode
used.
Table 3-1 describes the general pin attributes and presents an overview of pin multiplexing. All pin
multiplexing options are configurable using the pin mux registers.
The following special considerations apply:
• All I/Os support drive strengths of 2, 4, and 6 mA. Drive strength is configurable individually for each
pin.
• All I/Os support 10-µA pullups and pulldowns.
• These pulls are not active and all of the I/Os remain floating while the device is in Hibernate state.
• The VIO and VBAT supply must be tied together at all times.
• All digital I/Os are nonfail-safe.
6
Terminal Configuration and Functions
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NOTE
If an external device drives a positive voltage to the signal pads and the CC3200 device is
not powered, DC current is drawn from the other device. If the drive strength of the external
device is adequate, an unintentional wakeup and boot of the CC3200 device can occur. To
prevent current draw, TI recommends any one of the following:
• All devices interfaced to the CC3200 device must be powered from the same power rail
as the chip.
• Use level-shifters between the device and any external devices fed from other
independent rails.
• The nRESET pin of the CC3200 device must be held low until the VBAT supply to the
device is driven and stable.
Terminal Configuration and Functions
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Table 3-1. Pin Multiplexing
General Pin Attributes
Pkg Pin
1
Pin Alias
GPIO10
Use
I/O
Select as
Wakeup
Source
No
Function
Config
Addl
Analog
Mux
No
Muxed
with
JTAG
No
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
10
(0x4402 E0C8)
Signal
Direction
LPDS(1)
GPIO10
General-Purpose
I/O
I/O
Hi-Z
1
I2C_SCL
I2C Clock
O
(Open
Drain)
Hi-Z
3
GT_PWM06
Pulse-Width
Modulated O/P
O
Hi-Z
7
UART1_TX
UART TX Data
O
1
SDCARD_CLK SD Card Clock
O
0
I
Hi-Z
I/O
Hi-Z
I/O
(Open
Drain)
Hi-Z
Signal Name
0
6
2
8
GPIO11
I/O
Yes
No
No
GPIO_PAD_CONFIG_
11
(0x4402 E0CC)
Pad States
Signal
Description
Dig. Pin
Mux
Config
Mode
Value
12
GT_CCP01
0
GPIO11
General-Purpose
I/O
1
I2C_SDA
I2C Data
3
GT_PWM07
Pulse-Width
Modulated O/P
O
Hi-Z
4
pXCLK
(XVCLK)
Free Clock To
Parallel Camera
O
0
6
SDCARD_CM
D
SD Card
Command Line
I/O
Hi-Z
7
UART1_RX
UART RX Data
I
Hi-Z
12
GT_CCP02
Timer Capture
Port
I
Hi-Z
13
McAFSX
I2S Audio Port
Frame Sync
O
Hi-Z
Terminal Configuration and Functions
Timer Capture
Port
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
3
4
5
Pin Alias
GPIO12
GPIO13
GPIO14
Use
I/O
I/O
Select as
Wakeup
Source
No
Yes
I/O
Function
Config
Addl
Analog
Mux
No
No
No
Muxed
with
JTAG
No
No
No
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
12
(0x4402 E0D0)
GPIO_PAD_CONFIG_
13
(0x4402 E0D4)
GPIO_PAD_CONFIG_
14
(0x4402 E0D8)
Pad States
Dig. Pin
Mux
Config
Mode
Value
Signal Name
0
GPIO12
3
McACLK
4
pVS (VSYNC)
5
I2C_SCL
7
UART0_TX
12
GT_CCP03
0
GPIO13
General-Purpose
I/O
5
I2C_SDA
I2C Data
4
pHS (HSYNC)
Parallel Camera
Horizontal Sync
I
7
UART0_RX
UART0 RX Data
I
12
GT_CCP04
Timer Capture
Port
I
0
GPIO14
General-Purpose
I/O
5
I2C_SCL
I2C Clock
7
GSPI_CLK
General SPI
Clock
4
pDATA8
(CAM_D4)
Parallel Camera
Data Bit 4
I
12
GT_CCP05
Timer Capture
Port
I
(1)
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Signal
Description
Signal
Direction
General Purpose
I/O
I/O
Hi-Z
I2S Audio Port
Clock O
O
Hi-Z
Parallel Camera
Vertical Sync
I
Hi-Z
I/O
(Open
Drain)
Hi-Z
UART0 TX Data
O
1
Timer Capture
Port
I
Hi-Z
I2C Clock
LPDS
I/O
I/O
(Open
Drain)
I/O
I/O
(Open
Drain)
I/O
Terminal Configuration and Functions
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
6
Pin Alias
GPIO15
Use
Select as
Wakeup
Source
I/O
Function
Config
Addl
Analog
Mux
No
Muxed
with
JTAG
No
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
15
(0x4402 E0DC)
Dig. Pin
Mux
Config
Mode
Value
Signal Name
0
Pad States
Signal
Description
Signal
Direction
GPIO15
General-Purpose
I/O
I/O
5
I2C_SDA
I2C Data
7
GSPI_MISO
(1)
LPDS
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
I/O
(Open
Drain)
General SPI
MISO
I/O
Hi-Z
4
pDATA9
(CAM_D5)
Parallel Camera
Data Bit 5
I
13
GT_CCP06
Timer Capture
Port
I
8
SDCARD_
DATA0
SD Card Data
I/O
0
GPIO16
General-Purpose
I/O
I/O
7
GSPI_MOSI
4
pDATA10
(CAM_D6)
5
13
Hi-Z
Hi-Z
Hi-Z
7
GPIO16
I/O
No
No
GPIO_PAD_CONFIG_
16
(0x4402 E0E0)
8
8
10
GPIO17
I/O
Wake-Up
Source
No
No
GPIO_PAD_CONFIG_
17
(0x4402 E0E4)
General SPI
MOSI
I/O
Hi-Z
Parallel Camera
Data Bit 6
I
Hi-Z
UART1_TX
UART1 TX Data
O
1
GT_CCP07
Timer Capture
Port
I
Hi-Z
SDCARD_CLK SD Card Clock
O
O
0
GPIO17
General-Purpose
I/O
I/O
5
UART1_RX
UART1 RX Data
I
7
GSPI_CS
General SPI Chip
Select
I/O
Hi-Z
4
pDATA11
(CAM_D7)
Parallel Camera
Data Bit 7
I
8
SDCARD_
CMD
SD Card
Command Line
I/O
Terminal Configuration and Functions
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Function
Pad States
Hib(2)
nRESET = 0
Hi-Z(3)
Hi-Z
Hi-Z
Hi-Z(3)
Hi-Z
Hi-Z
O
1
Hi-Z
Hi-Z
I/O
Hi-Z
I2S Audio Port
Frame Sync
O
Hi-Z
Hi-Z
Hi-Z
Timer Capture
Port
I
Hi-Z
Hi-Z
Pkg Pin
Pin Alias
Use
Select as
Wakeup
Source
Config
Addl
Analog
Mux
Muxed
with
JTAG
Dig. Pin Mux Config
Reg
Dig. Pin
Mux
Config
Mode
Value
Signal Name
9
VDD_DIG1
Int pwr
N/A
N/A
N/A
N/A
N/A
VDD_DIG1
Internal Digital
Core Voltage
10
VIN_IO1
Sup.
input
N/A
N/A
N/A
N/A
N/A
VIN_IO1
Chip Supply
Voltage (VBAT)
11
FLASH_SPI_
CLK
O
N/A
N/A
N/A
N/A
N/A
FLASH_SPI_
CLK
Clock To SPI
Serial Flash
(Fixed Default)
O
12
FLASH_SPI_
DOUT
O
N/A
N/A
N/A
N/A
N/A
FLASH_SPI_
DOUT
Data To SPI
Serial Flash
(Fixed Default)
O
13
FLASH_SPI_
DIN
I
N/A
N/A
N/A
N/A
N/A
FLASH_SPI_
DIN
Data From SPI
Serial Flash
(Fixed Default)
I
14
FLASH_SPI_
CS
O
N/A
N/A
N/A
N/A
N/A
FLASH_SPI_
CS
Chip Select To
SPI Serial Flash
(Fixed Default)
0
GPIO22
General-Purpose
I/O
7
McAFSX
5
GT_CCP04
1
TDI
JTAG TDI. Reset
Default Pinout.
I
0
GPIO23
General-Purpose
I/O
I/O
2
UART1_TX
UART1 TX Data
O
1
9
I2C_SCL
I/O
(Open
Drain)
Hi-Z
15
16
GPIO22
TDI
I/O
I/O
No
No
No
No
No
MUXed
with
JTAG
TDI
GPIO_PAD_CONFIG_
22
(0x4402 E0F8)
GPIO_PAD_CONFIG_
23
(0x4402 E0FC)
Signal
Description
I2C Clock
Signal
Direction
(1)
LPDS
Hi-Z
Terminal Configuration and Functions
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
17
18
19
20
12
Pin Alias
TDO
GPIO28
TCK
TMS
Use
I/O
Select as
Wakeup
Source
Wake-Up
Source
I/O
I/O
I/O
Function
Config
Addl
Analog
Mux
No
Muxed
with
JTAG
MUXed
with
JTAG
TDO
No
No
No
GPIO_PAD_CONFIG_
24
(0x4402 E100)
GPIO_PAD_CONFIG_
28
(0x4402 E110)
No
No
Dig. Pin Mux Config
Reg
MUXed
with
JTAG/S
WDTCK
MUXed
with
GPIO_PAD_CONFIG_
JTAG/S
29
WD(0x4402 E114)
TMSC
Pad States
Dig. Pin
Mux
Config
Mode
Value
Signal Name
1
TDO
0
GPIO24
General-Purpose
I/O
I/O
5
PWM0
Pulse Width
Modulated O/P
O
2
UART1_RX
9
I2C_SDA
4
GT_CCP06
Timer Capture
Port
I
6
McAFSX
I2S Audio Port
Frame Sync
O
0
GPIO28
General-Purpose
I/O
I/O
1
TCK
JTAG/SWD TCK
Reset Default
Pinout
I
8
GT_PWM03
1
TMS
0
GPIO29
Terminal Configuration and Functions
Signal
Description
JTAG TDO.
Reset Default
Pinout.
UART1 RX Data
I2C Data
Pulse Width
Modulated O/P
JATG/SWD TMS
Reset Default
Pinout
Signal
Direction
(1)
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
LPDS
O
I
I/O
(Open
Drain)
O
I/O
General-Purpose
I/O
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
21(4)(5)
Pin Alias
SOP2
Use
O Only
Function
Select as
Wakeup
Source
Config
Addl
Analog
Mux
No
No
Muxed
with
JTAG
No
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
25
(0x4402 E104)
Dig. Pin
Mux
Config
Mode
Value
Signal Name
0
GPIO25
9
GT_PWM02
2
McAFSX
Pad States
(1)
Signal
Description
Signal
Direction
General-Purpose
I/O
O
Hi-Z
Pulse Width
Modulated O/P
O
Hi-Z
I2S Audio Port
Frame Sync
O
Hi-Z
TCXO_EN
Enable to
Optional External
40-MHz TCXO
O
See (7)
SOP2
Sense-On-Power
2
I
See (6)
WLAN_XTAL_
N
40-MHz XTAL
Pulldown if ext
TCXO is used.
40-MHz XTAL or
TCXO clock input
See
(6)
LPDS
Hib(2)
nRESET = 0
Driven
Low
Hi-Z
O
22
WLAN_XTAL
_N
WLAN
Ana.
N/A
N/A
N/A
N/A
23
WLAN_XTAL
_P
WLAN
Ana.
N/A
N/A
N/A
N/A
WLAN_XTAL_
P
24
VDD_PLL
Int. Pwr
N/A
N/A
N/A
N/A
VDD_PLL
Internal analog
voltage
25
LDO_IN2
Int. Pwr
N/A
N/A
N/A
N/A
LDO_IN2
Analog RF
supply from ANA
DC-DC output
26
NC
WLAN
Ana.
N/A
N/A
N/A
N/A
NC
Reserved
27
NC
WLAN
Ana.
N/A
N/A
N/A
N/A
NC
Reserved
28
NC
WLAN
Ana.
N/A
N/A
N/A
N/A
NC
Reserved
No
GPIO_PAD_CONFIG_
26
(0x4402 E108)
0
ANTSEL1(3)
Antenna
Selection Control
O
Hi-Z
Hi-Z
Hi-Z
No
GPIO_PAD_CONFIG_
27
(0x4402 E10C)
0
ANTSEL2(3)
Antenna
Selection Control
O
Hi-Z
Hi-Z
Hi-Z
N/A
N/A
29
(8)
ANTSEL1
O Only
No
User
config not
required
(9)
30
(8)
ANTSEL2
O Only
No
User
config not
required
(9)
31
RF_BG
WLAN
Ana.
N/A
N/A
RF_BG
RF BG band
Terminal Configuration and Functions
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
Pin Alias
Use
32
nRESET
33
14
Function
Select as
Wakeup
Source
Config
Addl
Analog
Mux
Muxed
with
JTAG
Dig. Pin Mux Config
Reg
Glob.
Rst
N/A
N/A
N/A
N/A
nRESET
Master chip
reset. Active low.
VDD_PA_IN
Int. Pwr
N/A
N/A
N/A
N/A
VDD_PA_IN
PA supply
voltage from PA
DC-DC output.
34(5)
SOP1
Config
Sense
N/A
N/A
N/A
N/A
SOP1
Sense On Power
1
35(5)
SOP0
Config
Sense
N/A
N/A
N/A
N/A
SOP0
Sense On Power
0
36
LDO_IN1
Internal
Power
N/A
N/A
N/A
N/A
LDO_IN1
Analog RF
supply from ana
DC-DC output
37
VIN_DCDC_
ANA
Supply
Input
N/A
N/A
N/A
N/A
VIN_DCDC_
ANA
Analog DC-DC
input (connected
to chip input
supply [VBAT])
38
DCDC_ANA_ Internal
SW
Power
N/A
N/A
N/A
N/A
DCDC_ANA_
SW
Analog DC-DC
switching node.
39
VIN_DCDC_
PA
Supply
Input
N/A
N/A
N/A
N/A
VIN_DCDC_PA
PA DC-DC input
(connected to
chip input supply
[VBAT])
40
DCDC_PA_S Internal
W_P
Power
N/A
N/A
N/A
N/A
DCDC_PA_
SW_ P
PA DCDC
switching node
41
DCDC_PA_S Internal
W_N
Power
N/A
N/A
N/A
N/A
DCDC_PA_
SW_ N
PA DCDC
switching node
42
DCDC_PA_O Internal
UT
Power
N/A
N/A
N/A
N/A
DCDC_PA_
OUT
PA buck
converter output
43
DCDC_DIG_
SW
Internal
Power
N/A
N/A
N/A
N/A
DCDC_DIG_
SW
DIG DC-DC
switching node
44
VIN_DCDC_
DIG
Supply
Input
N/A
VIN_DCDC_
DIG
DIG DC-DC input
(connected to
chip input supply
[VBAT])
N/A
N/A
N/A
Dig. Pin
Mux
Config
Mode
Value
Signal Name
Pad States
Terminal Configuration and Functions
Signal
Description
Signal
Direction
(1)
LPDS
Hib(2)
nRESET = 0
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
45
(10)
Pin Alias
DCDC_ANA2
_SW_P
Use
I/O
Function
Select as
Wakeup
Source
No
Config
Addl
Analog
Mux
User
config not
required
Muxed
with
JTAG
No
(9)(11)
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
31
(0x4402 E11C)
Dig. Pin
Mux
Config
Mode
Value
Signal Name
0
Signal
Description
Signal
Direction
GPIO31
General-Purpose
I/O
I/O
UART0 RX Data
I
I2S Audio Port
Frame Sync
O
9
UART0_RX
12
McAFSX
2
UART1_RX
UART1 RX Data
I
6
McAXR0
I2S Audio Port
Data 0 (RX/TX)
I/O
7
GSPI_CLK
General SPI
Clock
I/O
See (6)
46
Pad States
DCDC_ANA2 Internal
_SW_N
Power
N/A
N/A
N/A
N/A
N/A
(1)
LPDS
Hi-Z
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
DCDC_ANA2_ ANA2 DCDC
SW_P
Converter +ve
Switching Node.
