DATASHEET

HA-2515
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O B S U B S TI T 5
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SIBL DataHA
Sheet
PO S
®
May 2003
FN2893.5
12MHz, High Input Impedance,
Operational Amplifier
Features
HA-2515 is a high performance operational amplifier which
sets the standards for maximum slew rate, highest accuracy
and widest bandwidths for internally compensated devices.
In addition to excellent dynamic characteristics, this
dielectrically isolated amplifier also offers low offset current
and high input impedance.
• Fast Settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns
• Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60V/µs
The ±60V/µs slew rate and 250ns (0.1%) settling time of this
amplifier is ideally suited for high speed D/A, A/D, and pulse
amplification designs. HA-2515’s superior 12MHz gain
bandwidth and 1000kHz power bandwidth is extremely useful
in RF and video applications. For accurate signal conditioning
this amplifier also provides 10nA offset current, coupled with
100MΩ input impedance, and offset trim capability.
Pinout
• Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . . 1MHz
• Gain Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . 12MHz
• High Input Impedance . . . . . . . . . . . . . . . . . . . . . . 100MΩ
• Low Offset Current . . . . . . . . . . . . . . . . . . . . . . . . . . .10nA
• Internally Compensated for Unity Gain Stability
Applications
• Data Acquisition Systems
• RF Amplifiers
• Video Amplifiers
• Signal Generators
HA-2515 (PDIP)
TOP VIEW
• Pulse Amplification
Part Number Information
BAL
1
-IN
2
+IN
3
V-
4
+
1
8
COMP
7
V+
6
OUT
5
BAL
PART NUMBER
HA3-2515-5
TEMP.
RANGE (oC)
0 to 75
PACKAGE
8 Ld PDIP
PKG.
NO.
E8.3
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
HA-2515
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 40V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W) θJC (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . .
120
N/A
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range
HA-2515-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
VSUPPLY = ±15V
Electrical Specifications
TEMP (oC)
MIN
TYP
MAX
UNITS
Offset Voltage
25
-
5
10
mV
Full
-
-
14
mV
Offset Voltage Average Drift
Full
-
30
-
µV/oC
Bias Current
25
-
125
250
nA
nA
PARAMETER
INPUT CHARACTERISTICS
Full
-
-
500
25
-
20
50
nA
Full
-
-
100
nA
Input Resistance (Note 2)
25
40
100
-
MΩ
Common Mode Range
Full
±10.0
-
-
V
Large Signal Voltage Gain (Notes 3, 6)
25
7.5
15
-
kV/V
Full
5
-
-
kV/V
Common Mode Rejection Ratio (Note 4)
Full
74
90
-
dB
Gain Bandwidth Product (Note 5)
25
-
12
-
MHz
Output Voltage Swing (Note 3)
Full
±10.0
±12.0
-
V
Output Current (Note 6)
25
±10
±20
-
mA
Full Power Bandwidth (Notes 6, 11)
25
600
1000
-
kHz
25
-
25
50
ns
Offset Current
TRANSFER CHARACTERISTICS
OUTPUT CHARACTERISTICS
TRANSIENT RESPONSE
Rise Time (Notes 3, 7, 8, 9)
Overshoot (Notes 3, 7, 8, 9)
25
-
25
50
%
Slew Rate (Notes 3, 7, 9, 12)
25
±40
±60
-
V/µs
Settling Time to 0.1% (Notes 3, 7, 9, 12)
25
-
0.25
-
µs
POWER SUPPLY CHARACTERISTICS
Supply Current
25
-
4
6
mA
Power Supply Rejection Ratio (Note 10)
Full
74
90
-
dB
NOTES:
2. This parameter value is based on design calculations.
3. RL = 2kΩ.
4. VCM = ±10V
5. AV >10.
6. VO = ±10V.
7. CL = 50pF.
8. VO = ±200mV.
9. See Transient Response Test Circuits and Waveforms.
10. ∆V = ±5V.
