hfa1145

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1-88
330MHz, Low Power, Current Feedback
Video Operational Amplifier with Output
Disable
The HFA1145 is a high speed, low power current feedback
amplifier built with Intersil’s proprietary complementary
bipolar UHF-1 process.
HFA1145
July 15, 2015
FN3955.5
Features
• Low Supply Current . . . . . . . . . . . . . . . . . . . . . . . . 5.8mA
• High Input Impedance . . . . . . . . . . . . . . . . . . . . . . . 1M
• Wide -3dB Bandwidth. . . . . . . . . . . . . . . . . . . . . . 330MHz
• Very Fast Slew Rate. . . . . . . . . . . . . . . . . . . . . . 1000V/s
This amplifier features a TTL/CMOS compatible disable
control, pin 8, which when pulled low reduces the supply
current and forces the output into a high impedance state.
This allows easy implementation of simple, low power video
switching and routing systems. Component and composite
video systems also benefit from this op amp’s excellent gain
flatness, and good differential gain and phase specifications.
• Gain Flatness (to 75MHz) . . . . . . . . . . . . . . . . . . 0.1dB
Multiplexed A/D applications will also find the HFA1145
useful as the A/D driver/multiplexer.
• Pb-Free Plus Anneal Available (RoHS Compliant)
The HFA1145 is a low power, high performance upgrade for
the CLC410.
For Military grade product, please refer to the HFA1145/883
data sheet
PART
MARKING
TEMP.
RANGE
(°C)
• Differential Phase . . . . . . . . . . . . . . . . . . . . . 0.03 Degrees
• Output Enable/Disable Time . . . . . . . . . . . . . 180ns/35ns
• Pin Compatible Upgrade for CLC410
Applications
• Flash A/D Drivers
• Video Switching and Routing
• Professional Video Processing
• Video Digitizing Boards/Systems
Ordering Information
PART
NUMBER
(BRAND)
• Differential Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.02%
• Multimedia Systems
PACKAGE
PKG.
DWG. #
HFA1145IB
1145IB
-40 to 85 8 Ld SOIC
M8.15
HFA1145IBZ
(Note)
1145IBZ
-40 to 85 8 Ld SOIC
(Pb-free)
M8.15
HFA1145IP
HFA1145IP
-40 to 85 8 Ld PDIP
E8.3
HFA1145IPZ
(Note)
HFA1145IPZ
-40 to 85 8 Ld PDIP*
(Pb-free)
E8.3
HFA11XXEVAL DIP Evaluation Board for High Speed Op Amps
Note: Requires a SOIC-to-DIP adapter. See
“Evaluation Board” section inside.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
• RGB Preamps
• Medical Imaging
• Hand Held and Miniaturized RF Equipment
• Battery Powered Communications
Pinout
HFA1145 (SOIC)
TOP VIEW
NC 1
-IN 2
+IN 3
V- 4
8 DISABLE
+
7 V+
6 OUT
5 NC
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 1999, 2004, 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
HFA1145
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSUPPLY
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V
Output Current (Note 1) . . . . . . . . . . . . . . . . . Short Circuit Protected
30mA Continuous
60mA  50% Duty Cycle
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>600V
Thermal Resistance (Typical, Note 2)
JA (°C/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
170
Maximum Junction Temperature (Die Only) . . . . . . . . . . . . . . . . 175°C
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Output is short circuit protected to ground. Brief short circuits to ground will not degrade reliability, however continuous (100% duty cycle) output
current must not exceed 30mA for maximum reliability.
2. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VSUPPLY = 5V, AV = +1, RF = 510, RL = 100 Unless Otherwise Specified
PARAMETER
(NOTE 3)
TEST
LEVEL
TEMP. (°C)
MIN
TYP
MAX
UNITS
A
25
-
2
5
mV
A
Full
-
3
8
mV
B
Full
-
1
10
V/°C
VCM =1.8V
A
25
47
50
-
dB
VCM =1.8V
A
85
45
48
-
dB
VCM =1.2V
A
-40
45
48
-
dB
TEST CONDITIONS
INPUT CHARACTERISTICS
Input Offset Voltage
Average Input Offset Voltage Drift
Input Offset Voltage
Common-Mode Rejection Ratio
Input Offset Voltage
Power Supply Rejection Ratio
VPS =1.8V
A
25
50
54
-
dB
VPS =1.8V
A
85
47
50
-
dB
VPS =1.2V
A
-40
47
50
-
dB
A
25
-
6
15
A
A
Full
-
10
25
A
B
Full
-
5
60
nA/°C
VPS =1.8V
A
25
-
0.5
1
A/V
VPS =1.8V
A
85
-
0.8
3
A/V
VPS =1.2V
A
-40
-
0.8
3
A/V
VCM =1.8V
A
25
0.8
1.2
-
M
VCM =1.8V
A
85
0.5
0.8
-
M
VCM =1.2V
A
-40
0.5
0.8
-
M
A
25
-
2
7.5
A
A
Full
-
5
15
A
B
Full
-
60
200
nA/°C
A
25
-
3
6
A/V
Non-Inverting Input Bias Current
Non-Inverting Input Bias Current Drift
Non-Inverting Input Bias Current
Power Supply Sensitivity
Non-Inverting Input Resistance
Inverting Input Bias Current
Inverting Input Bias Current Drift
VCM =1.8V
Inverting Input Bias Current
Common-Mode Sensitivity
2
VCM =1.8V
A
85
-
4
8
A/V
VCM =1.2V
A
-40
-
4
8
A/V
FN3955.5
July 15, 2015
HFA1145
Electrical Specifications
VSUPPLY = 5V, AV = +1, RF = 510, RL = 100 Unless Otherwise Specified (Continued)
(NOTE 3)
TEST
LEVEL
TEMP. (°C)
MIN
TYP
MAX
UNITS
VPS =1.8V
A
25
-
2
5
A/V
VPS =1.8V
A
85
-
4
8
A/V
VPS =1.2V
A
-40
-
4
8
A/V
Inverting Input Resistance
C
25
-
60
-

Input Capacitance
C
25
-
1.6
-
pF
Input Voltage Common Mode Range
(Implied by VIO CMRR, +RIN, and -IBIAS CMS
tests)
A
25, 85
1.8
2.4
-
V
A
-40
1.2
1.7
-
V
PARAMETER
TEST CONDITIONS
Inverting Input Bias Current
Power Supply Sensitivity
Input Noise Voltage Density (Note 6)
f = 100kHz
B
25
-
3.5
-
nV/Hz
Non-Inverting Input Noise Current Density
(Note 6)
f = 100kHz
B
25
-
2.5
-
pA/Hz
Inverting Input Noise Current Density
(Note 6)
f = 100kHz
B
25
-
20
-
pA/Hz
AV = -1
C
25
-
500
-
k
B
25
-
270
-
MHz
B
Full
-
240
-
MHz
AV = -1, RF = 425
B
25
-
300
-
MHz
AV = +2
B
25
-
330
-
MHz
B
Full
-
260
-
MHz
B
25
-
130
-
MHz
B
Full
-
90
-
MHz
TRANSFER CHARACTERISTICS
Open Loop Transimpedance Gain
AC CHARACTERISTICS
RF = 510, Unless Otherwise Specified
-3dB Bandwidth
(VOUT = 0.2VP-P, Note 6)
AV = +1, +RS = 510
AV = +10, RF = 180
Full Power Bandwidth
(VOUT = 5VP-P at AV = +2/-1,
4VP-P at AV = +1, Note 6)
AV = +1, +RS = 510
B
25
-
135
-
MHz
AV = -1
B
25
-
140
-
MHz
AV = +2
B
25
-
115
-
MHz
To 25MHz
B
25
-
0.03
-
dB
B
Full
-
0.04
-
dB
B
25
-
0.11
-
dB
B
Full
-
0.22
-
dB
Gain Flatness
To 25MHz
(AV = +1, +RS = 510, VOUT = 0.2VP-P, Note 6)
To 75MHz
B
25
-
0.03
-
dB
B
25
-
0.09
-
dB
Minimum Stable gain
A
Full
-
1
-
V/V
A
25
3
3.4
-
V
A
Full
2.8
3
-
V
A
25, 85
50
60
-
mA
A
-40
28
42
-
mA
B
25
-
90
-
mA
B
25
-
0.08
-

Gain Flatness
(AV = +2, VOUT = 0.2VP-P, Note 6)
To 75MHz
OUTPUT CHARACTERISTICS AV = +2, RF = 510, Unless Otherwise Specified