ANA2 DCDC
DCDC_ANA2_
Converter -ve
SW_N
Switching Node.
47
VDD_ANA2
Internal
Power
N/A
N/A
N/A
N/A
N/A
VDD_ANA2
ANA2 DCDC O
48
VDD_ANA1
Internal
Power
N/A
N/A
N/A
N/A
N/A
VDD_ANA1
Analog supply
fed by ANA2
DCDC output
49
VDD_RAM
Internal
Power
N/A
N/A
N/A
N/A
N/A
VDD_RAM
SRAM LDO
output
Terminal Configuration and Functions
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
50
Pin Alias
GPIO0
Use
I/O
Select as
Wakeup
Source
No
Function
Config
Addl
Analog
Mux
User
config not
required
Muxed
with
JTAG
No
(9)
51
16
RTC_XTAL_
P
RTC
Clock
N/A
N/A
N/A
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
0
(0x4402 E0A0)
N/A
Pad States
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
I
Hi-Z
Hi-Z
Hi-Z
I2S Audio Port
Data 1 (RX/TX)
I/O
Hi-Z
Timer Capture
Port
I
Hi-Z
General SPI Chip
Select
I/O
Hi-Z
UART1_RTS
UART1 Request
To Send O
(Active Low)
O
1
3
UART0_RTS
UART0 Request
To Send O
(Active Low)
O
1
4
McAXR0
I2S Audio Port
Data 0 (RX/TX)
I/O
Hi-Z
Dig. Pin
Mux
Config
Mode
Value
Signal Name
Signal
Description
Signal
Direction
0
GPIO0
General-Purpose
I/O
I/O
12
UART0_CTS
UART0 Clear To
Send Input
(Active Low)
6
McAXR1
7
GT_CCP00
9
GSPI_CS
10
RTC_XTAL_P
Terminal Configuration and Functions
(1)
LPDS
Connect 32.768kHz XTAL or
Froce external
CMOS level
clock
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
52(10)
53
Pin Alias
RTC_XTAL_
N
GPIO30
Use
Function
Select as
Wakeup
Source
Config
Addl
Analog
Mux
User
config not
required
O Only
Muxed
with
JTAG
No
(9)(12)
I/O
No
User
config not
required
No
(9)
54
VIN_IO2
Supply
Input
N/A
N/A
N/A
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
32
(0x4402 E120)
GPIO_PAD_CONFIG_
30
(0x4402 E118)
N/A
Dig. Pin
Mux
Config
Mode
Value
Signal Name
Pad States
Signal
Description
RTC_XTAL_N
Connect 32.768kHz XTAL or
connect a 100 kΩ
to Vsupply.
0
GPIO32
General-Purpose
I/O
2
McACLK
4
Signal
Direction
(1)
LPDS
I/O
Hi-Z
I2S Audio Port
Clock O
O
Hi-Z
McAXR0
I2S Audio Port
Data (Only O
Mode Supported
On Pin 52)
O
Hi-Z
6
UART0_RTS
UART0 Request
To Send O
(Active Low)
O
1
8
GSPI_MOSI
General SPI
MOSI
I/O
Hi-Z
0
GPIO30
General-Purpose
I/O
I/O
Hi-Z
9
UART0_TX
UART0 TX Data
O
1
2
McACLK
I2S Audio Port
Clock O
O
Hi-Z
3
McAFSX
I2S Audio Port
Frame Sync
O
Hi-Z
4
GT_CCP05
Timer Capture
Port
I
Hi-Z
7
GSPI_MISO
General SPI
MISO
I/O
Hi-Z
VIN_IO2
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Chip Supply
Voltage (VBAT)
Terminal Configuration and Functions
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
55
GPIO1
56
57
VDD_DIG2
(13)
58(13)
59(13)
18
Pin Alias
GPIO2
GPIO3
GPIO4
Use
I/O
Internal
Power
Analog
Input
(up to
1.8 V)/
Digital
I/O
Analog
Input
(up to
1.8 V)/
Digital
I/O
Analog
Input
(up to
1.8 V)/
Digital
I/O
Select as
Wakeup
Source
No
N/A
Wake-Up
Source
No
Wake-up
Source
Function
Config
Addl
Analog
Mux
No
N/A
See
(10)(14)
See
(10)(14)
See
(10)(14)
Muxed
with
JTAG
No
N/A
No
No
No
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
1
(0x4402 E0A4)
Dig. Pin
Mux
Config
Mode
Value
Signal Name
0
Signal
Description
Signal
Direction
GPIO1
General-Purpose
I/O
I/O
3
UART0_TX
UART0 TX Data
O
1
4
pCLK
(PIXCLK)
Pixel Clock From
Parallel Camera
Sensor
I
Hi-Z
6
UART1_TX
UART1 TX Data
O
1
7
GT_CCP01
Timer Capture
Port
I
Hi-Z
GPIO_PAD_CONFIG_
3
(0x4402 E0AC)
GPIO_PAD_CONFIG_
4
(0x4402 E0B0)
LPDS
Hi-Z
VDD_DIG2
Internal Digital
Core Voltage
See (6)
ADC_CH0
ADC Channel 0
Input (1.5V max)
0
GPIO2
General-Purpose
I/O
I/O
Hi-Z
3
UART0_RX
UART0 RX Data
I
Hi-Z
6
UART1_RX
UART1 RXt Data
I
Hi-Z
7
GT_CCP02
Timer Capture
Port
I
Hi-Z
See (6)
ADC_CH1
0
GPIO3
General-Purpose
I/O
I/O
Hi-Z
6
UART1_TX
UART1 TX Data
O
1
4
pDATA7
(CAM_D3)
Parallel Camera
Data Bit 3
I
Hi-Z
See (6)
ADC_CH2
ADC Channel 2
Input (1.5V max)
0
GPIO4
General-Purpose
I/O
I/O
Hi-Z
6
UART1_RX
UART1 RX Data
I
Hi-Z
4
pDATA6
(CAM_D2)
Parallel Camera
Data Bit 2
I
Hi-Z
N/A
GPIO_PAD_CONFIG_
2
(0x4402 E0A8)
Pad States
(1)
Terminal Configuration and Functions
ADC Channel 1
Input (1.5V max)
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
I
I
I
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
60(13)
61
62
Pin Alias
GPIO5
GPIO6
GPIO7
Use
Analog
Input
(up to
1.8 V)/
Digital
I/O
I/O
I/O
Select as
Wakeup
Source
No
No
No
Function
Config
Addl
Analog
Mux
See
(10)(14)
No
No
Muxed
with
JTAG
No
No
No
Dig. Pin Mux Config
Reg
GPIO_PAD_CONFIG_
5
(0x4402 E0B4)
GPIO_PAD_CONFIG_
6
(0x4402 E0B8)
GPIO_PAD_CONFIG_
7
(0x4402 E0BC)
Pad States
Signal
Description
Signal
Direction
ADC Channel 3
Input (1.5V max)
I
(1)
Dig. Pin
Mux
Config
Mode
Value
Signal Name
See (6)
ADC_CH3
0
GPIO5
General-Purpose
I/O
I/O
Hi-Z
4
pDATA5
(CAM_D1)
Parallel Camera
Data Bit 1
I
Hi-Z
6
McAXR1
I2S Audio Port
Data 1 (RX/TX)
I/O
Hi-Z
7
GT_CCP05
Timer Capture
Port
I
Hi-Z
0
GPIO6
I/O
Hi-Z
5
UART0_RTS
UART0 Request
To Send O
(Active Low)
O
1
4
pDATA4
(CAM_D0)
Parallel Camera
Data Bit 0
I
Hi-Z
3
UART1_CTS
UART1 Clear To
Send Input
(Active Low)
I
Hi-Z
6
UART0_CTS
UART0 Clear To
Send Input
(Active Low)
I
Hi-Z
7
GT_CCP06
Timer Capture
Port
I
Hi-Z
0
GPIO7
I/O
Hi-Z
13
McACLKX
I2S Audio Port
Clock O
O
Hi-Z
3
UART1_RTS
UART1 Request
To Send O
(Active Low)
O
1
General-Purpose
I/O
General-Purpose
I/O
LPDS
10
UART0_RTS
UART0 Request
To Send O
(Active Low)
O
1
11
UART0_TX
UART0 TX Data
O
1
Hib(2)
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Terminal Configuration and Functions
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Table 3-1. Pin Multiplexing (continued)
General Pin Attributes
Pkg Pin
Pin Alias
Use
Select as
Wakeup
Source
Function
Config
Addl
Analog
Mux
Muxed
with
JTAG
Dig. Pin Mux Config
Reg
Dig. Pin
Mux
Config
Mode
Value
Signal Name
0
GPIO8
6
63
64
65
GPIO8
GPIO9
I/O
I/O
No
No
No
No
No
No
GPIO_PAD_CONFIG_
8
(0x4402 E0C0)
GPIO_PAD_CONFIG_
9
(0x4402 E0C4)
Pad States
Signal
Description
Signal
Direction
General-Purpose
I/O
I/O
SDCARD_IRQ Interrupt from SD
Card (Future
support)
McAFSX
I2S Audio Port
Frame Sync
O
12
GT_CCP06
Timer Capture
Port
I
0
GPIO9
3
GT_PWM05
nRESET = 0
Hi-Z
Hi-Z
Hi-Z
6
Hi-Z
Hi-Z
Hi-Z
I/O
Pulse Width
Modulated O/P
O
SDCARD_
DATA0
SD Cad Data
I/O
7
McAXR0
I2S Audio Port
Data (Rx/Tx)
I/O
12
GT_CCP00
Timer Capture
Port
I
GND_TAB
Hib(2)
LPDS
I
7
General-Purpose
I/O
(1)
Thermal pad and
electrical ground
(1) LPDS mode: The state of unused GPIOs in LPDS is input with 500 kΩ pulldown. For all used GPIOs , the user can enable internal pulls, which would hold them in a valid state.
(2) Hibernate mode: The CC3200 device leaves the digital pins in a Hi-Z state without any internal pulls when the device enters hibernate state. This can cause glitches on output lines unless
held at valid levels by external resistors.
(3) To minimize leakage in some serial flash vendors during LPDS, TI recommends the user application always enable internal weak pulldowns on FLASH_SPI_DATA and FLASH_SPI_CLK
pins.
(4) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an output on power up and driven logic high. During
hibernate low-power mode, the pin is in a high impedance state but pulled down for SOP mode to disable TCXO. Because of SOP functionality, the pin must be used as output only.
(5) Higher leakage current from the onboard serial flash can occur due to floating inputs when the device enters Hibernate mode. See reference schematics for recommended pull-up and
pull-down resistors.
(6) For details on proper use, see Section 3.2, Drive Strength and Reset States for Analog-Digital Multiplexed Pins.
(7) This pin is one of three that must have a passive pullup or pulldown resistor on board to configure the chip hardware power-up mode. For this reason, the pin must be output only when
used for digital functions.
(8) This pin is reserved for WLAN antenna selection, controlling an external RF switch that multiplexes the RF pin of the CC3200 device between two antennas. These pins should not be
used for other functionalities in general.
20
Terminal Configuration and Functions
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(9) Device firmware automatically enables the digital path during ROM boot.
(10) Pin 45 is used by an internal DC-DC (ANA2_DCDC) and pin 52 is used by the RTC XTAL oscillator. These modules use automatic configuration sensing. Therefore, some board-level
configuration is required to use pin 45 and pin 52 as digital pads (see Figure 3-2). Because the CC3200R device does not require ANA2_DCDC, the pin can always be used for digital
functions. However, pin 47 must be shorted to the supply input. Typically, pin 52 is used for RTC XTAL in most applications. However, in some applications a 32.768-kHz square-wave
clock might always be available onboard. In such cases, the XTAL can be removed to free up pin 52 for digital functions. The external clock must then be applied at pin 51. For the chip to
automatically detect this configuration, a 100K pull-up resistor must be connected between pin 52 and the supply line. To prevent false detection, TI recommends using pin 52 for outputonly functions.
(11) VDD_FLASH must be shorted to Vsupply.
(12) To use the digital functions, RTC_XTAL_N must be pulled high to Vsupply using 100-KΩ resistor.
(13) This pin is shared by the ADC inputs and digital I/O pad cells. Important: The ADC inputs are tolerant up to 1.8 V. On the other hand, the digital pads can tolerate up to 3.6 V. Hence,
care must be taken to prevent accidental damage to the ADC inputs. TI recommends that the output buffer(s) of the digital I/Os corresponding to the desired ADC channel be disabled first
(that is, converted to high-impedance state), and thereafter the respective pass switches (S7, S8, S9, S10) should be enabled (see Section 3.2, Drive Strength and Reset States for
Analog-Digital Multiplexed Pins).
(14) Requires user configuration to enable the ADC channel analog switch. (The switch is off by default.) The digital I/O is always connected and must be made Hi-Z before enabling the ADC
switch.
Figure 3-2. Board Configuration to Use Pins 45 and 52 as Digital Signals
Terminal Configuration and Functions
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3.1.1
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Connections for Unused Pins
All unused pins must be left as no connect (NC) pins. For a list of NC pins, see Table 3-2.
Table 3-2. Connections for Unused Pins
22
FUNCTION
SIGNAL NAME
PIN NUMBER
WLAN Analog
NC
26
WLAN Analog
NC
27
WLAN Analog
NC
28
Terminal Configuration and Functions
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3.1.2
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
Recommended Pin Multiplexing Configurations
Table 3-3 lists the recommended pin multiplexing configurations.
