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1- 888 -
HA-2842
®
80MHz, High Slew Rate, High Output
Current, Video Operational Amplifier
• Stable at Gains of 2 or Greater
The capabilities of the HA-2842 are ideally suited for high
speed cable driver circuits, where low closed loop gains and
high output drive are required. With a 6MHz full power
bandwidth, this amplifier is well suited for high frequency
signal conditioning circuits and video amplifiers. Gain
flatness of 0.035dB, combined with differential gain and
phase specifications of 0.02%, and 0.03 degrees,
respectively, make the HA-2842 ideal for component and
composite video applications.
A zener/nichrome based reference circuit, coupled with
advanced laser trimming techniques, yields a supply current
with a low temperature coefficient and low lot-to-lot variability.
For example, the average ICC variation from 85oC to -40oC is
<600µA (±2%), while the standard deviation of the ICC
distribution is <0.1mA (0.8%) at 25oC. Tighter ICC control
translates to more consistent AC parameters ensuring that
units from each lot perform the same way, and easing the task
of designing systems for wide temperature ranges. Critical AC
parameters, Slew Rate and Bandwidth, each vary by less than
±5% over the industrial temperature range (see Typical
Performance Curves)
Part Number Information.
HA9P2842-5
(H2842F5)
TEMP.
RANGE (oC)
0 to 75
PACKAGE
8 Ld SOIC
1
FN2766.7
Features
The HA-2842 is a wideband, high slew rate, operational
amplifier featuring an outstanding combination of speed,
bandwidth, and output drive capability. This amplifier’s
performance is further enhanced through stable operation
down to closed loop gains of +2, the inclusion of offset null
controls, and by its excellent video performance.
PART NUMBER
(BRAND)
October 2004
• Low AC Variability Over Process and Temperature
• Gain Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . 80MHz
• Gain Flatness to 10MHz. . . . . . . . . . . . . . . . . . . . 0.035dB
• High Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 400V/µs
• High Output Current (Min) . . . . . . . . . . . . . . . . . . . 100mA
• Differential Gain/Phase . . . . . . . . . . 0.02%/0.03 Degrees
• Low Supply Current (Max) . . . . . . . . . . . . . . . . . . . . 15mA
• Enhanced Replacement for AD842
Applications
• Pulse and Video Amplifiers
• Wideband Amplifiers
• Coaxial Cable Drivers
• Fast Sample-Hold Circuits
• High Frequency Signal Conditioning Circuits
Pinout
HA-2842 (SOIC)
TOP VIEW
BAL
1
-IN
2
+IN
3
V-
4
+
8
BAL
7
V+
6
OUT
5
NC
PKG.
DWG. #
M8.15
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003, 2004. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
HA-2842
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . . . . . . . 35V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V
Output Current (Notes 3, 4) . . . . . . . . . . . . . . . . . . . . . . . . . . 125mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100mA (50% Duty Cycle)
Thermal Resistance (Typical, Note 2)
Operating Conditions
Temperature Range
HA-2842-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC
Recommended Supply Voltage Range . . . . . . . . . . . ±6.5V to ±15V
θJA (oC/W)
8 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . .
160
Maximum Junction Temperature (Die) . . . . . . . . . . . . . . . . . . . .175oC
Maximum Junction Temperature (Plastic Package, Note 1) . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Maximum power dissipation, including output load, must be designed to maintain the maximum junction temperature below 150oC for plastic
packages. By using Application Note AN556 on Safe Operating Area equations, along with the packaging thermal resistances listed in the
Thermal Information section, proper load conditions can be determined.
2. θJA is measured with the component mounted on an evaluation PC board in free air.
3. VO = ±5V, RL Unconnected, Duty cycle ≤ 50%. For information about using high output current amplifiers, please refer to Application Note AN556
(Thermal Safe-Operating-Areas For High Current Op Amps), and the “Power Dissipation Considerations” section in the “Application Information”
section of this datasheet.