Output Voltage Swing
(Note 6)
AV = -1, RL = 100
Output Current
(Note 6)
AV = -1, RL = 50
Output Short Circuit Current
Closed Loop Output Impedance (Note 6)
3
DC
FN3955.5
July 15, 2015
HFA1145
Electrical Specifications
VSUPPLY = 5V, AV = +1, RF = 510, RL = 100 Unless Otherwise Specified (Continued)
PARAMETER
TEST CONDITIONS
(NOTE 3)
TEST
LEVEL
TEMP. (°C)
MIN
TYP
MAX
UNITS
Second Harmonic Distortion
(VOUT = 2VP-P, Note 6)
10MHz
B
25
-
-48
-
dBc
20MHz
B
25
-
-44
-
dBc
Third Harmonic Distortion
(VOUT = 2VP-P, Note 6)
10MHz
B
25
-
-50
-
dBc
20MHz
B
25
-
-45
-
dBc
Reverse Isolation (S12, Note 6)
30MHz
B
25
-
-55
-
dB
B
25
-
1.1
-
ns
B
Full
-
1.4
-
ns
TRANSIENT CHARACTERISTICS
AV = +2, RF = 510 Unless Otherwise Specified
Rise and Fall Times
VOUT = 0.5VP-P
Overshoot (Note 4)
(VOUT = 0 to 0.5V, VIN tRISE = 1ns)
+OS
B
25
-
3
-
%
-OS
B
25
-
5
-
%
Overshoot (Note 4)
(VOUT = 0.5VP-P, VIN tRISE = 1ns)
+OS
B
25
-
3
-
%
-OS
B
25
-
11
-
%
Slew Rate
(VOUT = 4VP-P, AV = +1, +RS = 510)
+SR
B
25
-
1000
-
V/s
B
Full
-
975
-
V/s
B
25
-
650
-
V/s
B
Full
-
580
-
V/s
B
25
-
1400
-
V/s
B
Full
-
1200
-
V/s
-SR (Note 5)
B
25
-
800
-
V/s
B
Full
-
700
-
V/s
+SR
B
25
-
2100
-
V/s
B
Full
-
1900
-
V/s
B
25
-
1000
-
V/s
B
Full
-
900
-
V/s
To 0.1%
B
25
-
15
-
ns
To 0.05%
B
25
-
23
-
ns
To 0.02%
B
25
-
30
-
ns
VIN =2V
B
25
-
8.5
-
ns
-SR (Note 5)
Slew Rate
(VOUT = 5VP-P, AV = +2)
+SR
Slew Rate
(VOUT = 5VP-P, AV = -1)
-SR (Note 5)
Settling Time
(VOUT = +2V to 0V step, Note 6)
Overdrive Recovery Time
VIDEO CHARACTERISTICS
AV = +2, RF = 510 Unless Otherwise Specified
Differential Gain
(f = 3.58MHz)
RL = 150
B
25
-
0.02
-
%
RL = 75
B
25
-
0.03
-
%
Differential Phase
(f = 3.58MHz)
RL = 150
B
25
-
0.03
-
Degrees
RL = 75
B
25
-
0.05
-
Degrees
VDISABLE = 0V
A
Full
-
3
4
mA
DISABLE CHARACTERISTICS
Disabled Supply Current
DISABLE Input Logic Low
A
Full
-
-
0.8
V
DISABLE Input Logic High
A
25, 85
2.0
-
-
V
A
-40
2.4
-
-
V
A
Full
-
100
200
A
DISABLE Input Logic Low Current
4
VDISABLE = 0V
FN3955.5
July 15, 2015
HFA1145
Electrical Specifications
VSUPPLY = 5V, AV = +1, RF = 510, RL = 100 Unless Otherwise Specified (Continued)
PARAMETER
TEST CONDITIONS
(NOTE 3)
TEST
LEVEL
TEMP. (°C)
MIN
TYP
MAX
UNITS
DISABLE Input Logic High Current
VDISABLE = 5V
A
Full
-
1
15
A
Output Disable Time (Note 6)
VIN =1V,
VDISABLE = 2.4V to 0V
B
25
-
35
-
ns
Output Enable Time (Note 6)
VIN =1V,
VDISABLE = 0V to 2.4V
B
25
-
180
-
ns
B
25
-
2.5
-
pF
A
Full
-
3
10
A
Disabled Output Capacitance
VDISABLE = 0V
Disabled Output Leakage
VDISABLE = 0V, VIN =
VOUT =3V
Off Isolation
(VDISABLE = 0V, VIN = 1VP-P, Note 6)
At 5MHz
B
25
-
-75
-
dB
At 25MHz
B
25
-
-60
-
dB
Power Supply Range
C
25
4.5
-
5.5
V
Power Supply Current (Note 6)
A
25
-
5.8
6.1
mA
A
Full
-
5.9
6.3
mA
2V,

POWER SUPPLY CHARACTERISTICS
NOTES:
3. Test Level: A. Production Tested; B. Typical or Guaranteed Limit Based on Characterization; C. Design Typical for Information Only.