Table 3-3. Recommended Pin Multiplexing Configurations
CC3200 Recommended Pinout Grouping Use – Examples (1)
Home
Wifi Audio ++
Security High- Industrial
end Toys
Sensor-Tag
Home
Security Toys
Wifi Audio ++
Industrial
WiFi Remote
w/ 7x7
keypad and
audio
Sensor DoorLock FireAlarm Toys
w/o Cam
Industrial
Home
Appliances
Industrial
Home
Appliances
Smart-Plug
Industrial
Home
Appliances"
External 32
kHz (2)
External 32
kHz (2)
Cam + I2S
(Tx or Rx) +
I2C + SPI +
SWD +
UART-Tx +
(App Logger)
2 GPIO +
1PWM + *4
overlaid
wakeup from
Hib
I2S (Tx & Rx)
+ 1 Ch ADC +
1x 4wire
UART + 1x
2wire UART +
1bit SD Card
+ SPI + I2C +
SWD + 3
GPIO + 1
PWM + 1
GPIO with
Wake-FromHib
I2S (Tx & Rx)
+ 2 Ch ADC +
2wire UART +
SPI + I2C +
SWD + 2
PMW + 6
GPIO + 3
GPIO with
Wake-FromHib
Cam + I2S
(Tx or Rx) +
I2C + SWD +
UART-Tx +
(App Logger)
4 GPIO +
1PWM + *4
overlaid
wakeup from
HIB
I2S (Tx & Rx)
+ 1 Ch ADC +
2x 2wire
UART + 1bit
SD Card +
SPI + I2C +
SWD + 4
GPIO + 1
PWM + 1
GPIO with
Wake-FromHib
I2S (Tx & Rx)
+ 1 Ch ADC +
UART (Tx
Only) I2C +
SWD + 15
GPIO + 1
PWM + 1
GPIO with
Wake-FromHib
I2S (Tx or Rx)
+ 2 Ch ADC +
2 wire UART
+ SPI + I2C +
3 PMW + 3
GPIO with
Wake-FromHib + 5 GPIO
SWD +
4 Ch ADC +
1x 4wire
UART + 1x
2wire UART +
SPI + I2C +
SWD + 1
PWM + 6
GPIO + 1
GPIO with
Wake-FromHib Enable
for Ext 40
MHz TCXO
3 Ch ADC +
2wire UART +
SPI + I2C +
SWD + 3
PWM + 9
GPIO + 2
GPIO with
Wake-FromHib
2 Ch ADC +
2wire UART +
I2C + SWD +
3 PWM + 11
GPIO + 5
GPIO with
Wake-FromHib
Pin Number
Pinout #11
Pinout #10
Pinout #9
Pinout #8
Pinout #7
Pinout #6
Pinout #5
Pinout #4
Pinout #3
Pinout #2
52
GSPI-MOSI
McASP-D0
(Tx)
53
GSPI-MISO
MCASPACLKX
45
GSPI-CLK
50
GSPI-CS
55
pCLK
(PIXCLK)
GPIOs
External
TCXO
40 MHZ (-40
to +85°C)
Pinout #1
GPIO_32
output only
GPIO_30
GPIO_30
UART0-TX
GPIO_30
UART0-TX
GPIO_30
McASP-AFSX McASP-D0
GPIO_31
McASP-AFSX McASP-AFSX McASP-AFSX UART0-RX
GPIO_31
UART0-RX
GPIO_31
McASP-D1
(Rx)
McASP-D1
McASP-D1
McASP-D1
McASP-D1
McASP-D1
UART0-CTS
GPIO_0
GPIO_0
GPIO_0
UART0-TX
UART0-TX
PIXCLK
UART0-TX
UART0-TX
UART0-TX
GPIO-1
UART0-TX
GPIO_1
GPIO_1
57
(wake) GPIO2 UART0-RX
UART0-RX
(wake) GPIO2 UART0-RX
GPIO_2
UART0-RX
ADC-0
UART0-RX
(wake)
GPIO_2
(wake)
GPIO_2
58
pDATA7 (D3)
ADC-CH1
pDATA7 (D3)
GPIO_3
ADC-1
ADC-1
ADC-1
ADC-1
GPIO_3
(1)
(2)
UART1-TX
MCASPACLKX
UART1-TX
GPIO_30
GPIO_30
Pins marked "wake" can be configured to wake up the chip from HIBERNATE or LPDS state. In the current silicon revision, any wake pin can trigger wake up from HIBERNATE. The
wakeup monitor in the hibernate control module logically ORs these pins applying a selection mask. However, wakeup from LPDS state can be triggered only by one of the wakeup pins
that can be configured before entering LPDS. The core digital wakeup monitor use a mux to select one of these pins to monitor.
The device supports the feeding of an external 32.768-kHz clock. This configuration frees one pin (32K_XTAL_N) to use in output-only mode with a 100K pullup.
Terminal Configuration and Functions
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CC3200
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
www.ti.com
Table 3-3. Recommended Pin Multiplexing Configurations (continued)
CC3200 Recommended Pinout Grouping Use – Examples (1)
59
pDATA6 (D2)
UART1-RX
(wake)
GPIO_4
pDATA6 (D2)
UART1-RX
GPIO_4
(wake)
GPIO_4
ADC-2
ADC-2
(wake)
GPIO_4
(wake)
GPIO_4
60
pDATA5 (D1)
ADC-3
ADC-3
pDATA5 (D1)
ADC-3
ADC-3
ADC-3
ADC-3
ADC-3
ADC-3
GPIO_5
61
pDATA4 (D0)
UART1-CTS
GPIO_6
pDATA4 (D0)
GPIO_6
GPIO_6
GPIO_6
UART0-RTS
GPIO_6
GPIO_6
GPIO_6
62
McASPACLKX
UART1-RTS
GPIO_7
McASPACLKX
McASPACLKX
McASPACLKX
McASPACLKX
GPIO_7
GPIO_7
GPIO_7
GPIO_7
63
McASP-AFSX SDCARD-IRQ McASP-AFSX McASP-AFSX SDCARD-IRQ GPIO_8
GPIO_8
GPIO_8
GPIO_8
GPIO_8
GPIO_8
64
McASP-D0
SDCARDDATA
GT_PWM5
McASP-D0
SDCARDDATA
GPIO_9
GT_PWM5
GT_PWM5
GT_PWM5
GT_PWM5
GPIO_9
1
UART1-TX
SDCARDCLK
GPIO_10
UART1-TX
SDCARDCLK
GPIO_10
GT_PWM6
UART1-TX
GT_PWM6
GPIO_10
GPIO_10
2
(wake)
pXCLK
(XVCLK)
SDCARDCMD
(wake)
GPIO_11
(wake)
pXCLK
(XVCLK)
SDCARDCMD
GPIO_11
(wake)
GPIO_11
UART1-RX
(wake)
GPIO_11
(wake)
GPIO_11
(wake)
GPIO_11
3
pVS (VSYNC) I2C-SCL
I2C-SCL
pVS (VSYNC) I2C-SCL
GPIO_12
I2C-SCL
I2C-SCL
I2C-SCL
GPIO_12
GPIO_12
4
(wake) pHS
(HSYNC)
I2C-SDA
I2C-SDA
(wake) pHS
(HSYNC)
I2C-SDA
GPIO_13
I2C-SDA
I2C-SDA
I2C-SDA
(wake)
GPIO_13
(wake)
GPIO_13
5
pDATA8 (D4)
GSPI-CLK
GSPI-CLK
pDATA8 (D4)
GSPI-CLK
I2C-SCL
GSPI-CLK
GSPI-CLK
GSPI-CLK
I2C-SCL
GPIO_14
6
pDATA9 (D5)
GSPI-MISO
GSPI-MISO
pDATA9 (D5)
GSPI-MISO
I2C-SDA
GSPI-MISO
GSPI-MISO
GSPI-MISO
I2C-SDA
GPIO_15
7
pDATA10
(D6)
GSPI-MOSI
GSPI-MOSI
pDATA10
(D6)
GSPI-MOSI
GPIO_16
GSPI-MOSI
GSPI-MOSI
GSPI-MOSI
GPIO_16
GPIO_16
8
(wake)
pDATA11
(D7)
GSPI-CS
GSPI-CS
(wake)
pDATA11
(D7)
GSPI-CS
GPIO_17
GSPI-CS
GSPI-CS
GSPI-CS
(wake)
GPIO_17
(wake)
GPIO_17
11
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
SPIFLASH_CLK
12
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
SPI-FLASHDOUT
13
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
SPI-FLASHDIN
14
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
SPI-FLASHCS
15
GPIO_22
GPIO_22
GPIO_22
GPIO_22
GPIO_22
GPIO_22
GPIO_22
GPIO_22
GPIO_22
GPIO_22
GPIO_22
16
I2C-SCL
GPIO_23
GPIO_23
I2C-SCL
GPIO_23
GPIO_23
GPIO_23
GPIO_23
GPIO_23
GPIO_23
GPIO_23
17
I2C-SDA
(wake)
GPIO_24
(wake)
GPIO_24
I2C-SDA
(wake)
GPIO_24
(wake)
GPIO_24
(wake)
GPIO_24
(wake)
GPIO_24
(wake)
GPIO_24
GT-PWM0
(wake)
GPIO_24
19
SWD-TCK
SWD-TCK
SWD-TCK
SWD-TCK
SWD-TCK
SWD-TCK
SWD-TCK
SWD-TCK
SWD-TCK
SWD-TCK
SWD-TCK
20
SWD-TMS
SWD-TMS
SWD-TMS
SWD-TMS
SWD-TMS
SWD-TMS
SWD-TMS
SWD-TMS
SWD-TMS
SWD-TMS
SWD-TMS
24
Terminal Configuration and Functions
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CC3200
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
Table 3-3. Recommended Pin Multiplexing Configurations (continued)
CC3200 Recommended Pinout Grouping Use – Examples (1)
18
GPIO_28
GPIO_28
GPIO_28
GPIO_28
GPIO_28
GPIO_28
GPIO_28
GPIO_28
GPIO_28
GPIO_28
GPIO_28
21
GT_PWM2
GT_PWM2
GT_PWM2
GT_PWM2
GT_PWM2
GT_PWM2
GT_PWM2
TCXO_EN
GT_PWM2
GT_PWM2
GPIO_25 out
only
Terminal Configuration and Functions
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CC3200
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
3.2
www.ti.com
Drive Strength and Reset States for Analog-Digital Multiplexed Pins
Table 3-4 describes the use, drive strength, and default state of these pins at first-time power up and reset
(nRESET pulled low).
Table 3-4. Drive Strength and Reset States for Analog-Digital Multiplexed Pins
Pin
3.3
Board Level Configuration
and Use
Default State at First Power
Up or Forced Reset
State after Configuration of
Analog Switches (ACTIVE,
LPDS, and HIB Power
Modes)
Maximum Effective Drive
Strength (mA)
29
Connected to the enable pin
Analog is isolated. The digital Determined by the I/O state,
of the RF switch (ANTSEL1).
I/O cell is also isolated.
as are other digital I/Os.
Other use not recommended.
4
30
Connected to the enable pin
Analog is isolated. The digital Determined by the I/O state,
of the RF switch (ANTSEL2).
I/O cell is also isolated.
as are other digital I/Os.
Other use not recommended.
4
45
VDD_ANA2 (pin 47) must be
shorted to the input supply
rail. Otherwise, the pin is
driven by the ANA2 DC-DC.
Analog is isolated. The digital Determined by the I/O state,
I/O cell is also isolated.
as are other digital I/Os.
4
50
Generic I/O
Analog is isolated. The digital Determined by the I/O state,
I/O cell is also isolated.
as are other digital I/Os.
4
52
The pin must have an
external pullup of 100 K to
the supply rail and must be
used in output signals only.
Analog is isolated. The digital Determined by the I/O state,
I/O cell is also isolated.
as are other digital I/Os.
4
53
Generic I/O
Analog is isolated. The digital Determined by the I/O state,
I/O cell is also isolated.
as are other digital I/Os.
4
57
Analog signal (1.8 V
absolute, 1.46 V full scale)
ADC is isolated. The digital
I/O cell is also isolated.
Determined by the I/O state,
as are other digital I/Os.
4
58
Analog signal (1.8 V
absolute, 1.46 V full scale)
ADC is isolated. The digital
I/O cell is also isolated.
Determined by the I/O state,
as are other digital I/Os.
4
59
Analog signal (1.8 V
absolute, 1.46 V full scale)
ADC is isolated. The digital
I/O cell is also isolated.
Determined by the I/O state,
as are other digital I/Os.
4
60
Analog signal (1.8 V
absolute, 1.46 V full scale)
ADC is isolated. The digital
I/O cell is also isolated.
Determined by the I/O state,
as are other digital I/Os.
4
Pad State After Application of Power To Chip But Prior To Reset Release
When a stable power is applied to the CC3200 chip for the first time or when supply voltage is restored to
the proper value following a prior period with supply voltage below 1.5 V, the level of the digital pads are
undefined in the period starting from the release of nRESET and until DIG_DCDC powers up. This period
is less than approximately 10 ms. During this period, pads can be internally pulled weakly in either
direction. If a certain set of pins are required to have a definite value during this pre-reset period, an
appropriate pullup or pulldown must be used at the board level. The recommended value of this external
pull is 2.7 KΩ.
26
Terminal Configuration and Functions
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
4 Specifications
All measurements are referenced at the device pins, unless otherwise indicated. All specifications are over
process and voltage, unless otherwise indicated.
4.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
PARAMETERS
VBAT and VIO
VIO-VBAT (differential)
PINS
MIN
MAX
UNIT
37, 39, 44
–0.5
3.8
V
0.0
V
10, 54
Digital inputs
–0.5
VIO + 0.5
V
RF pins
–0.5
2.1
V
Analog pins (XTAL)
–0.5
2.1
V
Operating temperature range (TA )
–40
+85
°C
4.2
Handling Ratings
Tstg
VESD
(1)
(2)
4.3
MIN
MAX
UNIT
–55
+125
°C
–2000
+2000
V
–500
+500
V
Storage temperature range
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC
JS-001, all pins (1)
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins (2)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Power-On Hours
CONDITIONS
POH
17,500 (1)
TAmbient up to 85°C, assuming 20% active mode and 80% sleep mode
(1)
4.4
The CC3200 device can be operated reliably for 10 years.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PARAMETERS
PINS
CONDITIONS
(1) (2)
(3) (4)
MIN
TYP
MAX
UNIT
VBAT, VIO (shorted to VBAT)
10, 37, 39,
44, 54
Direct battery connection
2.1
3.3
3.6
V
VBAT, VIO (shorted to VBAT)
10, 37, 39,
44, 54
Preregulated 1.85 V
1.76
1.85
1.9
V
20
°C/minute
Ambient thermal slew
–20
(1)
(2)
Operating temperature is limited by crystal frequency variation.
When operating at an ambient temperature of over 75°C, the transmit duty cycle must remain below 50% to avoid the auto-protect
feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60 seconds to restart the transmission.
(3)
(4)
To ensure WLAN performance, ripple on the 2.1- to 3.3-V supply must be less than ±300 mV.
To ensure WLAN performance, ripple on the 1.85-V supply must be less than 2% (±40 mV).
Specifications
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
4.5
www.ti.com
Brown-Out and Black-Out
The device enters a brown-out condition whenever the input voltage dips below VBROWN (see Figure 4-1 and
Figure 4-2). This condition must be considered during design of the power supply routing, especially if operating
from a battery. High-current operations (such as a TX packet) cause a dip in the supply voltage, potentially
triggering a brown-out. The resistance includes the internal resistance of the battery, contact resistance of the
battery holder (4 contacts for a 2 x AA battery) and the wiring and PCB routing resistance.
Figure 4-1. Brown-Out and Black-Out Levels (1 of 2)
Figure 4-2. Brown-Out and Black-Out Levels (2 of 2)
In the brown-out condition, all sections of the device shut down except for the Hibernate module (including the
32-kHz RTC clock), which remains on. The current in this state can reach approximately 400 µA.
The black-out condition is equivalent to a hardware reset event in which all states within the device are lost.
Table 4-1 lists the brown-out and black-out voltage levels.
Table 4-1. Brown-Out and Black-out Voltage Levels
VOLTAGE LEVEL
UNIT
Vbrownout
CONDITION
2.1
V
Vblackout
1.67
V
28
Specifications
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4.6
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
Electrical Characteristics (3.3 V, 25°C)
GPIO Pins Except 29, 30, 45, 50, 52, and 53 (25°C) (1)
PARAMETER
TEST
CONDITIONS
MIN
NOM
MAX
UNIT
CIN
Pin capacitance
VIH
High-level input voltage
0.65 × VDD
VDD + 0.5 V
VIL
Low-level input voltage
–0.5
0.35 × VDD
IIH
High-level input current
IIL
Low-level input current
VOH
High-level output voltage (VDD =
3.0 V)
VOL
Low-level output voltage (VDD =
3.0 V)
IOH
High-level
source current,
VOH = 2.4
IOL
Low-level sink
current,
VOL = 0.4
4
pF
V
V
5
nA
5
nA
2.4
V
0.4
V
2-mA Drive
2
mA
4-mA Drive
4
mA
6-mA Drive
6
mA
2-mA Drive
2
mA
4-mA Drive
4
mA
6-mA Drive
6
mA
(1)
TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk of
interference to the WLAN radio and mitigates any potential degradation of RF sensitivity and performance. The default drive strength
setting is 6 mA.