4. Maximum continuous (100% Duty Cycle) output current is 50mA. For currents >50mA, Duty Cycle must be derated accordingly.
VSUPPLY = ±15V, RL = 1kΩ, CL ≤ 10pF, Unless Otherwise Specified
Electrical Specifications
HA-2842-5
PARAMETER
TEST CONDITIONS
TEMP (oC)
MIN
TYP
MAX
UNITS
25
-
1
3
mV
INPUT CHARACTERISTICS
Offset Voltage (Note 10)
Full
-
-
6
mV
Average Offset Voltage Drift
Full
-
13
-
µV/oC
Bias Current (Note 10)
25
-
5
10
µA
Full
-
-
15
µA
Average Bias Current Drift
Full
-
20
-
nA/oC
Offset Current
25
-
0.5
1.0
µA
Full
-
-
1.5
µA
Average Offset Current Drift
Full
-
1.3
-
nA/oC
Input Resistance
25
-
170
-
kΩ
Input Capacitance
25
-
1
-
pF
Common Mode Range
Full
±10
-
-
V
Input Noise Voltage
10Hz to 1MHz
25
-
16
-
µVRMS
Input Noise Voltage Density
f = 1kHz, RSOURCE = 0Ω
25
-
16
-
nV ⁄ Hz
Input Noise Current (Note 10)
f = 1kHz, RSOURCE = 100kΩ
25
-
2
-
pA ⁄ Hz
Large Signal Voltage Gain
VO = ±10V
25
50
100
-
kV/V
Full
30
60
-
kV/V
Common-Mode Rejection Ratio (Note 10)
VCM = ±10V
Full
80
110
-
dB
25
2
-
-
V/V
TRANSFER CHARACTERISTICS
Minimum Stable Gain
Gain Bandwidth Product (Note 10)
AVCL = 100
25
-
80
-
MHz
Gain Flatness to 10MHz (Note 10)
RL ≥ 75Ω
25
-
±0.035
-
dB
2
HA-2842
VSUPPLY = ±15V, RL = 1kΩ, CL ≤ 10pF, Unless Otherwise Specified (Continued)
Electrical Specifications
HA-2842-5
PARAMETER
TEST CONDITIONS
TEMP (oC)
MIN
TYP
MAX
UNITS
OUTPUT CHARACTERISTICS
Output Voltage Swing (Note, 10)
VO = ± 10V
Full
±10
±11
-
V
Output Current (Note 10)
(Note 3)
Full
100
-
-
mA
25
-
8.5
-
Ω
Output Resistance
Full Power Bandwidth (Note 6)
VO = ± 10V
25
5.2
6
-
MHz
Differential Gain (Note 10)
(Note 5)
25
-
0.02
-
%
Differential Phase (Note 10)
(Note 5)
25
-
0.03
-
Degrees
Harmonic Distortion (Note 10)
VO = 2VP-P, f = 1MHz, AV = 2
25
-
>81
-
dBc
Rise Time
25
-
4
-
ns
Overshoot
25
-
25
-
%
TRANSIENT RESPONSE (Note 7)
Slew Rate (Notes 9, 10)
AV = +2
25
325
400
-
V/µs
Settling Time
10V Step to 0.1%
25
-
100
-
ns
25
-
14.2
-
mA
Full
-
14.3
15
mA
Full
70
80
-
dB
POWER REQUIREMENTS
Supply Current (Note 10)
Power Supply Rejection Ratio (Note 10)
(Note 8)
NOTES:
5. Differential gain and phase are measured with a VM700A video tester, using a NTC-7 composite VITS. RF = R1 = 1kΩ, RL = 700Ω.
Slew Rate
6. Full Power Bandwidth guaranteed based on slew rate measurement using FPBW = --------------------------- ; V PEAK = 10V .
