Information Equipment LSIs MN5814 VCOI VDD QVDZMSEL PD POSSET JUST HDOT2 CPH1 RL CPH2 STV2 CPH3 TFT AV Panel Controller IC ■ Overview 36 35 34 33 32 31 30 29 28 27 26 25 The MN5814 is a TFT LCD panel timing controller IC. 37 38 39 40 41 42 43 44 45 46 47 48 24 23 22 21 20 19 18 17 16 15 14 13 STH2 STH1 QH (ZOOMC) OEH STV1 OEV1 OEV2 OEV3 CPV INTEXT POL UD 1 2 3 4 5 6 7 8 9 10 11 12 • Supports both composite sync and separate sync signal video inputs. • Horizontal and vertical position adjustment function Horizontal: 5 bits (Adjustment range: 9.38 µs) Vertical: 4 bits (Adjustment range: 14 H) • Supports multiple panel types From 2.5-type to 7-type wide-screen panels For wide-screen panels: Display with black side bands (3 modes) Just-fit display Zoom (2 modes) • Switching between PAL and NTSC (PAL: decimation only) • Underside on-screen display (UONS) • An optimal zooming mode is possible according to the display panel through 2-zooming mode of ZOOM1 and ZOOM2. • UONS display at arbitrary positions is possible by the black side control pins. Also provides full-screen black side display. VCOO VSS RESET HDOT1 WH (UONS) HPOS4 HPOS3 HPOS2 HPOS1 NP1 VDD VSS SYNCIN HSYNCIN CPHSEL (SIDE2) QHSEL (SIDE1) VDBIN HOUT VOUT BLACK VPOS3 VPOS2 VPOS1 LIBOX (ZOOM) ■ Features (TOP VIEW) Note: Pin names in parentheses apply for use with the 1 200 and 1 440 stripe panel types. ■ Applications • TFT LCD panels Publication date: February 2003 SDF00021BEM 1 2 HOUT IH_ PDCONT PD D_VCO MS_NRESET MS_ NRESET HC_HCOUNT1 OEH MS_NRESET D_VCO HC_OEH D_VCO IH_PD SDF00021BEM ZO_ZOOMC MS_DTYP, MS_QH MS_PONRESET MS_DOT HC_HCOUNT3 MS_DOT MS_ZOTYP MS_UONS MS_NRESET D_VCO NL_OEV1 ∼ OEV3 VC_VOUT MS_NRESET D_VCO MS_NWH VC_VOUT VC_STV_LTBOX VC_UO NST MS_UO NS MS_NR ESET HC_OEH VDBIN TASOJIS1 INTEXT QVDZMSEL MS_RL Mode settings block (MS) MS_UD STV2 D_VCO STV1 Vertical synchronization block (VC) HC_HALF VC_ISTV HC_POLSET Polarity control block (PO) TP_VOBIN HC_CPV VC_UONST HC_OUT_MIN VC_VCOUNT VC_MABIKIEN VC_ZOOMEN VC_UONST HC_OEH_NOM MS_RL MS_UONS MS_NWH MS_DOT_HC [2 :0] MS_NRESET MS_DTYP, MS_QH MS_CPH MS_MODE MS_DOT TP_IHDBIN Line decimation/Zoom correction block (ZO) MS_UONS HC_WINDOW MS_ DOT Horizontal synchronization block (HC) MS_HPOS HC_OEV Division control block (D) FH_FIELD QVD selection block (NL) MS_ NRESET FH_FIELD MS_NWH NL_ VOUT FH_OEV1 MS_DOT Field discrimination block (FH) INTEXT FH_OEV2 HC_HCOUNT2 HC_OEH I_VCOI PO_QH D_VCO CPV BLACK OEV3 OEV2 OEV1 VCOI FH_OEV3 Equalization pulse removal block (TP) SYNCIN TP_HGOPER TP_HGOCOUNT HSYNCIN Phase comparison block (IH) VCOO Oscillator cell HC_OEH VDBIN RESET UD NP1 UONS ZOOM JUST HDOT2 HDOT1 VPOS3 VPOS2 VPOS1 POSSET HPOS4 HPOS3 HPOS2 HPOS1 CPHSEL QHSEL RL MN5814 ■ Block Diagram VC_VOUT MS_VPOS, MSBFVPOS VDBIN MS_NRESET VOUT POL STH2 STH1 CPV TP_VDBIN MS_MODE ZO_OEV1 ∼ OEV3 TASOJIS1 VC_VOUT MS_DOT QVDZMSEL MN5814 ■ Pin Descriptions Pin No. Pin Name I/O Description 1 SYNCIN I Composite sync input 2 HSYNCIN I Horizontal sync input (separate) 3 CPHSEL (SIDE2) I In 1 440 or 1 200-stripe mode: Black side and just-fit control In 960-stripe mode: Disabled In 480 or 960-delta mode: CPH pulse phase switching 4 QHSEL (SIDE1) I In 1 440 or 1 200-stripe mode: Black side and just-fit control In 960-stripe mode: Disabled In 480 or 960-delta mode: QH pulse phase switching 5 VDBIN I Vertical sync input (separate) 6 HOUT O Horizontal sync output 7 VOUT O Vertical sync output 