GPIO Pins 29, 30, 45, 50, 52, and 53 (25°C) (1)
PARAMETER
TEST
CONDITIONS
MIN
NOM
MAX
CIN
Pin capacitance
VIH
High-level input voltage
0.65 × VDD
VIL
Low-level input voltage
–0.5
IIH
High-level input current
IIL
Low-level input current
VOH
High-level output voltage
(VDD= 3.0 V)
VOL
Low-level output voltage
(VDD= 3.0 V)
IOH
High-level
source current,
VOH = 2.4
2-mA Drive
1.5
mA
4-mA Drive
2.5
mA
6-mA Drive
3.5
mA
Low-level sink
current, VOL =
0.4
2-mA Drive
1.5
mA
4-mA Drive
2.5
mA
6-mA Drive
3.5
IOL
VIL
(1)
(2)
7
UNIT
pF
VDD + 0.5V
0.35 × VDD
V
50
nA
50
nA
2.4
V
0.4
nRESET (2)
V
V
mA
0.6
V
TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk of
interference to the WLAN radio and mitigates any potential degradation of RF sensitivity and performance. The default drive strength
setting is 6 mA.
The nRESET pin must be held below 0.6 V to ensure the device is reset properly.
Pin Internal Pullup and Pulldown (25°C) (1)
PARAMETER
IOH
(1)
TEST CONDITIONS
Pull-Up current, VOH = 2.4
(VDD = 3.0 V)
MIN
5
NOM
MAX
10
UNIT
µA
TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk of
interference to WLAN radio and mitigates any potential degradation of RF sensitivity and performance. The default drive-strength setting
is 6 mA.
Specifications
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Pin Internal Pullup and Pulldown (25°C) (1)
PARAMETER
IOL
30
Pull-Down current, VOL =
0.4
(VDD = 3.0 V)
TEST CONDITIONS
MIN
5
Specifications
NOM
MAX
UNIT
µA
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4.7
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
WLAN Receiver Characteristics
TA = +25°C, VBAT = 2.1 to 3.6 V. Parameters measured at SoC pin on channel 7 (2442 MHz)
Parameter
Condition (Mbps)
Sensitivity
(8% PER for 11b rates, 10% PER for
11g/11n rates)(10% PER) (1)
4.8
Typ
1 DSSS
–95.7
2 DSSS
–93.6
11 CCK
–88.0
6 OFDM
–90.0
9 OFDM
–89.0
18 OFDM
–86.0
36 OFDM
–80.5
54 OFDM
–74.0
MCS0 (GF) (2)
–89.0
MCS7 (GF) (2)
–71.0
Maximum input level
(10% PER)
(1)
(2)
Min
802.11b
–4.0
802.11g
–10.0
Max
Units
dBm
Sensitivity is 1-dB worse on channel 13 (2472 MHz).
Sensitivity for mixed mode is 1-dB worse.
WLAN Transmitter Characteristics
TA = +25°C, VBAT = 2.1 to 3.6 V. Parameters measured at SoC pin on channel 7 (2442 MHz). (1)
Condition (2)
Parameter
Maximum RMS output power measured at
1 dB from IEEE spectral mask or EVM
Min
18.0
2 DSSS
18.0
11 CCK
18.3
6 OFDM
17.3
9 OFDM
17.3
18 OFDM
17.0
36 OFDM
16.0
54 OFDM
14.5
MCS7 (MM)
(2)
4.9
Max
Units
dBm
13.0
Transmit center frequency accuracy
(1)
Typ
1 DSSS
–25
25
ppm
Channel-to-channel variation is up to 2 dB. The edge channels (2412 and 2472 MHz) have reduced TX power to meet FCC emission
limits.
In preregulated 1.85-V mode, maximum TX power is 0.25 to 0.75 dB lower for modulations higher than 18 OFDM.
Current Consumption
TA = +25°C, VBAT = 3.6 V
TEST CONDITIONS (1)
PARAMETER
1 DSSS
TX
MCU ACTIVE
6 OFDM
NWP ACTIVE
54 OFDM
RX
1 DSSS
54 OFDM
NWP idle connected (3)
(1)
(2)
(3)
(2)
MIN
TYP
TX power level = 0
278
TX power level = 4
194
TX power level = 0
254
TX power level = 4
185
TX power level = 0
229
TX power level = 4
166
MAX UNIT
mA
59
59
15.3
TX power level = 0 implies maximum power (see Figure 4-3 through Figure 4-5). TX power level = 4 implies output power backed off
approximately 4 dB.
The CC3200 system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
DTIM = 1
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Current Consumption (continued)
TA = +25°C, VBAT = 3.6 V
TEST CONDITIONS (1)
PARAMETER
1 DSSS
TX
6 OFDM
NWP ACTIVE
MCU SLEEP
54 OFDM
(2)
MIN
275
TX power level = 4
191
TX power level = 0
251
TX power level = 4
182
TX power level = 0
226
TX power level = 4
163
1 DSSS
RX
TX
6 OFDM
NWP active
MCU LPDS
54 OFDM
1 DSSS
RX
54 OFDM
NWP LPDS (4)
56
Peak calibration current
(4)
(5)
(6)
(7)
32
(7)
TX power level = 0
272
TX power level = 4
188
TX power level = 0
248
TX power level = 4
179
TX power level = 0
223
TX power level = 4
160
mA
53
53
0.25
NWP idle connected (3)
NWP hibernate
mA
12.2
1 DSSS
MCU hibernate
MAX UNIT
56
54 OFDM
NWP idle connected (3)
(5)
TYP
TX power level = 0
0.825
(6)
4
VBAT = 3.3 V
450
VBAT = 2.1 V
670
VBAT = 1.85 V
700
µA
mA
LPDS current does not include the external serial flash. The LPDS number reported is with retention of 64KB MCU SRAM. The CC3200
device can be configured to retain 0KB, 64KB, 128KB, 192KB or 256KB SRAM in LPDS. Each 64KB retained increases LPDS current
by 4 µA.
For the 1.85-V mode, the Hibernate current is higher by 50 µA across all operating modes because of leakage into the PA and analog
power inputs.
Serial flash current consumption in power-down mode during hibernate is not included.
The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms . Calibration is performed sparingly,
typically when coming out of Hibernate and only if temperature has changed by more than 20°C or the time elapsed from prior
calibration is greater than 24 hours.
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1 DSSS
19.00
280.00
Color by
17.00
264.40
TX Power (dBm)
IBAT (VBAT @ 3.6 V)
249.00
13.00
233.30
11.00
218.00
9.00
202.00
7.00
186.70
5.00
171.00
3.00
155.60
1.00
IBAT (VBAT @ 3.6 V)(mAmp)
TX Power (dBm)
15.00
140.00
0
1
2
3
4
5
6
7
8
9
10
TX power level setting
11
12
13
14
15
Note: The area enclosed in the circle represents a significant reduction in current when transitioning from TX power
level 3 to 4. In the case of lower range requirements (14 dbm output power), TI recommends using TX power level 4
to reduce the current.
Figure 4-3. TX Power and IBAT vs TX Power Level Settings (1 DSSS)
6 OFDM
19.00
280.00
Color by
17.00
IBAT (VBAT @ 3.6 V)
249.00
13.00
233.30
11.00
218.00
9.00
202.00
7.00
186.70
5.00
171.00
3.00
155.60
1.00
IBAT (VBAT @ 3.6 V)(mAmp)
15.00
TX Power (dBm)
264.40
TX Power (dBm)
140.00
0
1
2
3
4
5
6
7
8
9
10
TX power level setting
11
12
13
14
15
Figure 4-4. TX Power and IBAT vs TX Power Level Settings (6 OFDM)
Specifications
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54 OFDM
19.00
280.00
Color by
17.00
IBAT (VBAT @ 3.6 V)
249.00
13.00
233.30
11.00
218.00
9.00
202.00
7.00
186.70
5.00
171.00
3.00
155.60
1.00
IBAT (VBAT @ 3.6 V)(mAmp)
15.00
TX Power (dBm)
264.40
TX Power (dBm)
140.00
0
1
2
3
4
5
6
7
8
9
10
TX power level setting
11
12
13
14
15
Figure 4-5. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
4.10 Thermal Characteristics for RGC Package
AIR FLOW
PARAMETER
0 lfm (C/W)
150 lfm (C/W)
250 lfm (C/W)
500 lfm (C/W)
θja
23
14.6
12.4
10.8
Ψjt
0.2
0.2
0.3
0.1
Ψjb
2.3
2.3
2.2
2.4
θjc
6.3
θjb
2.4
4.11 Timing and Switching Characteristics
4.11.1 Power Supply Sequencing
For proper operation of the CC3200 device, perform the recommended power-up sequencing as follows:
1. Tie VBAT (pins 37, 39, 44) and VIO (pins 54 and 10) together on the board.
2. Hold the RESET pin low while the supplies are ramping up. TI recommends using a simple RC circuit (100K ||
0.1 µF, RC = 10 ms).
3. For an external RTC clock, ensure that the clock is stable before RESET is deasserted (high).
For timing diagrams, see Section 4.11.2, Reset Timing.
4.11.2 Reset Timing
4.11.2.1 nRESET (32K XTAL)
Figure 4-6 shows the reset timing diagram for the 32K XTAL first-time power-up and reset removal.
34
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T1
T2
T3
T4
HW INIT
FW INIT
APP CODE LOAD
VBAT
VIO
nRESET
RESET
APP CODE EXECUTE
32.76 KHz
XTAL
Figure 4-6. First-Time Power-Up and Reset Removal Timing Diagram (32K XTAL)
Table 4-2 describes the timing requirements for the 32K XTAL first-time power-up and reset removal.
Table 4-2. First-Time Power-Up and Reset Removal Timing Requirements (32K XTAL)
Item
Name
Description
Min
T1
Supply settling time
Depends on
application board
power supply, decap,
and so on
T2
Hardware wakeup
time
T3
Time taken by ROM
firmware to initialize
hardware
Includes 32.768 -kHz
XOSC settling time
T4
App code load time
Image size (KByte) x
0.75 ms
Typ
Max
3 ms
25 ms
1.1 s
4.11.2.2 nRESET (External 32K)
Figure 4-7 shows the reset timing diagram for the external 32K first-time power-up and reset removal.
T1
T2
T3
T4
HW INIT
FW INIT
APP CODE LOAD
VBAT
VIO
nRESET
RESET
APP CODE EXECUTE
32.768 KHz
External Clock
Figure 4-7. First-Time Power-Up and Reset Removal Timing Diagram (External 32K)
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Table 4-3 describes the timing requirements for the external 32K first-time power-up and reset removal.
Table 4-3. First-Time Power-Up and Reset Removal Timing Requirements (External 32K)
Item
Name
Description
T1
Supply settling time
Depends on
application board
power supply, decap,
and so on
Min
T2
Hardware wakeup
time
T3
Time taken by ROM
firmware to initialize
hardware
Time taken by ROM
firmware
T4
App code load time
Image size (KByte) x
0.75 ms
Typ
Max
3 ms
25 ms
3 ms
4.11.2.3 Wakeup from Hibernate
Figure 4-8 shows the timing diagram for wakeup from the hibernate state.
Application software requests
entry to hibernate mode
THIB_MIN
T2
T3
T4
FW INIT
APP CODE
LOAD
VBAT
VIO
nRESET
STATE
ACTIVE
HIBERNATE
HW WAKEUP
EXECUTION
32 KHz
RTC CLK
Figure 4-8. Wakeup From Hibernate Timing Diagram
NOTE
The 32.768-kHz XTAL is kept enabled by default when the chip goes to hibernate.
Table 4-4 describes the software hibernate timing requirements.
Table 4-4. Software Hibernate Timing Requirements
Item
Name
Description
Min
Typ
Thib_min
Minimum hibernate time
The time for which the device has to
be held in hibernate mode
10 ms
T2
Hardware wakeup time
Time taken by the hardware to
initialize
25 ms
T3
Firmware initialization time
Time taken by the ROM firmware to
initialize the hardware
3 ms
T4
Code download time
Time taken to download the code from
the serial flash to on-chip RAM
36
Specifications
Max
Image size (KByte) x 0.75 ms
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4.11.3 Clock Specifications
The CC3200 device requires two separate clocks for its operation:
• A slow clock running at 32.768 kHz is used for the RTC.
• A fast clock running at 40 MHz is used by the device for the internal processor and the WLAN subsystem.
The device features internal oscillators that enable the use of cheaper crystals rather than dedicated TCXOs for
these clocks. The RTC can also be fed externally to provide reuse of an existing clock on the system and reduce
overall cost.
4.11.3.1 Slow Clock Using Internal Oscillator
The RTC crystal connected on the device supplies the free-running slow clock. The accuracy of the slow clock
frequency must be 32.768 kHz ±150 ppm. In this mode of operation, the crystal is tied between RTC_XTAL_P
(pin 51) and RTC_XTAL_N (pin 52) with a suitable load capacitance.
Figure 4-9 shows the crystal connections for the slow clock.
51
RTC_XTAL_P
10 pF
GND
32.768 kHz
RTC_XTAL_N
52
10 pF
GND
SWAS031-028
Figure 4-9. RTC Crystal Connections
4.11.3.2 Slow Clock Using an External Clock
When an RTC clock oscillator is present in the system, the CC3200 device can accept this clock directly as an
input. The clock is fed on the RTC_XTAL_P line and the RTC_XTAL_N line is held to VIO. The clock must be a
CMOS-level clock compatible with VIO fed to the device.
Figure 4-10 shows the external RTC clock input connection.
RTC_XTAL_P
32.768 kHz
VIO
Host system
100 K
RTC_XTAL_N
SWAS031-029
Figure 4-10. External RTC Clock Input
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4.11.3.3 Fast Clock (Fref) Using an External Crystal
The CC3200 device also incorporates an internal crystal oscillator to support a crystal-based fast clock. The
XTAL is fed directly between WLAN_XTAL_P (pin 23) and WLAN_XTAL_N (pin 22) with suitable loading
capacitors.
Figure 4-11 shows the crystal connections for the fast clock.
23
WLAN_XTAL_P
6.2 pF
GND
40 MHz
WLAN_XTAL_N
22
6.2 pF
GND
SWAS031-030
Figure 4-11. Fast Clock Crystal Connections
4.11.3.4 Fast Clock (Fref) Using an External Oscillator
The CC3200 device can accept an external TCXO/XO for the 40-MHz clock. In this mode of operation, the clock
is connected to WLAN_XTAL_P (pin 23). WLAN_XTAL_N (pin 22) is connected to GND. The external TCXO/XO
can be enabled by TCXO_EN (pin 21) from the device to optimize the power consumption of the system.
If the TCXO does not have an enable input, an external LDO with an enable function can be used. Using the
LDO improves noise on the TCXO power supply.
Figure 4-12 shows the connection.