2πV PEAK
7. Refer to Test Circuits section of this data sheet.
8. VSUPPLY = ±10V to ±20V.
9. This parameter is not tested. The limits are guaranteed based on lab characterization and reflect lot-to-lot variation.
10. See “Typical Performance Curves” for more information.
3
HA-2842
Test Circuits and Waveforms
IN
+
OUT
-
500Ω
NOTES:
500Ω
11. VS = ±15V.
12. AV = +2.
13. CL ≤ 10pF
TEST CIRCUIT
INPUT
INPUT
OUTPUT
OUTPUT
Input = 100mV/Div., Output = 100mV/Div., 50ns/Div.
Input = 5V/Div., Output = 5V/Div., 50ns/Div.
SMALL SIGNAL RESPONSE
LARGE SIGNAL RESPONSE
NOTES:
SETTLING
POINT
14. AV = -2.
15. Feedback and summing resistors must be matched (0.1%).
16. HP5082-2810 clipping diodes recommended.
2.5kΩ
5kΩ
17. Tektronix P6201 FET probe used at settling point.
1kΩ
18. For 0.01% settling time, heat sinking is suggested to reduce
thermal effects and an analog ground plane with supply
decoupling is suggested to minimize ground loop errors.
V+
500Ω
VIN
-
VOUT
+
V-
SETTLING TIME TEST CIRCUIT
V+
5kΩ
+
BAL
OUT
V-
SUGESTED OFFSET VOLTAGE ADJUSTMENT
4
HA-2842
Application Information
Power Dissipation Considerations
The Intersil HA-2842 is a state of the art monolithic device
which also approaches the “ALL-IN-ONE” amplifier concept.
This device features an outstanding set of AC parameters
augmented by excellent output drive capability providing for
suitable application in both high speed and high output drive
circuits.
At high output currents, especially with the 8 lead SOIC
package, care must be taken to ensure that the Maximum
Junction Temperature (TJ, see “Absolute Maximum Ratings”
table) isn’t exceeded. As an example consider the HA-2842 in
the SOIC package, with a required output current of 50mA at
VOUT = 10V with ±15V supplies. The power dissipation is the
quiescent power (450mW = 30V x 15mA) plus the power
dissipated in the output stage
(POUT = 250mW = 50mA x (15V - 10V)), or a total of 700mW.
The thermal resistance (θJA) of the SOIC package is 157oC/W,
which increases the junction temperature by 110oC over the
ambient temperature (TA). Remaining below TJMAX requires
that TA be restricted to ≤ 40oC (150oC - 110oC). Heatsinking
would be required for operation at ambient temperatures
greater than 40oC.
Primarily intended to be used in balanced 50Ω and 75Ω
coaxial cable systems as a driver, the HA-2842 could also be
used as a power booster in audio systems as well as a
power amp in power supply circuits. This device would also
be suitable as a small DC motor driver.
Prototyping Guidelines
For best overall performance in any application, it is
recommended that high frequency layout techniques be
used. This should include:
MAX POUT WITHOUT HEATSINK (VS = ±15V)
TA
8 LEAD SOIC
(θJA = 157oC/W)
85oC
Heatsink Required
70oC
60mW
25oC
350mW
1. Mounting the device through a ground plane.
2. Connecting unused pins (NC) to the ground plane.
3. Mounting feedback components on Teflon standoffs
and/or locating these components as close to the device
as possible.
4. Placing power supply decoupling capacitors from device
supply pins to ground.
Allowable output power can be increased by decreasing the
quiescent dissipation via lower supply voltages.
For more information please refer to Application Note AN556,
Thermal Safe Operating Areas for High Current Op Amps.
Typical Performance Curves
TA = 25oC, VSUPPLY = ±15V, RL = 1kΩ , CL < 10pF, Unless Otherwise Specified
100
OPEN LOOP
100
AVCL = 1000
80
AVCL = 10
GAIN (dB)
60
AVCL = 2
40
20
0
0
PHASE (DEGREE)
AVCL = 100
90
AVCL
AVCL
= 1000 = 100
OPEN LOOP
AVCL AVCL
= 10 = 2
180
GAIN BANDWIDTH PRODUCT (MHz)
120
90
80
70
60
50
40
30
10
100
1K
10K
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 1. FREQUENCY RESPONSE FOR VARIOUS GAINS
5
5
6
7
8
9
10
11
12
SUPPLY VOLTAGE (±V)
13
14
15
FIGURE 2. GAIN BANDWIDTH PRODUCT vs SUPPLY VOLTAGE
HA-2842
Typical Performance Curves
TA = 25oC, VSUPPLY = ±15V, RL = 1kΩ , CL < 10pF, Unless Otherwise Specified (Continued)
110
90
100
80
90
CMRR (dB)
GAIN BANDWIDTH PRODUCT (MHz)
100
70
60
80
70
50
60
40
50
30
-40
-20
0
20
40
60
80
100
120
140
100
1K
10K
TEMPERATURE (oC)
FIGURE 3. GAIN BANDWIDTH PRODUCT vs TEMPERATURE
1M
10M
FIGURE 4. CMRR vs FREQUENCY
NOISE VOLTAGE (nV/√Hz)
90
80
PSRR (dB)
100K
FREQUENCY (Hz)
70
60
50
40
30
50
20
40
16
30
12
20
8
NOISE VOLTAGE
10
4
0
0
NOISE CURRENT
20
NOISE CURRENT (pA/√Hz)
-60
10
1K
10K
100K
1M
10M
10
100
FREQUENCY (Hz)
FIGURE 5. PSRR vs FREQUENCY
10K
100K
FIGURE 6. INPUT NOISE vs FREQUENCY
425
450
400
SLEW RATE (V/µs)
400
SLEW RATE (V/µs)
1K
FREQUENCY (Hz)
375
350
350
300
250
200
-60
-40
-20
0
20
40
60
80
100 120
TEMPERATURE (oC)
FIGURE 7. SLEW RATE vs TEMPERATURE
6
140
5
6
7
8
9
10
11
12
13
SUPPLY VOLTAGE (±V)
FIGURE 8. SLEW RATE vs SUPPLY VOLTAGE
14
15
HA-2842
Typical Performance Curves
TA = 25oC, VSUPPLY = ±15V, RL = 1kΩ , CL < 10pF, Unless Otherwise Specified (Continued)
3
2
6
1
5
0
BIAS CURRENT
4
-1
3
-60
-40
-20
0
20
40
60
80
100
120
14
SUPPLY CURRENT (mA)
OFFSET VOLTAGE
7
16
INPUT OFFSET VOLTAGE (mV)
INPUT BIAS CURRENT (µA)
8
12
10
125oC
8
25oC
6
-2
140
-55oC
4
5
6
7
8
TEMPERATURE (oC)
9
±15V, 1kΩ
±15V, 150Ω
NEGATIVE OUTPUT SWING (V)
POSITIVE OUTPUT SWING (V)
13
14
15
-2.5
±8V, 150Ω
12.5
10
±15V, 75Ω
7.5
±8V, 1kΩ
5
±8V, 75Ω
±8V, 150Ω
-40
-20
0
20
40
60
80
100
120
±8V, 1kΩ
-7.5
±15V, 75Ω
-10
±15V, 150Ω
-12.5
-15
-60
140
±8V, 75Ω
-5
±15V, 1kΩ
-40
-20
TEMPERATURE (oC)
0
20
40
60
80
100
120 140
TEMPERATURE (oC)
FIGURE 11. POSITIVE OUTPUT SWING vs TEMPERATURE
FIGURE 12. NEGATIVE OUTPUT SWING vs TEMPERATURE
30
-40
VSUPPLY = ±15V
-50
20
THD (dBc)
OUTPUT VOLTAGE SWING (VP-P)
12
FIGURE 10. SUPPLY CURRENT vs SUPPLY VOLTAGE
15
25
11
SUPPLY VOLTAGE (±V)
FIGURE 9. INPUT OFFSET VOLTAGE AND INPUT BIAS
CURRENT vs TEMPERATURE
2.5
-60
10
15
VSUPPLY = ±8V
VO = 10VP-P
-60
-70
10
-80
5
VO = 1VP-P
VO = 0.5VP-P
-90
0
VO = 2VP-P
1K
10K
100K
1M
10M
FREQUENCY (Hz)
FIGURE 13. MAXIMUM UNDISTORTED OUTPUT SWING
vs FREQUENCY
7
100M
100K
1M
10M
FREQUENCY (Hz)
FIGURE 14. TOTAL HARMONIC DISTORTION vs FREQUENCY
HA-2842
Typical Performance Curves
TA = 25oC, VSUPPLY = ±15V, RL = 1kΩ , CL < 10pF, Unless Otherwise Specified (Continued)
0.025
-50
VO = 5VP-P
VO = 2VP-P
DIFFERENTIAL GAIN (%)
THIRD INTERMOD PRODUCT (dBc)
-40
-60
-70
-80
VO = 1VP-P
VO = 0.50VP-P
-90
VSUPPLY = ±8V
0.020
0.015
0.010
VSUPPLY = ±15V
VO = 0.25VP-P
500K
1M
0
100
10M
200
300
FREQUENCY (Hz)
400
500
600
700
800
900 1000
LOAD RESISTANCE (Ω)
FIGURE 15. INTERMODULATION DISTORTION vs
FREQUENCY (TWO TONE)
FIGURE 16. DIFFERENTIAL GAIN vs LOAD RESISTANCE
0.14
0.04
RL = 75Ω
0.12
VSUPPLY = ±8V
0.10
0.03
GAIN FLATNESS (±dB)
DIFFERENTIAL PHASE (DEGREES)
VSUPPLY = ±10V
0.005
0.08
VSUPPLY = ±10V
0.06
0.02
RL = 150Ω
RL = 500Ω
0.01
VSUPPLY = ±15V
0.04
RL = 1000Ω
0.02
0
0
100
200 300
400
500
600
700
800
900
1000
0
1M
2M
3M
4M
FIGURE 17. DIFFERENTIAL PHASE vs LOAD RESISTANCE
GAIN BANDWIDTH PRODUCT (MHz)
80
75
70
65
100
200
300
400
500
600
700
800
900 1000
LOAD RESISTANCE (Ω)
FIGURE 19. GAIN BANDWIDTH PRODUCT vs LOAD RESISTANCE
8
6M
7M
8M
9M
10M
FIGURE 18. GAIN FLATNESS vs FREQUENCY (AVCL = 2)
85
0
5M
FREQUENCY (Hz)
LOAD RESISTANCE (Ω)
HA-2842
Die Characteristics
PASSIVATION:
Type: Nitride over Silox
Silox Thickness: 12kÅ ±2kÅ
Nitride thickness: 3.5kÅ ±1kÅ
DIE DIMENSIONS:
77 mils x 81 mils x 19 mils
1960µm x 2060µm x 483µm
SUBSTRATE POTENTIAL (POWERED UP):
METALLIZATION:
V-
Type: Aluminum, 1% Copper
Thickness: 16kÅ ±2kÅ
TRANSISTOR COUNT:
58
PROCESS:
High Frequency Bipolar Dielectric Isolation
Metallization Mask Layout
HA-2842
BAL
BAL
COMP
-IN
V+
OUT
+IN
V-
9
HA-2842
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
INDEX
AREA
0.25(0.010) M
H
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
SYMBOL
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
µα
e
A1
B
0.25(0.010) M
C
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
MILLIMETERS
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
8o
0o
N
NOTES:
MAX
A1
e
0.10(0.004)
MIN
α
8
0o
8
7
8o
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
10
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