4. Undershoot dominates for output signal swings below GND (e.g. 0.5VP-P), yielding a higher overshoot limit compared to the VOUT = 0 to 0.5V
condition. See the “Application Information” section for details.
5. Slew rates are asymmetrical if the output swings below GND (e.g. a bipolar signal). Positive unipolar output signals have symmetric positive and
negative slew rates comparable to the +SR specification. See the “Application Information” section, and the pulse response graphs for details.
6. See Typical Performance Curves for more information.
Application Information
Optimum Feedback Resistor
Although a current feedback amplifier’s bandwidth
dependency on closed loop gain isn’t as severe as that of a
voltage feedback amplifier, there can be an appreciable
decrease in bandwidth at higher gains. This decrease may be
minimized by taking advantage of the current feedback
amplifier’s unique relationship between bandwidth and RF. All
current feedback amplifiers require a feedback resistor, even
for unity gain applications, and RF, in conjunction with the
internal compensation capacitor, sets the dominant pole of the
frequency response. Thus, the amplifier’s bandwidth is
inversely proportional to RF. The HFA1145 design is optimized
for RF = 510 at a gain of +2. Decreasing RF decreases
stability, resulting in excessive peaking and overshoot (Note:
Capacitive feedback will cause the same problems due to the
feedback impedance decrease at higher frequencies). At
higher gains, however, the amplifier is more stable so RF can
be decreased in a trade-off of stability for bandwidth.
The table below lists recommended RF values for various
gains, and the expected bandwidth. For a gain of +1, a
resistor (+RS) in series with +IN is required to reduce gain
peaking and increase stability.
GAIN
(ACL)
RF ()
BANDWIDTH
(MHz)
-1
425
300
+1
510 (+RS = 510)
270
+2
510
330
+5
200
300
+10
180
130
Non-inverting Input Source Impedance
For best operation, the DC source impedance seen by the
non-inverting input should be 50This is especially
important in inverting gain configurations where the noninverting input would normally be connected directly to GND.
DISABLE Input TTL Compatibility
The HFA1145 derives an internal GND reference for the
digital circuitry as long as the power supplies are
symmetrical about GND. With symmetrical supplies the
digital switching threshold (VTH = (VIH + VIL)/2 = (2.0 +
0.8)/2) is 1.4V, which ensures the TTL compatibility of the
DISABLE input. If asymmetrical supplies (e.g. +10V, 0V) are
utilized, the switching threshold becomes:
V+ + VV TH = ------------------- + 1.4V
2
and the VIH and VIL levels will be VTH  0.6V, respectively.
5
FN3955.5
July 15, 2015
HFA1145
The die version of the HFA1145 provides the user with a GND
pad for setting the disable circuitry GND reference. With
symmetrical supplies the GND pad may be left unconnected, or
tied directly to GND. If asymmetrical supplies (e.g. +10V, 0V)
are utilized, and TTL compatibility is desired, die users must
connect the GND pad to GND. With an external GND, the
DISABLE input is TTL compatible regardless of supply voltage
utilized.
Pulse Undershoot and Asymmetrical Slew Rates
The HFA1145 utilizes a quasi-complementary output stage to
achieve high output current while minimizing quiescent supply
current. In this approach, a composite device replaces the
traditional PNP pulldown transistor. The composite device
switches modes after crossing 0V, resulting in added distortion
for signals swinging below ground, and an increased
undershoot on the negative portion of the output waveform
(See Figures 5, 8, and 11). This undershoot isn’t present for
small bipolar signals, or large positive signals. Another artifact
of the composite device is asymmetrical slew rates for output
signals with a negative voltage component. The slew rate
degrades as the output signal crosses through 0V (See Figures
5, 8, and 11), resulting in a slower overall negative slew rate.
Positive only signals have symmetrical slew rates as illustrated
in the large signal positive pulse response graphs (See Figures
4, 7, and 10).