Vcc
XO (40MHz)
CC3200
EN
TCXO_EN
82 pF
WLAN_XTAL_P
OUT
WLAN_XTAL_N
SWAS031-087
Figure 4-12. External TCXO Input
Table 4-5 lists the external Fref clock requirements.
Table 4-5. External Fref Clock Requirements (–40°C to +85°C)
Characteristics
Condition
Sym
Min
Frequency
Typ
40.00
Frequency accuracy (Initial + temp + aging)
Frequency input duty cycle
Clock voltage limits
38
Max
45
Sine or clipped
sine wave, AC
coupled
Specifications
Vpp
0.7
50
Unit
MHz
±25
ppm
55
%
1.2
Vpp
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Table 4-5. External Fref Clock Requirements (–40°C to +85°C) (continued)
Characteristics
Condition
Phase noise @ 40 MHz
Input impedance
Max
Unit
@ 1 kHz
Sym
Min
–125
dBc/Hz
@ 10 kHz
–138.5
dBc/Hz
@ 100 kHz
–143
dBc/Hz
Resistance
Typ
12
KΩ
Capacitance
7
pF
MAX
UNIT
Initial + temp + aging
±150
ppm
32.768 kHz, C1 = C2 = 10 pF
70
kΩ
MAX
UNIT
±150
ppm
100
ns
80
%
4.11.3.5 Input Clocks/Oscillators
Table 4-6 lists the RTC crystal requirements.
Table 4-6. RTC Crystal Requirements
CHARACTERISTICS
CONDITION
SYM
MIN
TYP
Frequency
32.768
Frequency accuracy
Crystal ESR
kHz
Table 4-7 lists the external RTC digital clock requirements.
Table 4-7. External RTC Digital Clock Requirements
CHARACTERISTICS
CONDITION
SYM
MIN
Frequency
TYP
32768
Hz
Frequency accuracy
(Initial + temp + aging)
Input transition time tr/tf (10% to 90%)
tr/tf
Frequency input duty cycle
Slow clock input voltage limits
20
Square wave, DC coupled
50
Vih
0.65 × VIO
VIO
V
Vil
0
0.35 × VIO
V peak
Input impedance
1
MΩ
5
pF
MAX
UNIT
Table 4-8 lists the WLAN fast-clock crystal requirements.
Table 4-8. WLAN Fast-Clock Crystal Requirements
CHARACTERISTICS
CONDITION
SYM
MIN
TYP
Frequency
Frequency accuracy
Crystal ESR
40
MHz
Initial + temp + aging
40 MHz, C1 = C2 = 6.2 pF
40
50
±25
ppm
60
Ohm
4.11.3.6 WLAN Filter Requirements
The device requires an external bandpass filter to meet the various emission standards, including FCC. Table 49 presents the attenuation requirements for the bandpass filter. TI recommends using the same filter used in the
reference design to ease the process of certification.
Table 4-9. WLAN Filter Requirements
Parameter
Return loss
Frequency (MHz)
2412 to 2484
Requirements
Min
10
Typ
Max
Units
dB
Specifications
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Table 4-9. WLAN Filter Requirements (continued)
Parameter
Frequency (MHz)
(1)
2412 to 2484
Insertion loss
Attenuation
Reference Impendence
Filter type
(1)
Requirements
Min
Typ
Max
Units
1
1.5
dB
800 to 830
30
45
1600 to 1670
20
25
3200 to 3300
30
48
4000 to 4150
45
50
4800 to 5000
20
25
5600 to 5800
20
25
6400 to 6600
20
35
7200 to 7500
35
45
7500 to 10000
20
25
2412 to 2484
50
dB
Ω
Bandpass
Insertion loss directly impacts output power and sensitivity. At customer discretion, insertion loss can be relaxed to meet attenuation
requirements.
4.11.4 Peripherals
This section describes the peripherals that are supported by the CC3200 device:
• SPI
• McASP
• GPIO
• I2C
• IEEE 1149.1 JTAG
• ADC
• Camera parallel port
• UART
4.11.4.1 SPI
4.11.4.1.1 SPI Master
The CC3200 microcontroller includes one SPI module, which can be configured as a master or slave device. The
SPI includes a serial clock with programmable frequency, polarity, and phase, a programmable timing control
between chip select and external clock generation, and a programmable delay before the first SPI word is
transmitted. Slave mode does not include a dead cycle between two successive words.
Figure 4-13 shows the timing diagram for the SPI master.
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I2
CLK
I6
I7
MISO
I9
I8
MOSI
SWAS032-017
Figure 4-13. SPI Master Timing Diagram
Table 4-10 lists the timing parameters for the SPI master.
Table 4-10. SPI Master Timing Parameters
Parameter
Number
(1)
Parameter
(1)
Parameter Name
Min
I1
F
Clock frequency
I2
Tclk
Clock period
50
I5
D
Duty cycle
45
I6
tIS
RX data setup time
1
2
Max
Unit
20
MHz
ns
55
%
ns
I7
tIH
RX data hold time
I8
tOD
TX data output delay
8.5
ns
ns
I9
tOH
TX data hold time
8
ns
Timing parameter assumes a maximum load of 20 pF.
4.11.4.1.2 SPI Slave
Figure 4-14 shows the timing diagram for the SPI slave.
I2
CLK
I6
I7
MISO
I9
I8
MOSI
SWAS032-017
Figure 4-14. SPI Slave Timing Diagram
Table 4-11 lists the timing parameters for the SPI slave.
Table 4-11. SPI Slave Timing Parameters
(1)
Parameter
Number
Parameter (1)
Parameter Name
I1
F
Min
Max
Unit
Clock frequency @ VBAT = 3.3 V
20
MHz
Clock frequency @ VBAT ≤ 2.1 V
12
Timing parameter assumes a maximum load of 20 pF at 3.3 V.
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Table 4-11. SPI Slave Timing Parameters (continued)
Parameter
Number
Parameter
(1)
Parameter Name
Min
I2
Tclk
Clock period
50
I5
D
Duty cycle
45
I6
tIS
RX data setup time
4
4
Max
Unit
ns
55
%
ns
I7
tIH
RX data hold time
I8
tOD
TX data output delay
20
ns
I9
tOH
TX data hold time
24
ns
4.11.4.2 McASP
The McASP interface functions as a general-purpose audio serial port optimized for multichannel audio
applications and supports transfer of two stereo channels over two data pins. The McASP consists of transmit
and receive sections that operate synchronously and have programmable clock and frame-sync polarity. A
fractional divider is available for bit-clock generation.
4.11.4.2.1 I2S Transmit Mode
Figure 4-15 shows the timing diagram for the I2S transmit mode.
I2
I1
I3
McACLKX
I4
I4
McAFSX
McAXR0/1
SWAS032-015
Figure 4-15. I2S Transmit Mode Timing Diagram
Table 4-12 lists the timing parameters for the I2S transmit mode.
Table 4-12. I2S Transmit Mode Timing Parameters
Parameter Number
Parameter (1)
Parameter Name
Max
Unit
I1
fclk
Clock frequency
9.216
MHz
(1)
Min
I2
tLP
Clock low period
1/2 fclk
ns
I3
tHT
Clock high period
1/2 fclk
ns
I4
tOH
TX data hold time
22
ns
Timing parameter assumes a maximum load of 20 pF.
4.11.4.2.2 I2S Receive Mode
Figure 4-16 shows the timing diagram for the I2S receive mode.
I2
I1
I3
McACLKX
I5
I4
McAFSX
McAXR0/1
SWAS032-016
Figure 4-16. I2S Receive Mode Timing Diagram
42
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Table 4-13 lists the timing parameters for the I2S receive mode.
Table 4-13. I2S Receive Mode Timing Parameters
Parameter Number
Parameter (1)
Parameter Name
Max
Unit
I1
fclk
Clock frequency
9.216
MHz
(1)
Min
I2
tLP
Clock low period
1/2 fclk
ns
I3
tHT
Clock high period
1/2 fclk
ns
I4
tOH
RX data hold time
0
ns
I5
tOS
RX data setup time
15
ns
Timing parameter assumes a maximum load of 20 pF.
4.11.4.3 GPIO
All digital pins of the device can be used as general-purpose input/output (GPIO) pins.The GPIO module consists
of four GPIO blocks, each of which provides eight GPIOs. The GPIO module supports 24 programmable GPIO
pins, depending on the peripheral used. Each GPIO has configurable pullup and pulldown strength (weak 10 µA),
configurable drive strength (2, 4, and 6 mA), and open-drain enable.
Figure 4-17 shows the GPIO timing diagram.
VDD
80%
20%
tGPIOF
tGPIOR
SWAS031-067
Figure 4-17. GPIO Timing
4.11.4.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
Table 4-14 lists the GPIO output transition times for Vsupply = 3.3 V.
Table 4-14. GPIO Output Transition Times (Vsupply = 3.3 V) (1) (2)
Drive
Strength
(mA)
Tr (ns)
Drive Strength Control Bits
Tf (ns)
Min
Nom
Max
Min
Nom
Max
8.0
9.3
10.7
8.2
9.5
11.0
6.6
7.1
7.6
4.7
5.2
5.8
3.2
3.5
3.7
2.3
2.6
2.9
1.7
1.9
2.0
1.3
1.5
1.6
2MA_EN=1
2
4MA_EN=0
8MA_EN=0
2MA_EN=0
4
4MA_EN=1
8MA_EN=0
2MA_EN=0
8
4MA_EN=0
8MA_EN=1
2MA_EN=1
14
4MA_EN=1
8MA_EN=1
(1)
(2)
Vsupply = 3.3 V, T = 25°C, total pin load = 30 pF
The transition data applies to the pins other than the multiplexed analog-digital pins 29, 30, 45, 50, 52, and 53.
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4.11.4.3.2 GPIO Output Transition Time Parameters (Vsupply = 1.8 V)
Table 4-15 lists the GPIO output transition times for Vsupply = 1.8 V.
Table 4-15. GPIO Output Transition Times (Vsupply = 1.8 V) (1) (2)
Drive
Strength
(mA)
Tr (ns)
Drive Strength Control Bits
Tf (ns)
Min
Nom
Max
Min
Nom
Max
11.7
13.9
16.3
11.5
13.9
16.7
13.7
15.6
18.0
9.9
11.6
13.6
5.5
6.4
7.4
3.8
4.7
5.8
2.9
3.4
4.0
2.2
2.7
3.3
2MA_EN=1
2
4MA_EN=0
8MA_EN=0
2MA_EN=0
4
4MA_EN=1
8MA_EN=0
2MA_EN=0
8
4MA_EN=0
8MA_EN=1
2MA_EN=1
14
4MA_EN=1
8MA_EN=1
(1)
(2)
Vsupply = 1.8 V, T = 25°C, total pin load = 30 pF
The transition data applies to the pins other than the multiplexed analog-digital pins 29, 30, 45, 50, 52, and 53.
4.11.4.3.3 GPIO Input Transition Time Parameters
Table 4-16 lists the input transition time parameters.
Table 4-16. GPIO Input Transition Time Parameters
Parameter
Condition
Input transition time
(tr,tf), 10% to 90%
Symbol
Min
Max
tr
1
3
tf
1
3
Unit
ns
4.11.4.4 I2C
The CC3200 microcontroller includes one I2C module operating with standard (100 Kbps) or fast (400 Kbps)
transmission speeds.
Figure 4-18 shows the I2C timing diagram.
I2
I6
I5
I2CSCL
I1
I4
I7
I8
I3
I9
I2CSDA
SWAS031-068
2
Figure 4-18. I C Timing
Table 4-17 lists the I2C timing parameters.
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Table 4-17. I2C Timing Parameters (1)
Parameter Number
Parameter
Parameter Name
I2
tLP
Clock low period
I3
tSRT
SCL/SDA rise time
–
I4
tDH
Data hold time
NA
I5
tSFT
SCL/SDA fall time
I6
tHT
Clock high time
I7
tDS
Data setup time
tLP/2
I8
tSCSR
Start condition setup
time
36
–
System clock
I9
tSCS
Stop condition setup
time
24
–
System clock
(1)
(2)
(3)
Min
See
Max
Unit
-
System clock
(2)
.
See
.
ns
–
–
See
(3)
(2)
.
3
ns
–
System clock
System clock
All timing is with 6-mA drive and 20-pF load.
This value depends on the value programmed in the clock period register of I2C. Maximum output frequency is the result of the minimal
value programmed in this register.
Because I2C is an open-drain interface, the controller can drive logic 0 only. Logic is the result of external pullup. Rise time depends on
the external signal capacitance and external pullup register value.
4.11.4.5 IEEE 1149.1 JTAG
The Joint Test Action Group (JTAG) port is an IEEE standard that defines a test access port (TAP) and boundary
scan architecture for digital integrated circuits and provides a standardized serial interface to control the
associated test logic. For detailed information on the operation of the JTAG port and TAP controller, see the
IEEE Standard 1149.1,Test Access Port and Boundary- Scan Architecture.
Figure 4-19 shows the JTAG timing diagram.
J2
J3
J4
TCK
J7
TMS
TDI
J8
J7
J8
TMS Input Valid
TMS Input Valid
J9
J9
J10
TDI Input Valid
J10
TDI Input Valid
J1
J11
TDO
TDO Output Valid
TDO Output Valid
SWAS031-069
Figure 4-19. JTAG Timing
Table 4-18 lists the JTAG timing parameters.
Table 4-18. JTAG Timing Parameters
Parameter Number
Parameter
Parameter Name
Max
Unit
J1
fTCK
Clock frequency
Min
15
MHz
J2
tTCK
Clock period
1/fTCK
ns
J3
tCL
Clock low period
tTCK/2
ns
J4
tCH
Clock high period
tTCK/2
ns
J7
tTMS_SU
TMS setup time
1
J8
tTMS_HO
TMS hold time
16
J9
tTDI_SU
TDI setup time
1
J10
tTDI_HO
TDI hold time
16
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Table 4-18. JTAG Timing Parameters (continued)
Parameter Number
Parameter
Parameter Name
J11
tTDO_HO
TDO hold time
Min
Max
Unit
15
4.11.4.6 ADC
Table 4-19 lists the ADC electrical specifications.
Table 4-19. ADC Electrical Specifications
Parameter
Description
Condition and Assumptions
Min
Typ
Max
Unit
Nbits
Number of bits
INL
Integral nonlinearity
Worst-case deviation from
histogram method over full scale
(not including first and last three
LSB levels)
–2.5
12
2.5
LSB
DNL
Differential nonlinearity
Worst-case deviation of any step
from ideal
–1
4
LSB
Input range
Bits
0
Driving source
impedance
FCLK
Clock rate
Successive approximation input
clock rate
Input capacitance
Number of channels
1.4
V
100
Ω
10
MHz
3.2
pF
4
Fsample
Sampling rate of each ADC
F_input_max
Maximum input signal frequency
62.5
SINAD
Signal-to-noise and distortion
Input frequency dc to 300 Hz
and 1.4 Vpp sine wave input
I_active
Active supply current
Average for analog-to-digital
during conversion without
reference current
I_PD
Power-down supply current for
core supply
KSPS
31
Absolute offset error
55
kHz
60
dB
1.5
mA
Total for analog-to-digital when
not active (this must be the SoC
level test)
1
µA
FCLK = 10 MHz
±2
mV
±2
%
Gain error
Figure 4-20 shows the ADC clock timing diagram.