8 BLACK O Black signal output 9 VPOS3 I Vertical display position switching (STV1 and STV2 position switching) 10 VPOS2 I 11 VPOS1 I 12 LTBOX (ZOOM) I High: Zoom or letterbox display In 1 440 or 1 200-mode: Zoom display control In 480 or 960-delta or 960-stripe mode: Letterbox display control 13 UD 1 Up/down scan direction switching (STV1 and STV2 output switching) 14 POL O Video, opposite electrode reversal signal 15 INTEXT I Composite/separate input switching 16 CPV O Gate driver IC clock 17 OEV3 O Gate driver IC output stage enable pulse signals 18 OEV2 O 19 OEV1 O 20 STV1 O Gate driver IC start pulse 1 21 OEH O Source driver IC output stage enable pulse signal 22 QH (ZOOMC) O In 480 or 960-delta mode: Color arrangement switching pulse In 1 200 or 1 440-mode: Zoom control pulse In 960 stripe mode: Fixed low-level output 23 STH1 O Source driver IC start pulse 1 24 STH2 O Source driver IC start pulse 2 25 CPH3 O Source driver IC clock 3 26 STV2 O Source driver IC start pulse 2 27 CPH2 O Source driver IC clock 2 28 RL I Left/right scan direction switching (STH1 and STH2 output switching) SDF00021BEM 3 MN5814 ■ Pin Descriptions (continued) 4 Pin No. Pin Name I/O Description 29 CPH1 O Source driver IC clock 1 30 HDOT2 I Display pixel count mode switch 2 31 JUST I In 1 200 or 1 440-mode: Just-fit display switching In 960-mode: Stripe/delta control 32 POSSET I Horizontal/vertical display position offset switching 33 PD O Phase comparator output 34 QVDZMSEL I In 480 or 960-delta or stripe mode: QVD input In 1 200 or 1 400-mode: Zoom 1/zoom 2 display switching OEV pulse control in zoom mode 35 VDD I Power supply (VDD) 36 VCOI I VCO input (system clock input) 37 VCOO O VCO output 38 VSS I Ground (GND) 39 RESET I System reset 40 HDOT1 I Display pixel count mode switching 1 41 WH (UONS) I In 1 200 or 1 440-mode: "Under on-screen" display control In 480 or 960-delta or stripe mode: WH (write/hold) control 42 HPOS4 I Horizontal display position switching signals 43 HPOS3 I (STH1 and STH2 position switching) 44 HPOS2 I 45 HPOS1 I 46 NP1 I NTSC/PAL switching 47 VDD I Power supply (VDD) 48 VSS I Ground (GND) SDF00021BEM MN5814 ■ Electrical Characteristics 1. Absolute Maximum Ratings at VSS = 0 V Parameter Symbol Rating Unit VDD − 0.3 to +4.6 V Input pin voltage VI − 0.3 to VDD+0.3 V Output pin voltage VO − 0.3 to VDD+0.3 V Output current (HL2 pins) IO ±6 mA Output current (HL4 pins) IO ±12 mA Power dissipation PD 330 mW Operating temperature Topr −40 to +85 °C Storage temperature Tstg −55 to +150 °C Supply voltage Note) 1. HL2 pins: QH, CPV, OEH, OEV1 to OEV3, POL, STH1, STH2, STV1, STV2, HOUT, VOUT, BLACK HL4 pins: PD, CPH1 to CPH3 2. The absolute maximum ratings are limit values for stresses applied to the chip so that the chip will not be destroyed. Operation is not guaranteed within these ranges. 3. All the VDD and VSS pins must be connected externally to the corresponding power or ground. 4. The power dissipation rating applies at Topr = 85°C when the MN5814 is mounted on a glass-epoxy printed circuit board. The actual value differs depending on the printed circuit board used and the thermal conditions in the end product. 