PC Board Layout
This amplifier’s frequency response depends greatly on the
care taken in designing the PC board. The use of low
inductance components such as chip resistors and chip
capacitors is strongly recommended, while a solid
ground plane is a must!
Attention should be given to decoupling the power supplies.
A large value (10F) tantalum in parallel with a small value
(0.1F) chip capacitor works well in most cases.
Terminated microstrip signal lines are recommended at the
device’s input and output connections. Capacitance,
parasitic or planned, connected to the output must be
minimized, or isolated as discussed in the next section.
Care must also be taken to minimize the capacitance to
ground at the amplifier’s inverting input (-IN), as this
capacitance causes gain peaking, pulse overshoot, and if
large enough, instability. To reduce this capacitance, the
designer should remove the ground plane under traces
connected to -IN, and keep connections to -IN as short as
possible.
An example of a good high frequency layout is the Evaluation
Board shown in Figure 2.
6
Driving Capacitive Loads
Capacitive loads, such as an A/D input, or an improperly
terminated transmission line will degrade the amplifier’s
phase margin resulting in frequency response peaking and
possible oscillations. In most cases, the oscillation can be
avoided by placing a resistor (RS) in series with the output
prior to the capacitance.
Figure 1 details starting points for the selection of this
resistor. The points on the curve indicate the RS and CL
combinations for the optimum bandwidth, stability, and
settling time, but experimental fine tuning is recommended.
Picking a point above or to the right of the curve yields an
overdamped response, while points below or left of the curve
indicate areas of underdamped performance.
RS and CL form a low pass network at the output, thus limiting
system bandwidth well below the amplifier bandwidth of
270MHz (for AV = +1). By decreasing RS as CL increases (as
illustrated in the curves), the maximum bandwidth is obtained
without sacrificing stability. In spite of this, the bandwidth
decreases as the load capacitance increases. For example, at
AV = +1, RS = 62, CL = 40pF, the overall bandwidth is
limited to 180MHz, and bandwidth drops to 75MHz at AV = +1,
RS = 8, CL = 400pF.
50
SERIES OUTPUT RESISTANCE ()
Optional GND Pad (Die Use Only) for
TTL Compatibility
40
30
20
AV = +1
AV = +2
10
0
0
50
100
200
300
150
250
LOAD CAPACITANCE (pF)
350
400
FIGURE 1. RECOMMENDED SERIES OUTPUT RESISTOR vs
LOAD CAPACITANCE
Evaluation Board
The performance of the HFA1145 may be evaluated using
the HFA11XX Evaluation Board and a SOIC to DIP adaptor
like the Aries Electronics Part Number 14-350000-10. The
layout and schematic of the board are shown in Figure 2.
The VH connection may be used to exercise the DISABLE
pin, but note that this connection has no 50 termination. To
order evaluation boards (part number HFA11XXEVAL),
please contact your local sales office.
FN3955.5
July 15, 2015
HFA1145
VH
1
+IN
VL
OUT
V+
VGND
FIGURE 2A. TOP LAYOUT
FIGURE 2B. TOP LAYOUT
510
510
VH
R1
50
IN
10F
0.1F
1
8
2
7
3
6
4
5
-5V
GND
10F
0.1F
+5V
50
OUT
GND
VL
FIGURE 2. EVALUATION BOARD SCHEMATIC AND LAYOUT
Typical Performance Curves
200
3.0
AV = +1
+RS = 510
2.5
100
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (mV)
150
VSUPPLY = 5V, RF = 510 TA = 25°C, RL = 100 Unless Otherwise Specified
50
0
-50
-100
AV = +1
+RS = 510
2.0
1.5
1.0
0.5
0
-0.5
-150
-1.0
-200
TIME (5ns/DIV.)
FIGURE 3. SMALL SIGNAL PULSE RESPONSE
7
TIME (5ns/DIV.)
FIGURE 4. LARGE SIGNAL POSITIVE PULSE RESPONSE
FN3955.5
July 15, 2015
HFA1145
Typical Performance Curves
2.0
200
AV = +1
+RS = 510
AV = +2
150
1.0
OUTPUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
1.5
VSUPPLY = 5V, RF = 510 TA = 25°C, RL = 100 Unless Otherwise Specified (Continued)
0.5
0
-0.5
-1.0
-1.5
100
50
0
-50
-100
-150
-2.0
-200
TIME (5ns/DIV.)