Repeats Every 16 µs
Internal Ch
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
ADC CLOCK
= 10 MHz
Sampling
4 cycles
SAR Conversion
16 cycles
EXT CHANNEL 0
Sampling
4 cycles
SAR Conversion
16 cycles
INTERNAL CHANNEL
Sampling
4 cycles
SAR Conversion
16 cycles
EXT CHANNEL 1
Sampling
4 cycles
SAR Conversion
16 cycles
INTERNAL CHANNEL
Figure 4-20. ADC Clock Timing
4.11.4.7 Camera Parallel Port
The fast camera parallel port interfaces with a variety of external image sensors, stores the image data in a
FIFO, and generates DMA requests. The camera parallel port supports 8 bits.
Figure 4-21 shows the timing diagram for the camera parallel port.
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Figure 4-21. Camera Parallel Port Timing Diagram
Table 4-20 lists the timing parameters for the camera parallel port.
Table 4-20. Camera Parallel Port Timing Parameters
Parameter Number
Parameter
Parameter Name
Min
Max
Unit
pCLK
Clock frequency
2
MHz
I2
Tclk
Clock period
1/pCLK
ns
I3
tLP
Clock low period
Tclk/2
ns
I4
tHT
Clock high period
Tclk/2
ns
I7
D
Duty cycle
45 to 55
%
I8
tIS
RX data setup time
2
ns
I9
tIH
RX data hold time
2
ns
4.11.4.8 UART
The CC3200 device includes two UARTs with the following features:
• Programmable baud-rate generator allowing speeds up to 3 Mbps
• Separate 16 x 8 TX and RX FIFOs to reduce CPU interrupt service loading
• Programmable FIFO length, including 1-byte deep operation providing conventional double-buffered interface
• FIFO trigger levels of 1/8, 1/4, 1/2, 3/4, and 7/8
• Standard asynchronous communication bits for start, stop, and parity
• Line-break generation and detection
• Fully programmable serial interface characteristics
– 5, 6, 7, or 8 data bits
– Even, odd, stick, or no-parity bit generation and detection
– 1 or 2 stop-bit generation
• RTS and CTS hardware flow support
• Standard FIFO-level and End-of-Transmission interrupts
• Efficient transfers using μDMA
– Separate channels for transmit and receive
– Receive single request asserted when data is in the FIFO; burst request asserted at programmed FIFO
level
– Transmit single request asserted when there is space in the FIFO; burst request asserted at programmed
FIFO level
• System clock is used to generate the baud clock.
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5 Detailed Description
5.1
Overview
The CC3200 device has a rich set of peripherals for diverse application requirements. The device
optimizes bus matrix and memory management to give the application developer the needed advantage.
This section briefly highlights the internal details of the CC3200 device and offers suggestions for
application configurations.
5.1.1
5.2
Device Features
Functional Block Diagram
Figure 5-1 shows the functional block diagram of the CC3200 SimpleLink Wi-Fi solution.
VCC
Wide voltage
(2.1 to 3.6 V)/
preregulated 1.85 V
SPI
Flash
SPI
peripheral
I2C
peripheral
SSPI
GSPI
I2C
32-kHz
XTAL
CC3200
40-MHZ
XTAL
GPIO/PWM
Parallel
port
I2S
Miscellaneous
Peripheral
Camera
sensor
Audio
codec
SWAS032-011
Figure 5-1. Functional Block Diagram
5.3
ARM Cortex-M4 Processor Core Subsystem
The high-performance ARM Cortex-M4 processor provides a low-cost platform that meets the needs of
minimal memory implementation, reduced pin count, and low power consumption, while delivering
outstanding computational performance and exceptional system response to interrupts.
• The ARM Cortex-M4 core has low-latency interrupt processing with the following features:
– A 32-bit ARM Cortex Thumb® instruction set optimized for embedded applications
– Handler and thread modes
– Low-latency interrupt handling by automatic processor state saving and restoration during entry and
exit
– Support for ARMv6 unaligned accesses
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•
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Nested vectored interrupt controller (NVIC) closely integrated with the processor core to achieve low
latency interrupt processing. Features include:
– Bits of priority configurable from 3 to 8
– Dynamic reprioritization of interrupts
– Priority grouping that enables selection of preempting interrupt levels and nonpreempting interrupt
levels
– Support for tail-chaining and late arrival of interrupts, which enables back-to-back interrupt
processing without the overhead of state saving and restoration between interrupts
– Processor state automatically saved on interrupt entry and restored on interrupt exit with no
instruction overhead
– Wake-up interrupt controller (WIC) providing ultra-low power sleep mode support
Bus interfaces:
– Three advanced high-performance bus (AHB-Lite) interfaces: ICode, DCode, and system bus
interfaces
– Bit-band support for memory and select peripheral that includes atomic bit-band write and read
operations
Low-cost debug solution featuring:
– Debug access to all memory and registers in the system, including access to memory-mapped
devices, access to internal core registers when the core is halted, and access to debug control
registers even while SYSRESETn is asserted
– Serial wire debug port (SW-DP) or serial wire JTAG debug port (SWJ-DP) debug access
– Flash patch and breakpoint (FPB) unit to implement breakpoints and code patches
CC3200 Device Encryption
Figure 5-2 shows a standard MCU for the CC3200 device. Application image and user data files are not
encrypted. Network certificates are encrypted using a device-specific key.
Serial Flash
Data Files
Encrypted
Network
Certificates
Open File System
Application
Image
CC3200
128bit
KEK
Boot loader
Application
Code
Application
Data
Network
Processor
SWAS032-030
Figure 5-2. CC3200 Standard MCU
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5.5
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Wi-Fi Network Processor Subsystem
The Wi-Fi network processor subsystem includes a dedicated ARM MCU to completely offload the host
MCU along with an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast,
secure WLAN and Internet connections with 256-bit encryption. The CC3200 device supports station, AP,
and Wi-Fi Direct modes. The device also supports WPA2 personal and enterprise security and WPS 2.0.
The Wi-Fi network processor includes an embedded IPv4 TCP/IP stack.
Table 5-1 summarizes the NWP features.
Table 5-1. Summary of Features Supported by the NWP Subsystem
50
Item
Domain
Category
Feature
Details
1
TCP/IP
Network Stack
IPv4
2
TCP/IP
Network Stack
TCP/UDP
3
TCP/IP
Protocols
DHCP
4
TCP/IP
Protocols
ARP
5
TCP/IP
Protocols
DNS/mDNS
DNS Address resolution and local server
6
TCP/IP
Protocols
IGMP
Up to IGMPv3 for multicast management
7
TCP/IP
Applications
mDNS
Support multicast DNS for service publishing over IP
8
TCP/IP
Applications
mDNS-SD
9
TCP/IP
Applications
Web Sever/HTTP Server
10
TCP/IP
Security
TLS/SSL
TLS v1.2 (client/server)/SSL v3.0
11
TCP/IP
Security
TLS/SSL
For the supported Cipher Suite, go to SimpleLink Wi-Fi
CC3200 SDK.
12
TCP/IP
Sockets
RAW Sockets
User-defined encapsulation at WLAN MAC/PHY or IP
layers
13
WLAN
Connection
Policies
Allows management of connection and reconnection
policy
14
WLAN
MAC
Promiscuous mode
15
WLAN
Performance
Initialization time
16
WLAN
Performance
Throughput
UDP = 16 Mbps
17
WLAN
Performance
Throughput
TCP = 13 Mbps
18
WLAN
Provisioning
WPS2
19
WLAN
Provisioning
AP Config
20
WLAN
Provisioning
SmartConfig
21
WLAN
Role
Station
802.11bgn Station with legacy 802.11 power save
22
WLAN
Role
Soft AP
802.11 bg single station with legacy 802.11 power
save
23
WLAN
Role
P2P
P2P operation as GO
24
WLAN
Role
P2P
P2P operation as CLIENT
25
WLAN
Security
STA-Personal
26
WLAN
Security
STA-Enterprise
WPA2 enterprise security
27
WLAN
Security
STA-Enterprise
EAP-TLS
28
WLAN
Security
STA-Enterprise
EAP-PEAPv0/TLS
29
WLAN
Security
STA-Enterprise
EAP-PEAPv1/TLS
30
WLAN
Security
STA-Enterprise
EAP-PEAPv0/MSCHAPv2
31
WLAN
Security
STA-Enterprise
EAP-PEAPv1/MSCHAPv2
32
WLAN
Security
STA-Enterprise
EAP-TTLS/EAP-TLS
33
WLAN
Security
STA-Enterprise
EAP-TTLS/MSCHAPv2
34
WLAN
Security
AP-Personal
WPA2 personal security
Baseline IPv4 stack
Base protocols
Client and server mode
Support ARP protocol
Service discovery protocol over IP in local network
URL static and dynamic response with template.
Filter-based Promiscuous mode frame receiver
From enable to first connection to open AP less than
50 ms
Enrollee using push button or PIN method.
AP mode for initial product configuration (with
configurable Web page and beacon Info element)
Alternate method for initial product configuration
WPA2 personal security
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Power-Management Subsystem
The CC3200 power-management subsystem contains DC-DC converters to accommodate the differing
voltage or current requirements of the system.
• Digital DC-DC
– Input: VBAT wide voltage (2.1 to 3.6 V) or preregulated 1.85 V
• ANA1 DC-DC
– Input: VBAT wide voltage (2.1 to 3.6 V)
– In preregulated 1.85-V mode, the ANA1 DC-DC converter is bypassed.
• PA DC-DC
– Input: VBAT wide voltage (2.1 to 3.6 V)
– In preregulated 1.85-V mode, the PA DC-DC converter is bypassed.
In preregulated 1.85-V mode, the ANA1 DC-DC and PA DC-DC converters are bypassed. The CC3200
device is a single-chip WLAN radio solution used on an embedded system with a wide-voltage supply
range. The internal power management, including DC-DC converters and LDOs, generates all of the
voltages required for the device to operate from a wide variety of input sources. For maximum flexibility,
the device can operate in the modes described in the following sections.
5.6.1
VBAT Wide-Voltage Connection
In the wide-voltage battery connection, the device is powered directly by the battery or preregulated 3.3-V
supply. All other voltages required to operate the device are generated internally by the DC-DC
converters. This scheme is the most common mode for the device as it supports wide-voltage operation
from 2.1 to 3.6 V (for electrical connections, see Section 6.1.1, Typical Application – CC3200 WideVoltage Mode).
5.6.2
Preregulated 1.85 V
The preregulated 1.85-V mode of operation applies an external regulated 1.85 V directly at the pins 10,
25, 33, 36, 37, 39, 44, 48, and 54 of the device. The VBAT and the VIO are also connected to the 1.85-V
supply. This mode provides the lowest BOM count version in which inductors used for PA DC-DC and
ANA1 DC-DC (2.2 and 1 µH) and a capacitor (22 µF) can be avoided. For electrical connections, see
Section 6.1.2, Typical Application – CC3200 Preregulated 1.85-V Mode.
In the preregulated 1.85-V mode, the regulator providing the 1.85 V must have the following
characteristics:
• Load current capacity ≥900 mA.
• Line and load regulation with <2% ripple with 500 mA step current and settling time of <4 µs with the
load step.
• The regulator must be placed very close to the CC3200 device so that the IR drop to the device is very
low.
5.7
Low-Power Operating Mode
From a power-management perspective, the CC3200 device comprises the following two independent
subsystems:
• Cortex-M4 application processor subsystem
• Networking subsystem
Each subsystem operates in one of several power states.
The Cortex-M4 application processor runs the user application loaded from an external serial flash. The
networking subsystem runs preprogrammed TCP/IP and Wi-Fi data link layer functions.
The user program controls the power state of the application processor subsystem and can be in one of
the five modes described in Table 5-2.
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NOTE
Table 5-2 lists the modes by power consumption, with highest power modes listed first.
Table 5-2. User Program Modes
Application Processor (MCU)
Mode
Description
MCU active mode
MCU executing code at 80-MHz state rate
MCU sleep mode
The MCU clocks are gated off in sleep mode and the entire state of the device is retained. Sleep mode
offers instant wakeup. The MCU can be configured to wake up by an internal fast timer or by activity
from any GPIO line or peripheral.
MCU LPDS mode
State information is lost and only certain MCU-specific register configurations are retained. The MCU
can wake up from external events or by using an internal timer. (The wake-up time is less than 3 ms.)
Certain parts of memory can be retained while the MCU is in LPDS mode. The amount of memory
retained is configurable. Users can choose to preserve code and the MCU-specific setting. The MCU
can be configured to wake up using the RTC timer or by an external event on specific GPIOs defined in
Table 3-1 as the wake-up source.
MCU hibernate mode
The lowest power mode in which all digital logic is power-gated. Only a small section of the logic directly
powered by the input supply is retained. The real-time clock (RTC) clock keeps running and the MCU
supports wakeup from an external event or from an RTC timer expiry. Wake-up time is longer than
LPDS mode at about 15 ms plus the time to load the application from serial flash, which varies
according to code size. In this mode, the MCU can be configured to wake up using the RTC timer or
external event on a GPIO (GPIO0–GPIO6).
The NWP can be active or in LPDS mode and takes care of its own mode transitions. When there is no
network activity, the NWP sleeps most of the time and wakes up only for beacon reception.
Table 5-3. Networking Subsystem Modes
Network Processor Mode
Network active mode processing
layer 3, 2, and 1
Description
Transmitting or receiving IP protocol packets
Network active mode (processing Transmitting or receiving MAC management frames; IP processing not required.
layer 2 and 1)
Network active listen mode
Special power optimized active mode for receiving beacon frames (no other frames supported)
Network connected Idle
A composite mode that implements 802.11 infrastructure power save operation. The CC3200R network
processor automatically goes into LPDS mode between beacons and then wakes to active listen mode
to receive a beacon and determine if there is pending traffic at the access point. If not, the network
processor returns to LPDS mode and the cycle repeats.
Network LPDS mode
Low-power state between beacons in which the state is retained by the network processor, allowing for
a rapid wake up.
Network disabled
The operation of the application and network processor ensures that the device remains in the lowest
power mode most of the time to preserve battery life. Table 5-4 summarizes the important CC3200 chiplevel power modes.
Table 5-4. Important Chip-Level Power Modes
Power States for
Applications MCU
and Network
Processor
Network Processor Active Mode
(Transmit, Receive, or Listen)
Network Processor LPDS Mode
Network Processor
Disabled
MCU active mode
Chip = active (C)
Chip = active
Chip = active
MCU LPDS mode
Chip = active (A)
Chip = LPDS (B)
Chip = LPDS
MCU hibernate mode
Not supported because chip is hibernated by Not supported because chip is hibernated by Chip = hibernate (D)
MCU; thus, network processor cannot be in MCU; thus, network processor cannot be in
active mode
LPDS mode
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The following examples show the use of the power modes in applications:
• A product that is continuously connected to the network in the 802.11 infrastructure power-save mode
but sends and receives little data spends most of the time in connected idle, which is a composite of
modes A (receiving a beacon frame) and B (waiting for the next beacon).
• A product that is not continuously connected to the network but instead wakes up periodically (for
example, every 10 minutes) to send data spends most of the time in mode D (hibernate), jumping
briefly to mode C (active) to transmit data.
5.8
5.8.1
Memory
External Memory Requirements
The CC3200 device maintains a proprietary file system on the SFLASH. The CC3200 file system stores
the service pack file, system files, configuration files, certificate files, web page files, and user files. By
using a format command through the API, users can provide the total size allocated for the file system.
The starting address of the file system cannot be set and is always located at the beginning of the
SFLASH. The applications microcontroller must access the SFLASH memory area allocated to the file
system directly through the CC3200 file system. The applications microcontroller must not access the
SFLASH memory area directly.