11. Full Power Bandwidth guaranteed based on slew rate measurement using: FPBW = Slew Rate/2πVPEAK.
12. VOUT = ±5V.
2
HA-2515
Test Circuits and Waveforms
+5V
+200mV
INPUT
-5V
+5V
INPUT
0mV
75%
OUTPUT
OVERSHOOT
∆V
25%
-5V
ERROR BAND
±10mV FROM
FINAL VALUE
SLEW
RATE
= ∆V/∆t
∆t
+200mV
90%
OUTPUT
10%
0mV
RISE TIME
SETTLING
TIME
NOTE: Measured on both positive and negative transitions from 0V
to +200mV and 0V to -200mV at the output.
FIGURE 1. SLEW RATE AND SETTLING TIME
FIGURE 2. TRANSIENT RESPONSE
+
IN
OUT
2kΩ
50pF
RL = 2kΩ, CL = 50pF
Upper Trace: Input
Lower Trace: Output
FIGURE 3. SLEW RATE AND TRANSIENT RESPONSE
2kΩ
2
3
FIGURE 4. VOLTAGE FOLLOWER PULSE RESPONSE
1µF
V+
INPUT
Vertical = 5V/Div.
Horizontal = 200ns/Div.
TA = 25oC, VS = ±15V
+
7 0.01µF
6
4
OUTPUT
V+
1µF
50pF
20kΩ
V-
5kΩ
0.01µF
RT
2kΩ
D
G
5kΩ
IN
2N4416
S
BAL.
SETTLING TIME
TEST POINT
V-
2kΩ
CR1
OUT
COMP
CC
CR2
NOTES:
13. AV = -1.
14. Feedback and summing resistor ratios should be 0.1% matched.
15. Clipping diodes CR1 and CR2 are optional. HP5082-2810
recommended.
FIGURE 5. SETTLING TIME TEST CIRCUIT
3
NOTE: Tested offset adjustment range is IVOS + 1mVI minimum
referred to output. Typical ranges are ±6mV with RT = 20kΩ.
FIGURE 6. SUGGESTED VOS ADJUSTMENT AND
COMPENSATION HOOK UP
HA-2515
Schematic
BAL
R5
200
Q1
R2
2K
R7 R10
1.8K 1.8K
Q6
Q8
R11
2K
Q7
C2
2.7pF
Q9
C1
10pF
Q15
R4
11.13K
Q38
1.68K
Q35
R25
Q29
Q30
Q31
Q36
Q32
4
Q39
1.68K
Q17
Q18
R26
Q28
Q27
Q25
R20
3.0K
Q23
Q22
Q24
R22
240Ω
R14
30
Q19
R19 Q13
6.3K
Q26
R23
3.0K
Q33
OUT
Q40
Q37
Q34
R13
30
Q14
Q12
+IN
-IN
Q16
Q11
Q4
COMP
R12
1.1K
Q10
Q5
R3
960
V+
R8
200
R6 R9
200 200
R1
4K
Q2
Q3
BAL
R18
1.48K
R17
1.48K
R16
1.48K
Q20
Q21
R15
740
V-
HA-2515
Typical Performance Curves
4.4
100
4.2
80
SUPPLY CURRENT (mA)
BIAS CURRENT
CURRENT (nA)
4.0
VSUPPLY = ±20V
VSUPPLY = ±15V
VSUPPLY = ±10V
3.8
3.6
60
40
20
OFFSET CURRENT
3.4
0
3.2
-50
-25
0
25
50
75
100
-20
125
-50
-25
TEMPERATURE (oC)
FIGURE 7. POWER SUPPLY CURRENT vs TEMPERATURE
0
25
50
TEMPERATURE (oC)
75
100
125
FIGURE 8. INPUT BIAS AND OFFSET CURRENT vs
TEMPERATURE
1.1
NORMALIZED PARAMETERS
REFERRED TO VALUES AT 25oC
10
10K SOURCE RESISTANCE
0K SOURCE RESISTANCE
1.0
THERMAL NOISE
OF 10K RESISTOR
1kHz
10kHz
FREQUENCY (Hz)
100kHz
BANDWIDTH
0.9
0
100
30
GAIN
60
60
PHASE
90
40
120
20
150
0
180
100
1K
10K
1M
100K
FREQUENCY (Hz)
10M
100M
FIGURE 11. OPEN LOOP GAIN AND PHASE RESPONSE
5
-50
-25
0
25
50
75
100
125
FIGURE 10. NORMALIZED AC PARAMETERS vs
TEMPERATURE
1.1
PHASE (DEGREES)
OPEN LOOP VOLTAGE GAIN (dB)
SLEW RATE
TEMPERATURE (oC)
120
-20
10
SLEW RATE
1.0
1MHz
FIGURE 9. EQUIVALENT INPUT NOISE vs BANDWIDTH
(WITH 10Hz HIGH PASS FILTER)
80
BANDWIDTH
0.8
0.1
100Hz
NORMALIZED PARAMETERS
REFERRED TO VALUES AT ±15V
EQUIVALENT INPUT NOISE (µVRMS)
100
SLEW RATE
1.0
BANDWIDTH
BANDWIDTH
SLEW RATE
0.9
0.8
±10
±15
SUPPLY VOLTAGE (V)
FIGURE 12. NORMALIZED AC PARAMETERS vs SUPPLY
VOLTAGE AT 25oC
±20
HA-2515
Typical Performance Curves
(Continued)
90
VSUPPLY = ±20V
VSUPPLY = ±15V
VSUPPLY = ±10V
100
0pF
30pF
100pF
80
85
GAIN (dB)
OPEN LOOP VOLTAGE GAIN (dB)
120
60
40
20
80
300pF
1000pF
0
-20
10
75
100
1K
10K
100K
FREQUENCY (Hz)
1M
10M
-50
100M
FIGURE 13. OPEN LOOP GAIN RESPONSE FOR VARIOUS
VALUES OF CAPACITORS FROM COMPENSATION
PIN TO GROUND
TA = 25oC
30
VSUPPLY = ±15V
20
15
VSUPPLY = ±10V
10
5
0
10K
100K
1MEG
10MEG
FREQUENCY (Hz)
FIGURE 15. OUTPUT VOLTAGE SWING vs FREQUENCY
6
25
50
75
100
125
FIGURE 14. OPEN LOOP VOLTAGE GAIN vs TEMPERATURE
VSUPPLY = ±20V
25
0
TEMPERATURE (oC)
35
OUTPUT VOLTAGE SWING (VP-P)
-25
HA-2515
Die Characteristics
SUBSTRATE POTENTIAL (Powered Up):
DIE DIMENSIONS:
Unbiased
65 mils x 57 mils x 19 mils
1650µm x 1450µm x 483µm
TRANSISTOR COUNT:
METALLIZATION:
40
Type: Al, 1% Cu
Thickness: 16kÅ ±2kÅ
PROCESS:
Bipolar Dielectric Isolation
PASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ±2kÅ
Nitride Thickness: 3.5kÅ ±1.5kÅ
Metallization Mask Layout
HA-2515
+IN
-IN
BAL
COMP
V-
V+
BAL
OUT
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
7
HA-2515
FN
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
SYMBOL
-B-
-C-
A2
SEATING
PLANE
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MAX
NOTES
-
0.210
-
5.33
4
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
0.204
0.355
-
D
0.355
0.400
9.01
D1
0.005
-
0.13
-
5
A
L
MIN
A
E
BASE
PLANE
MAX
A1
-AD
MILLIMETERS
MIN
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
10.16
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
eA
0.300 BSC
7.62 BSC
6
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
8
N
8
8
9
Rev. 0 12/93
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