TIME (5ns/DIV.)
FIGURE 5. LARGE SIGNAL BIPOLAR PULSE RESPONSE
2.0
AV = +2
2.5
1.5
2.0
1.0
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
3.0
FIGURE 6. SMALL SIGNAL PULSE RESPONSE
1.5
1.0
0.5
0
-0.5
AV = +2
0.5
0
-0.5
-1.0
-1.5
-1.0
-2.0
TIME (5ns/DIV.)
TIME (5ns/DIV.)
FIGURE 7. LARGE SIGNAL POSITIVE PULSE RESPONSE
200
3.0
AV = +10
RF = 180
2.5
100
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (mV)
150
FIGURE 8. LARGE SIGNAL BIPOLAR PULSE RESPONSE
50
0
-50
-100
AV = +10
RF = 180
2.0
1.5
1.0
0.5
0
-0.5
-150
-1.0
-200
TIME (5ns/DIV.)
FIGURE 9. SMALL SIGNAL PULSE RESPONSE
8
TIME (5ns/DIV.)
FIGURE 10. LARGE SIGNAL POSITIVE PULSE RESPONSE
FN3955.5
July 15, 2015
HFA1145
Typical Performance Curves
2.0
AV = +10
RF = 180
1.5
DISABLE
800mV/DIV.
(0.4V to 2.4V)
1.0
0.5
0
OUT
400mV/DIV.
-0.5
-1.0
0V
-1.5
AV = +1, VIN = 1V
-2.0
TIME (5ns/DIV.)
TIME (50ns/DIV.)
0
VOUT = 200mVP-P
+RS = 510 (+1)
+RS = 0 (-1)
AV = +1
AV = -1
-3
0
AV = -1
90
180
AV = +1
0.3
1
10
FREQUENCY (MHz)
100
270
NORMALIZED GAIN (dB)
3
FIGURE 12. OUTPUT ENABLE AND DISABLE RESPONSE
NORMALIZED PHASE (DEGREES)
GAIN (dB)
FIGURE 11. LARGE SIGNAL BIPOLAR PULSE RESPONSE
AV = +2
3
0
AV = +10
-3
AV = +5
AV = +2
0.3
AV = +2
VOUT = 200mVP-P
0
VOUT = 1.5VP-P
-3
VOUT = 5VP-P
VOUT = 200mVP-P
0
90
VOUT = 1.5VP-P
180
270
VOUT = 5VP-P
0.3
1
10
FREQUENCY (MHz)
100
500
FIGURE 15. FREQUENCY RESPONSE FOR VARIOUS OUTPUT
VOLTAGES
9
NORMALIZED GAIN (dB)
3
180
AV = +10
10
FREQUENCY (MHz)
100
270
500
FIGURE 14. FREQUENCY RESPONSE
PHASE (DEGREES)
NORMALIZED GAIN (dB)
FIGURE 13. FREQUENCY RESPONSE
1
90
AV = +5
VOUT = 200mVP-P
RF = 510 (+2)
RF = 200 (+5)
RF = 180 (+10)
500
0
PHASE (DEGREES)
OUTPUT VOLTAGE (V)
VSUPPLY = 5V, RF = 510 TA = 25°C, RL = 100 Unless Otherwise Specified (Continued)
3
AV = -1
0
VOUT = 4VP-P (+1)
VOUT = 5VP-P (-1, +2)
+RS = 510(+1)
-3
1
AV = +1
AV = +2
10
100
200
FREQUENCY (MHz)
FIGURE 16. FULL POWER BANDWIDTH
FN3955.5
July 15, 2015
HFA1145
VOUT = 200mVP-P
3
VSUPPLY = 5V, RF = 510 TA = 25°C, RL = 100 Unless Otherwise Specified (Continued)
RL = 500
AV = +2
RL = 1k
500
AV = +2
0
RL = 100
RL = 50
RL = 100
0
90
RL = 1k
RL = 500
180
270
0.3
1
10
FREQUENCY (MHz)
100
BANDWIDTH (MHz)
-3
RF = 180 (+10)
+RS = 510 (+1)
AV = +1
300
200
AV = +10
100
0
-100
500
-50
0
50
100
150
TEMPERATURE (°C)
FIGURE 17. FREQUENCY RESPONSE FOR VARIOUS LOAD
RESISTORS
FIGURE 18. -3dB BANDWIDTH vs TEMPERATURE
-30
OFF ISOLATION (dB)
VOUT = 200mVP-P
+RS = 510 (+1)
0.25
NORMALIZED GAIN (dB)
VOUT = 200mVP-P
400
RL = 50
PHASE (DEGREES)
NORMALIZED GAIN (dB)
Typical Performance Curves
0.20
0.15
0.10
AV = +2
0.05
AV = +2
VIN = 1VP-P
-40
-50
-60
-70
-80
-90
0
AV = +1
-0.05
-0.10
1
10
FREQUENCY (MHz)
0.3
75
1
-40
VOUT = 2VP-P
AV = +2
AV = +1, +2
-60
AV = -1
-70
-80
-90
0.3
1
10
FREQUENCY (MHz)
FIGURE 21. REVERSE ISOLATION (S12)
10
100
FIGURE 20. OFF ISOLATION
OUTPUT IMPEDANCE ()
REVERSE ISOLATION (dB)
FIGURE 19. GAIN FLATNESS
-50
10
FREQUENCY (MHz)
100
1K
100
10
1
0.1
0.01
0.3
1
10
100
FREQUENCY (MHz)
1000
FIGURE 22. ENABLED OUTPUT IMPEDANCE
FN3955.5
July 15, 2015
HFA1145
Typical Performance Curves
VSUPPLY = 5V, RF = 510 TA = 25°C, RL = 100 Unless Otherwise Specified (Continued)
-30
AV = +2
0.8
AV = +2
VOUT = 2V
-40
0.4
DISTORTION (dBc)
SETTLING ERROR (%)
0.6
0.2
0.1
0
-0.2
-0.4
20MHz
-50
10MHz
-60
-0.6
-0.8
-70
3
8
13
18
23
28
TIME (ns)
33
38
43
48
0
5
3.6
AV = +2
3.5
OUTPUT VOLTAGE (V)
-40
20MHz
-50
10MHz
-60
|-VOUT| (RL= 100
AV = -1
+VOUT (RL= 100
3.4
3.3
3.2
3.1
+VOUT (RL= 50
3.0
2.9
2.8
|-VOUT| (RL= 50
2.7
-5
0
5
OUTPUT POWER (dBm)
10
2.6
-50
15
-25
0
25
50
75
100
125
TEMPERATURE (°C)
FIGURE 25. THIRD HARMONIC DISTORTION vs POUT
FIGURE 26. OUTPUT VOLTAGE vs TEMPERATURE
100
10
10
ENI
INI+
POWER SUPPLY CURRENT (mA)
INI-
6.1
NOISE CURRENT (pA/Hz)
100
NOISE VOLTAGE (nV/Hz)
15
FIGURE 24. SECOND HARMONIC DISTORTION vs POUT
-30
-70
10
OUTPUT POWER (dBm)
FIGURE 23. SETTLING RESPONSE
DISTORTION (dBc)
-5
6.0
5.9
5.8
5.7
5.6
1
0.1
1
1
10
100
FREQUENCY (kHz)
FIGURE 27. INPUT NOISE CHARACTERISTICS
11
3.5
4
4.5
5
5.5
6
6.5
7
7.5
POWER SUPPLY VOLTAGE (V)
FIGURE 28. SUPPLY CURRENT vs SUPPLY VOLTAGE
FN3955.5
July 15, 2015
HFA1145
PASSIVATION:
Die Characteristics
DIE DIMENSIONS:
Type: Nitride
Thickness: 4kÅ 0.5kÅ
59 mils x 59 mils x 19 mils
1500m x 1500m x 483m
TRANSISTOR COUNT:
METALLIZATION:
75
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ 0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ 0.8kÅ
SUBSTRATE POTENTIAL (Powered Up):
Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1145
DISABLE
-IN
V+
OUT
+IN
V-
OPTIONAL GND (NOTE)
NOTE: This pad is not bonded out on packaged units. Die users may set a GND reference, via this pad, to ensure the TTL compatibility
of the DIS input when using asymmetrical supplies (e.g. V+ = 10V, V- = 0V). See the “Application Information” section for details.
12
FN3955.5
July 15, 2015
HFA1145
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
INDEX
AREA
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
H
0.25(0.010) M
B M
INCHES
E
SYMBOL
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e

B S
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N

NOTES:
MILLIMETERS
8
0°
8
8°
0°
7
8°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
13
FN3955.5
July 15, 2015