The file system manages the allocation of SFLASH blocks for stored files according to download order,
which means that the location of a specific file is not fixed in all systems. Files are stored on SFLASH
using human-readable file names rather than file IDs. The file system API works using plain text, and file
encryption and decryption is invisible to the user. Encrypted files can be accessed only through the file
system (see Figure 5-2).
All file types can have a maximum of 128 supported files in the file system. All files are stored in blocks of
4KB and thus use a minimum of 4KB of flash space. Encrypted files with fail-safe support and optional
security are twice the original size and use a minimum of 8KB. Encrypted files are counted as fail safe in
terms of space. The maximum file size is 16MB.
Table 5-5 lists the SFLASH size recommendations.
Table 5-5. CC3200 SFLASH Size Recommendations
Typical Fail-Safe
Typical NonFail-Safe
File system
Item
20KB
20KB
Service pack
224KB
112KB
System and configuration files
216KB
108KB
MCU code
512KB
256KB
Total
8Mb
4Mb
Recommended
16Mb
8Mb
The CC3200 device supports JEDEC specification SFDP (serial flash device parameters). The following
SFLASH devices are verified for functionality with the CC3200 device in addition to the ones in the
reference design:
• Micron (N25Q128-A13BSE40): 128Mb
• Spansion (S25FL208K): 8Mb
• Winbond (W25Q16V): 16Mb
• Adesto (AT25DF081A): 8Mb
• Macronix (MX25L12835F-M2): 128Mb
For compatibility with the CC3200 device, the SFLASH device must support the following commands:
• Command 0x9F (read the device ID [JEDEC]). Procedure: SEND 0x9F, READ 3 bytes.
• Command 0x05 (read the status of the SFLASH). Procedure: SEND 0x05, READ 1 byte. Assume bit 0
is busy and bit 1 is write enable.
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•
•
•
•
•
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Command 0x06 (set write enable). Procedure: SEND 0x06, read status until write-enable bit is set.
Command 0xC7 (chip erase). Procedure: SEND 0xC7, read status until busy bit is cleared.
Command 0x03 (read data). Procedure: SEND 0x03, SEND 24-bit address, read n bytes.
Command 0x02 (write page). Procedure: SEND 0x02, SEND 24-bit address, write n bytes (0<n<256).
Command 0x20 (sector erase). Procedure: SEND 0x20, SEND 24-bit address, read status until busy
bit is cleared. Sector size is assumed to be always 4K.
Internal Memory
The CC3200 device includes on-chip SRAM to which application programs are downloaded and executed.
The application developer must share the SRAM for code and data. To select the appropriate SRAM
configuration, see the device variants listed in the orderable addendum at the end of this datasheet. The
micro direct memory access (μDMA) controller can transfer data to and from SRAM and various
peripherals. The CC3200 ROM holds the rich set of peripheral drivers, which saves SRAM space. For
more information on drivers, see the CC3200 API list.
5.8.2.1
SRAM
The CC3200 family provides up to 256KB of zero-wait-state, on-chip SRAM. Internal RAM is capable of
selective retention during LPDS mode. This internal SRAM is located at offset 0x2000 0000 of the device
memory map.
Use the µDMA controller to transfer data to and from the SRAM.
When the device enters low-power mode, the application developer can choose to retain a section of
memory based on need. Retaining the memory during low-power mode provides a faster wakeup. The
application developer can choose the amount of memory to retain in multiples of 64KB. For more
information, see the API guide.
5.8.2.2
ROM
The internal zero-wait-state ROM of the CC3200 device is at address 0x0000 0000 of the device memory
and programmed with the following components:
• Bootloader
• Peripheral driver library (DriverLib) release for product-specific peripherals and interfaces
The bootloader is used as an initial program loader (when the serial flash memory is empty). The CC3200
DriverLib software library controls on-chip peripherals with a bootloader capability. The library performs
peripheral initialization and control functions, with a choice of polled or interrupt-driven peripheral support.
The DriverLib APIs in ROM can be called by applications to reduce flash memory requirements and free
the flash memory to be used for other purposes.
5.8.2.3
Memory Map
Table 5-6 describes the various MCU peripherals and how they are mapped to the processor memory. For
more information on peripherals, see the API document.
Table 5-6. Memory Map
54
Start Address
End Address
0x0000 0000
0x0007 FFFF
On-chip ROM (Bootloader + DriverLib)
Description
0x2000 0000
0x2003 FFFF
Bit-banded on-chip SRAM
0x2200 0000
0x23FF FFFF
Bit-band alias of 0x2000 0000 through 0x200F FFFF
0x4000 0000
0x4000 0FFF
Watchdog timer A0
0x4000 4000
0x4000 4FFF
GPIO port A0
0x4000 5000
0x4000 5FFF
GPIO port A1
0x4000 6000
0x4000 6FFF
GPIO port A2
Detailed Description
Comment
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CC3200
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
Table 5-6. Memory Map (continued)
Start Address
End Address
0x4000 7000
0x4000 7FFF
GPIO port A3
0x4000 C000
0x4000 CFFF
UART A0
0x4000 D000
0x4000 DFFF
UART A1
0x4002 0000
0x400 07FF
I2C A0 (Master)
0x4002 0800
0x4002 0FFF
I2C A0 (Slave)
0x4003 0000
0x4003 0FFF
General-purpose timer A0
0x4003 1000
0x4003 1FFF
General-purpose timer A1
0x4003 2000
0x4003 2FFF
General-purpose timer A2
0x4003 3000
0x4003 3FFF
General-purpose timer A3
0x400F 7000
0x400F 7FFF
Configuration registers
0x400F E000
0x400F EFFF
System control
0x400F F000
0x400F FFFF
µDMA
0x4200 0000
0x43FF FFFF
Bit band alias of 0x4000.0000 through 0x400F.FFFF
0x4401 C000
0x4401 EFFF
McASP
0x4402 0000
0x4402 0FFF
SSPI
Used for external serial
flash
0x4402 1000
0x4402 2FFF
GSPI
Used by application
processor
0x4402 5000
0x4402 5FFF
MCU reset clock manager
0x4402 6000
0x4402 6FFF
MCU configuration space
0x4402 D000
0x4402 DFFF
Global power, reset, and clock manager (GPRCM)
0x4402 E000
0x4402 EFFF
MCU shared configuration
0x4402 F000
0x4402 FFFF
Hibernate configuration
0x4403 0000
0x4403 FFFF
Crypto range (includes apertures for all crypto-related
blocks as follows)
0x4403 0000
0x4403 0FFF
DTHE registers and TCP checksum
0x4403 5000
0x4403 5FFF
MD5/SHA
0x4403 7000
0x4403 7FFF
AES
5.9
5.9.1
Description
0x4403 9000
0x4403 9FFF
DES
0xE000 0000
0xE000 0FFF
Instrumentation trace Macrocell™
0xE000 1000
0xE000 1FFF
Data watchpoint and trace (DWT)
0xE000 2000
0xE000 2FFF
Flash patch and breakpoint (FPB)
0xE000 E000
0xE000 EFFF
Nested vectored interrupt controller (NVIC)
0xE004 0000
0xE004 0FFF
Trace port interface unit (TPIU)
0xE004 1000
0xE004 1FFF
Reserved for embedded trace macrocell (ETM)
0xE004 2000
0xE00F FFFF
Reserved
Comment
Boot Modes
Overview
The boot process of the application processor includes two phases. The first phase consists of
unrestricted access to all register space and configuration of the specific device setting. In the second
phase, the application processor executes user-specific code.
Figure 5-3 shows the bootloader flow chart.
Detailed Description
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M4 Power ON
Boot Mode =
(Fn2WJ or Fn4WJ)
(See Note.)
Boot Mode = LDfrUART
(See Note.)
Enable Clk to M4, Release
Reset to M4
Cortex Loads the PC with contents of
0x4 location, which is in ROM and part
of BootCode.
Device-Init
done?
yes
no
Execute Device Init
(From Secure ROM)
SOP=UARTLOAD
yes
Download the code using
SLProgrammer and jump
to the application
Invoke
downloader
no
Clear
Device-Init-Done
Valid Apps code in
SFLASH?
Jump to the user code.
yes
no
Infite Loop
SWAS032-012
Note: For definitions of the SoP mode functional configurations, see Table 5-7.
Figure 5-3. Bootloader Flow Chart
5.9.2
Invocation Sequence/Boot Mode Selection
The following sequence of events occur during the Cortex processor boot:
1. After power-on-reset (POR), the processor starts execution.
2. The processor jumps to the first few lines (FFL) of code in the ROM to determine if the current boot is
the first device-init boot or the second MCU boot. The determination is based on the Device-Init flag in
a secure register. The Device-Init flag is set out of POR. The registers in the secure region are
accessible only in the device-init mode.
3. If the current boot is the first boot, the processor executes the device-init code from ROM.
4. At the end of the boot, the processor clears the Device-Init flag and changes the master ID of the
processor and the DMA. These registers are part of the secure region.
5. The processor resets itself, initiating a second boot.
6. During the second boot, the processor rereads the Device-Init flag, the bit is cleared, and the
processor obtains a different master ID.
7. After executing FFL and the unsecure boot code, the processor jumps to the developer code
(application).
8. For the rest of the operation (until the next power cycle), the Cortex mode is designated the MCU.
During this phase, access to the secure region is restricted.
5.9.3
Boot Mode List
The CC3200 device implements a sense-on-power (SoP) scheme to determine the device operation
mode. The device can be configured to power up in one of the three following modes:
• Fn4WJ: Functional mode with a 4-wire JTAG mapped to fixed pins.
• Fn2WJ: Functional mode with a 2-wire SWD mapped to fixed pins.
• LDfrUART: UART load mode to flash the system during development and in OEM assembly line (for
example, serial flash connected to the CC3200R device).
56
Detailed Description
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
SoP values are sensed from the device pin during power up. This encoding determines the boot flow.
Before the device is taken out of reset, the SoP values are copied to a register and then determine the
device operation mode while powering up. These values determine the boot flow as well as the default
mapping for some of the pins (JTAG, SWD, UART0) Table 5-7 show the pull configurations.
Table 5-7. CC32x0 Functional Configurations
Name
SoP[2]
SoP[1]
SoP[0]
SoP Mode
UARTLOAD
Pullup
Pulldown
Pulldown
LDfrUART
Factory/Lab Flash/SRAM load through UART.
Device waits indefinitely for UART to load code.
The SOP bits then must be toggled to configure
the device in functional mode. Also puts JTAG in
4-wire mode.
Comment
FUNCTIONAL_
2WJ
Pulldown
Pulldown
Pullup
Fn2WJ
Functional development mode. In this mode, twopin SWD is available to the developer. TMS and
TCK are available for debugger connection.
FUNCTIONAL_
4WJ
Pulldown
Pulldown
Pulldown
Fn4WJ
Functional development mode. In this mode, fourpin JTAG is available to the developer. TDI, TMS,
TCK, and TDO are available for debugger
connection.
The recommended value of pull resistors for SOP0 and SOP1 is 100 kΩ and 2.7 kΩ for SOP2. SOP2 can
be used by the application for other functions after chip power-up is complete. However, to avoid spurious
SOP values from being sensed at power-up, TI strongly recommends that the SOP2 pin be used only for
output signals. On the other hand, the SOP0 and SOP1 pins are multiplexed with WLAN analog test pins
and are not available for other functions.
Detailed Description
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6 Applications and Implementation
6.1
6.1.1
Application Information
Typical Application – CC3200 Wide-Voltage Mode
Figure 6-1 shows the schematics for an application using the CC3200 wide-voltage mode.
Consider adding extra decoupling capacitors
if the battery cannot the peak current requirement.
VBAT
VBAT
VBAT
R1
100k
C5
C3
C4
4.7uF
4.7uF
4.7uF
CC_nRESET
0.1uF
C6
100uF
C7
100uF
C8
0.1uF
FL1
2.4GHz Filter
DEA202450BT- 1294C1
L1
1
OUT
GND1
IN
2
RF_BG
50 Ohm
31
L2
R2
38
CHIP ANTENNA
Feed
32
50 Ohm
nRESET
VIN_IO1
VIN_IO2
VIN_DCDC_DIG
10
54
44
39
VIN_DCDC_ANA
Optional
VIN_DCDC_PA
U2
37
0.1uF
3.6nH
E2
3
GND2
C2
C9
1.0pF
2.45GHz Ant
AH316M245001-T
4
C1
VBAT
100k
DCDC_ANA_SW
U1
2.2uH
48
C10
VDD_ANA1
FLASH_SPI_CSa
10uF
FLASH_SPI_DIN
C11
0.1uF
FLASH_SPI_DOUT
36
25
C13
0.1uF
FLASH_SPI_CLK
GPIO_00
GPIO_01
GPIO_02
41
42
33
DCDC_PA_SW_P
GPIO_03
DCDC_PA_SW_N
GPIO_04
DCDC_PA_OUT
GPIO_05
GPIO_06
VDD_PA_IN
GPIO_07
L8
GPIO_09
2.2uH
43
9
C18
56
C19
10uF
DCDC_DIG_SW
GPIO_10
VDD_DIG1
GPIO_11
VDD_DIG2
GPIO_12
C20
0.1uF
R7
0R
GPIO_13
0.1uF
GPIO_14
45
46
47
DCDC_ANA2_SW_P
GPIO_15
VDD_ANA2
GPIO_16
GPIO_17
0 1uF
49
24
C23
VDD_RAM
GPIO_22
VDD_PLL
GPIO_28
C22
27
0 1uF
0 1uF
28
26
GPIO_30
C12
0w1uF
4
8M (1M x 8)
M25PX80-VMN6TP
CC_GPIO_00
55
CC_GPIO_01
57
CC_GPIO_02
58
CC_GPIO_03
CC_nRESET
59
CC_GPIO_04
60
CC_GPIO_05
61
CC_GPIO_02
62
NC_26
WLAN_XTALP
CC_GPIO_08
SOP2
64
CC_GPIO_09
1
CC_GPIO_10
2
CC_GPIO_11
3
CC_GPIO_12
4
CC_GPIO_13
5
CC_GPIO_14
6
CC_GPIO_15
7
CC_GPIO_16
8
CC_GPIO_17
15
CC_GPIO_22
18
CC_GPIO_28
53
CC_GPIO_30
GND_TAB
ANTSEL1
ANTSEL2
23
22
29
Special usage
Refer datasheet
30
65
GPIO_24/JTAG_TDO
17
JTAG_TCK
GPIO_25/SOP2
GPIO_23/JTAG_TDI
16
20
CC3200
19
35
10pF
SOP1
SOP0
RTC_XTAL_P
34
51
GPIO_29/JTAG_TMS
WLAN_XTALM
RTC_XTAL_N
Y1
Crystal
32 768KHz
Add provision on the board to isolate
GPIO_01 and GPIO_02 while programming.
CC_GPIO_07
63
NC_28
21
52
FLASH PROGRAMMING
INTERFACE
CC_GPIO_01
CC_GPIO_06
NC_27
C24
C46
GND
3
DCDC_ANA2_SW_N
C21
10pF
100k
CLK
8
7
SOP0
GPIO_08
VBAT
R6 is required only when
the CC_GPIO_31 is to be used
100k
R4
WP
C17
0.1uF
CC_GPIO_31
R6
0R
R3
50
RESET
DIN
1
22uF
6
VCC
DOUT
3
C16
22uF
11
CS
C42
6.2pF
Y2
Crystal
40 MHz
Q24FA20H00396
C49
6.2pF
2
C15
5
4
For GPIO_31 to be used,
provide VBAT to pin47
2
LDO_IN2
L3
1uH
1
LDO_IN1
C14
0.1uF
40
14
13
12
SOP0
SOP2
R8
100k
R9
100k
R10
2.7k
JTAG
Note: JTAG and SOP
R104
100k
For 4-wire7JTAG/Functional mode
SOP[2:0] = 000
For 2-wire JTAG/Functional mode
SOP[2:0] = 001
Pins 16,17 can be used as GPIO
For Flash programming
SOP[2:0] = 100
NOTE: This schematic is rated from 2.3 to 3.6 V because of the limitation of the serial flash.
Figure 6-1. Schematics for CC3200 Wide-Voltage Mode Application
58
Applications and Implementation
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Table 6-1 lists the bill of materials for an application using the CC3200 wide-voltage mode.
Table 6-1. Bill of Materials for CC3200 Wide-Voltage Mode Application
Item
Qty
Part Reference
Value
Manufacturer
1
3
C1 C2 C3
4.7 µF
Samsung ElectroMechanics
America, Inc
2
13
C4 C5 C8 C11
C12 C13 C14
C17 C19 C20
C21 C22 C23
0.1 µF
Taiyo Yuden
3
1
C9
1.0 pF
4
2
C10 C18
5
2
6
Part Number
Description
CL05A475MQ5NRNC
Capacitor, Ceramic: 4.7 µF 6.3 V 20%
X5R 0402
LMK105BJ104KV-F
Capacitor, Ceramic: 0.1 µF 10 V 10%
X5R 0402
Murata Electronics
North America
GJM1555C1H1R0BB01D
Capacitor, Ceramic: 1 pF 50 V NP0 0402
10 µF
Murata Electronics
North America
GRM188R60J106ME47D
Capacitor, Ceramic: 10 µF 6.3 V 20%
X5R 0603
C15 C16
22 µF
Taiyo Yuden
AMK107BBJ226MAHT
Capacitor, Ceramic: 22 µF 4 V 20% X5R
0603
2
C24 C46
10 pF
Murata Electronics
North America
GRM1555C1H100FA01D
Capacitor, Ceramic: 10 pF 50 V 1% NP0
0402
7
2
C42 C49
6.2 pF
Murata Electronics
North America
GRM1555C1H6R2BA01D
Capacitor, Ceramic: 6.2 pF 50 V NP0
0402
8
1
E2
2.4GHz
Ant
Taiyo Yuden
AH316M245001-T
Chip Antenna: 50 Ω Bluetooth WLAN
ZigBee® WIMAX
9
1
FL1
2.4GHz
Filter
TDK-Epcos
DEA202450BT-1294C1-H
Filter, Bandpass: 2.4 GHz WLAN SMD
10
1
L1
3.6 nH
Murata Electronics
North America
LQP15MN3N6B02D
Inductor: 3.6 nH 0.1 nH 0402
11
2
L2 L8
2.2 µH
Murata Electronics
North America
LQM2HPN2R2MG0L
Inductor: 2.2 µH 20% 1300 mA 1008
12
1
L3
1 µH
Murata
LQM2HPN1R0MJ0L
Inductor, Power: 1.0 µH 1500 mA 1007
16
1
U1
8M
(1M x
8)
17
1
U2
18
1
19
1
Micron Technology M25PX80-VMN6TP
Inc
IC Flash: 8Mb 75 MHz 8SO
CC3200
Texas Instruments
CC3200R1
ARM M4 MCU with 802.11bgn WI-FI
Y1
Crystal
Abracon
Corporation
ABS07-32.768KHZ-T
Crystal: 32.768 kHz 12.5 pF SMD
Y2
Crystal
Epson
Q24FA20H00396
Crystal: 40 MHz 8 pF SMD
NOTE
Use any 5% tolerance resistor 0402 or higher package.
6.1.2
Typical Application – CC3200 Preregulated 1.85-V Mode
Figure 6-2 shows the schematics for an application using the CC3200 preregulated 1.85-V mode.
Applications and Implementation
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1.85V
Consider adding extra decoupling capacitors
if the battery cannot source the peak current.
1.85V
R1
100K
1.85V
CC_nRESET
C5
C1
C2
C3
C4
C8
0.1uF
0.1uF
0.1uF
FL1
2.4GHz Filter
DEA202450BT-1294C1
Feed
50 Ohm
VDD_ANA1
FLASH_SPI_CSl
FLASH_SPI_DIN
FLASH_SPI_CLK
GPIO_00
GPIO_02
41
42
33
C16
DCDC_PA_SW_P
GPIO_03
DCDC_PA_SW_N
GPIO_04
DCDC_PA_OUT
GPIO_05
GPIO_06
VDD_PA_IN
GPIO_07
GPIO_09
2.2uH
R3
100k
R4
100k
50
DIN
RESET
WP
CLK
GND
4
8
7
C12
0.1uF
3
4
8M (1M x 8)
W25Q80BWZPIG
CC_GPIO_00
55
CC_GPIO_01
57
CC_GPIO_02
58
CC_GPIO_03
CC_nRESET
59
CC_GPIO_04
60
CC_GPIO_05
61
C18
56
C19
10uF
DCDC_DIG_SW
GPIO_10
VDD_DIG1
GPIO_11
VDD_DIG2
GPIO_12
C20
0.1uF
R7
0R
GPIO_13
0.1uF
GPIO_14
45
46
47
DCDC_ANA2_SW_P
GPIO_15
CC_GPIO_02
VDD_ANA2
GPIO_16
GPIO_17
0.1uF
24
C23
VDD_RAM
GPIO_22
VDD_PLL
GPIO_28
C22
27
0.1uF
0.1uF
28
26
GPIO_30
NC_26
WLAN_XTALP
SOP2
CC_GPIO_09
1
CC_GPIO_10
2
CC_GPIO_11
3
CC_GPIO_12
4
CC_GPIO_13
5
CC_GPIO_14
6
CC_GPIO_15
7
CC_GPIO_16
8
CC_GPIO_17
15
CC_GPIO_22
18
CC_GPIO_28
53
CC_GPIO_30
GND_TAB
ANTSEL1
ANTSEL2
23
22
29
Special usage
Refer datasheet
30
65
GPIO_24/JTAG_TDO
17
JTAG_TCK
GPIO_23/JTAG_TDI
16
20
SOP1
GPIO_25/SOP2
19
35
CC3200
21
SOP0
RTC_XTAL_P
10pF
GPIO_29/JTAG_TMS
WLAN_XTALM
RTC_XTAL_N
34
51
CC_GPIO_08
64
NC_28
Y1
Crystal
32.768KHz
63
NC_27
C24
52
Add provision on the board to isolate
GPIO_01 and GPIO_02 while programming.
CC_GPIO_07
DCDC_ANA2_SW_N
C21
49
FLASH PROGRAMMING
INTERFACE
CC_GPIO_01
CC_GPIO_06
62
1
9
C46
6
VCC
DOUT
3
43
1.85V
10pF
11
CS
C42
6.2pF
Y2
Crystal
40 MHz
Q24FA20H00396
C49
6.2pF
2
L8
R6
0R
5
SOP0
GPIO_08
CC_GPIO_31
R6 is required only
if GPIO_31 is used
2
C17
0.1uF
22uF
2.45GHz Ant
AH316M245001-T
1.85V
4
For GPIO_31 to be used,
provide Vcc to pin47
1
LDO_IN2
GPIO_01
1.85V
14
13
12
LDO_IN1
C14
0.1uF
40
E2
C9
1.0pF
U1
FLASH_SPI_DOUT
25
3.6nH
3
100k
DCDC_ANA_SW
C11
0.1uF
C13
0.1uF
OUT
GND1
50 Ohm
31
R2
36
IN
2
RF_BG
48
L1
1
nRESET
1.85V
38
CHIP ANTENNA
GND2
32
10
VIN_IO1
54
VIN_IO2
VIN_DCDC_DIG
VIN_DCDC_ANA
Optional
4.7uF
39
U3
4.7uF
44
4.7uF
VIN_DCDC_PA
C7
100uF
37
C6
100uF
SOP0
SOP2
R8
100k
R9
100k
R10
2.7k
JTAG
Note: JTAG and SOP
For 4-wire JTAG/Functional mode
SOP[2:0] = 000
R104
100k
For 2-wire JTAG/Functional mode
SOP[2:0] = 001
Pins 16,17 can be used as GPIO
For Flash programming
SOP[2:0] = 100
Figure 6-2. Schematics for CC3200 Preregulated 1.85-V Mode Application
60
Applications and Implementation
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Product Folder Links: CC3200
CC3200
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
Table 6-1 lists the bill of materials for an application using the CC3200 preregulated 1.85-V mode.
Table 6-2. Bill of Materials for CC3200 Preregulated 1.85-V Mode Application
Item
Qty
Part Reference
Value
Manufacturer
1
3
C1 C2 C3
4.7 µF
Samsung ElectroMechanics
America, Inc
2
12
C4 C5 C8 C11
C12 C14 C17
C19 C20 C21
C22 C23
0.1 µF
Taiyo Yuden
3
1
C9
1.0 pF
Murata Electronics
North America
4
1
C16
22 µF
Taiyo Yuden
5
2
C13 C18
10 µF
6
2
C24 C46
7
2
8
Part Number
Description
CL05A475MQ5NRNC
Capacitor, Ceramic: 4.7 µF 6.3 V 20%
X5R 0402
LMK105BJ104KV-F
Capacitor, Ceramic: 0.1 µF 10 V 10%
X5R 0402
GJM1555C1H1R0BB01D
Capacitor, Ceramic: 1 pF 50 V NP0 0402
AMK107BBJ226MAHT
Capacitor, Ceramic: µF 4 V 20% X5R
0603
Murata Electronics
North America
GRM188R60J106ME47D
Capacitor, Ceramic: 10 µF 6.3 V 20%
X5R 0603
10 pF
Murata Electronics
North America
GRM1555C1H100FA01D
Capacitor, Ceramic: 10 pF 50 V 1% NP0
0402
C42 C49
6.2 pF
Murata Electronics
North America
GRM1555C1H6R2BA01D
Capacitor, Ceramic: 6.2 pF 50 V NP0
0402
1
E2
2.4GHz
Ant
Taiyo Yuden
AH316M245001-T
Antenna, Chip: 50 Ω Bluetooth WLAN
ZigBee WIMAX
9
1
FL1
2.4GHz
Filter
TDK-Epcos
DEA202450BT-1294C1-H
Filter, Bandpass: 2.4 GHz WLAN SMD
10
1
L1
3.6 nH
Murata Electronics
North America
LQP15MN3N6B02D
Inductor: 3.6 nH 0.1 nH 0402
11
1
L8
2.2 µH
Murata Electronics
North America
LQM2HPN2R2MG0L
Inductor: 2.2 µH 20% 1300 mA 1008
15
1
U1
8M
(1M x
8)
Winbond
W25Q80BWZPIG
IC FLASH 8Mb 75 MHz 8WSON
16
1
U2
CC3200
Texas Instruments
CC3200R1
ARM M4 MCU with 802.11bgn WIFI
17
1
Y1
Crystal
Abracon
Corporation
ABS07-32.768KHZ-T
Crystal: 32.768 kHz 12.5 pF SMD
18
1
Y2
Crystal
Epson
Q24FA20H00396
Crystal: 40 MHz 8 pF SMD
NOTE
Use any 5% tolerance resistor 0402 or higher package.
Applications and Implementation
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CC3200
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7 Device and Documentation Support
7.1
Device Support
7.1.1
Development Support
The CC3200 evaluation board includes a set of tools and documentation to help the user during the
development phase.
7.1.1.1
PinMux Tool
The CC3200 device uses pin multiplexing extensively to accommodate the large number of peripheral
functions in the smallest possible package. The PinMux tool is a utility used to select the appropriate pin
multiplexing configuration that meets the end application requirements. The PinMux tool makes it easy to
understand the various pin multiplexing options and enables the best configuration to be chosen without
error.
7.1.1.2
Radio Tool
The SimpleLink radio tool is a utility for operating and testing the CC3200 chipset designs during
development of the application board. The CC3200 device has an auto-calibrated radio that enables easy
connection to the antenna without requiring expertise in radio circuit design.
7.1.1.3
Uniflash Flash Programmer
The Uniflash flash programmer utility allows end users to communicate with the SimpleLink device to
update the serial flash. The easy GUI interface enables flashing of files (including read-back verification
option), storage format (secured and nonsecured formatting), version reading for boot loader and chip ID,
and so on.
7.1.2
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the
CC3200 device and support tools (see Figure 7-1).
X
CC
3
2
0
0
R
1 MX
RGC
R
PREFIX
X = preproduction device
no prefix = production device
PACKAGING
R = tape/reel
T = small reel
DEVICE FAMILY
CC = wireless connectivity
PACKAGE
RGC = 9x9 QFN
SERIES NUMBER
3 = Wi-Fi Centric
MEMORY SIZE
M1 = 128KB
M2 = 256KB
Figure 7-1. CC3200 Device Nomenclature
62
Device and Documentation Support
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CC3200
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7.2
SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
Documentation Support
The following documents provide support for the CC3200 device.
7.3
SWRU372
CC3200 SimpleLink Wi-Fi and IoT Solution With MCU LaunchPad Getting Started Guide
SWRU367
CC3200 SimpleLink Wi-Fi and IoT Solution With MCU Technical Reference Manual
SWRU369
CC3200 SimpleLink Wi-Fi and IoT Solution With MCU Programmer's Guide
SWRU370
CC3100 and CC3200 SimpleLink Wi-Fi and IoT Solution Layout Guidelines
SWRC289
CC3200 SimpleLink Wi-Fi and IoT Solution With MCU LaunchPad Board Design Files
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
7.4
Trademarks
SimpleLink, Internet-On-a-Chip, SmartConfig, E2E are trademarks of Texas Instruments.
Cortex is a registered trademark of ARM Limited.
ARM is a registered trademark of ARM Physical IP, Inc.
Macrocell is a trademark of Kappa Global Inc.
Wi-Fi CERTIFIED is a trademark of Wi-Fi Alliance.
Wi-Fi, Wi-Fi Direct are registered trademarks of Wi-Fi Alliance.
ZigBee is a registered trademark of ZigBee Alliance.
All other trademarks are the property of their respective owners.
7.5
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.6
Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Device and Documentation Support
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SWAS032F – JULY 2013 – REVISED FEBRUARY 2015
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8 Mechanical Packaging and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
64
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
Product Folder Links: CC3200
Copyright © 2013–2015, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CC3200R1M1RGCR
ACTIVE
VQFN
RGC
64
2500
Green (RoHS
& no Sb/Br)
CU
Level-3-260C-168 HR
-40 to 85
CC3200R1
M1
CC3200R1M2RGC
ACTIVE
VQFN
RGC
64
260
Green (RoHS
& no Sb/Br)
CU
Level-3-260C-168 HR
-40 to 85
CC3200R1
M2
CC3200R1M2RGCR
ACTIVE
VQFN
RGC
64
2500
Green (RoHS
& no Sb/Br)
CU
Level-3-260C-168 HR
-40 to 85
CC3200R1
M2
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2015
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Apr-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CC3200R1M1RGCR
VQFN
RGC
64
2500
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
CC3200R1M2RGCR
VQFN
RGC
64
2500
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Apr-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC3200R1M1RGCR
VQFN
RGC
64
2500
367.0
367.0
38.0
CC3200R1M2RGCR
VQFN
RGC
64
2500
367.0
367.0
38.0
Pack Materials-Page 2
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