2. Recommended Operating Conditions at VSS = 0 V Parameter Min Typ Max Unit VDD 2.7 3.3 3.6 V Ambient temperature Ta −40 85 °C Input rise time tr 0 100 ns Input fall time tf 0 100 ns 30 MHz 33 pF Supply voltage Symbol Condition Oscillator frequency fOSC1 30 MHz Xtal Recommended values for external capacitors CXI90 CXO90 VDD = 3.3 V, with an external feedback resistor (15 MHz to 25 MHz) 10 (25 MHz to 40 MHz) Recommended values for external resistors Rf90 VI = VDD or VSS , VDD = 3.3 V XI XO 2.2 kΩ CXI Rf CXO Note) Since the oscillator characteristics differ depending on the oscillator element used and the external capacitor conditions, consult the manufacturer of the oscillator element to determine the optimal oscillator circuit. SDF00021BEM 5 MN5814 ■ Electrical Characteristics (continued) 3. Electrical Characteristics at VDD = 2.7 V to 3.6 V, VSS = 0 V, fTEST = 30 MHz, Ta = -40°C to +85°C Parameter Quiescent supply current Symbol Condition Min Typ Max Unit IDDS VI (pulled-up pins) = OPEN, VI (pulled-down pins) = OPEN, 500 µA 15 30 mA 1.85 VDD × 0.7 V VDD × 0.3 1.45 ±5 µA VI (XI) = VDD *, With either the VDD or the VSS level applied simultaneously to all of the other input pins and I/O pins in the high-impedance state. Operating supply current IDDO VI = VDD or VSS , f = 30 MHz, VDD = 3.3 V, outputs open 1) CMOS input level Schmitt trigger pins: RESET, VDBIN, SYNCIN, HSYNCIN Input threshold voltage VT+ VDD = 2.7 V to 3.6 V VT− Input leakage current ILI VI = VDD or VSS 2) CMOS input level pins with built-in pull-up resistor: RL, UD, HDOT1, HDOT2, INTEXT High-level input voltage VIH VDD × 0.7 VDD V Low-level input voltage VIL 0 VDD × 0.3 V Pull-up resistor RIH VI = 0 V 33 100 318 kΩ Input leakage current ILIH VI = VDD ±10 µA 3) CMOS input level pins with built-in pull-down resistor: NP1, HPOS1 to HPOS4, JUST, UONS, VPOS1 to VPOS3, ZOOM, QHSEL, CPHSEL, POSSET, QVDZMSEL High-level input voltage VIH VDD × 0.7 VDD V Low-level input voltage VIL 0 VDD × 0.3 V Pull-down resistor RIL VI = VDD 33 100 318 kΩ Input leakage current ILIL VI = VSS ±10 µA 4) Push-pull output pins: QH, CPV, OEH, OEV1 to OEV3, POL, HOUT, VOUT, BLACK High-level output voltage VOH IOH = −1.9 mA, VI = VDD or VSS VDD − 0.6 V Low-level output voltage VOL IOL = 1.9 mA, VI = VDD or VSS 0.4 V 5) Push-pull output pins: CPH1 to CPH3 High-level output voltage VOH IOH = −3.8 mA, VI = VDD or VSS VDD − 0.6 V Low-level output voltage VOL IOL = 3.8 mA, VI = VDD or VSS 0.4 V Note) *: The IDDS associated with the VDD applied to the oscillator pin XI shall be take from a power supply separate from the measured power supply. 6 SDF00021BEM MN5814 ■ Electrical Characteristics (continued) 3. Electrical Characteristics at VDD = 2.7 V to 3.6 V, VSS = 0 V, fTEST = 30 MHz, Ta = -40°C to +85°C (continued) Parameter Symbol Condition Min Typ Max Unit 6) Tristate output pins: STH1, STH2, STV1, STV2 High-level output voltage VOH IOH = −1.9 mA, VI = VDD or VSS VDD − 0.6 V Low-level output voltage VOL IOL = 1.9 mA, VI = VDD or VSS 0.4 V Output leakage current ILO VO = High-impedance state, VI = VDD or VSS , VO = VDD or VSS ±5 µA High-level output voltage VOH IOH = −3.8 mA, VI = VDD or VSS VDD − 0.6 V Low-level output voltage VOL IOL = 3.8 mA, VI = VDD or VSS 0.4 V Output leakage current ILO VO = High-impedance state, VI = VDD or VSS , VO = VDD or VSS ±5 µA 7) Tristate output pins: PD ■ Package Dimensions (Units: mm) • TQFP048-P-0707B (Lead-free package) 9.00±0.20 7.00±0.10 25 36 24 7.00±0.10 9.00±0.20 (0.75) 37 0.10 M 0.10 (1.00) 0.15±0.05 12 0.20±0.05 (1.00) 0.50 0.10+0.10 -0.05 1 (0.75) 1.20 max. 13 48 0° to 8° 0.50±0.10 Seating plane SDF00021BEM 7 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL